Summary
This report covers the market landscape and supply-chain for Precursors used in semiconductor device fabrication. It includes information about key suppliers, issues/trends in the material supply chain, estimates on supplier market share, and forecast for the material segments.
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Provides market and technical trend information on organic and inorganic precursors, addressing CVD, ALD, and SOD applications including ILDs & low-κ dielectrics, hard masks, sidewall spacers and etch stop layers
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Provides focused information for supply-chain managers, process integration and R&D directors, as well as business development and financial analysts
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Covers information about key dielectric precursor suppliers, issues/trends in the material supply chain, estimates on supplier market share, and forecast for the electronics material segments
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Includes 3 Quarterly Updates, with updates on market trends and forecasts from the analyst
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Table of Contents
1 Executive Summary 11
1.1 PRECURSORS BUSINESS – MARKET OVERVIEW 12
1.2 PRECURSORS MARKET TRENDS IMPACTING 2024 OUTLOOK 13
1.3 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT: DIELECTRIC PRECURSORS 14
1.4 PRECURSOR TRENDS 15
1.5 PRECURSOR TECHNOLOGY TRENDS16
1.6 COMPETITIVE LANDSCAPE DIELECTRIC PRECURSORS 17
1.7 ANALYST ASSESSMENT OF DIELECTRIC PRECURSORS 18
2 Scope, Purpose, and Methodology 19
2.1 SCOPE 20
2.2 METHODOLOGY 21
2.3 OVERVIEW OF OTHER TECHCET CMR(TM) OFFERINGS 22
3 Semiconductor Industry Market Status and Outlook 23
3.1 WORLDWIDE ECONOMY AND OUTLOOK 24
3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY26
3.1.2 SEMICONDUCTOR SALES GROWTH27
3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS28
3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT 29
3.2.1 ELECTRONICS OUTLOOK30
3.2.2 AUTOMOTIVE INDUSTRY OUTLOOK31
3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS32
3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS33
3.2.3 SMARTPHONE OUTLOOK34
3.2.4 PC OUTLOOK35
3.2.5 SERVERS / IT MARKET36
3.3 SEMICONDUCTOR FABRICATION GROWTH and EXPANSION 37
3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS 38
3.3.2 NEW FABS IN THE US39
3.3.3 WW FAB EXPANSION DRIVING GROWTH 40
3.3.4 EQUIPMENT SPENDING TRENDS41
3.3.5 ADVANCED LOGIC TECHNOLOGY ROADMAPS42
3.3.5.1 DRAM TECHNOLOGY ROADMAPS43
3.3.5.2 3D NAND TECHNOLOGY ROADMAPS44
3.3.6 FAB INVESTMENT ASSESSMENT45
3.4 POLICY and TRADE TRENDS AND IMPACT 46
3.5 SEMICONDUCTOR MATERIALS OVERVIEW 47
3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028 48
3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028 49
4 Material Market Trends 50
4.1 CVD, ALD METAL and HIGH-K AND ADVANCED DIELECTRIC PRECURSORS MARKET TRENDS 51
4.1.1 2023 PRECURSOR MARKET LEADING INTO 2024 52
4.1.2 PRECURSOR MARKET OUTLOOK53
4.1.3 DIELECTRIC PRECURSORS 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT54
4.1.4 DIELECTRIC PRODUCTION OF TOP SUPPLIERS55
4.1.5 DIELECTRIC PRODUCTION BY REGION 56
4.1.6 ALD/CVD MATERIAL PRODUCTION CAPACITY EXPANSIONS57
4.1.7 INVESTMENT ANNOUNCEMENTS OVERVIEW59
4.2 PRICING TRENDS 60
4.3 TECHNOLOGY TRENDS/TECHNICAL DRIVERS - OUTLINE 61
4.3.1 PRECURSOR GENERAL TECHNOLOGY OVERVIEW and TECHNOLOGY TRENDS 62
4.3.2 CUSTOMER DRIVEN TECHNOLOGIES63
4.3.3 NAND ROADMAPS AND CHALLENGES - 3D NAND LEVELS W/ STACKS/TIERS 64
4.3.4 3D NAND PROCESS ADVANCES REQUIRED65
4.3.5 MICRON UNVEILS BREAKTHROUGH NVDRAM:
A DUAL-LAYER 32GBIT NON-VOLATILE FERROELECTRIC MEMORY WITH NEAR-DRAM PERFORMANCE 66
4.3.6 ADVANCED LOGIC ROADMAPS AND CHALLENGES – LOGIC TRANSISTOR EST. ROADMAP 67
4.3.7 ADVANCED LOGIC (FOUNDRY) NODE HVM ESTIMATE68
4.3.7.1 THE SEMICONDUCTOR SHOWDOWN: SAMSUNG AND TSMC'S GAA FETS VS. INTEL'S RIBBONFET 69
4.3.8 ADV LOGIC FUTURE TECHNOLOGY CHALLENGES 70
4.3.9 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY72
4.3.9.1 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY – DSA73
4.3.9.2 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY:
CENTURA SCULPTA BY APPLIED MATERIALS:
SHAPING THE FUTURE OF SEMICONDUCTOR MANUFACTURING75
4.3.9.3 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY:
LINE EDGE ROUGHNESS REDUCTION THRU DEPOSITION76
4.3.10 CFET ARCHITECTURE: CFET SCALING ADVANTAGE77
4.3.10.1 CFET ARCHITECTURE: COMPLEMENTARY FETS (CFETS)78
4.3.10.2 CFET ARCHITECTURE: CFET FUTURE PROSPECTS81
4.3.11 INORGANIC EUV RESIST – SPIN ON DEPOSITION83
4.3.11.1 INORGANIC EUV RESIST – ALD DEPOSITED84
4.3.12 SELF ALIGNED MULTI PATTERNING – SADP85
4.3.12.1 SELF ALIGNED MULTI PATTERNING – SAQP86
4.3.12.2 SELF ALIGNED MULTI PATTERNING – PEALD EQUIPMENT87
4.3.12.3 SELF ALIGNED MULTI PATTERNING - CAN SAQP BYPASS EUV BEYOND 7 NM?88
4.3.13 EUV, MULTI PATTERNING AND GEOPOLITICS89
4.3.14 AREA SELECTIVE DEPOSITION (ASD)90
4.3.14.1 AREA SELECTIVE DEPOSITION (ASD) –
TU EINDHOVEN SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT 91
4.3.15 SPECIALTY/EMERGING DIELECTRIC AND APPLICATIONS 92
4.3.16 REGIONAL CONSIDERATIONS – DIELECTRICS93
4.3.17 REGIONAL ASPECTS AND DRIVERS94
4.4 EHS AND TRADE/LOGISTIC ISSUES – METALS, HIGH-K AND DIELECTRICS 96
4.5 ANALYST ASSESSMENT OF DIELECTRIC MARKET TRENDS 97
5 Supply-Side Market Landscape 98
5.1 PRECURSOR MATERIAL MARKET SHARE 99
5.1.1 CURRENT QUARTER ACTIVITY – MERCK 100
5.1.1.1 MERCK101
5.1.2 CURRENT QUARTER ACTIVITY – AIR LIQUIDE 103
5.1.2.1 AIR LIQUIDE104
5.1.3 CURRENT QUARTER ACTIVITY –ENTEGRIS 105
5.1.3.1 ENTEGRIS106
5.1.4 ADEKA107
5.1.4.1 ADEKA108
5.2 MandA ACTIVITY AND PARTNERSHIPS 109
5.3 PLANT CLOSURES 111
5.4 NEW ENTRANTS 112
5.4.1 MSP LAUNCHES TURBO II VAPORIZERS:
NEXT-GEN EFFICIENCY FOR SEMICONDUCTOR FABRICATION 113
5.5 SUPPLIERS OR PARTS/PRODUCT LINES THAT ARE AT RISK OF DISCONTINUATIONS 114
5.6 TECHCET ANALYST ASSESSMENT OF PRECURSOR SUPPLIERS 115
6 Sub Tier Supply Chain, Precursors 116
6.1 SUB-TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW 117
6.1.1 SUB-TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW –
TIER 2 EXAMPLES
NOURYON AND GELEST 118
6.1.2 SUB-TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW –
CHEMICAL and GAS
MANAGEMENT SYSTEMS 119
6.1.3 SUB-TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW –
CHEMICAL
DELIVERY CABINETS 120
6.1.4 SUB-TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW –
VALVE
MANIFOLD BOXES (VMB) 121
6.1.5 SUB-TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW –
BULK SPEC GAS SYSTEMS 122
6.1.6 SUB-TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW –
GAS CABINETS 123
6.1.7 SUB-TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW –
FORMING GAS and DOPANT GAS BLENDERS 124
6.1.8 SUB-TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW CHEMICAL -
MONITORING AND ANALYTICAL SYSTEMS 125
6.2 SUB-TIER MATERIAL CVD and ALD PRECURSOR TRENDS 126
6.3 SUB-TIER MATERIAL INDUSTRIAL VS. SEMICONDUCTOR-GRADE 127
6.4 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER GLOBAL NETWORK MERCK 128
6.5 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER GLOBAL NETWORK AIR LIQUIDE 129
6.6 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER NEWS 130
6.7 SUB-TIER SUPPLY-CHAIN DISRUPTORS 132
6.8 SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT 133
7 Supplier profiles 134
ADEKA CORPORATION
AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER)
AZMAX CO., LTD
CITY CHEMICAL LLC
DNF CO., LTD ...and 20 + more
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List of Tables/Graphs
LIST OF FIGURES
FIGURE 1.1: DIELECTRIC PRECURSOR REVENUE (M USD) FORECAST BY SEGMENT 14
FIGURE 1.2: WW MARKET SHARE - DIELECTRIC PRECURSORS 2023 (U$ 686 M) 17
FIGURE 3.1: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2023) 26
FIGURE 3.2: WORLDWIDE SEMICONDUCTOR SALES 27
FIGURE 3.3: TECHCET’S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSI) 28
FIGURE 3.4: 2023 SEMICONDUCTOR CHIP APPLICATIONS 29
FIGURE 3.5: GLOBAL LIGHT VEHICLE UNIT SALES (IN MILLIONS OF UNITS) 31
FIGURE 3.6: ELECTRIFICATION TREND BY WORLD REGION 32
FIGURE 3.7: AUTOMOTIVE SEMICONDUCTOR PRODUCTION 33
FIGURE 3.8: MOBILE PHONE SHIPMENTS, WW ESTIMATES 34
FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST 35
FIGURE 3.10: TSMC PHOENIX CAMPUS WITH THE 2ND FAB VISIBLE IN THE BACKGROUND 37
FIGURE 3.11: ESTIMATED GLOBAL FAB SPENDING 2023-2028 38
FIGURE 3.12: FAB EXPANSIONS WITHIN THE US 39
FIGURE 3.13: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD 40
FIGURE 3.14: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M) AND Y-O-Y CHANGE 41
FIGURE 3.15: ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP OVERVIEW 42
FIGURE 3.16: DRAM TECHNOLOGY ROADMAP OVERVIEW 43
FIGURE 3.17: 3D NAND TECHNOLOGY ROADMAP OVERVIEW 44
FIGURE 3.18: INTEL OHIO PLANT SITE AS OF FEB. 2024 45
FIGURE 3.19: TECHCET WAFER START FORECAST BY NODE SEGMENTS 48
FIGURE 3.20: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD) 49
FIGURE 4.1: DIELECTRIC PRECURSOR REVENUE (M USD) FORECAST BY SEGMENT 54
FIGURE 4.2: WW MARKET SHARE - DIELECTRIC PRECURSORS 2023 (U$ 686 M) 55
FIGURE 4.3: DIELECTRIC PRECURSOR MARKET REGIONAL ASSESSMENT 2023 56
FIGURE 4.4: END USE APPLICATIONS DRIVING NEW DEVICE PROCESSES 63
FIGURE 4.5: 3D NAND STACKING DRIVES DIELECTRICS AND METALS PRECURSOR VOLUME 64
FIGURE 4.6: 3D NAND PROGRESSION 65
FIGURE 4.7: 32 GB NVDRAM WITH 1T 1C MEMORY LAYERS 66
FIGURE 4.8: GATE STRUCTURE ROADMAP 67
FIGURE 4.9: ADVANCED LOGIC (FOUNDRY) NODE ROAD MAP 68
FIGURE 4.10: RIBBON FET 69
FIGURE 4.11: MONO LAYER NANO SHEETS CHANNELS 71
FIGURE 4.12: NANO IMPRINT LITHOGRAPHY PROCESS FLOW 72
FIGURE 4.13: ALD/ALE ENHANCEMENT OF NANO IMPRINT LITHOGRAPHY 72
FIGURE 4.14: DIRECTED SELF-ASSEMBLY 73
FIGURE 4.15: DSA PATENT FILING BY COMPANY 74
FIGURE 4.16: DSA PATEN FILING SINCE 2023 74
FIGURE 4.17: WHAT IS PATTERN SHAPING? 75
FIGURE 4.18: REFINING EUV PATTERNING BY APPLIED MATERIALS 76
FIGURE 4.19: COMPLEMENTARY FET (CFET) 77
FIGURE 4.20: CFET IMPROVES PERFORMANCE IN TRACK SCALING 77
FIGURE 4.21: MONOLITHIC CFET PROCESS FLOW EXAMPLE 78
FIGURE 4.22: MCFET NEW FEATURE: MIDDLE DIELECTRIC ISOLATION 78
FIGURE 4.23: LOW TEMPERATURE GATE STACK OPTION EXAMPLES 79
FIGURE 4.24: LOW TEMPERATURE SD/CONTACT OPTION EXAMPLES 79
FIGURE 4.25: BSPDN ADVANTAGE: IR DROP REDUCTION 80
FIGURE 4.26: INCREASING NUMBER OF ALD STEPS REQUIRED BY NEXT GENERATION GAA-FET AND CFET 81
FIGURE 4.27: IMEC SUB-1NM TRANSISTOR ROADMAP, 3D-STACKED CMOS 2.0 PLANS 82
FIGURE 4.28: INPRIA EUV MOR 83
FIGURE 4.29: INPRIA SPIN ON INORGANIC RESIST IS MUCH THINNER THAN STANDARD STACKS OF PHOTO RESIST 83
FIGURE 4.30: PATENT FILING FOR MLD DEPOSITED EUV RESIST. SEARCH PERFORMED IN PATBASE 84
FIGURE 4.31: SADP PROCESS FLOW USING ALD SPACER 85
FIGURE 4.32: ONE OF MANY FLAVORS OF SAQP PROCESS FLOW 86
FIGURE 4.33: SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT 91
FIGURE 4.34: SPECIALTY/EMERGING DIELECTRIC APPLICATIONS FOR HETEROGENOUS INTEGRATIONS (APPLIED MATERIALS) 92
FIGURE 4.35: 2023 DIELECTRIC REVENUE SHARE BY REGION 93
FIGURE 5.1: 2023 PRECURSOR MATERIAL SUPPLIER MARKET SHARE BY REVENUE 99
FIGURE 5.2: MERCK ELECTRONICS REVENUE 2022-2023 (M EUR), LEFT. SEMICONDUCTOR SOLUTIONS ANNUAL REVENUE FORECAST (M EUR), RIGHT. 102
FIGURE 5.3: AIR LIQUIDE ELECTRONICS REVENUE FORECAST (M EUR) 104
FIGURE 5.4: THE MS (MATERIAL SOLUTIONS) DIVISION OF ENTEGRIS REVENUE FORECAST 106
FIGURE 5.5: ADEKA REVENUE ELECTRONICS REVENUE FORECAST (100M JPY) 107
FIGURE 6.1: FORMING GAS BLENDER CONFIGURATION 124
FIGURE 6.2: TOP COUNTRIES/REGIONS THAT SUPPLY VERSUM MATERIALS US LLC (PANJIVA APRIL 2024) 128
FIGURE 6.3: TOP COUNTRIES/REGIONS THAT SUPPLY AIR LIQUIDE AMERICA CORP. (PANJEIVA APRIL 2024) 129
FIGURE 6.4: TOP COUNTRIES/REGIONS THAT SUPPLY H.C. STARCK INC. (USA) 130
LIST OF TABLES
TABLE 1.1: DIELECTRIC PRECURSOR REVENUES AND GROWTH RATES 14
TABLE 1.2: ESTIMATED DIELECTRIC PRECURSOR MARKET SHARE BY SUPPLIER 2023 17
TABLE 3.1: GLOBAL GDP AND SEMICONDUCTOR REVENUES 24
TABLE 3.2: WORLD BANK ECONOMIC OUTLOOK (JANUARY 2024) 25
TABLE 3.3: BATTERY ELECTRIC VEHICLE (BEV) REGIONAL TRENDS 32
TABLE 3.4: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES MARKET SPENDING 2023 36
TABLE 4.1: PRECURSORS REVENUE AND GROWTH RATES 51
TABLE 4.2: DIELECTRIC PRECURSOR REVENUES AND GROWTH RATES 54
TABLE 4.3: ESTIMATED DIELECTRIC PRECURSOR MARKET SHARE BY SUPPLIER 2023 55
TABLE 4.4: DIELECTRIC PRECURSOR MARKET REGIONAL ASSESSMENT 2023 56
TABLE 4.5: OVERVIEW OF ANNOUNCED 2023/2024 MATERIAL SUPPLIER INVESTMENTS 59
TABLE 4.6: LEADING EDGE LOGIC DESCRIPTIONS BY NODE (TSMC, INTEL) 69
TABLE 4.7: MULTIPATTERNING AT 7NM BY TSMC 88
TABLE 4.8: SELECTIVE DEPOSITION - SELECTIVELY DEPOSITED MATERIALS 90
TABLE 4.9: REGIONAL PRECURSOR MATERIAL MARKETS 94
TABLE 4.10: REGIONAL PRECURSOR MATERIAL MARKETS, CONTINUED 95
TABLE 5.1: MERCK QUARTER FINANCIALS 100
TABLE 5.2: AIR LIQUIDE CURRENT QUARTER FINANCIALS 103
TABLE 5.3: ENTEGRIS SUPPLIER CURRENT QUARTER FINANCIALS 105
TABLE 6.1: CVD AND ALD PRECURSOR 127
Press Release
TECHCET Projects Strong Precursor Market
San Diego, CA, May 1, 2025: TECHCET — the electronic materials advisory firm providing business and technology information reports that the ALD/CVD precursor market is expected to grow roughly 8% in 2025. Following a dip in wafer starts earlier in 2024, the global market rebounded from USD 1.7 billion to USD 1.9 to end the year. This recovery was largely attributed to advancements in logic devices and a slower recovery in DRAM and NAND wafer starts. Looking ahead, wafer starts for logic devices smaller than 45nm are projected to grow at over 8.6% CAGR through 2029, potentially pushing the market past USD 2.5 billion. More information on market forecasting and trends is included in TECHCET’s Critical Materials Report on ALD/CVD Precursors.
Precursor Market Revenue Trends 2024-2029
Taking a closer look, as the industry advances to the 3nm and 2nm technology nodes, this will fuel strong growth in the ALD/CVD materials market, which are now critical to enabling the smaller, more complex structures of next-generation logic and memory chips. Meanwhile emerging applications beyond traditional semiconductor technologies are opening new opportunities for ALD uses.
Market dynamics are shifting as Samsung Electronics, SK Hynix, and Micron are reportedly planning to drop earlier versions of memory to address stronger opportunities, such as DDR5 and high-bandwidth memory (HBM), to meet the growing demands of AI and high-performance computing applications. Even with geopolitical tensions and resultant shifts in the supply chain, the long-term outlook for the precursor market remains strong, with a projected CAGR of 7.3% through 2029.
