TIMs have been widely adopted in many industries such as consumer electronics, electric vehicle batteries, electric vehicle power electronics, data centers, 5G, advanced semiconductor packaging, space and satellite technologies and advanced driver-assistance systems (ADAS). However, with the rapid growth of many of these sectors and increasing power density, TIMs are facing greater challenges in balancing costs, thermal conductivities, viscosities, dielectric strength, and other physical properties. The specific requirements vary across industries. For instance, TIMs in EV batteries are highly cost-sensitive; TIMs for 5G in the mmWave spectrum ideally need to have both high thermal conductivity and excellent electromagnetic absorbent properties; and TIMs in high-performance applications such as data centers and semiconductor packaging are moving towards higher thermal conductivity using liquid metal or graphene in certain cases. Meanwhile, there are key design transitions in the target applications, such as EV batteries becoming more integrated, data centers and advanced chips trending towards higher powers driven by AI and more compact packaging technologies, the increasing adoption of autonomous driving and challenges in thermal management for ADAS sensors, mmWave in 5G, the transition from Si IGBT to SiC MOSFET for EV power electronics and the higher junction temperature, as well as the hard environment and reliability requirement for space technologies. Trends like these, among others, are expected to drive a revolution in the TIM market.

 

This report from IDTechEx considers the forms, filler materials, and matrix materials of TIM2s along with die-attach materials (TIM1s), benchmarks commercial products, details recent high-performance materials and their commercial successes, and identifies the market trends based on the collaboration and acquisitions of leading TIM suppliers. It also analyzes current TIM applications in fast-growing industries, along with the key drivers and requirements in each of these areas such as electric vehicle batteries, electric vehicle power electronics, data centers, advanced semiconductor packaging (TIM1 and TIM1.5), space and satellite technologies, 5G infrastructure, consumer electronics (smartphones, tablets, and laptops), EMI shielding, and ADAS sensor components (e.g., LiDAR, cameras, etc). In addition, 10-year forecasts of TIM1s (where applicable) and TIM2s in revenue (US$), area (m2, where applicable), mass (kg, where applicable), and TIM unit price (US$) forecasts were given for EV batteries, data centers, consumer electronics, ADAS electronics, advanced semiconductor packaging, and 5G infrastructure.

Electric vehicle (EV) industry is currently the largest target application for thermal interface materials (TIMs) with EV batteries dominating the TIM adoption. With the increasing popularity of EVs, the market demand has been increasing rapidly, and this trend is expected to continue for the upcoming decade. Battery technology, as one of the core technologies in EVs, is also seeing rapid changes. With the increasing demand for long mileage, there is a trend towards higher energy density, reduced weight, faster charging, and fire safety, all of which require effective thermal management and materials to support. Within EV batteries, the property of TIM highly depends on cell formats, thermal management strategies, pack designs, and costs of TIMs. This report conducts extensive research into EV battery designs, covering the transition from modular designs to cell-to-pack designs, CATL Qilin's latest CTP3.0 using inter-cell liquid cooling chambers, and analyzes its impacts on energy density and TIM forms. 10-year TIM area (m2), mass (kg), and revenue (US$) forecasts are provided across multiple vehicle segments (cars, buses, trucks, vans, and two-wheelers) and by TIM form (thermally conductive adhesives, gap fillers, and gap pads).

 

In terms of EV power electronics, the mega trend is the transition from Si IGBT to SiC MOSFETs. This transition leads to a higher junction temperature (175ºC+ or even 200ºC+ for SiC MOSFET compared with up to 150ºC for Si IGBT). This trend imposes a rising demand for high-performance TIMs and die-attach materials. Typical TIM2s for EV power electronics as of early 2025 have a thermal conductivity around 4W/mK, but this is expected to increase over time. Similarly, die-attach materials, due to more stringent requirements, are also seeing transitions from traditional solder alloys to Ag sintering, and this trend will potentially extend to Cu sintering to reduce the cost in the future. IDTechEx's report on "Thermal Interface Materials 2026-2036: Technologies, Markets and Forecasts" conducts comprehensive analysis of TIM1 (die-attach and substrate-attach) and TIM2s in EV power electronics, along with a 10-year granular forecast.

 

Driven by AI, high-performance computing, telecommunication and crypto mining, along with the transition to 2.5D and 3D semiconductor packaging, data centers and chips used for high performance computing and AI are becoming unprecedently powerful and densely packed, leading to a rising difficulty in thermal management. If the heat is not dissipated properly, it can lead to decreased performance, shortened lifespan, and even hardware failure, thereby causing significant technical issues. This report conducts extensive research into data center components and advanced semiconductor packaging architecture, analyzing TIM1s, TIM1.5s, and TIM2s used in commercially available processors, semiconductors, server boards, line cards, switches/supervisors, and power supplies, with a number of case studies including AI GPUs from Nvidia. 10-year TIM area (m2), mass (kg), and revenue (US$) forecasts are provided across key data center components (processors, chipsets, switches, and power supplies) with analysis of the TIM requirements for data center applications with the increasing thermal design power and upcoming transition to direct-to-chip or even immersion cooling. Emerging TIM1 and TIM1.5 options are also included, with 10-year market size forecast of TIM1s and TIM1.5s being used in advanced semiconductor packaging.

 

With the greater demand for autonomous driving and smart interiors (e.g., driver monitoring and occupant monitoring, etc), advanced driver assistance systems (ADAS) are becoming increasingly popular. In ADAS, various electronic components such as sensors, cameras, and processors are used to collect and process data, and make decisions. These components can generate heat during operation, and with the continuous densification of designs, the heat dissipation will become a bigger challenge. If the heat is not properly managed, it can cause damage to the components, thereby affecting sensors' performance. This report provides a detailed analysis of TIM requirements for ADAS LiDAR, cameras, radar, and computers with commercial use-cases and 10-year granular TIM area (m2), mass (kg), and revenue (US$) forecasts.

EMI shielding plays a critical role across many industries ranging from ADAS radar, 5G antenna, to smartphones. One of the exciting segments is 5G. Compared with 4G, 5G uses higher frequencies and shorter wavelengths. The adoption of mmWave and increased frequency shrinks the sizes of antenna and associated electronics, leading to greater heat dissipation challenges. Further to this, a large number of 5G base stations need to be deployed locally because of the inherent short transmission lengths. 5G presents more EMI challenges since the effectiveness of EMI mitigation measures declines with higher frequencies because smaller wavelengths allow energy to escape through gaps in shields. To mitigate this issue, this report analyzes several EMI TIMs that can provide both EMI shielding and high thermal conductivities. In contrast to traditional board-level shields (BLSs), with a layer of TIM inside and outside the shield, a single layer of TIM and EMI absorber can be used directly on the chip to make contact with the heat sink, which not only improves overall thermal performance but also reduces manufacturing complexity.

 

The growing density of infrastructure and power demands in 5G, coupled with technological shifts, creates a substantial market for Thermal Interface Materials (TIMs). This report examines thermal and EMI challenges within 5G infrastructure, presenting current design solutions through teardowns or use cases and outlining future design progressions. It includes updated databases and detailed market forecasts for station size and frequency. Despite nearing the end of its hype cycle, 5G continues to offer significant market opportunities and growth prospects for thermal management solutions.

 

Space and satellite technologies are gaining significant tractions, and in vacuum space environments, thermal management becomes very challenging due to the hard environments. IDTechEx's report covers use cases of TIMs that are approved by NASA to be used in space technologies, along with analysis on the requirements of TIMs being used.

 

In summary, this report is a comprehensive market research report, focusing on thermal interface materials (TIM1, TIM1.5 and TIM2, as well as TIM filler), and a wide range of applications, along with 10-year market size and area forecasts for different applications. IDTechEx forecasts that the market size of TIMs will reach around US$7.5 billion by 2036.

 

Key Aspects

• Forms of TIM2s
• Benchmarking of TIM2 forms, TIM2 filler materials, and TIM2 matrix materials
• Summary and comparison of commercial products by form
• TIM2 Filler: performance and cost comparison
• Advancements in TIM2 formulation: fillers and format
• Drivers for TIM2 improvements in general
• Key industry acquisitions
• Overview of dispensing equipment and requirements
• TIM1s and TIM1.5s:

• Current utilization, requirements, and drivers for TIM, TIM2s, TIM1.5s (where applicable), and TIM1s (where applicable), in key emerging or evolving markets:

• Teardowns (where applicable) and use-cases in the above categories
• Primary information from key companies
• Company profiles