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中小規模の半導体機器メーカ向けニッチ市場と戦略

Niche Markets and Strategies for Small/Mid-size Semiconductor Equipment Companies

半導体プロセスレポートシリーズ

 

出版社 出版年月電子版価格
The Information Network
インフォメーションネットワーク
2020年7月US$4,995
企業ライセンス

サマリー

この調査レポートは、中小規模の企業が勝負できる半導体技術分野を特定しています。

In this report we identify areas of semiconductor-related technologies where a small or mid-sized company can compete against larger competitors. These high-tech applications segmented as those are fabricated on 300mm wafers and those built on non-300mm wafers.

 



目次

Table of Contents

Chapter 1    Introduction    1-1

Chapter 2    Niche Markets for PROCESSES for 300mm Wafers    2-1

2.1    Introduction    2-1
2.2    Wafer Level Processing (WLP)    2-3
2.2.1    Introduction    2-3

2.2.2    Flip Chip/WLP Processing Issues and Trends    2-4

  • Wafer Bumping    2-4
  • Wafer Level Packaging    2-8
  • Pad Redistribution    2-12
  • Wafer Bumping Costs    2-18

2.2.3    Lithography Issues And Trends    2-20
2.2.4    UBM Etch Issues And Trends    2-21

2.2.5    Metallization Issues and Trends    2-25

  • Gold Bumping Metallization    2-25
  • Solder Bumping Metallization    2-27

2.2.6    Analysis of WLP Market    2-29
2.3    3-D TSV    2-32
2.3.1    Insight Into Critical Issues    2-32
2.3.2    Cost Structure    2-33
2.3.3    Critical Processing Technologies    2-40
2.3.4    Evaluation Of Critical Development Segments    2-46
2.3.5    TSV Device Forecast    2-52
2.4    Non-volatile Memory Devices MRAM, RRAM and FeRAM    2-55
2.4.1    Processing Requirements for MRAMs    2-60
2.4.2    Processing Requirements for RRAMs    2-62
2.4.3    Processing Requirements for FeRAMs    2-65
2.4.4    Roadmap for Commercialization    2-67
2.5    Ultrathin Wafers    2-70
2.5.1    Applications for Ultrathin Wafers    2-70
2.5.2    Substrate Thinning    2-71
2.5.3    Backside Metallization Requirements    2-77
2.5.4    Surface Stress Relief    2-79
2.5.5    Ultrathin Wafer Market    2-81

Chapter 3    Niche Markets for EQUIPMENT for SUB 300mm Wafers    3-1

3.1    Introduction    3-1
3.2    MEMs    3-3
3.2.1    The MEMS Market Infrastructure    3-3

3.2.2    Forecast Of The Key Applications And Markets    3-4

  • MEMS Device Market Forecast    3-4
  • MEMS System Market Forecast    3-16

3.2.3    Markets for Equipment and Materials Suppliers    3-19
3.3    HB-LEDs    3-39
3.3.1    Recent Progress in High Brightness LED Technology and Applications    3-39
3.3.2    Processing Equipment    3-48
3.3.3    Materials of Construction    3-60
3.3.4    OLED Manufacturing    3-64
3.3.5    Outlook for the Worldwide OLED Market    3-67
3.3.6    Outlook for the Worldwide HB-LED Market    3-71
3.4    Compound Semiconductors    3-82
3.4.1    GaAs Devices    3-82
3.4.2    Equipment Trends    3-91
3.4.3    Wafer Sizes    3-103
3.4.4    GaAs IC Market Forecast    3-106
3.4.5    Competing Against SiGe    3-108
3.5    Thin Film Read/Write Heads for HDD    3-116
3.5.1    Trends in HDDs    3-116
3.5.2    Recording Head Market Forecast    3-125
3.5.3    Head Processing    3-128
3.5.4    Head Fabrication - CMP, Deposition, Lithography    3-133
3.5.5    CMP Challenges    3-138
3.5.6    Lithography Challenges    3-144
3.6    Bulk Acoustic Wave (BAW)    3-147
3.6.1    Basic Elements of the BAW Device    3-151
3.6.2    AlN Layer Quality Requirements    3-154
3.6.3    Equipment Requirements for BAW and FBAR Filtering Devices    3-158
3.6.4    Bulk Acoustic Wave (BAW) Market    3-159

List of Tables

2.1    Common UBM Stacks For Solder And Gold Bumping    2-5
2.2    Solder Bumping Guidelines    2-7
2.3    ITRS Pin Counts For Different Applications    2-9
2.4    Pillar-WLP CSP Guidelines    2-14
2.5    Pad Redistribution Guidelines    2-17
2.6    UBM Film Etchants    2-24
2.7    Common UBM Stacks For Gold And Solder Bumping    2-26
2.8    WLP Demand By Device (Units)    2-30
2.9    WLP Demand By Device (Wafers)    2-31
2.10    Forecast Of TSV Devices By Wafers    2-53
3.1    MEMS Device Markets    3-5
3.2    MEMS System Markets    3-18
3.3    MEMS Equipment Markets    3-20
3.4    Color, Wavelength Material Of LED    3-41
3.5    Comparison of LED, HB-LED, UHB-LED Characteristics    3-47
3.6    Epitaxy Metrics from Initial Solid-State Lighting Manufacturing R&D Roadmap    3-54
3.7    Process Control Metrics    3-56
3.8    Production Method for Various LEDs    3-61
3.9    GaAs IC Market Forecast    3-107
3.10    Comparison Of Piezoelectric Materials For BAW Applications    3-155

List of Figures

2.1    Solder Bumping Process    2-6
2.2    Pillar-WLPCSP Process    2-13
2.3    Pad Redistribution Process    2-16
2.4    Via First (iTSV) Cost Of Ownership    2-34
2.5    Via First (iTSV) Cost Of Ownership Front And Back Side    2-36
2.6    Via First (iTSV) Process Flow    2-37
2.7    iTSV Versus pTSV Cost Of Ownership    2-38
2.8    Effect Of TSV Depth And Diameter On Cost    2-39
2.9    Illustration Of Bosch Process    2-43
2.10    Process And Equipment Flow For EMC3D Consortium Members    2-47
2.11    Various TSV Integration Schemes    2-49
2.12    Forecast OF TSV Devices By Wafers    2-54
3.1    Operation of LED    3-40
3.2    Market drivers for LED Biz and Applications    3-44
3.3    SSL vs. Classical Technologies    3-45
3.4    LED Performance vs. Traditional Light Sources    3-46
3.5    Pareto Analysis Of SSL Manufacturing Costs    3-51
3.6    Nanoimprint Lithography System    3-59
3.7    Regular LED (white) Front-End Steps    3-62
3.8    Schematic of AMOLED    3-68
3.9    Active Matrix OLED Capacity and Demand Forecast    3-69
3.10    LED Market by Sector    3-80
3.11    Worldwide LED Market Forecast    3-81
3.12    Schematic of GaAs MESFET    3-83
3.13    Schematic of GaAs HEMT Device    3-85
3.14    Schematic of GaAs HBT Device    3-88
3.15    Schematic of GaAs HBT Device    3-90
3.16    pHEMT MMIC Process Flow Chart    3-92
3.17    0.15 Micron 3MI Process Cross Section    3-98
3.18    InGaP HBT Process    3-101
3.19    Worldwide SiGe Market Forecast    3-114
3.20    Hard Disk Drive Roadmap    3-117
3.21    Decrease In Average Price Of Storage    3-118
3.22    Heads Per Drive    3-120
3.23    Increase In Areal Density    3-122
3.24    Market Forecast Of Recording Head Consumption    3-126
3.25    Heads Per Drive Forecast    3-127
3.26    Thin Film Head Structure    3-129
3.27    Critical Features In Thin Film Head Structure    3-130
3.28    Spin Valve Head Structure    3-131
3.29    Cross-Sectional View TFH Stacks    3-134
3.30    Cross-Sectional View Of A TFH Design    3-135
3.31    CMP Slurry System For Tfh Wafer Polishing    3-142
3.32    Critical Feature Trends In Thin Film Heads    3-145
3.33    Application Space For Rf Filters    3-149
3.34    FBAR Diagram    3-152
3.35    BAW-SMR Diagram    3-153
3.36    RF Front-End Filters In Mobile Devices    3-160

 

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