Summary
This report covers the market landscape and supply - chain for Precursors used in semiconductor device fabrication. It includes information about key suppliers, issues/trends in the material supply chain, estimates on supplier market share, and forecast for the material segments.
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Provides market and technical trend information on organic and inorganic precursors, addressing CVD, ALD applications including high κ metal - oxides, barrier layers, metal interconnects, and capping layers, among others.
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Provides focused information for supply - chain managers, process integration and R&D directors, as well as business development and financial analysts
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Covers information about key suppliers, issues/trends in the electronics material supply chain, estimates on supplier market share, and forecast for the electronics material segments
Table of contents
2024 - 2025 ALD/CVD, HI-K AND METAL PRECURSOR
SUPPLY-CHAIN and MARKET ANALYSIS A CRITICAL MATERIALS REPORT(TM)
Table of Contents
EXECUTIVE SUMMARY 12
1.1 PRECURSORS BUSINESS – MARKET OVERVIEW 13
1.2 PRECURSORS MARKET TRENDS IMPACTING 2024 OUTLOOK 14
1.3 5 - YEAR UNIT SHIPMENT FORECAST BY SEGMENT: METAL AND HIGH-K PRECURSORS 15
1.4 PRECURSOR TRENDS 16
1.5 PRECURSOR TECHNOLOGY TRENDS 17
1.6 COMPETITIVE LANDSCAPE METAL and HIGH-K PRECURSORS 18
1.7 PRECURSOR EHS, TRADE, AND/OR LOGISTICS ISSUES/CONCERNS 19
1.8 ANALYST ASSESSMENT OF METAL AND HIGH-K PRECURSORS 20
2 SCOPE, PURPOSE AND METHODOLOGY 21
2.1 SCOPE 22
2.2 METHODOLOGY 23
2.3 OVERVIEW OF OTHER TECHCET CMR(TM) OFFERINGS 24
3 SEMICONDUCTOR INDUSTRY MARKET STATUS and OUTLOOK 25
3.1 WORLDWIDE ECONOMY AND OUTLOOK 26
3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY 28
3.1.2 SEMICONDUCTOR SALES GROWTH 29
3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS 30
3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT 31
3.2.1 ELECTRONICS OUTLOOK 32
3.2.2 AUTOMOTIVE INDUSTRY OUTLOOK 33
3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS 34
3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS 35
3.2.3 SMARTPHONE OUTLOOK 36
3.2.4 PC OUTLOOK 37
3.2.5 SERVERS / IT MARKET 38
3.3 SEMICONDUCTOR FABRICATION GROWTH and EXPANSION 39
3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS 40
3.3.2 NEW FABS IN THE US 41
3.3.3 WW FAB EXPANSION DRIVING GROWTH 42
3.3.4 EQUIPMENT SPENDING TRENDS 43
3.3.5 ADVANCED LOGIC TECHNOLOGY ROADMAPS 44
3.3.5.1 DRAM TECHNOLOGY ROADMAPS 45
3.3.5.2 3D NAND TECHNOLOGY ROADMAPS 46
3.3.6 FAB INVESTMENT ASSESSMENT 47
3.4 POLICY and TRADE TRENDS AND IMPACT 48
3.5 SEMICONDUCTOR MATERIALS OVERVIEW 49
3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028 50
3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028 51
4 MATERIAL MARKETTRENDS 52
4.1 CVD, ALD METAL and HIGH-K AND ADVANCED DIELECTRIC PRECURSORS MARKET TRENDS 53
4.1.1 2023 PRECURSOR MARKET LEADING INTO 2024 54
4.1.2 PRECURSOR MARKET OUTLOOK 55
4.1.3 METAL AND HIGH - K PRECURSORS 5 - YEAR UNIT SHIPMENT FORECAST BY SEGMENT 56
4.2 PRECURSORS SUPPLY CAPACITY AND DEMAND, INVESTMENTS 57
4.2.1 METAL and HIGH - K PRECURSOR PRODUCTION CAPACITY OF TOP SUPPLIERS 58
4.2.2 METAL and HIGH - K PRODUCTION BY REGION 59
4.2.3 ALD/CVD MATERIAL PRODUCTION CAPACITY EXPANSIONS 60
4.2.4 INVESTMENT ANNOUNCEMENTS OVERVIEW 62
4.2.5 PRECURSORS SUPPLY VS. DEMAND BALANCE – OVERVIEW 63
4.3 PRICING TRENDS 64
4.4 TECHNOLOGY TRENDS/TECHNICAL DRIVERS - OUTLINE 65
4.4.1 PRECURSOR GENERAL TECHNOLOGY OVERVIEW and TECHNOLOGY TRENDS 66
4.4.2 CUSTOMER DRIVEN TECHNOLOGIES 67
4.4.3 NAND ROADMAPS AND CHALLENGES - 3D NAND LEVELS W/ STACKS/TIERS 68
4.4.4 3D NAND PROCESS ADVANCES REQUIRED 69
4.4.5 NEW MATERIALS AND ETCH CHEMISTRIES ENABLE 3D NAND SCALING – PF3(G) AND MOO2CL2(S) 70
4.4.6 MOLYBDENUM: THE NEW FRONTIER IN SEMICONDUCTOR METALLIZATION ACCORDING TO LAM RESEARCH 71
4.4.7 DRAM PROCESS ADVANCES REQUIRED 72
4.4.8 DRAM FUTURE TECHNOLOGY CHALLENGES 73
4.4.9 MICRON UNVEILS BREAKTHROUGH NVDRAM: A DUAL - LAYER 32GBIT NON -
VOLATILE FERROELECTRIC MEMORY WITH NEAR - DRAM PERFORMANCE 74
4.4.10 ADVANCED LOGIC ROADMAPS AND CHALLENGES – LOGIC TRANSISTOR EST. ROADMAP 75
4.4.11 ADVANCED LOGIC (FOUNDRY) NODE HVM ESTIMATE 76
4.4.12 ADV LOGIC PROCESS ADVANCES REQUIRED 77
4.4.12.1 THE SEMICONDUCTOR SHOWDOWN: SAMSUNG AND TSMC'S GAA FETS VS. INTEL'S RIBBONFET 78
4.4.13 ADV LOGIC FUTURE TECHNOLOGY CHALLENGES 79
4.4.14 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY 81
4.4.14.1 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY – DSA 82
4.4.14.2 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY:
CENTURA SCULPTA BY APPLIED MATERIALS: SHAPING THE FUTURE OF SEMICONDUCTOR MANUFACTURING 84
4.4.14.3 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY:
LINE EDGE ROUGHNESS REDUCTION THRU DEPOSITION 85
4.4.15 CFET ARCHITECTURE: CFET SCALING ADVANTAGE 86
4.4.15.1 CFET ARCHITECTURE: COMPLEMENTARY FETS (CFETS) 87
4.4.15.2 CFET ARCHITECTURE: CFET FUTURE PROSPECTS 90
4.4.16 INORGANIC EUV RESIST – ALD DEPOSITED 92
4.4.17 MOLECULAR LAYER DEPOSITION (MLD) 93
4.4.17.1 TREND IS MLD COMBINED WITH ALD 94
4.4.17.2 DIFFERENT TYPES OF MLD PRECURSORS AND MATERIALS 95
4.4.17.3 MLD APPLICATIONS 96
4.4.18 AREA SELECTIVE DEPOSITION (ASD) 97
4.4.18.1 AREA SELECTIVE DEPOSITION (ASD) – ADEKA PRESENT ASD HF - PRECURSOR 98
4.4.18.2 AREA SELECTIVE DEPOSITION (ASD) – TU EINDHOVEN SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT 99
4.4.20 SPECIALTY/EMERGING METAL AND APPLICATIONS 100
4.4.21 SPECIALTY/EMERGING HIGH - K AND APPLICATIONS 101
4.5 REGIONAL CONSIDERATIONS – METAL AND HIGH - K 102
4.5.1 REGIONAL ASPECTS AND DRIVERS 103
4.6 EHS AND TRADE/LOGISTIC ISSUES – METALS, HIGH - K AND DIELECTRICS 105
4.6.1 ESH METALS 106
4.6.2 ESH HIGH - K 107
4.6.3 ESH RECYCLING 108
4.7 TRADE/LOGISTICS ISSUES – METAL MATERIALS 109
4.7.1 TRADE/LOGISTICS ISSUES – HIGH - K MATERIALS 110
4.8 ANALYST ASSESSMENT OF HIGH - K MARKET TRENDS 111
4.8.1 ANALYST ASSESSMENT OF METAL MARKET TRENDS 112
5 SUPPLY - SIDE MARKET LANDSCAPE 113
5.1 PRECURSOR MATERIAL MARKET SHARE 114
5.1.1 CURRENT QUARTER ACTIVITY – MERCK 115
5.1.1.1 MERCK 116
5.1.2 CURRENT QUARTER ACTIVITY – AIR LIQUIDE 118
5.1.2.1 AIR LIQUIDE 119
5.1.3 CURRENT QUARTER ACTIVITY –ENTEGRIS 120
5.1.3.1 ENTEGRIS 121
5.1.4 ADEKA 122
5.1.4.1 ADEKA 123
5.2 MandA ACTIVITY AND PARTNERSHIPS 124
5.3 PLANT CLOSURES 126
5.4 NEW ENTRANTS 127
5.4.1 MSP LAUNCHES TURBO II(TM) VAPORIZERS: NEXT - GEN EFFICIENCY FOR SEMICONDUCTOR FABRICATION 128
5.4.2 A NEW ZR PRECURSOR WAFER - SCALE ZIRCONIUM DIOXIDE FILMS 129
5.4.3 ADVANCES IN MOLYBDENUM THIN FILMS: NEW LIQUID PRECURSORS BOOST VAPOR PHASE DEPOSITION 130
5.4.4 HANWHA TO SUPPLY ALD EQUIPMENT FOR MOLYBDENUM DEPOSITION FOR MEMORY APPLICATIONS 131
5.5 SUPPLIERS OR PARTS/PRODUCT LINES THAT ARE AT RISK OF DISCONTINUATIONS 132
5.6 TECHCET ANALYST ASSESSMENT OF PRECURSOR SUPPLIERS 133
6 SUB - TIER SUPPLY - CHAIN, PRECURSORS 134
6.1 SUB - TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW 135
6.1.1 SUB - TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW –
TIER 2 EXAMPLES NOURYON AND GELEST 136
6.1.2 SUB - TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW –
CHEMICAL and GAS MANAGEMENT SYSTEMS 137
6.1.3 SUB - TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW –
CHEMICAL DELIVERY CABINETS 138
6.1.4 SUB - TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW –
VALVE MANIFOLD BOXES (VMB) 139
6.1.5 SUB - TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW –
BULK SPEC GAS SYSTEMS 140
6.1.6 SUB - TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW –
GAS CABINETS 141
6.1.7 SUB - TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW –
FORMING GAS and DOPANT GAS BLENDERS 142
6.1.8 SUB - TIER SUPPLY CHAIN: SOURCES and MARKETS OVERVIEW –
CHEMICAL - MONITORING AND ANALYTICAL SYSTEMS 143
6.2 SUB - TIER MATERIAL CVD and ALD PRECURSOR TRENDS 144
6.3 SUB - TIER MATERIAL INDUSTRIAL VS. SEMICONDUCTOR - GRADE 145
6.4 SEMICONDUCTOR - GRADE SUB - TIER MATERIAL SUPPLIER
GLOBAL NETWORK MERCK 146
6.5 SEMICONDUCTOR - GRADE SUB - TIER MATERIAL SUPPLIER
GLOBAL NETWORK AIR LIQUIDE 147
6.6 SEMICONDUCTOR - GRADE SUB - TIER MATERIAL SUPPLIER NEWS 148
6.7 SUB - TIER SUPPLY - CHAIN: DISRUPTIONS 150
6.8 SUB - TIER SUPPLY - CHAIN PLANT UPDATES 151
6.9 SUB - TIER SUPPLY - CHAIN PLANT UPDATES – HAFNIA AND REO FROM THE DUBBO PROJECT 152
6.10 MINERAL USED IN THE SEMICONDUCTOR INDUSTRY DEPENDENCIES 153
6.11 SUB - TIER SUPPLY - CHAIN PRICING TRENDS - COBALT 154
6.12 SUB - TIER SUPPLY - CHAIN PRICING TRENDS: ZIRCONIUM AND HAFNIUM 156
6.13 SUB - TIER SUPPLY - CHAIN PRICING TRENDS – HAFNIUM 157
6.14 SUB - TIER SUPPLY - CHAIN PRICING TRENDS - GALLIUM 158
6.15 ALUMINUM 160
6.16 TITANIUM 161
6.17 TUNGSTEN 162
6.18 MOLYBDENUM 163
6.19 NIOBIUM AND TANTALUM 164
6.20 RARE EARTHS 165
6.21 SUB - TIER SUPPLY - CHAIN PRICING TRENDS - PGM 166
6.22 SUB - TIER SUPPLY - CHAIN PRICING TRENDS - GERMANIUM 168
6.23 SUB - TIER SUPPLY - CHAIN TECHCET ANALYST ASSESSMENT 170
7 SUPPLIER PROFILES 171
ADEKA CORPORATION
AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER)
AZMAX CO., LTD
CITY CHEMICAL LLC
DNF CO., LTD
…AND 20+ MORE
プレスリリース
2024年8月1日
先端アプリケーションが牽引する半導体ALD/CVD前駆体
Mo、WF6、Co前駆体が大きく成長
2024年8月1日、カリフォルニア州サンディエゴ発：
半導体サプライチェーンの回復力を高めるための材料市場情報を提供するアドバイザリー会社TECHCETは、2024年の半導体金属および酸化物前駆体の売上高が17億米ドルに達し、2023年比で15%増加すると予測している。これは全てのフロントプロセス材料セグメントの中で最も高い成長率である。金属／金属酸化物プリカーサは市場の大半を占め、予想収益は9億7200万米ドル、誘電体プリカーサは合計7億4200万米ドルになると予想される。プリカーサ市場は2023年から2028年にかけて年平均成長率9％で増加すると予測される。市場予測とトレンドに関する詳細情報は、ALD/CVD前駆体に関するTECHCETの新しいCritical Materials Reports（TM) に掲載されている。
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金属および誘電体前駆体市場の収益予測
次世代ロジック、DRAM、3D NANDデバイスに不可欠なGAA FET、EUVリソグラフィ、High-k/メタルゲートトランジスタなどの先端プロセス技術に多額の投資が行われている。プリカーサの収益成長の回復は、AIと先端技術アプリケーションによって牽引されている。さらに、2nmロジックノード以降のバックサイドパワーデリバリのためのメタライゼーションもメタルプリカーサの成長を押し上げている。
モリブデン(Mo)前駆体、特にMoO2Cl2は、その良好な電気特性と次世代デバイスへの応用により、高い成長が予測される。先端デバイス・ノードと強く結びついている他のプリカーサには、コバルト・プリカーサ(CoCOCpとCCTBA)と六フッ化タングステン(WF6)がある。
より持続可能で効率的な生産方法へのシフトは、環境負荷の低減と製造効率の改善に焦点を当てた新しいプレカーサーの開発に影響を及ぼしている。
業界の大手企業は、増大する需要に対応するため、生産能力を拡大している。エア・リキード、メルク、ジェレスト／三菱化学グループなどの企業は、台湾、韓国、米国などの主要地域で生産設備に多額の投資を行っている。
テクセット社は、長年の経験を持ち、半導体業界の中で十分かつ正確に市場や技術動向を分析することのできるエキスパート達によって運営されています。同社がこれまでコンサルタントを委託された企業は多く、材料メー... もっと見る
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