The thin wafer market is projected to grow from USD 11.4 billion in 2022 and is projected to reach USD 20.6 billion by 2027; it is expected to grow at a CAGR of 12.5% from 2022 to 2027.
Reducing sizes of electronic devices, rising adoption of MEMS tech…
Global Non-UV Dicing Tapes Market Size study, By Material Type (PVC (Polyvinyl Chloride), PET (Polyethylene Terephthalate), PO (Polyvinylene copolymer film), Others), By Thickness (85-125 Micron, 126-150 Micron, Below 85 Micron, Above 150 Micron), By Coating Type (Single Sided, Double Sided), By Application (Wafer Dicing, Package Dicing, Others), and Regional Forecasts 2022-2028
Global Semiconductor Manufacturing Equipment Market Size study, By Front-End Equipment (Lithography Equipment, Water Surface Conditioning Equipment, Wafer Cleaning Equipment, Deposition Equipment, Other Front-End Equipment), By Back-End Equipment (Assembly and Packaging, Dicing, Metrology, Bonding, Water Testing), By Fab Facility Equipment (Automation Equipment, Chemical Control Equipment, Gas Control Equipment, Others), By Product Type (Memory, Foundry, Logic, MPU, Discrete, Others), By Dimension (2D ICs, 2.5D ICs, 3D ICs), By Supply Chain Participant (IDM Firms, OSAT Companies, Foundries), and Regional Forecasts 2022-2028
Semiconductor Manufacturing Equipment Market with COVID-19 Impact Analysis by Front-end Equipment, Back-end Equipment, Fab Facility Equipment, Product Type, Dimension, Supply Chain Participant, Region - Global Forecast to 2027
The global wafer level packaging market experienced strong growth during 2015-2020. Looking forward, IMARC Group expects the market to grow at a CAGR of around 11% during 2021-2026. The wafer-level packaging (WLP) refers to a packaging solution used for a…
Non-UV dicing tapes are used for large die sizes in the electronics industry. It is made up of flexible films, which is commonly made up of PVC material.
Market Analysis and Insights: Global and United States Non-UV Dicing Tapes Market
This report focus…
The rapid expansion of semiconductor chip application is one of the primary factors contributing to the growth of the semiconductor packaging and test market in the world. The use of semiconductor chips has expanded broadly with rising demands from variou…
Market Analysis and Insights: Global Semiconductor Wafer Mounting Machine Market
The global Semiconductor Wafer Mounting Machine market is valued at US$ million in 2020. The market size will reach US$ million by the end of 2027, growing at a CAGR of % …
Market Analysis and Insights: Global Wafer Saw Dicing Blades Market
The global Wafer Saw Dicing Blades market is valued at US$ million in 2020. The market size will reach US$ million by the end of 2027, growing at a CAGR of % during 2021-2027.
Global …
この調査レポートは世界のMEMSデバイス、装置、材料市場を調査・分析し、ベンダと半導体製造工場に向けた予測や戦略を提供しています。
A significant portion of MEMS manufacturing technology has come from the IC industry. MEMS devices can be made using silicon…