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 Fan-Out Wafer Level Packaging - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031
The global market for Fan-Out Wafer Level Packaging was estimated to be worth US$ 599 million in 2024 and is forecast to a readjusted size of US$ 1581 million by 2031 with a CAGR of 15.0% during th... もっと見る
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SummaryThe global market for Fan-Out Wafer Level Packaging was estimated to be worth US$ 599 million in 2024 and is forecast to a readjusted size of US$ 1581 million by 2031 with a CAGR of 15.0% during the forecast period 2025-2031.The Fan-Out WLP technique involves cutting and separating the chip and then embedding the chip inside the panel. The procedure is to attach the chip face down to the Carrier, and the chip spacing should conform to the Pitch specification of the circuit design, while the receiver performs Molding to form a Panel. Follow-up will be separation, sealant panel and a vehicle for sealant panel Wafer shape, also called reconstruct Wafer (Reconstituted Wafer), can be widely used standard Wafer process, need is formed on the sealant panel circuit design. Since the area of the sealing panel is larger than that of the chip, not only can I/O contacts be made into the wafer area by Fan-In method; It can also be Fanned Out on a plastic mold to accommodate more I/O contacts. The proliferation of smartphones, tablets, wearables, and IoT devices is driving the need for smaller, lighter, and more power-efficient semiconductor packages. FOWLP offers a thin form factor and reduced package size, making it ideal for compact electronics. As consumer demand for high-performance and aesthetically sleek devices rises, manufacturers are increasingly adopting FOWLP solutions. The rise of 5G smartphones, AR/VR headsets, and gaming consoles requires high-speed, low-power, and high-density semiconductor packages. FOWLP provides improved signal integrity, shorter interconnects, and lower parasitic inductance, which enhance performance for processors, memory modules, and sensors. This trend is a key driver for the adoption of fan-out packaging in advanced mobile and computing applications. Modern electronic devices increasingly integrate multiple functions such as logic, memory, RF components, and sensors within a single package. FOWLP supports heterogeneous integration, allowing multiple dies and components to be packaged together efficiently. This capability enables manufacturers to produce multi-functional, high-performance chips with enhanced thermal management and reliability, fueling market growth. The automotive sector, particularly electric vehicles (EVs) and autonomous vehicles (AVs), is increasingly relying on advanced semiconductor packages for sensors, power management, ADAS (Advanced Driver Assistance Systems), and infotainment systems. FOWLP provides high-density integration and improved electrical performance, making it suitable for automotive applications where space constraints, reliability, and thermal performance are critical. The global shift toward 5G networks and high-speed wireless communication is boosting demand for FOWLP. Fan-out packaging allows efficient routing of high-frequency signals, reduces signal loss, and enhances overall RF performance, making it an attractive solution for 5G transceivers, IoT gateways, and wireless modules. This report aims to provide a comprehensive presentation of the global market for Fan-Out Wafer Level Packaging, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Fan-Out Wafer Level Packaging by region & country, by Type, and by Application. The Fan-Out Wafer Level Packaging market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Fan-Out Wafer Level Packaging. Market Segmentation By Company TSMC ASE Technology Holding Co. JCET Group Amkor Technology Siliconware Technology (SuZhou) Co. Nepes Segment by Type High Density Fan-Out Package Core Fan-Out Package Segment by Application CMOS Image Sensor A Wireless Connection Logic and Memory Integrated Circuits Mems and Sensors Analog and Hybrid Integrated Circuits Others By Region North America United States Canada Asia-Pacific China Japan South Korea Southeast Asia India Australia Rest of Asia-Pacific Europe Germany France U.K. Italy Netherlands Nordic Countries Rest of Europe Latin America Mexico Brazil Rest of Latin America Middle East & Africa Turkey Saudi Arabia UAE Rest of MEA Chapter Outline Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry. Chapter 2: Detailed analysis of Fan-Out Wafer Level Packaging company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc. Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments. Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets. Chapter 5: Revenue of Fan-Out Wafer Level Packaging in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world. Chapter 6: Revenue of Fan-Out Wafer Level Packaging in country level. It provides sigmate data by Type, and by Application for each country/region. Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc. Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry. Chapter 9: Conclusion. Table of Contents1 Market Overview1.1 Fan-Out Wafer Level Packaging Product Introduction 1.2 Global Fan-Out Wafer Level Packaging Market Size Forecast (2020-2031) 1.3 Fan-Out Wafer Level Packaging Market Trends & Drivers 1.3.1 Fan-Out Wafer Level Packaging Industry Trends 1.3.2 Fan-Out Wafer Level Packaging Market Drivers & Opportunity 1.3.3 Fan-Out Wafer Level Packaging Market Challenges 1.3.4 Fan-Out Wafer Level Packaging Market Restraints 1.4 Assumptions and Limitations 1.5 Study Objectives 1.6 Years Considered 2 Competitive Analysis by Company 2.1 Global Fan-Out Wafer Level Packaging Players Revenue Ranking (2024) 2.2 Global Fan-Out Wafer Level Packaging Revenue by Company (2020-2025) 2.3 Key Companies Fan-Out Wafer Level Packaging Manufacturing Base Distribution and Headquarters 2.4 Key Companies Fan-Out Wafer Level Packaging Product Offered 2.5 Key Companies Time to Begin Mass Production of Fan-Out Wafer Level Packaging 2.6 Fan-Out Wafer Level Packaging Market Competitive Analysis 2.6.1 Fan-Out Wafer Level Packaging Market Concentration Rate (2020-2025) 2.6.2 Global 5 and 10 Largest Companies by Fan-Out Wafer Level Packaging Revenue in 2024 2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Fan-Out Wafer Level Packaging as of 2024) 2.7 Mergers & Acquisitions, Expansion 3 Segmentation by Type 3.1 Introduction by Type 3.1.1 High Density Fan-Out Package 3.1.2 Core Fan-Out Package 3.2 Global Fan-Out Wafer Level Packaging Sales Value by Type 3.2.1 Global Fan-Out Wafer Level Packaging Sales Value by Type (2020 VS 2024 VS 2031) 3.2.2 Global Fan-Out Wafer Level Packaging Sales Value, by Type (2020-2031) 3.2.3 Global Fan-Out Wafer Level Packaging Sales Value, by Type (%) (2020-2031) 4 Segmentation by Application 4.1 Introduction by Application 4.1.1 CMOS Image Sensor 4.1.2 A Wireless Connection 4.1.3 Logic and Memory Integrated Circuits 4.1.4 Mems and Sensors 4.1.5 Analog and Hybrid Integrated Circuits 4.1.6 Others 4.2 Global Fan-Out Wafer Level Packaging Sales Value by Application 4.2.1 Global Fan-Out Wafer Level Packaging Sales Value by Application (2020 VS 2024 VS 2031) 4.2.2 Global Fan-Out Wafer Level Packaging Sales Value, by Application (2020-2031) 4.2.3 Global Fan-Out Wafer Level Packaging Sales Value, by Application (%) (2020-2031) 5 Segmentation by Region 5.1 Global Fan-Out Wafer Level Packaging Sales Value by Region 5.1.1 Global Fan-Out Wafer Level Packaging Sales Value by Region: 2020 VS 2024 VS 2031 5.1.2 Global Fan-Out Wafer Level Packaging Sales Value by Region (2020-2025) 5.1.3 Global Fan-Out Wafer Level Packaging Sales Value by Region (2026-2031) 5.1.4 Global Fan-Out Wafer Level Packaging Sales Value by Region (%), (2020-2031) 5.2 North America 5.2.1 North America Fan-Out Wafer Level Packaging Sales Value, 2020-2031 5.2.2 North America Fan-Out Wafer Level Packaging Sales Value by Country (%), 2024 VS 2031 5.3 Europe 5.3.1 Europe Fan-Out Wafer Level Packaging Sales Value, 2020-2031 5.3.2 Europe Fan-Out Wafer Level Packaging Sales Value by Country (%), 2024 VS 2031 5.4 Asia Pacific 5.4.1 Asia Pacific Fan-Out Wafer Level Packaging Sales Value, 2020-2031 5.4.2 Asia Pacific Fan-Out Wafer Level Packaging Sales Value by Region (%), 2024 VS 2031 5.5 South America 5.5.1 South America Fan-Out Wafer Level Packaging Sales Value, 2020-2031 5.5.2 South America Fan-Out Wafer Level Packaging Sales Value by Country (%), 2024 VS 2031 5.6 Middle East & Africa 5.6.1 Middle East & Africa Fan-Out Wafer Level Packaging Sales Value, 2020-2031 5.6.2 Middle East & Africa Fan-Out Wafer Level Packaging Sales Value by Country (%), 2024 VS 2031 6 Segmentation by Key Countries/Regions 6.1 Key Countries/Regions Fan-Out Wafer Level Packaging Sales Value Growth Trends, 2020 VS 2024 VS 2031 6.2 Key Countries/Regions Fan-Out Wafer Level Packaging Sales Value, 2020-2031 6.3 United States 6.3.1 United States Fan-Out Wafer Level Packaging Sales Value, 2020-2031 6.3.2 United States Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031 6.3.3 United States Fan-Out Wafer Level Packaging Sales Value by Application, 2024 VS 2031 6.4 Europe 6.4.1 Europe Fan-Out Wafer Level Packaging Sales Value, 2020-2031 6.4.2 Europe Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031 6.4.3 Europe Fan-Out Wafer Level Packaging Sales Value by Application, 2024 VS 2031 6.5 China 6.5.1 China Fan-Out Wafer Level Packaging Sales Value, 2020-2031 6.5.2 China Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031 6.5.3 China Fan-Out Wafer Level Packaging Sales Value by Application, 2024 VS 2031 6.6 Japan 6.6.1 Japan Fan-Out Wafer Level Packaging Sales Value, 2020-2031 6.6.2 Japan Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031 6.6.3 Japan Fan-Out Wafer Level Packaging Sales Value by Application, 2024 VS 2031 6.7 South Korea 6.7.1 South Korea Fan-Out Wafer Level Packaging Sales Value, 2020-2031 6.7.2 South Korea Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031 6.7.3 South Korea Fan-Out Wafer Level Packaging Sales Value by Application, 2024 VS 2031 6.8 Southeast Asia 6.8.1 Southeast Asia Fan-Out Wafer Level Packaging Sales Value, 2020-2031 6.8.2 Southeast Asia Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031 6.8.3 Southeast Asia Fan-Out Wafer Level Packaging Sales Value by Application, 2024 VS 2031 6.9 India 6.9.1 India Fan-Out Wafer Level Packaging Sales Value, 2020-2031 6.9.2 India Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031 6.9.3 India Fan-Out Wafer Level Packaging Sales Value by Application, 2024 VS 2031 7 Company Profiles 7.1 TSMC 7.1.1 TSMC Profile 7.1.2 TSMC Main Business 7.1.3 TSMC Fan-Out Wafer Level Packaging Products, Services and Solutions 7.1.4 TSMC Fan-Out Wafer Level Packaging Revenue (US$ Million) & (2020-2025) 7.1.5 TSMC Recent Developments 7.2 ASE Technology Holding Co. 7.2.1 ASE Technology Holding Co. Profile 7.2.2 ASE Technology Holding Co. Main Business 7.2.3 ASE Technology Holding Co. Fan-Out Wafer Level Packaging Products, Services and Solutions 7.2.4 ASE Technology Holding Co. Fan-Out Wafer Level Packaging Revenue (US$ Million) & (2020-2025) 7.2.5 ASE Technology Holding Co. Recent Developments 7.3 JCET Group 7.3.1 JCET Group Profile 7.3.2 JCET Group Main Business 7.3.3 JCET Group Fan-Out Wafer Level Packaging Products, Services and Solutions 7.3.4 JCET Group Fan-Out Wafer Level Packaging Revenue (US$ Million) & (2020-2025) 7.3.5 JCET Group Recent Developments 7.4 Amkor Technology 7.4.1 Amkor Technology Profile 7.4.2 Amkor Technology Main Business 7.4.3 Amkor Technology Fan-Out Wafer Level Packaging Products, Services and Solutions 7.4.4 Amkor Technology Fan-Out Wafer Level Packaging Revenue (US$ Million) & (2020-2025) 7.4.5 Amkor Technology Recent Developments 7.5 Siliconware Technology (SuZhou) Co. 7.5.1 Siliconware Technology (SuZhou) Co. Profile 7.5.2 Siliconware Technology (SuZhou) Co. Main Business 7.5.3 Siliconware Technology (SuZhou) Co. Fan-Out Wafer Level Packaging Products, Services and Solutions 7.5.4 Siliconware Technology (SuZhou) Co. Fan-Out Wafer Level Packaging Revenue (US$ Million) & (2020-2025) 7.5.5 Siliconware Technology (SuZhou) Co. Recent Developments 7.6 Nepes 7.6.1 Nepes Profile 7.6.2 Nepes Main Business 7.6.3 Nepes Fan-Out Wafer Level Packaging Products, Services and Solutions 7.6.4 Nepes Fan-Out Wafer Level Packaging Revenue (US$ Million) & (2020-2025) 7.6.5 Nepes Recent Developments 8 Industry Chain Analysis 8.1 Fan-Out Wafer Level Packaging Industrial Chain 8.2 Fan-Out Wafer Level Packaging Upstream Analysis 8.2.1 Key Raw Materials 8.2.2 Raw Materials Key Suppliers 8.2.3 Manufacturing Cost Structure 8.3 Midstream Analysis 8.4 Downstream Analysis (Customers Analysis) 8.5 Sales Model and Sales Channels 8.5.1 Fan-Out Wafer Level Packaging Sales Model 8.5.2 Sales Channel 8.5.3 Fan-Out Wafer Level Packaging Distributors 9 Research Findings and Conclusion 10 Appendix 10.1 Research Methodology 10.1.1 Methodology/Research Approach 10.1.1.1 Research Programs/Design 10.1.1.2 Market Size Estimation 10.1.1.3 Market Breakdown and Data Triangulation 10.1.2 Data Source 10.1.2.1 Secondary Sources 10.1.2.2 Primary Sources 10.2 Author Details 10.3 Disclaimer
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