Summary

The global market for Wafer Grinder (Wafer Thinning Equipment) was estimated to be worth US$ 1042 million in 2024 and is forecast to a readjusted size of US$ 1699 million by 2031 with a CAGR of 7.1% during the forecast period 2025-2031.
Wafer Grinder (Wafer Thinning Equipment) uses a centrally located robot to move a wafer from an input station to a measuring station. Thereafter, the wafer is moved into a grind station and a wash station sequentially. The robot is able to move a wafer from the wash station to either the measuring station for after-grinding measurements or directly to an output station. During grinding of one wafer, a second wafer may be held between the measuring station and the grind station while a ground wafer is moved from the wash station to the measuring station for after-grinding measurements.
The Wafer Grinder (Wafer Thinning Equipment) market, primarily driven by the increasing demand for precision and efficiency in semiconductor manufacturing, is growing rapidly across the globe. Wafer Grinder (Wafer Thinning Equipment)s are integral in wafer thinning processes, where the primary applications include the processing of 200mm and 300mm wafers. Among the various types of Wafer Grinder (Wafer Thinning Equipment)s, the fully automatic Wafer Grinder (Wafer Thinning Equipment)s dominate the market, they have higher automation levels, allowing for increased efficiency and precision, accounting for approximately 52% of the global market share. The most significant application market is for 300mm wafers, which accounts for 83% of the global demand, primarily driven by the advanced semiconductor manufacturing processes that require thinner wafers with high precision. Geographically, the Asia-Pacific (APAC) region holds the largest consumption share, accounting for about 78% of the global market, driven by the robust semiconductor manufacturing ecosystem in countries like China, Japan, South Korea, and Taiwan.
Manufacturers, like Disco, TOKYO SEIMITSU, Okamoto Semiconductor Equipment Division, CETC, G&N, etc. are well-known for the wonderful performance of their Wafer Grinder (Wafer Thinning Equipment) and related services. The top five players account for about 90% of the revenue market in 2024.
Market Drivers:
Technological Advancements in Semiconductor Manufacturing: As the demand for smaller, more powerful, and energy-efficient electronic devices grows, semiconductor manufacturers are continuously advancing their processes to meet these demands. This includes the need for thinner, more precisely engineered wafers, driving the demand for high-performance Wafer Grinder (Wafer Thinning Equipment)s. Fully automatic Wafer Grinder (Wafer Thinning Equipment)s, known for their precision and ability to handle larger volumes, are particularly in demand to meet these stringent manufacturing requirements.
Miniaturization of Electronic Devices: The global trend towards smaller, more compact electronic devices—such as smartphones, wearables, and IoT devices—requires thinner semiconductor wafers. As a result, there is a growing demand for wafer thinning solutions that can maintain high quality while reducing thickness. Fully automatic Wafer Grinder (Wafer Thinning Equipment)s are the preferred solution, as they offer high precision and productivity.
Surge in Semiconductor Demand: The semiconductor industry is experiencing significant growth, driven by the rise in demand for various electronic applications, including computing, communication, and automotive systems. As the industry's focus shifts towards advanced technology nodes, the demand for larger wafers, particularly 300mm wafers, is growing. These trends are contributing to the expansion of the Wafer Grinder (Wafer Thinning Equipment) market, especially in regions such as APAC, which dominate semiconductor manufacturing.
Growth in 300mm Wafer Demand: The 300mm wafer segment is the most significant application for Wafer Grinder (Wafer Thinning Equipment)s, accounting for 83% of the global market share. Larger wafers allow for more chips to be processed at once, reducing manufacturing costs per chip. This increase in 300mm wafer production is a significant growth factor for the Wafer Grinder (Wafer Thinning Equipment) market, as manufacturers need specialized equipment to handle the larger wafers efficiently.
Shift Towards Fully Automated Solutions: Fully automated Wafer Grinder (Wafer Thinning Equipment)s are gaining popularity due to their higher efficiency, reduced labor costs, and the ability to maintain consistency across large batches. As semiconductor manufacturers continue to scale production, automation becomes increasingly essential to meet high-volume production requirements without compromising quality.
Market Restraints:
Despite the strong growth, several factors may restrain the expansion of the Wafer Grinder (Wafer Thinning Equipment) market:
High Initial Investment: Fully automatic Wafer Grinder (Wafer Thinning Equipment)s come with a high initial cost, which could be prohibitive for smaller semiconductor manufacturers or emerging markets with limited capital. Additionally, the cost of maintaining and upgrading these high-tech machines can be a barrier for smaller players who may prefer less expensive, semi-automatic models.
Technological Complexity: Fully automatic Wafer Grinder (Wafer Thinning Equipment)s are highly complex systems that require specialized knowledge to operate, program, and maintain. This could limit the adoption of such systems in regions with a shortage of skilled technicians and engineers. The technical complexity can also result in extended downtime during maintenance or troubleshooting, affecting overall production efficiency.
Conclusion:
The Wafer Grinder (Wafer Thinning Equipment) market is poised for significant growth, driven by advancements in semiconductor manufacturing, the increasing demand for thinner and more precise wafers, and the rise in 300mm wafer processing. Fully automatic Wafer Grinder (Wafer Thinning Equipment)s, which dominate the market with a 52% share, will continue to lead the market due to their higher efficiency and precision.
The APAC region remains the largest consumer of Wafer Grinder (Wafer Thinning Equipment)s, accounting for 78% of the global market. However, despite these strong growth drivers, challenges such as high initial investment costs and technological complexity may pose barriers to market entry for smaller players. Manufacturers will need to innovate and focus on automation, precision, and cost-effective solutions to capitalize on the growing demand for wafer thinning equipment.
In conclusion, the Wafer Grinder (Wafer Thinning Equipment) market offers abundant opportunities for companies that can provide high-quality, efficient, and cost-effective wafer grinding solutions, particularly those that address the increasing demand for 300mm wafers and advanced semiconductor manufacturing processes.
This report aims to provide a comprehensive presentation of the global market for Wafer Grinder (Wafer Thinning Equipment), focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Wafer Grinder (Wafer Thinning Equipment) by region & country, by Level of Automation, and by Application.
The Wafer Grinder (Wafer Thinning Equipment) market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Grinder (Wafer Thinning Equipment).
Market Segmentation
By Company
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
WAIDA MFG
Hunan Yujing Machine Industrial
SpeedFam
TSD
Engis Corporation
NTS
Segment by Level of Automation
Fully Automatic
Semi-Automatic
Segment by Application
200mm Wafer
300mm Wafer
Others
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Wafer Grinder (Wafer Thinning Equipment) manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Level of Automation, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Wafer Grinder (Wafer Thinning Equipment) in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Wafer Grinder (Wafer Thinning Equipment) in country level. It provides sigmate data by Level of Automation, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

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Table of Contents

1 Market Overview
1.1 Wafer Grinder (Wafer Thinning Equipment) Product Introduction
1.2 Global Wafer Grinder (Wafer Thinning Equipment) Market Size Forecast
1.2.1 Global Wafer Grinder (Wafer Thinning Equipment) Sales Value (2020-2031)
1.2.2 Global Wafer Grinder (Wafer Thinning Equipment) Sales Volume (2020-2031)
1.2.3 Global Wafer Grinder (Wafer Thinning Equipment) Sales Price (2020-2031)
1.3 Wafer Grinder (Wafer Thinning Equipment) Market Trends & Drivers
1.3.1 Wafer Grinder (Wafer Thinning Equipment) Industry Trends
1.3.2 Wafer Grinder (Wafer Thinning Equipment) Market Drivers & Opportunity
1.3.3 Wafer Grinder (Wafer Thinning Equipment) Market Challenges
1.3.4 Wafer Grinder (Wafer Thinning Equipment) Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Wafer Grinder (Wafer Thinning Equipment) Players Revenue Ranking (2024)
2.2 Global Wafer Grinder (Wafer Thinning Equipment) Revenue by Company (2020-2025)
2.3 Global Wafer Grinder (Wafer Thinning Equipment) Players Sales Volume Ranking (2024)
2.4 Global Wafer Grinder (Wafer Thinning Equipment) Sales Volume by Company Players (2020-2025)
2.5 Global Wafer Grinder (Wafer Thinning Equipment) Average Price by Company (2020-2025)
2.6 Key Manufacturers Wafer Grinder (Wafer Thinning Equipment) Manufacturing Base and Headquarters
2.7 Key Manufacturers Wafer Grinder (Wafer Thinning Equipment) Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Wafer Grinder (Wafer Thinning Equipment)
2.9 Wafer Grinder (Wafer Thinning Equipment) Market Competitive Analysis
2.9.1 Wafer Grinder (Wafer Thinning Equipment) Market Concentration Rate (2020-2025)
2.9.2 Global 5 and 10 Largest Manufacturers by Wafer Grinder (Wafer Thinning Equipment) Revenue in 2024
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Grinder (Wafer Thinning Equipment) as of 2024)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Level of Automation
3.1 Introduction by Level of Automation
3.1.1 Fully Automatic
3.1.2 Semi-Automatic
3.2 Global Wafer Grinder (Wafer Thinning Equipment) Sales Value by Level of Automation
3.2.1 Global Wafer Grinder (Wafer Thinning Equipment) Sales Value by Level of Automation (2020 VS 2024 VS 2031)
3.2.2 Global Wafer Grinder (Wafer Thinning Equipment) Sales Value, by Level of Automation (2020-2031)
3.2.3 Global Wafer Grinder (Wafer Thinning Equipment) Sales Value, by Level of Automation (%) (2020-2031)
3.3 Global Wafer Grinder (Wafer Thinning Equipment) Sales Volume by Level of Automation
3.3.1 Global Wafer Grinder (Wafer Thinning Equipment) Sales Volume by Level of Automation (2020 VS 2024 VS 2031)
3.3.2 Global Wafer Grinder (Wafer Thinning Equipment) Sales Volume, by Level of Automation (2020-2031)
3.3.3 Global Wafer Grinder (Wafer Thinning Equipment) Sales Volume, by Level of Automation (%) (2020-2031)
3.4 Global Wafer Grinder (Wafer Thinning Equipment) Average Price by Level of Automation (2020-2031)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 200mm Wafer
4.1.2 300mm Wafer
4.1.3 Others
4.2 Global Wafer Grinder (Wafer Thinning Equipment) Sales Value by Application
4.2.1 Global Wafer Grinder (Wafer Thinning Equipment) Sales Value by Application (2020 VS 2024 VS 2031)
4.2.2 Global Wafer Grinder (Wafer Thinning Equipment) Sales Value, by Application (2020-2031)
4.2.3 Global Wafer Grinder (Wafer Thinning Equipment) Sales Value, by Application (%) (2020-2031)
4.3 Global Wafer Grinder (Wafer Thinning Equipment) Sales Volume by Application
4.3.1 Global Wafer Grinder (Wafer Thinning Equipment) Sales Volume by Application (2020 VS 2024 VS 2031)
4.3.2 Global Wafer Grinder (Wafer Thinning Equipment) Sales Volume, by Application (2020-2031)
4.3.3 Global Wafer Grinder (Wafer Thinning Equipment) Sales Volume, by Application (%) (2020-2031)
4.4 Global Wafer Grinder (Wafer Thinning Equipment) Average Price by Application (2020-2031)
5 Segmentation by Region
5.1 Global Wafer Grinder (Wafer Thinning Equipment) Sales Value by Region
5.1.1 Global Wafer Grinder (Wafer Thinning Equipment) Sales Value by Region: 2020 VS 2024 VS 2031
5.1.2 Global Wafer Grinder (Wafer Thinning Equipment) Sales Value by Region (2020-2025)
5.1.3 Global Wafer Grinder (Wafer Thinning Equipment) Sales Value by Region (2026-2031)
5.1.4 Global Wafer Grinder (Wafer Thinning Equipment) Sales Value by Region (%), (2020-2031)
5.2 Global Wafer Grinder (Wafer Thinning Equipment) Sales Volume by Region
5.2.1 Global Wafer Grinder (Wafer Thinning Equipment) Sales Volume by Region: 2020 VS 2024 VS 2031
5.2.2 Global Wafer Grinder (Wafer Thinning Equipment) Sales Volume by Region (2020-2025)
5.2.3 Global Wafer Grinder (Wafer Thinning Equipment) Sales Volume by Region (2026-2031)
5.2.4 Global Wafer Grinder (Wafer Thinning Equipment) Sales Volume by Region (%), (2020-2031)
5.3 Global Wafer Grinder (Wafer Thinning Equipment) Average Price by Region (2020-2031)
5.4 North America
5.4.1 North America Wafer Grinder (Wafer Thinning Equipment) Sales Value, 2020-2031
5.4.2 North America Wafer Grinder (Wafer Thinning Equipment) Sales Value by Country (%), 2024 VS 2031
5.5 Europe
5.5.1 Europe Wafer Grinder (Wafer Thinning Equipment) Sales Value, 2020-2031
5.5.2 Europe Wafer Grinder (Wafer Thinning Equipment) Sales Value by Country (%), 2024 VS 2031
5.6 Asia Pacific
5.6.1 Asia Pacific Wafer Grinder (Wafer Thinning Equipment) Sales Value, 2020-2031
5.6.2 Asia Pacific Wafer Grinder (Wafer Thinning Equipment) Sales Value by Region (%), 2024 VS 2031
5.7 South America
5.7.1 South America Wafer Grinder (Wafer Thinning Equipment) Sales Value, 2020-2031
5.7.2 South America Wafer Grinder (Wafer Thinning Equipment) Sales Value by Country (%), 2024 VS 2031
5.8 Middle East & Africa
5.8.1 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Sales Value, 2020-2031
5.8.2 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Sales Value by Country (%), 2024 VS 2031
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Wafer Grinder (Wafer Thinning Equipment) Sales Value Growth Trends, 2020 VS 2024 VS 2031
6.2 Key Countries/Regions Wafer Grinder (Wafer Thinning Equipment) Sales Value and Sales Volume
6.2.1 Key Countries/Regions Wafer Grinder (Wafer Thinning Equipment) Sales Value, 2020-2031
6.2.2 Key Countries/Regions Wafer Grinder (Wafer Thinning Equipment) Sales Volume, 2020-2031
6.3 United States
6.3.1 United States Wafer Grinder (Wafer Thinning Equipment) Sales Value, 2020-2031
6.3.2 United States Wafer Grinder (Wafer Thinning Equipment) Sales Value by Level of Automation (%), 2024 VS 2031
6.3.3 United States Wafer Grinder (Wafer Thinning Equipment) Sales Value by Application, 2024 VS 2031
6.4 Europe
6.4.1 Europe Wafer Grinder (Wafer Thinning Equipment) Sales Value, 2020-2031
6.4.2 Europe Wafer Grinder (Wafer Thinning Equipment) Sales Value by Level of Automation (%), 2024 VS 2031
6.4.3 Europe Wafer Grinder (Wafer Thinning Equipment) Sales Value by Application, 2024 VS 2031
6.5 China
6.5.1 China Wafer Grinder (Wafer Thinning Equipment) Sales Value, 2020-2031
6.5.2 China Wafer Grinder (Wafer Thinning Equipment) Sales Value by Level of Automation (%), 2024 VS 2031
6.5.3 China Wafer Grinder (Wafer Thinning Equipment) Sales Value by Application, 2024 VS 2031
6.6 Japan
6.6.1 Japan Wafer Grinder (Wafer Thinning Equipment) Sales Value, 2020-2031
6.6.2 Japan Wafer Grinder (Wafer Thinning Equipment) Sales Value by Level of Automation (%), 2024 VS 2031
6.6.3 Japan Wafer Grinder (Wafer Thinning Equipment) Sales Value by Application, 2024 VS 2031
6.7 South Korea
6.7.1 South Korea Wafer Grinder (Wafer Thinning Equipment) Sales Value, 2020-2031
6.7.2 South Korea Wafer Grinder (Wafer Thinning Equipment) Sales Value by Level of Automation (%), 2024 VS 2031
6.7.3 South Korea Wafer Grinder (Wafer Thinning Equipment) Sales Value by Application, 2024 VS 2031
6.8 Southeast Asia
6.8.1 Southeast Asia Wafer Grinder (Wafer Thinning Equipment) Sales Value, 2020-2031
6.8.2 Southeast Asia Wafer Grinder (Wafer Thinning Equipment) Sales Value by Level of Automation (%), 2024 VS 2031
6.8.3 Southeast Asia Wafer Grinder (Wafer Thinning Equipment) Sales Value by Application, 2024 VS 2031
6.9 India
6.9.1 India Wafer Grinder (Wafer Thinning Equipment) Sales Value, 2020-2031
6.9.2 India Wafer Grinder (Wafer Thinning Equipment) Sales Value by Level of Automation (%), 2024 VS 2031
6.9.3 India Wafer Grinder (Wafer Thinning Equipment) Sales Value by Application, 2024 VS 2031
7 Company Profiles
7.1 Disco
7.1.1 Disco Company Information
7.1.2 Disco Introduction and Business Overview
7.1.3 Disco Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2020-2025)
7.1.4 Disco Wafer Grinder (Wafer Thinning Equipment) Product Offerings
7.1.5 Disco Recent Development
7.2 TOKYO SEIMITSU
7.2.1 TOKYO SEIMITSU Company Information
7.2.2 TOKYO SEIMITSU Introduction and Business Overview
7.2.3 TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2020-2025)
7.2.4 TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Product Offerings
7.2.5 TOKYO SEIMITSU Recent Development
7.3 G&N
7.3.1 G&N Company Information
7.3.2 G&N Introduction and Business Overview
7.3.3 G&N Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2020-2025)
7.3.4 G&N Wafer Grinder (Wafer Thinning Equipment) Product Offerings
7.3.5 G&N Recent Development
7.4 Okamoto Semiconductor Equipment Division
7.4.1 Okamoto Semiconductor Equipment Division Company Information
7.4.2 Okamoto Semiconductor Equipment Division Introduction and Business Overview
7.4.3 Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2020-2025)
7.4.4 Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Product Offerings
7.4.5 Okamoto Semiconductor Equipment Division Recent Development
7.5 CETC
7.5.1 CETC Company Information
7.5.2 CETC Introduction and Business Overview
7.5.3 CETC Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2020-2025)
7.5.4 CETC Wafer Grinder (Wafer Thinning Equipment) Product Offerings
7.5.5 CETC Recent Development
7.6 Koyo Machinery
7.6.1 Koyo Machinery Company Information
7.6.2 Koyo Machinery Introduction and Business Overview
7.6.3 Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2020-2025)
7.6.4 Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Product Offerings
7.6.5 Koyo Machinery Recent Development
7.7 Revasum
7.7.1 Revasum Company Information
7.7.2 Revasum Introduction and Business Overview
7.7.3 Revasum Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2020-2025)
7.7.4 Revasum Wafer Grinder (Wafer Thinning Equipment) Product Offerings
7.7.5 Revasum Recent Development
7.8 WAIDA MFG
7.8.1 WAIDA MFG Company Information
7.8.2 WAIDA MFG Introduction and Business Overview
7.8.3 WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2020-2025)
7.8.4 WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Product Offerings
7.8.5 WAIDA MFG Recent Development
7.9 Hunan Yujing Machine Industrial
7.9.1 Hunan Yujing Machine Industrial Company Information
7.9.2 Hunan Yujing Machine Industrial Introduction and Business Overview
7.9.3 Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2020-2025)
7.9.4 Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Product Offerings
7.9.5 Hunan Yujing Machine Industrial Recent Development
7.10 SpeedFam
7.10.1 SpeedFam Company Information
7.10.2 SpeedFam Introduction and Business Overview
7.10.3 SpeedFam Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2020-2025)
7.10.4 SpeedFam Wafer Grinder (Wafer Thinning Equipment) Product Offerings
7.10.5 SpeedFam Recent Development
7.11 TSD
7.11.1 TSD Company Information
7.11.2 TSD Introduction and Business Overview
7.11.3 TSD Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2020-2025)
7.11.4 TSD Wafer Grinder (Wafer Thinning Equipment) Product Offerings
7.11.5 TSD Recent Development
7.12 Engis Corporation
7.12.1 Engis Corporation Company Information
7.12.2 Engis Corporation Introduction and Business Overview
7.12.3 Engis Corporation Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2020-2025)
7.12.4 Engis Corporation Wafer Grinder (Wafer Thinning Equipment) Product Offerings
7.12.5 Engis Corporation Recent Development
7.13 NTS
7.13.1 NTS Company Information
7.13.2 NTS Introduction and Business Overview
7.13.3 NTS Wafer Grinder (Wafer Thinning Equipment) Sales, Revenue, Price and Gross Margin (2020-2025)
7.13.4 NTS Wafer Grinder (Wafer Thinning Equipment) Product Offerings
7.13.5 NTS Recent Development
8 Industry Chain Analysis
8.1 Wafer Grinder (Wafer Thinning Equipment) Industrial Chain
8.2 Wafer Grinder (Wafer Thinning Equipment) Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Wafer Grinder (Wafer Thinning Equipment) Sales Model
8.5.2 Sales Channel
8.5.3 Wafer Grinder (Wafer Thinning Equipment) Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.1.1 Research Programs/Design
10.1.1.2 Market Size Estimation
10.1.1.3 Market Breakdown and Data Triangulation
10.1.2 Data Source
10.1.2.1 Secondary Sources
10.1.2.2 Primary Sources
10.2 Author Details
10.3 Disclaimer