This report describes the semiconductor equipment markets for more than 24 different sectors and profiles 43 leading equipment companies in the U.S., Europe, and Asia. Market shares for each company for each sector are presented, and each sector is forecast.

 

The Semiconductor Industry Association (SIA) announced global semiconductor industry sales totaled $526.8 billion in 2023, a decrease of 8.2% compared to the 2022 total of $574.1 billion, which was the industry’s highest-ever annual total. Sales picked up during the second half of 2023. In fact, fourth-quarter sales of $146.0 billion were 11.6% more than the total from the fourth quarter of 2022 and 8.4% higher than the total from third quarter of 2023. And global sales for the month of December 2023 were $48.6 billion, an increase of 1.5% compared to November 2023 total. Monthly sales are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.

 

On a regional basis, Europe was the only regional market that experienced annual growth in 2023, with sales there increasing 4.0%. Annual sales into all other regional markets decreased in 2023: Japan (-3.1%), the Americas (-5.2%), AsiaPacific/All Other (-10.1%), and China (-14.0%). Sales for the month of December 2023 increased compared to November 2023 in China (4.7%), the Americas (1.8%), and Asia Pacific/All Other (0.3%), but decreased in Japan (-2.4%) and Europe (-3.9%).

 

Several semiconductor product segments stood out in 2023. Sales of logic products totaled $178.5 billion in 2023, making it the largest product category by sales.Memory products were second in terms of sales, totaling $92.3 billion. Microcontroller units (MCUs) grew by 11.4% to a total of $27.9 billion. And sales of automotive ICs grew by 23.7% year-over-year to a record total of $42.2 billion.

 

Industry Trends

• Development of Smaller Semiconductor Features. There has been a push forsmaller, more efficient chips continues, with leading manufacturers movingtowards 5nm, 3nm, and even 2nm process nodes.

• Transition to 3D Device Structures. Foundries are adopting 3D FinFETtransistors. In 2019 the leading logic processes in production were Intel’s 10nmprocess, Samsung’s 7nm process and TSMC’s 7nm optical process (7FF). At theend of 2019, Samsung and TSMC both began risk production of 5nm processes　and both processes were in production in 2020.

• Memory makers are moving to 300-layer 3D NAND and vertical structures fornext generation NAND technology. These trends will require process control with metrology solutions capable of measuring critical dimensions in these 3D　structures that are currently supported only by optical metrology technology.

• Transition to 3D Integration Technology. Three-dimensional (3D) integration ofactive devices, directly connecting multiple IC chips, offers many benefits,including power efficiency, performance enhancements, significant productminiaturization, and cost reduction. It provides an additional way to extendMoore’s law beyond spending ever-increasing efforts to shrink feature sizes. Acritical element in enabling 3D integration is the Through-Silicon Via (TSV); TSVprovides the high-bandwidth interconnection between stacked chips. The TSV　process is beginning to enter production. In the case of TSV, since multiple chipsare connected, the process has to achieve and maintain very high yield levels in order to be economically viable. TSV metrology solutions are required to closely monitor and measure depth, side-wall slope, top and bottom diameter (CD), and bottom curvature.

• There has been a shift towards SiC and GaN materials marks a significant trend　in power electronics and RF applications. These materials offer superior performance in terms of efficiency, heat resistance, and power handling, especially at high voltages and frequencies. This makes them particularly suited for applications in electric vehicles, renewable energy systems, and 5G networks, where these characteristics can lead to more efficient, compact, and reliable systems.

• Increasing Use of Extreme Ultraviolet (EUV) lithography. Lithography. The industry's relentless pursuit of Moore's Law is driving the development of advanced process nodes, now approaching 3nm and looking towards 2nm technologies. Extreme Ultraviolet (EUV) lithography plays a pivotal role in this evolution, enabling the creation of smaller, more complex circuits by allowing for finer feature patterning without the need for complex multi-patterning techniques. This leap in lithography technology is essential for maintaining the pace of semiconductor miniaturization and performance gains.

• New Materials. Since 2012, as features on technology nodes continued to shrink and 3D transistors (FinFET design) were introduced, an increasing number of critical process steps came to rely on the deposition of high-quality dielectric films with exacting thickness, feature coverage, stress, electrical and mechanical requirements.

• Growing of Foundry Manufacturing. As a result of the rising investment needed for semiconductor process development and production as well as the proliferation of different types of semiconductors, semiconductor manufacturing is increasingly being outsourced to large semiconductor contract manufacturers, or foundries. A foundry typically runs several different processes and makes hundreds to thousands of different semiconductor product types in one facility, making the maintenance of a constant high production yield and overall equipment efficiency more difficult to achieve. This trend of shifting to foundries for manufacturing needs has progressed even further during recent years. The challenges associated with foundry in the following years relate to aspects such as: shortening the time to market, reducing costs and monitoring process complexity.

• Advanced Memory Manufacturing. As a result of recent years progress, the NAND market is entering a critical transition phase as NAND technology shifts from traditional 2D planar structures to 3D structures where 2D NAND flash is reaching its practical limit for cost-per-bit reductions and thus major cost reductions in the future will come from the shifting to 3D NAND structures.

• ALD is being incorporated into the volume manufacturing process. We believe that the ALD end-market will still continue to grow as the multi-patterning market will still exist, and ALD demand will be further expanded by new critical layers and applications, with the emergence of EUV continuing to extend chip makers’ roadmap (increasing the range of material and device architecture available.

• There has been a shift towards SiC and GaN materials marks a significant trend in power electronics and RF applications. These materials offer superior performance in terms of efficiency, heat resistance, and power handling, especially at high voltages and frequencies. This makes them particularly suited for applications in electric vehicles, renewable energy systems, and 5G networks, where these characteristics can lead to more efficient, compact, and reliable systems.

• Increasing Use of Extreme Ultraviolet (EUV) lithography. Lithography. The industry's relentless pursuit of Moore's Law is driving the development of advanced process nodes, now approaching 3nm and looking towards 2nm technologies. Extreme Ultraviolet (EUV) lithography plays a pivotal role in this
  evolution, enabling the creation of smaller, more complex circuits by allowing for finer feature patterning without the need for complex multi-patterning techniques. This leap in lithography technology is essential for maintaining the pace of semiconductor miniaturization and performance gains.

• New Materials. Since 2012, as features on technology nodes continued to shrink and 3D transistors (FinFET design) were introduced, an increasing number of critical process steps came to rely on the deposition of high-quality dielectric films with exacting thickness, feature coverage, stress, electrical and mechanical requirements. 

• Growing of Foundry Manufacturing. As a result of the rising investment needed for semiconductor process development and production as well as the proliferation of different types of semiconductors, semiconductor manufacturing is increasingly being outsourced to large semiconductor contract 
  manufacturers, or foundries. A foundry typically runs several different processes and makes hundreds to thousands of different semiconductor product types in one facility, making the maintenance of a constant high production yield and overall equipment efficiency more difficult to achieve. This trend of shifting to foundries for manufacturing needs has progressed even further during recent years. The challenges associated with foundry in the following years relate to aspects such as: shortening the time to market, reducing costs and monitoring process complexity.

2.1 Introduction 2-1

2.2 Foundries 2-2

2.2.1 Foundry Capex Trends 2-2

2.2.2 Foundry Revenue Growth 2-4

2.2.3 Foundry Market Share 2-6

2.2.4 Revenue Growth by Foundry 2-7

2.2.5 Global Foundry / Logic Lithography Demand 2-8

2.2.6 Global Foundry Equipment Demand By Type 2-8

2.2.7 TSMC Wafer Price By Node 2-8

2.2.8 Foundry Technology Linewidth Roadmap 2-15

2.2.9 Capacity trend by linewidth 2-15

2.2.10 Capacity ratio by region 2-15

2.3 DRAM 2-20

2.3.1 Present and Future Capacity of DRAM by Manufacturer 2-20

2.3.2 DRAM Revenue Demand Forecast By Application 2-20

2.3.3 DRAM Market Shares 2-24

2.3.4 DRAM Capex 2-25

2.4 NAND 2-27

2.4.1 NAND Revenue Demand Forecast By Applications 2-27

2.4.2 NAND Market Shares 2-31

2.4.3 3D NAND Capacity 2-31

2.5 China 2-35

2.5.1 China’s Semiconductor Infrastructure 2-35

2.5.2 China’s Semiconductor Market 2-36

2.5.3 China’s IC Production 2-37

2.5.4 China’s IC Consumption 2-41

2.5.5 China’s IC Production/Consumption Ratio 2-41

2.5.6 China’s IC Import Requirements 2-41

2.5.7 China’s IC Supply/Demand 2-41

2.5.8 China’s IC Fab Capacity 2-46

2.5.9 China’s IC Fab Capacity by Region 2-46

2.5.10 China’s 8- And 12-Inch Fabs and Foundries 2-46

2.5.11 China’s IC Fab Capacity by Wafer Size 2-46

2.5.12 China’s IC Fab Capacity by Geometry 2-46

2.5.13 China’s IC Production by Type 2-53

 

3.1 AMHS Market Shares and Forecast 3-1

3.2 CMP Market Shares and Forecast 3-4

3.3 Clean Market Shares and Forecast 3-7

3.3.1 Plasma Strip 3-8

3.3.2 Spray Processors 3-11

3.3.3 Wet Stations 3-14

3.4 Deposition Market Shares and Forecast 3-17

3.4.1 ALD 3-18

3.4.2 Epitaxy 3-21

3.4.3 MOCVD 3-24

3.4.4 LPCVD (non-tube) 3-27

3.4.5 LPCVD (tube) 3-30

3.4.6 PECVD 3-33

3.4.7 PVD 3-36

3.5 Ion Implantation Market Shares and Forecast 3-39

3.6 Lithography Market Shares and Forecast 3-42

3.6.1 Direct-Write E-Beam Lithography 3-43

3.6.2 Mask-Making Lithography 3-46

3.6.3 Steppers 3-49

3.7 Oxidation/Diffusion Market Shares and Forecast 3-52

3.8 Photoresist Processing (Track) Market Shares and Forecast 3-55

3.9 RTP Market Shares and Forecast 3-58

3.10 Plasma Etch Market Shares and Forecast 3-61

3.10.1 Dielectric 3-62

3.10.2 Conductor 3-65

3.11 Process Control Market Shares and Forecast 3-68

3.11.1 Lithography Metrology 3-69

3.11.2 Thin-Film Metrology 3-72

3.11.3 Wafer Inspection and Defect Review 3-75

 

4.1 Applied Materials 4-1

4.1.1 Business Sectors Covered In The Market Analysis Chapter 4-1

4.1.2 Company Profile 4-2

4.1.3 Company Financials 4-12

4.2 Axcelis Technologies 4-13

4.1.2 Business Sectors Covered In The Market Analysis Chapter 4-13

4.2.2 Company Profile 4-13

4.2.3 Company Financials 4-16

4.3 KLA 4-17

4.3.1 Business Sectors Covered In The Market Analysis Chapter 4-17

4.3.2 Company Profile 4-17

4.3.3 Company Financials 4-19

4.4 Lam Research 4-20

4.4.1 Business Sectors Covered In The Market Analysis Chapter 4-20

4.4.2 Company Profile 4-20

4.4.3 Company Financials 4-27

4.5 Mattson Technology 4-28

4.5.1 Business Sectors Covered In The Market Analysis Chapter 4-28

4.5.2 Company Profile 4-28

4.5.3 Company Financials 4-30

4.6 Opto Innovation 4-31

4.6.1 Business Sectors Covered In The Market Analysis Chapter 4-31

4.6.2 Company Profile - Nanometrics 4-31

4.6.3 Sectors Covered In The Market Analysis Chapter 4-35

4.6.4 Company Profile – Rudolph Technologies 4-35

4.6.5 Company Financials 4-38

4.7 Veeco 4-39

4.7.1 Business Sectors Covered In The Market Analysis Chapter 4-39

4.7.2 Company Profile 4-39

4.7.3 Company Financials 4-42

 

5.1 Aixtron 5-1

5.1.1 Business Sectors Covered In The Market Analysis Chapter 5-1

5.1.2 Company Profile 5-1

5.1.3 Company Financials 5-3

5.2 ASM International 5-4

5.2.1 Business Sectors Covered In The Market Analysis Chapter 5-4

5.2.2 Company Profile 5-4

5.2.3 Company Financials 5-7

5.3 ASML 5-8

5.3.1 Business Sectors Covered In The Market Analysis Chapter 5-8

5.3.2 Company Profile 5-8

5.3.3 Company Financials 5-12

5.4 Carl Zeiss 5-13

5.4.1 Business Sectors Covered In The Market Analysis Chapter 5-13

5.4.2 Company Profile 5-13

5.4.3 Company Financials 5-15

5.5 Camtek 5-16

5.5.1 Business Sectors Covered In The Market Analysis Chapter 5-16

5.5.2 Company Profile 5-16

5.5.3 Company Financials 5-18

5.6 EV Group 5-19

5.6.1 Business Sectors Covered In The Market Analysis Chapter 5-19

5.6.2 Company Profile 5-19

5.6.3 Company Financials 5-21

5.7 LPE 5-22

5.7.1 Business Sectors Covered In The Market Analysis Chapter 5-22

5.7.2 Company Profile 5-22

5.7.3 Company Financials 5-22

5.8 Mycronic 5-23

5.8.1 Business Sectors Covered In The Market Analysis Chapter 5-23

5.8.2 Company Profile 5-23

5.8.3 Company Financials 5-24

5.9 Nova Measuring Instruments9 5-25

5.9.1 Business Sectors Covered In The Market Analysis Chapter 5-25

5.9.2 Company Profile 5-25

5.9.3 Company Financials 5-29

5.10 Oerlikon / Evatec 5-30

5.10.1 Business Sectors Covered In The Market Analysis Chapter 5-30

5.10.2 Company Profile 5-30

5.10.3 Company Financials 5-31

5.11 Semilab 5-32

5.11.1 Business Sectors Covered In The Market Analysis Chapter 5-32

5.11.2 Company Profile 5-32

5.11.3 Company Financials 5-33

 

6.1 ACM Research 6-1

6.1.1 Business Sectors Covered In The Market Analysis Chapter 6-1

6.1.2 Company Profile 6-1

6.1.3 Company Financials 6-3

6.2 Advantest 6-4

6.2.1 Business Sectors Covered In The Market Analysis Chapter 6-4

6.2.2 Company Profile 6-4

6.2.3 Company Financials 6-5

6.3 AMEC 6-8

6.3.1 Business Sectors Covered In The Market Analysis Chapter 6-8

6.3.2 Company Profile 6-8

6.3.3 Company Financials 6-9

6.4 Avaco 6-10

6.4.1 Business Sectors Covered In The Market Analysis Chapter 6-10

6.4.2 Company Profile 6-10

6.4.3 Company Financials 6-11

6.5 Canon 6-12

6.5.1 Business Sectors Covered In The Market Analysis Chapter 6-12

6.5.2 Company Profile 6-12

6.5.3 Company Financials 6-14

6.5.6 Canon Anelva 6-16

6.6.1 Business Sectors Covered In The Market Analysis Chapter 6-16

6.6.2 Company Profile 6-16

6.6.3 Company Financials 6-17

6.7 Daifuku 6-18

6.7.1 Business Sectors Covered In The Market Analysis Chapter 6-18

6.7.2 Company Profile 6-18

6.7.3 Company Financials 6-19

6.8 Ebara 6-20

6.8.1 Business Sectors Covered In The Market Analysis Chapter 6-20

6.8.2 Company Profile 6-20

6.8.3 Company Financials 6-22

6.9 Eugene Technology 6-24

6.9.1 Business Sectors Covered In The Market Analysis Chapter 6-24

6.9.2 Company Profile 6-24

6.9.3 Company Financials 6-25

6.10 Hitachi High-Technologies 6-26

6.10.1 Business Sectors Covered In The Market Analysis Chapter 6-26

6.10.2 Company Profile 6-26

6.1.3 Company Financials 6-28

6.10 Hitachi Kokusai Electric 6-29

6.11.1 Business Sectors Covered In The Market Analysis Chapter 6-29

6.11.2 Company Profile 6-29

6.11.3 Company Financials 6-30

6.12 Hwatsing 6-31

6.12.1 Business Sectors Covered In The Market Analysis Chapter 6-31

6.12.2 Company Profile 6-31

6.12.3 Company Financials 6-31

6.13 JEOL 6-32

6.13.1 Business Sectors Covered In The Market Analysis Chapter 6-32

6.13.2 Company Profile 6-32

6.13.3 Company Financials 6-33

6.14 Jusung Engineering 6-33

6.14.1 Business Sectors Covered In The Market Analysis Chapter 6-34

6.14.2 Company Profile 6-34

6.14.3 Company Financials 6-35

6.15 KC Tech 6-36

6.15.1 Business Sectors Covered In The Market Analysis Chapter 6-36

6.15.2 Company Profile 6-36

6.15.3 Company Financials 6-37

6.16 Lasertec 6-38

6.16.1 Business Sectors Covered In The Market Analysis Chapter 6-38

6.16.2 Company Profile 6-38

6.16.3 Company Financials 6-39

6.17 Murata Machinery 6-40

6.17.1 Business Sectors Covered In The Market Analysis Chapter 6-40

6.17.2 Company Profile 6-40

6.17.3 Company Financials 6-41

6.18 Murata Machinery 6-42

6.18.1 Business Sectors Covered In The Market Analysis Chapter 6-42

6.18.2 Company Profile 6-42

6.18.3 Company Financials 6-44

6.19 Nikon 6-45

6.19.1 Business Sectors Covered In The Market Analysis Chapter 6-45

6.19.2 Company Profile 6-45

6.19.3 Company Financials 6-46

6.20 Nippon Sanso 6-48

6.20.1 Business Sectors Covered In The Market Analysis Chapter 6-48

6.20.2 Company Profile 6-48

6.20.3 Company Financials 6-49

6.21 Nissin Ion Equipment 6-50

6.21.1 Business Sectors Covered In The Market Analysis Chapter 6-50

6.21.2 Company Profile 6-50

6.21.3 Company Financials 6-50

6.22 NuFlare Technology 6-51

6.22.1 Business Sectors Covered In The Market Analysis Chapter 6-51

6.22.2 Company Profile 6-51

6.22.3 Company Financials 6-52

6.23 Piotech 6-53

6.23.1 Business Sectors Covered In The Market Analysis Chapter 6-53

6.23.2 Company Profile 6-53

6.23.3 Company Financials 6-53

6.24 PSK 6-54

6.24.1 Business Sectors Covered In The Market Analysis Chapter 6-54

6.24.2 Company Profile 6-54

6.24.3 Company Financials 6-55

6.25 Raintree Scientific Instruments 6-56

6.25.1 Business Sectors Covered In The Market Analysis Chapter 6-56

6.25.2 Company Profile 6-56

6.25.3 Company Financials 6-57

6.26 Screen Semiconductor Solutions 6-58

6.26.1 Business Sectors Covered In The Market Analysis Chapter 6-58

6.26.2 Company Profile 6-58

6.26.3 Company Financials 6-60

6.27 SEMES 6-61

6.27.1 Business Sectors Covered In The Market Analysis Chapter 6-61

6.27.2 Company Profile 6-61

6.27.3 Company Financials 6-62

6.28 SEN 6-63

6.28.1 Business Sectors Covered In The Market Analysis Chapter 6-63

6.28.2 Company Profile 6-63

6.28.3 Company Financials 6-63

6.29 TES 6-64

6.29.1 Business Sectors Covered In The Market Analysis Chapter 6-64

6.29.2 Company Profile 6-64

6.29.3 Company Financials 6-65

6.30 Tokyo Electron 6-66

6.30.1 Business Sectors Covered In The Market Analysis Chapter 6-66

6.30.2 Company Profile 6-66

6.30.3 Company Financials 6-69

6.31 Tokyo Seimitsu 6-70

6.31.1 Business Sectors Covered In The Market Analysis Chapter 6-70

6.31.2 Company Profile 6-70

6.31.3 Company Financials 6-71

6.32 Topcon Technohouse 6-72

6.32.1 Business Sectors Covered In The Market Analysis Chapter 6-72

6.32.2 Company Profile 6-72

6.32.3 Company Financials 6-72

6.33 Toray Engineering 6-73

6.33.1 Business Sectors Covered In The Market Analysis Chapter 6-73

6.33.2 Company Profile 6-73

6.33.3 Company Financials 6-74

6.34 Ulvac 6-75

6.34.1 Business Sectors Covered In The Market Analysis Chapter 6-75

6.34.2 Company Profile 6-75

6.34.3 Company Financials 6-76

6.35 Ushio 6-77

6.35.1 Business Sectors Covered In The Market Analysis Chapter 6-77

6.35.2 Company Profile 6-77

6.35.3 Company Financials 6-77

6.36 Wonik IPS 6-78

6.36.1 Business Sectors Covered In The Market Analysis Chapter 6-78

6.36.2 Company Profile 6-78

6.36.3 Company Financials 6-78