シリコンウェハーの市場とサプライチェーン：半導体デバイスプロセス用途

サマリー

この調査レポートは半導体デバイス処理向けシリコンウエハー産業について、ポリシリコンから最終使用量までの市場全体とサプライチェーンを調査しています。市場シェア・予測、サプライヤー情報に加え、SOIがシリコンウエハー市場に与える影響についても解説しています。

主な掲載内容（目次より抜粋）

1. エグゼクティブサマリー
2. 調査範囲
3. 市場展望
4. 材料動向
5. サプライヤの市場環境
6. サブサプライヤの材料サプライヤチェーン
7. サプライヤ情報

Techcet’s Silicon Wafer Report looks at the full market and supply chain of the silicon wafer industry, from polysilicon through end usage volumes. Market shares and forecast are provided as well as supplier profiles. In addition, the influence of SOI on this market is also included.

目次

Table of Contents

1 Executive Summary .......................................... 7

1.1 Highlight Material Segment Business Growth Overview ................... 7
1.2 Highlight Material Segment Market Trends .......................... 7
1.3 Highlight Material Segment Technology Trends ........................ 10
1.4 5-Year Material Segment Forecast ................................. 11
1.5 Analyst Assessment ......................................... 12

2 SCOPE .................................................. 14

2.1 Scope - Overview ........................................... 14
2.2 Purpose .................................................. 14
2.3 Methodology ................................................ 15
2.4 Brief overview of other TECHCET Reports ............................ 15

3 Market Outlook .......................................... 16

3.1 Summary of Economic Outlook and Geo-political News ................. 16
3.2 3.2 End Market Drivers ........................................ 22
3.3 3.3 Semiconductor Device Outlook ............................... 28
3.4 3.4 Summary of Equipment Spending/Capital Investments ............... 30
3.5 Overall China Market News & Trends............................... 34
3.6 TECHCET 5-Year Wafer Start Forecast ............................ 36
3.7 Semiconductor Market Overview Summary .......................... 37

4 Material Segment Trends ..................................... 39

4.1 Fab Material Supply/Demand ................................... 39
4.1.2 Current Market Assessment .................................... 49
4.1.3 Leading & Influential Supplier Synopsis ........................... 50
4.1.3.1 GlobalWafers ................................................ 51
4.1.3.2 SEH ..................................................... 52
4.1.3.3 Siltronic ...................................................... 53
4.1.3.4 Sumco .................................................... 55
4.1.3.5 SOITEC .................................................. 56
4.1.3.6 Wafer Works ................................................. 56
4.1.3.7 Okmetic .................................................. 57
4.1.3.8 Formosa Sumco Technology ...................................... 57
4.2 Raw Material Shortages and Supply Chain Constraints .................. 57
4.3 Technical Drivers & Challenges .................................. 63
4.3.14.3.14.3.14.3.14.3.1 Material Trends for the Leading Edge .............................. 63
4.3.2 Trends/Impact/Status of Legacy Materials .......................... 65
4.3.3 Other Wafer Materials- SiC................................... 67
4.4 Regional Trends/Drivers ........................................ 69
4.5 EHS and Logistics Issues ...................................... 72
4.6 Packaging and Shipping Trends/Topics ............................. 73

5 Supplier Market Landscape .................................... 74

5.1 M&A Activity ................................................ 74
5.2 New Plants/New Entrants....................................... 75
5.3 Recently Closed or ”To Be” Closed Plants ........................... 77
5.4 Suppliers or Parts/Product Lines at Risk of Discontinuance or Capacity Reductions/Constraints ... 77
5.4.1 Suppliers or Parts/Product Lines at Risk of Discontinuance.............. 77
5.4.2 Capacity Reductions/Constraints ............................... 78
5.5 Materials Market Size & Forecast .................................. 79
5.5.1 Wafer Forecasts By Segments ................................ 84
5.5.2 Wafer Pricing Trends ...................................... 88

6 Sub-tier Material Supply Chain ................................. 90

6.1 Raw Material Source and Status ................................. 90
6.1.1 Other Markets ........................................... 93
6.1.2 Supply Chain Disruptions/Constraints .............................. 94
6.1.3 M & A Activity ............................................ 95
6.1.4 Logistic Issues .......................................... 95
6.1.5 New Entrants............................................. 95
6.1.6 Recently Closed ”To Be” Closed Plants ........................... 97
6.1.7 TECHCET Analyst Assessment ................................. 97
6.2 Raw Material Pricing Trends/Price ................................ 98
6.3 TECHCET Analyst Assessment .................................. 98

7 Supplier Profiles ........................................... 99

7.1 Advanced Silicon Technology (AST) ................................ 99
7.1.1 TECHCET Analyst Assessment ............................... 101
7.2 ESWIN BOE................................................ 101
7.3 Ferrotec ................................................ 104
7.4 Formosa-Sumco Technology .................................... 107
7.5 GlobalWafers ............................................. 108
7.6 Gritek .................................................... 112
7.7 JRH QL Electronics ........................................ 114
7.8 Okmetic ................................................ 117
7.9 Shin-Etsu Handotai (SEH) .................................... 119
7.10 Siltronic A.G. ............................................. 124
7.11 SK Siltron ............................................... 128
7.12 SOITEC ................................................ 130
7.13 Sumco .................................................. 131
7.14 Wafer Works .............................................. 134
7.15 Wafer Works .............................................. 139
7.16 Zhonghuan Semiconductor ................................... 139
7.17 Zing Semiconductor ....................................... 142

Appendix A Silicon Wafer Manufacturing Overview ..................... 147

A.1 Crystal Growth .............................................. 147
A.2 Modifications .............................................. 148
A.3 Value-Added Variations ........................................ 149
Appendix B Advanced Geometry Focus Characteristics .................. 152

B.1 LPD Size and Count Reduction.................................. 152
B.2 Wafer Flatness .............................................. 153
B.3 SOI ...................................................... 154

List of Figures

Figure 1.1: 300mm Wafer Inventory ............................. 8
Figure 1.2: Silicon Area Shipments .............................. 12
Figure 3.1: 2018 Global Economy and the Electronics Supply Chain ........... 17
Figure 3.2: WW Semiconductor Sales ............................. 18
Figure 3.3: Global Purchasing Managers Index ...................... 19
Figure 3.4: Global Electronics Production Annual Growth ................. 22
Figure 3.5: Global Electronics Production Annual Growth ................. 23
Figure 3.6: Automotive Electronic Content Growth .................... 26
Figure 3.7: Automotive Semiconductor Market Growth .................... 27
Figure 3.8: 2019 Semiconductor Revenue Growth Forecasts ............... 28
Figure 3.9: 2019 Semiconductor Market Size by Device Segment ............ 29
Figure 3.10: Semiconductor Device Unit Growth ....................... 30
Figure 3.11: 200 mm Fab Capacity Outlook to 2022 ..................... 34
Figure 3.12: China IC Production Share and Consumption Trends .............. 35
Figure 3.13: TECHCET Wafer Starts by Technology Node and Device Type ....... 38
Figure 4.1: Worldwide Quarterly Wafer Shipments .................... 43
Figure 4.2: Q4 vs. Q3 Silicon Shipment Growth Change ................... 43
Figure 4.3: 300 mm Wafer Inventory ............................. 45
Figure 4.4: 200 mm Wafer Inventory ............................. 45
Figure 4.5: Quarterly Wafer Shipments through 2019 ................... 47
Figure 4.6: Q1 vs. Q4 Silicon Shipment Growth Change ................... 48
Figure 4.7: Quarterly Wafer Shipments by Diameter through 2019 ............ 49
Figure 4.8: Wafer Supply Capacity and Demand ....................... 58
Figure 4.9: SiC Device Performance Range ........................ 67
Figure 4.10: Epitaxial SiC Demand Forecast .......................... 68
Figure 4.11: Regional Fab Capacity Share by Diameter .................... 70
Figure 5.1: Silicon Wafer Supply/Demand Outlook .................... 79
Figure 5.2: Worldwide Silicon Wafer Revenues ...................... 80
Figure 5.3: SOI Revenues by Diameter ........................... 81
Figure 5.4: SOI Wafer Shipments by Diameter ...................... 81
Figure 5.5: Estimated 2017 Silicon Wafer Market Share by Revenue .......... 82
Figure 5.6: Estimated 2018 Silicon Wafer Market Share by Revenue .......... 82
Figure 5.7: Total Wafer Shipment Area Forecast through 2024 ............... 83
Figure 5.8: Worldwide Silicon Wafer Revenue Forecast .................... 84
Figure 5.9: Total Wafer Shipment Forecast by Diameter .................. 85
Figure 5.10: Worldwide Epitaxial Wafer Shipment Forecast ................. 86
Figure 5.11: SOI Wafer Count Forecast .......................... 87
Figure 5.12: SOI Wafer Revenue Forecast ......................... 87
Figure 5.13: Markets for SOI ................................ 88
Figure 5.14: Aggregated Wafer Pricing Trends by Diameter ................ 89
Figure 6.1: 2018 Polysilicon Market Share .......................... 91
Figure 6.2: Polysilicon Demand by Semiconductor and Solar ............... 93
Figure 6.3: OCI Polysilicon Capacity Roadmap ....................... 96
Figure 6.4: Polysilicon Spot Price Trends ............................ 98
Figure A.0.1 Crystal Growth Methodologies ......................... 148
Figure A.0.2 Crystal Slicing Methodologies .......................... 149
Figure A.0.3 Double-Sided Polishing Methodology ...................... 150
Figure A.0.4 Epitaxial Reactors for Value-Added Layer Extension ............. 151
Figure B.0.1 Wafer Yield Impacts by Zone .......................... 154
Figure B.0.2 Bonded Wafer SOI Process Used by SOITEC ................. 155
Figure B.0.3 Value-Added Wafer Sample Cross-Sections ................ 156

List of Tables

Table 1-1: Device Technology Trends & Issues...................... 11
Table 2-1: 2019 TECHCET Critical Material Reports ...................... 15
Table 3-1: Global GDP and Semiconductor Revenues ................... 16
Table 3-2: IMF World Economic Outlook ............................ 20
Table 3-3: World Bank GDP Forecast .............................. 21
Table 3-4: Worldwide IT Spending Forecast (Billions of U.S. Dollars).......... 23
Table 3-5: Smartphone Vendor Shipments (Millions of Units) .............. 24
Table 3-6: VLSI Research Semiconductor Revenue by Segment .............. 29
Table 3-7: 2019 Semiconductor Equipment Outlook ..................... 31
Table 3-8: Top IDM and Foundry Capex Spenders ($ Billions, ranked by 2018) .... 31
Table 3-9: 2019 Investment Plans for Selected Device Companies ............. 32
Table 4-1: Estimated Wafer Starts, Installed Fab Capacity, and Fab Utilization ..... 39
Table 4-2: Comparison of CY1Q 2019 Revenues ....................... 49
Table 4-3: Announced and Estimated Capacity Additions by Wafer Manufacturers ... 59
Table 4-4: Estimated Capacity Additions for 300 mm Wafer Production in China ...... 60
Table 4-5: Estimated Capacity for 200 mm Wafer Production in China ........... 61
Table 4-6: Estimated Capacity for 150 mm Wafer Production in China ........... 62
Table 4-7: Epitaxial Wafer Suppliers in China ........................ 62
Table 4-8: Estimated Status of China Wafer Capacity vs. Worldwide .......... 63
Table 4-9: Wafer Technology Development Issues & Trends ............... 64
Table 4-10: Technology Development Trends/Issues Related to Legacy Wafers ...... 66
Table B.0-1 Application by Wafer Type, Simplified Overview ................ 157