Summary

The global market for Through Glass Via (TGV) Substrate was estimated to be worth US$ 123 million in 2024 and is forecast to a readjusted size of US$ 674 million by 2031 with a CAGR of 27.2% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Through Glass Via (TGV) Substrate cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
In 2024, global Through Glass Via (TGV) Substrate production reached approximately 4.05 million units , with an average global market price of around US$ 30.4 per unit.
TGV substrate, or Through-Glass Via (TGV) substrate, is a glass-based substrate featuring vertical electrical interconnections. It is characterized by three core aspects: glass material, through-via technology, and metallization.

TGV is a miniaturized packaging technology used in semiconductor packaging and microelectronic devices, providing vertical electrical interconnections through a glass substrate. It employs high-quality borosilicate glass or quartz glass as the base material. Processes such as laser-induced etching, seed layer sputtering, electroplating filling, chemical mechanical planarization, RDL, and bumping are used to achieve 3D interconnection. The diameter of TGVs typically ranges from 10μm to 100μm. For various applications in advanced packaging, tens of thousands of TGV vias are usually required per wafer, and they undergo metallization to ensure the necessary electrical conductivity.

TGV substrates exhibit excellent high-frequency electrical properties. The dielectric constant of glass material is only about one-third that of silicon, and its loss tangent is two to three orders of magnitude lower than that of silicon. This significantly reduces substrate loss and parasitic effects, ensuring signal integrity. The fabrication of TGV substrates does not require complex insulating layer deposition processes. Moreover, thinning is unnecessary for ultra-thin interposers, simplifying the production process and improving efficiency. Since large-format, ultra-thin panel glass is readily available and no insulating layer deposition is required on the substrate surface or the inner walls of the TGVs, manufacturing costs are greatly reduced. Even when the interposer thickness is less than 100μm, warpage remains minimal, ensuring the stability and reliability of the packaged structure. TGV substrates offer unique advantages in applications such as RF chips, high-end MEMS sensors, and high-density system integration, making them one of the preferred choices for next-generation high-frequency 3D chip packaging.

Currently, wafer-level TGV substrates are relatively mature in the market, while panel-level TGV substrates are still in the research or trial production stage. This report provides statistics based on wafer-sized TGV substrates. Additionally, a separate forecast and analysis for panel-level TGV substrates are included in Section 1.5 of this chapter.
Through-Glass Via (TGV) is an advanced 3D integrated circuit technology that enables device miniaturization, high-density packaging, and GHz-speed data processing for various markets such as data centers, 5G communication networks, and IoT devices. Glass is a potential alternative to silicon-based interposers. Compared to Through-Silicon Vias (TSVs), TGVs offer advantages such as lower cost, easy availability of large-format ultra-thin glass substrates, and superior high-frequency electrical performance. The core of TGV technology lies in the deep via formation process. Currently developed glass via formation techniques include plasma etching and laser ablation. However, due to the fragile nature, surface smoothness, and chemical inertness of glass materials, existing technologies have not yet enabled large-scale production and widespread application of TGVs.

From a regional perspective, the Chinese market has experienced rapid changes in recent years. In 2024, China's market size was $25.42 million, accounting for approximately 20.62% of the global market. It is expected to reach $132.12 million by 2031, representing 27.83% of the global market share by then. China is not only a leading country in 5G network deployment but also a major producer of downstream 5G terminal devices. The growth rate of China's TGV market exceeds the global average. With future technological advancements and cost reductions, the TGV market is poised for significant expansion.

In terms of product types and technologies, 300 mm wafers dominated the market in 2024, holding a 65.05% global market share.
Analyzing application areas, the consumer electronics sector is the largest application market for TGV substrates, accounting for 63.91% of the market. TGV substrates are widely used in smartphones, wearable devices, and high-speed processors to meet the demand for miniaturization of electronic components. The automotive industry accounts for 21.10% of the market, where TGV substrates enhance vehicle safety and performance in applications such as advanced driver-assistance systems (ADAS), infotainment systems, and power modules for electric vehicles. In other sectors, biomedical applications are gradually increasing due to the biocompatibility and high precision of TGV substrates, playing an important role in implantable medical devices, biosensors, and microfluidic chips. The integration rate of TGV substrates in 5G and high-frequency communication applications is rising, strongly supporting the development of next-generation wireless networks and data centers.
The TGV substrate market is highly concentrated. Globally, core manufacturers of TGV substrates mainly include Corning, LPKF, Samtec, SCHOTT, Xiamen Sky Semiconductor Technology, and Tecnisco. In 2024, the first-tier manufacturers, primarily Corning and LPKF, held a combined 50% market share. Second-tier manufacturers, such as Samtec, SCHOTT, Xiamen Sky Semiconductor Technology, and Tecnisco, collectively accounted for 33.86% of the market. The top players held nearly 90% of the market share in 2024. Competition in the industry is expected to intensify in the coming years, particularly in the Chinese market.
However, market development faces challenges. High production costs are a significant barrier to market expansion. Compared to traditional substrates, TGV substrate manufacturing technology is complex, leading to increased production time and impacting supply chain efficiency. Furthermore, in emerging markets, adoption rates are slower than in mature markets due to limited awareness of TGV technology.

In summary, the global TGV substrate market holds promising prospects but is accompanied by significant challenges. Companies must continuously optimize production processes to reduce costs, increase R&D investment to overcome technical hurdles, strengthen market promotion to enhance technology awareness, and closely monitor changes in policies and regulations. Only by doing so can they secure a favorable position in the intense market competition and promote the sustainable and healthy development of the TGV substrate market.
This report aims to provide a comprehensive presentation of the global market for Through Glass Via (TGV) Substrate, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Through Glass Via (TGV) Substrate by region & country, by Type, and by Application.
The Through Glass Via (TGV) Substrate market size, estimations, and forecasts are provided in terms of sales volume (K Pcs) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Through Glass Via (TGV) Substrate.

Market Segmentation
By Company
Corning
LPKF
Samtec
SCHOTT
Xiamen Sky Semiconductor Technology
Tecnisco
PLANOPTIK
NSG Group
AGC
JNTC
Segment by Type
Wafer based TGV Substrate
Panel based TGV Substrate
Segment by Application
Consumer Electronics
Automobile Industry
High-performance Computing and Data Centers
Others
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Through Glass Via (TGV) Substrate manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Through Glass Via (TGV) Substrate in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Through Glass Via (TGV) Substrate in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

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Table of Contents

1 Market Overview
1.1 Through Glass Via (TGV) Substrate Product Introduction
1.2 Global Through Glass Via (TGV) Substrate Market Size Forecast
1.2.1 Global Through Glass Via (TGV) Substrate Sales Value (2020-2031)
1.2.2 Global Through Glass Via (TGV) Substrate Sales Volume (2020-2031)
1.2.3 Global Through Glass Via (TGV) Substrate Sales Price (2020-2031)
1.3 Through Glass Via (TGV) Substrate Market Trends & Drivers
1.3.1 Through Glass Via (TGV) Substrate Industry Trends
1.3.2 Through Glass Via (TGV) Substrate Market Drivers & Opportunity
1.3.3 Through Glass Via (TGV) Substrate Market Challenges
1.3.4 Through Glass Via (TGV) Substrate Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Through Glass Via (TGV) Substrate Players Revenue Ranking (2024)
2.2 Global Through Glass Via (TGV) Substrate Revenue by Company (2020-2025)
2.3 Global Through Glass Via (TGV) Substrate Players Sales Volume Ranking (2024)
2.4 Global Through Glass Via (TGV) Substrate Sales Volume by Company Players (2020-2025)
2.5 Global Through Glass Via (TGV) Substrate Average Price by Company (2020-2025)
2.6 Key Manufacturers Through Glass Via (TGV) Substrate Manufacturing Base and Headquarters
2.7 Key Manufacturers Through Glass Via (TGV) Substrate Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Through Glass Via (TGV) Substrate
2.9 Through Glass Via (TGV) Substrate Market Competitive Analysis
2.9.1 Through Glass Via (TGV) Substrate Market Concentration Rate (2020-2025)
2.9.2 Global 5 and 10 Largest Manufacturers by Through Glass Via (TGV) Substrate Revenue in 2024
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Through Glass Via (TGV) Substrate as of 2024)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Wafer based TGV Substrate
3.1.2 Panel based TGV Substrate
3.2 Global Through Glass Via (TGV) Substrate Sales Value by Type
3.2.1 Global Through Glass Via (TGV) Substrate Sales Value by Type (2020 VS 2024 VS 2031)
3.2.2 Global Through Glass Via (TGV) Substrate Sales Value, by Type (2020-2031)
3.2.3 Global Through Glass Via (TGV) Substrate Sales Value, by Type (%) (2020-2031)
3.3 Global Through Glass Via (TGV) Substrate Sales Volume by Type
3.3.1 Global Through Glass Via (TGV) Substrate Sales Volume by Type (2020 VS 2024 VS 2031)
3.3.2 Global Through Glass Via (TGV) Substrate Sales Volume, by Type (2020-2031)
3.3.3 Global Through Glass Via (TGV) Substrate Sales Volume, by Type (%) (2020-2031)
3.4 Global Through Glass Via (TGV) Substrate Average Price by Type (2020-2031)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Consumer Electronics
4.1.2 Automobile Industry
4.1.3 High-performance Computing and Data Centers
4.1.4 Others
4.2 Global Through Glass Via (TGV) Substrate Sales Value by Application
4.2.1 Global Through Glass Via (TGV) Substrate Sales Value by Application (2020 VS 2024 VS 2031)
4.2.2 Global Through Glass Via (TGV) Substrate Sales Value, by Application (2020-2031)
4.2.3 Global Through Glass Via (TGV) Substrate Sales Value, by Application (%) (2020-2031)
4.3 Global Through Glass Via (TGV) Substrate Sales Volume by Application
4.3.1 Global Through Glass Via (TGV) Substrate Sales Volume by Application (2020 VS 2024 VS 2031)
4.3.2 Global Through Glass Via (TGV) Substrate Sales Volume, by Application (2020-2031)
4.3.3 Global Through Glass Via (TGV) Substrate Sales Volume, by Application (%) (2020-2031)
4.4 Global Through Glass Via (TGV) Substrate Average Price by Application (2020-2031)
5 Segmentation by Region
5.1 Global Through Glass Via (TGV) Substrate Sales Value by Region
5.1.1 Global Through Glass Via (TGV) Substrate Sales Value by Region: 2020 VS 2024 VS 2031
5.1.2 Global Through Glass Via (TGV) Substrate Sales Value by Region (2020-2025)
5.1.3 Global Through Glass Via (TGV) Substrate Sales Value by Region (2026-2031)
5.1.4 Global Through Glass Via (TGV) Substrate Sales Value by Region (%), (2020-2031)
5.2 Global Through Glass Via (TGV) Substrate Sales Volume by Region
5.2.1 Global Through Glass Via (TGV) Substrate Sales Volume by Region: 2020 VS 2024 VS 2031
5.2.2 Global Through Glass Via (TGV) Substrate Sales Volume by Region (2020-2025)
5.2.3 Global Through Glass Via (TGV) Substrate Sales Volume by Region (2026-2031)
5.2.4 Global Through Glass Via (TGV) Substrate Sales Volume by Region (%), (2020-2031)
5.3 Global Through Glass Via (TGV) Substrate Average Price by Region (2020-2031)
5.4 North America
5.4.1 North America Through Glass Via (TGV) Substrate Sales Value, 2020-2031
5.4.2 North America Through Glass Via (TGV) Substrate Sales Value by Country (%), 2024 VS 2031
5.5 Europe
5.5.1 Europe Through Glass Via (TGV) Substrate Sales Value, 2020-2031
5.5.2 Europe Through Glass Via (TGV) Substrate Sales Value by Country (%), 2024 VS 2031
5.6 Asia Pacific
5.6.1 Asia Pacific Through Glass Via (TGV) Substrate Sales Value, 2020-2031
5.6.2 Asia Pacific Through Glass Via (TGV) Substrate Sales Value by Region (%), 2024 VS 2031
5.7 South America
5.7.1 South America Through Glass Via (TGV) Substrate Sales Value, 2020-2031
5.7.2 South America Through Glass Via (TGV) Substrate Sales Value by Country (%), 2024 VS 2031
5.8 Middle East & Africa
5.8.1 Middle East & Africa Through Glass Via (TGV) Substrate Sales Value, 2020-2031
5.8.2 Middle East & Africa Through Glass Via (TGV) Substrate Sales Value by Country (%), 2024 VS 2031
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Through Glass Via (TGV) Substrate Sales Value Growth Trends, 2020 VS 2024 VS 2031
6.2 Key Countries/Regions Through Glass Via (TGV) Substrate Sales Value and Sales Volume
6.2.1 Key Countries/Regions Through Glass Via (TGV) Substrate Sales Value, 2020-2031
6.2.2 Key Countries/Regions Through Glass Via (TGV) Substrate Sales Volume, 2020-2031
6.3 United States
6.3.1 United States Through Glass Via (TGV) Substrate Sales Value, 2020-2031
6.3.2 United States Through Glass Via (TGV) Substrate Sales Value by Type (%), 2024 VS 2031
6.3.3 United States Through Glass Via (TGV) Substrate Sales Value by Application, 2024 VS 2031
6.4 Europe
6.4.1 Europe Through Glass Via (TGV) Substrate Sales Value, 2020-2031
6.4.2 Europe Through Glass Via (TGV) Substrate Sales Value by Type (%), 2024 VS 2031
6.4.3 Europe Through Glass Via (TGV) Substrate Sales Value by Application, 2024 VS 2031
6.5 China
6.5.1 China Through Glass Via (TGV) Substrate Sales Value, 2020-2031
6.5.2 China Through Glass Via (TGV) Substrate Sales Value by Type (%), 2024 VS 2031
6.5.3 China Through Glass Via (TGV) Substrate Sales Value by Application, 2024 VS 2031
6.6 Japan
6.6.1 Japan Through Glass Via (TGV) Substrate Sales Value, 2020-2031
6.6.2 Japan Through Glass Via (TGV) Substrate Sales Value by Type (%), 2024 VS 2031
6.6.3 Japan Through Glass Via (TGV) Substrate Sales Value by Application, 2024 VS 2031
6.7 South Korea
6.7.1 South Korea Through Glass Via (TGV) Substrate Sales Value, 2020-2031
6.7.2 South Korea Through Glass Via (TGV) Substrate Sales Value by Type (%), 2024 VS 2031
6.7.3 South Korea Through Glass Via (TGV) Substrate Sales Value by Application, 2024 VS 2031
6.8 Southeast Asia
6.8.1 Southeast Asia Through Glass Via (TGV) Substrate Sales Value, 2020-2031
6.8.2 Southeast Asia Through Glass Via (TGV) Substrate Sales Value by Type (%), 2024 VS 2031
6.8.3 Southeast Asia Through Glass Via (TGV) Substrate Sales Value by Application, 2024 VS 2031
6.9 India
6.9.1 India Through Glass Via (TGV) Substrate Sales Value, 2020-2031
6.9.2 India Through Glass Via (TGV) Substrate Sales Value by Type (%), 2024 VS 2031
6.9.3 India Through Glass Via (TGV) Substrate Sales Value by Application, 2024 VS 2031
7 Company Profiles
7.1 Corning
7.1.1 Corning Company Information
7.1.2 Corning Introduction and Business Overview
7.1.3 Corning Through Glass Via (TGV) Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
7.1.4 Corning Through Glass Via (TGV) Substrate Product Offerings
7.1.5 Corning Recent Development
7.2 LPKF
7.2.1 LPKF Company Information
7.2.2 LPKF Introduction and Business Overview
7.2.3 LPKF Through Glass Via (TGV) Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
7.2.4 LPKF Through Glass Via (TGV) Substrate Product Offerings
7.2.5 LPKF Recent Development
7.3 Samtec
7.3.1 Samtec Company Information
7.3.2 Samtec Introduction and Business Overview
7.3.3 Samtec Through Glass Via (TGV) Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
7.3.4 Samtec Through Glass Via (TGV) Substrate Product Offerings
7.3.5 Samtec Recent Development
7.4 SCHOTT
7.4.1 SCHOTT Company Information
7.4.2 SCHOTT Introduction and Business Overview
7.4.3 SCHOTT Through Glass Via (TGV) Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
7.4.4 SCHOTT Through Glass Via (TGV) Substrate Product Offerings
7.4.5 SCHOTT Recent Development
7.5 Xiamen Sky Semiconductor Technology
7.5.1 Xiamen Sky Semiconductor Technology Company Information
7.5.2 Xiamen Sky Semiconductor Technology Introduction and Business Overview
7.5.3 Xiamen Sky Semiconductor Technology Through Glass Via (TGV) Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
7.5.4 Xiamen Sky Semiconductor Technology Through Glass Via (TGV) Substrate Product Offerings
7.5.5 Xiamen Sky Semiconductor Technology Recent Development
7.6 Tecnisco
7.6.1 Tecnisco Company Information
7.6.2 Tecnisco Introduction and Business Overview
7.6.3 Tecnisco Through Glass Via (TGV) Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
7.6.4 Tecnisco Through Glass Via (TGV) Substrate Product Offerings
7.6.5 Tecnisco Recent Development
7.7 PLANOPTIK
7.7.1 PLANOPTIK Company Information
7.7.2 PLANOPTIK Introduction and Business Overview
7.7.3 PLANOPTIK Through Glass Via (TGV) Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
7.7.4 PLANOPTIK Through Glass Via (TGV) Substrate Product Offerings
7.7.5 PLANOPTIK Recent Development
7.8 NSG Group
7.8.1 NSG Group Company Information
7.8.2 NSG Group Introduction and Business Overview
7.8.3 NSG Group Through Glass Via (TGV) Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
7.8.4 NSG Group Through Glass Via (TGV) Substrate Product Offerings
7.8.5 NSG Group Recent Development
7.9 AGC
7.9.1 AGC Company Information
7.9.2 AGC Introduction and Business Overview
7.9.3 AGC Through Glass Via (TGV) Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
7.9.4 AGC Through Glass Via (TGV) Substrate Product Offerings
7.9.5 AGC Recent Development
7.10 JNTC
7.10.1 JNTC Company Information
7.10.2 JNTC Introduction and Business Overview
7.10.3 JNTC Through Glass Via (TGV) Substrate Sales, Revenue, Price and Gross Margin (2020-2025)
7.10.4 JNTC Through Glass Via (TGV) Substrate Product Offerings
7.10.5 JNTC Recent Development
8 Industry Chain Analysis
8.1 Through Glass Via (TGV) Substrate Industrial Chain
8.2 Through Glass Via (TGV) Substrate Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Through Glass Via (TGV) Substrate Sales Model
8.5.2 Sales Channel
8.5.3 Through Glass Via (TGV) Substrate Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.1.1 Research Programs/Design
10.1.1.2 Market Size Estimation
10.1.1.3 Market Breakdown and Data Triangulation
10.1.2 Data Source
10.1.2.1 Secondary Sources
10.1.2.2 Primary Sources
10.2 Author Details
10.3 Disclaimer