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SiC Polishing Consumables - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031

SiC Polishing Consumables - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031


The global market for SiC Polishing Consumables was estimated to be worth US$ 134 million in 2024 and is forecast to a readjusted size of US$ 472 million by 2031 with a CAGR of 19.6% during the for... もっと見る

 

 

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Summary

The global market for SiC Polishing Consumables was estimated to be worth US$ 134 million in 2024 and is forecast to a readjusted size of US$ 472 million by 2031 with a CAGR of 19.6% during the forecast period 2025-2031.
Silicon Carbide (SiC) is a wide band gap semiconductor that can operate at higher temperature, power level, and voltage. This enables improved energy efficiency in power devices, LED lighting, and telecommunications. Because of its unique properties, SiC is the material of choice for diverse applications such as Hybrid Electric vehicles, power electronic switches, and LED lighting technology.
This report studies the SiC Polishing Consumables, include the SiC CMP Slurry and SiC CMP Pad.
The global key players of SiC polishing consumables include DuPont, Entegris, Fujimi Corporation, Saint-Gobain, Fujibo and Shanghai Xinanna, etc. In 2024, the global top four players occupied for a share approximately 82% in terms of revenue.
The key players of SiC CMP slurry include Entegris, Fujimi Corporation, Saint-Gobain, and Shanghai Xinanna, etc. In 2024, the global top three players occupied for a share approximately 82.4% in terms of revenue.

The key players of SiC CMP pads include DuPont, Entegris, and Fujibo, etc. DuPont is domaing the global SiC CMP pads market, holds a share over 75%.
The market for silicon carbide (SiC) chemical mechanical polishing (CMP) consumables, including slurries and pads, is at a pivotal stage, reflecting the rapid growth of the SiC wafer industry itself. Currently, the market is highly concentrated, with a small number of key players dominating the supply chain. Entegris and Fujimi Corporation are the established leaders in SiC CMP slurries, leveraging their deep expertise in materials science to develop proprietary formulations that meet the stringent demands of SiC polishing. Similarly, DuPont and Fujibo hold a commanding position in the SiC CMP pads market. This limited number of suppliers, while ensuring high quality and performance, also presents a potential bottleneck for future capacity expansion. Most of the market activity today is focused on 6-inch SiC wafers, which have become the industry standard for power electronics and are critical for the automotive and energy sectors. However, there is a nascent but growing demand for 8-inch wafers, which promises economies of scale and is a key focus for leading SiC manufacturers like Wolfspeed and STMicroelectronics. The performance of these consumables directly impacts the final device yield and quality, making their development a critical path item for the entire SiC ecosystem.

Several powerful trends are acting as tailwinds for the SiC CMP consumables market. First and foremost is the accelerated adoption of SiC in electric vehicles (EVs). SiC power devices are crucial for EV inverters, on-board chargers, and DC-DC converters due to their superior efficiency, power density, and thermal conductivity compared to traditional silicon-based solutions. As EV production scales up globally, so does the demand for SiC wafers and, by extension, the consumables used to polish them. Second, the global push for renewable energy is a significant driver. SiC components are essential for solar inverters and wind turbine systems, where they help maximize energy conversion efficiency. The third factor is the transition from 6-inch to 8-inch wafers. This shift is driven by the semiconductor industry’s constant quest for lower costs per die. As major SiC manufacturers invest heavily in 8-inch fabrication lines, the demand for high-performance CMP slurries and pads specifically optimized for these larger wafers will surge. This transition will require significant R&D investment from consumables suppliers to address new technical challenges related to polishing uniformity and defectivity on larger substrates.

Despite the robust growth drivers, the SiC CMP consumables industry faces significant challenges. The primary obstacle is the extreme hardness and chemical inertness of SiC, which makes polishing an inherently difficult and slow process. This necessitates the use of abrasive slurries and durable pads that are both effective and cost-effective. Developing new formulations that can achieve higher material removal rates (MRR) while minimizing surface defects remains a major technical hurdle. A second major challenge is the high cost and limited supply of raw materials, particularly the specialized abrasives and chemicals used in slurries. The concentrated nature of the market could also be a point of concern, as it could lead to potential supply chain vulnerabilities if a key supplier faces production issues. Furthermore, the lack of a standardized polishing process across different SiC device manufacturers adds complexity. Each manufacturer has its own proprietary recipes, requiring consumables suppliers to develop a wide range of products or work closely with individual customers on tailored solutions. This fragmentation can slow down the overall maturation of the industry and hinder the development of universal, high-yield polishing processes.

This report aims to provide a comprehensive presentation of the global market for SiC Polishing Consumables, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of SiC Polishing Consumables by region & country, by Type, and by Wafer Size.
The SiC Polishing Consumables market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding SiC Polishing Consumables.

Market Segmentation
By Company
DuPont
Fujibo Group
Entegris (CMC Materials)
Saint-Gobain
Fujimi Corporation
Shanghai Xinanna Electronic Technology
Vibrantz (Ferro)
Beijing Hangtian Saide
Beijing Grish Hitech
Tianjin Helen
CHUANYAN
Engis Corporation
Segment by Type
SiC CMP Pads
SiC CMP Slurry
Segment by Wafer Size
8 Inch SiC Wafer
6 Inch SiC Wafer
4 Inch SiC Wafer
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of SiC Polishing Consumables company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Wafer Size, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of SiC Polishing Consumables in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of SiC Polishing Consumables in country level. It provides sigmate data by Type, and by Wafer Size for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.


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Table of Contents

1 Market Overview
1.1 SiC Polishing Consumables Product Introduction
1.2 Global SiC Polishing Consumables Market Size Forecast (2020-2031)
1.3 SiC Polishing Consumables Market Trends & Drivers
1.3.1 SiC Polishing Consumables Industry Trends
1.3.2 SiC Polishing Consumables Market Drivers & Opportunity
1.3.3 SiC Polishing Consumables Market Challenges
1.3.4 SiC Polishing Consumables Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global SiC Polishing Consumables Players Revenue Ranking (2024)
2.2 Global SiC Polishing Consumables Revenue by Company (2020-2025)
2.3 Key Companies SiC Polishing Consumables Manufacturing Base Distribution and Headquarters
2.4 Key Companies SiC Polishing Consumables Product Offered
2.5 Key Companies Time to Begin Mass Production of SiC Polishing Consumables
2.6 SiC Polishing Consumables Market Competitive Analysis
2.6.1 SiC Polishing Consumables Market Concentration Rate (2020-2025)
2.6.2 Global 5 and 10 Largest Companies by SiC Polishing Consumables Revenue in 2024
2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in SiC Polishing Consumables as of 2024)
2.7 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 SiC CMP Pads
3.1.2 SiC CMP Slurry
3.2 Global SiC Polishing Consumables Sales Value by Type
3.2.1 Global SiC Polishing Consumables Sales Value by Type (2020 VS 2024 VS 2031)
3.2.2 Global SiC Polishing Consumables Sales Value, by Type (2020-2031)
3.2.3 Global SiC Polishing Consumables Sales Value, by Type (%) (2020-2031)
4 Segmentation by Wafer Size
4.1 Introduction by Wafer Size
4.1.1 8 Inch SiC Wafer
4.1.2 6 Inch SiC Wafer
4.1.3 4 Inch SiC Wafer
4.2 Global SiC Polishing Consumables Sales Value by Wafer Size
4.2.1 Global SiC Polishing Consumables Sales Value by Wafer Size (2020 VS 2024 VS 2031)
4.2.2 Global SiC Polishing Consumables Sales Value, by Wafer Size (2020-2031)
4.2.3 Global SiC Polishing Consumables Sales Value, by Wafer Size (%) (2020-2031)
5 Segmentation by Region
5.1 Global SiC Polishing Consumables Sales Value by Region
5.1.1 Global SiC Polishing Consumables Sales Value by Region: 2020 VS 2024 VS 2031
5.1.2 Global SiC Polishing Consumables Sales Value by Region (2020-2025)
5.1.3 Global SiC Polishing Consumables Sales Value by Region (2026-2031)
5.1.4 Global SiC Polishing Consumables Sales Value by Region (%), (2020-2031)
5.2 North America
5.2.1 North America SiC Polishing Consumables Sales Value, 2020-2031
5.2.2 North America SiC Polishing Consumables Sales Value by Country (%), 2024 VS 2031
5.3 Europe
5.3.1 Europe SiC Polishing Consumables Sales Value, 2020-2031
5.3.2 Europe SiC Polishing Consumables Sales Value by Country (%), 2024 VS 2031
5.4 Asia Pacific
5.4.1 Asia Pacific SiC Polishing Consumables Sales Value, 2020-2031
5.4.2 Asia Pacific SiC Polishing Consumables Sales Value by Region (%), 2024 VS 2031
5.5 South America
5.5.1 South America SiC Polishing Consumables Sales Value, 2020-2031
5.5.2 South America SiC Polishing Consumables Sales Value by Country (%), 2024 VS 2031
5.6 Middle East & Africa
5.6.1 Middle East & Africa SiC Polishing Consumables Sales Value, 2020-2031
5.6.2 Middle East & Africa SiC Polishing Consumables Sales Value by Country (%), 2024 VS 2031
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions SiC Polishing Consumables Sales Value Growth Trends, 2020 VS 2024 VS 2031
6.2 Key Countries/Regions SiC Polishing Consumables Sales Value, 2020-2031
6.3 United States
6.3.1 United States SiC Polishing Consumables Sales Value, 2020-2031
6.3.2 United States SiC Polishing Consumables Sales Value by Type (%), 2024 VS 2031
6.3.3 United States SiC Polishing Consumables Sales Value by Wafer Size, 2024 VS 2031
6.4 Europe
6.4.1 Europe SiC Polishing Consumables Sales Value, 2020-2031
6.4.2 Europe SiC Polishing Consumables Sales Value by Type (%), 2024 VS 2031
6.4.3 Europe SiC Polishing Consumables Sales Value by Wafer Size, 2024 VS 2031
6.5 China
6.5.1 China SiC Polishing Consumables Sales Value, 2020-2031
6.5.2 China SiC Polishing Consumables Sales Value by Type (%), 2024 VS 2031
6.5.3 China SiC Polishing Consumables Sales Value by Wafer Size, 2024 VS 2031
6.6 Japan
6.6.1 Japan SiC Polishing Consumables Sales Value, 2020-2031
6.6.2 Japan SiC Polishing Consumables Sales Value by Type (%), 2024 VS 2031
6.6.3 Japan SiC Polishing Consumables Sales Value by Wafer Size, 2024 VS 2031
6.7 South Korea
6.7.1 South Korea SiC Polishing Consumables Sales Value, 2020-2031
6.7.2 South Korea SiC Polishing Consumables Sales Value by Type (%), 2024 VS 2031
6.7.3 South Korea SiC Polishing Consumables Sales Value by Wafer Size, 2024 VS 2031
6.8 Southeast Asia
6.8.1 Southeast Asia SiC Polishing Consumables Sales Value, 2020-2031
6.8.2 Southeast Asia SiC Polishing Consumables Sales Value by Type (%), 2024 VS 2031
6.8.3 Southeast Asia SiC Polishing Consumables Sales Value by Wafer Size, 2024 VS 2031
6.9 India
6.9.1 India SiC Polishing Consumables Sales Value, 2020-2031
6.9.2 India SiC Polishing Consumables Sales Value by Type (%), 2024 VS 2031
6.9.3 India SiC Polishing Consumables Sales Value by Wafer Size, 2024 VS 2031
7 Company Profiles
7.1 DuPont
7.1.1 DuPont Profile
7.1.2 DuPont Main Business
7.1.3 DuPont SiC Polishing Consumables Products, Services and Solutions
7.1.4 DuPont SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
7.1.5 DuPont Recent Developments
7.2 Fujibo Group
7.2.1 Fujibo Group Profile
7.2.2 Fujibo Group Main Business
7.2.3 Fujibo Group SiC Polishing Consumables Products, Services and Solutions
7.2.4 Fujibo Group SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
7.2.5 Fujibo Group Recent Developments
7.3 Entegris (CMC Materials)
7.3.1 Entegris (CMC Materials) Profile
7.3.2 Entegris (CMC Materials) Main Business
7.3.3 Entegris (CMC Materials) SiC Polishing Consumables Products, Services and Solutions
7.3.4 Entegris (CMC Materials) SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
7.3.5 Entegris (CMC Materials) Recent Developments
7.4 Saint-Gobain
7.4.1 Saint-Gobain Profile
7.4.2 Saint-Gobain Main Business
7.4.3 Saint-Gobain SiC Polishing Consumables Products, Services and Solutions
7.4.4 Saint-Gobain SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
7.4.5 Saint-Gobain Recent Developments
7.5 Fujimi Corporation
7.5.1 Fujimi Corporation Profile
7.5.2 Fujimi Corporation Main Business
7.5.3 Fujimi Corporation SiC Polishing Consumables Products, Services and Solutions
7.5.4 Fujimi Corporation SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
7.5.5 Fujimi Corporation Recent Developments
7.6 Shanghai Xinanna Electronic Technology
7.6.1 Shanghai Xinanna Electronic Technology Profile
7.6.2 Shanghai Xinanna Electronic Technology Main Business
7.6.3 Shanghai Xinanna Electronic Technology SiC Polishing Consumables Products, Services and Solutions
7.6.4 Shanghai Xinanna Electronic Technology SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
7.6.5 Shanghai Xinanna Electronic Technology Recent Developments
7.7 Vibrantz (Ferro)
7.7.1 Vibrantz (Ferro) Profile
7.7.2 Vibrantz (Ferro) Main Business
7.7.3 Vibrantz (Ferro) SiC Polishing Consumables Products, Services and Solutions
7.7.4 Vibrantz (Ferro) SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
7.7.5 Vibrantz (Ferro) Recent Developments
7.8 Beijing Hangtian Saide
7.8.1 Beijing Hangtian Saide Profile
7.8.2 Beijing Hangtian Saide Main Business
7.8.3 Beijing Hangtian Saide SiC Polishing Consumables Products, Services and Solutions
7.8.4 Beijing Hangtian Saide SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
7.8.5 Beijing Hangtian Saide Recent Developments
7.9 Beijing Grish Hitech
7.9.1 Beijing Grish Hitech Profile
7.9.2 Beijing Grish Hitech Main Business
7.9.3 Beijing Grish Hitech SiC Polishing Consumables Products, Services and Solutions
7.9.4 Beijing Grish Hitech SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
7.9.5 Beijing Grish Hitech Recent Developments
7.10 Tianjin Helen
7.10.1 Tianjin Helen Profile
7.10.2 Tianjin Helen Main Business
7.10.3 Tianjin Helen SiC Polishing Consumables Products, Services and Solutions
7.10.4 Tianjin Helen SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
7.10.5 Tianjin Helen Recent Developments
7.11 CHUANYAN
7.11.1 CHUANYAN Profile
7.11.2 CHUANYAN Main Business
7.11.3 CHUANYAN SiC Polishing Consumables Products, Services and Solutions
7.11.4 CHUANYAN SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
7.11.5 CHUANYAN Recent Developments
7.12 Engis Corporation
7.12.1 Engis Corporation Profile
7.12.2 Engis Corporation Main Business
7.12.3 Engis Corporation SiC Polishing Consumables Products, Services and Solutions
7.12.4 Engis Corporation SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
7.12.5 Engis Corporation Recent Developments
8 Industry Chain Analysis
8.1 SiC Polishing Consumables Industrial Chain
8.2 SiC Polishing Consumables Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 SiC Polishing Consumables Sales Model
8.5.2 Sales Channel
8.5.3 SiC Polishing Consumables Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.1.1 Research Programs/Design
10.1.1.2 Market Size Estimation
10.1.1.3 Market Breakdown and Data Triangulation
10.1.2 Data Source
10.1.2.1 Secondary Sources
10.1.2.2 Primary Sources
10.2 Author Details
10.3 Disclaimer

 

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