Summary

US, Europe, APAC Electronic Components Market Research Report by Category (Active Electronic Components, Passive Electronic Components), by End-Use Vertical (Consumer Electronics, Automotive, Aerospace and Defence, Industrial, Medical, Telecommunications, Utilities, Robotics, Others), and by Region (US, Europe, APAC) Industry Analysis till 2035

Market Overview
The electronic components market is projected to grow at a CAGR of 5.0% from 2025 to 2035, reaching an estimated value of USD 384,235.40 million by the end of the forecast period. Electronic components are the basic building blocks used in electronic circuits and systems, such as resistors, capacitors, transistors, and integrated circuits. They control the flow of electricity, process signals, and enable devices to perform specific functions. These parts are essential in products ranging from smartphones and computers to industrial machinery and medical equipment.
The US, Europe, and Asia-Pacific electronic components market is experiencing strong growth, driven mainly by the rapid adoption of IoT and connected devices. From smart homes and wearables to industrial automation and connected vehicles, demand for sensors, microcontrollers, connectivity chips, and power management systems is rising sharply. In the US, smart healthcare devices and industrial IoT solutions are expanding quickly. Europe is going forward with the smart city projects like Philips' IoT-based lighting systems. APAC is leading the IoT deployment, which is reinforced by 5G rollouts and government-backed digital infrastructure projects. Besides, the technological innovation is just the key to the growth by the development of the semiconductor industry, the trend of miniaturization and the integration of AI. Advanced chips such as the ones made of 3nm technology from TSMC and Samsung are providing more power and at the same time energy efficiency in the field of consumer electronics, vehicles that are self-driving and industrial systems.
Though the market is still experiencing some challenges. One of the most important issues is how to maintain cost efficiency without compromising quality, which especially occurs when the sourcing of obsolete components for legacy systems like aerospace and defense is on the rise. Along with that, the manufacturer’s profit margins have been partly squeezed due to price pressures from OEMs and constantly changing raw material costs.
The areas of robotics, renewable energy, and industrial automation promise a lot of opportunities. The use of robotics in the automotive industry and healthcare, the development of renewable energy systems such as solar and wind power, and the application of the Industry 4.0 principle in factories are the major factors that stimulate the demand for high-performance components. If these trends continue, the market for electronic components in these regions will be strong throughout the coming years.

Market Segmentations
The electrical components market is classified by category, comprising active and passive electronic components.
consumer electronics, automotive, aerospace and defence, industrial, medical, telecommunications, utilities, robotics, and others, are end-user vertical types of the electrical components market.

Regional Insights
The US electronic components market benefits from strong demand in consumer electronics, automotive, telecom, and industrial applications. The rollout of 5G networks and the changeover to electric vehicles have increased the market for high-performance semiconductors, sensors, and power management systems. On the one hand, the component adoption pace has been quickened due to the digital infrastructure and the EV technology support from the federal government. But supply chain bottlenecks, trade disputes, and rapid tech cycles challenge manufacturers. Not only that, companies are also investing heavily in R&D to maintain competitiveness in a fast-evolving market.
Europe’s market expansion has been positively influenced by numerous green energy projects, automotive production, and industrial automation. The continent’s change from traditional to green energy sources demands the use of sophisticated control systems and power electronics. Despite the fact that Germany still holds the lead as the center for automotive electronics, France and the Netherlands have been playing an increasingly important role in semiconductor and PCB manufacturing. In an attempt to elevate innovation and manufacturing effectiveness, enterprises are collaborating. The steadiness of the supply chain and continuous R&D investment are still being prioritized in order to keep up with technology trends.
Asia-Pacific leads the global market, powered by large-scale consumer electronics production in China, Japan, South Korea, and Taiwan. The expansion of IoT infrastructure and Industry 4.0 technologies is boosting demand for sensors, processors, and connectivity modules. Governments and private firms are investing heavily in smart manufacturing and automation. Sustainability goals are pushing the adoption of energy-efficient components. Nonetheless, supply chain vulnerabilities and export restrictions pose ongoing risks for manufacturers.

Major Players
Key players in the electronic components market are Texas Instruments Incorporated, Broadcom Inc., Infineon Technologies AG, NXP Semiconductors NV, Renesas Electronics Corp, STMicroelectronics N.V., Microchip Technology, Silicon Laboratories Inc., Panasonic Holdings Corporation, Nordic Semiconductor ASA, Nippon Chemi-con Corporation, Samsung Electro-Mechanics, Glen Magnetics, Inc., AGILE MAGNETICS, INC, Vishay Intertechnology Inc., TDK CORPORATION, KOA Corporation, EREMU, SA, Sagami Elec Co., Ltd, Murata Manufacturing Co., Ltd, Broadcom Inc., Infineon Technologies AG, STMicroelectronics N.V., Microchip Technology, NIPPON CHEMI-CON CORPORATION, Samsung Electro-Mechanics, AGILE MAGNETICS, INC, Vishay Intertechnology Inc., TDK CORPORATION, and Murata Manufacturing Co., Ltd.

ページTOPに戻る

Table of Contents

TABLE OF CONTENTS
1 EXECUTIVE SUMMARY ......... 39
2 MARKET INTRODUCTION ...... 41
2.1 DEFINITION ......... 41
2.2 SCOPE OF THE STUDY ...... 41
2.3 RESEARCH OBJECTIVE .... 41
2.4 MARKET STRUCTURE ...... 42
3 RESEARCH METHODOLOGY ................. 43
3.1 OVERVIEW ........... 43
3.2 DATA FLOW ......... 44
3.2.1 DATA MINING PROCESS .......... 45
3.3 PURCHASED DATABASE: .................. 46
3.4 SECONDARY SOURCES: .... 47
3.4.1 SECONDARY RESEARCH DATA FLOW: ....... 48
3.5 PRIMARY RESEARCH: ....... 49
3.5.1 PRIMARY RESEARCH DATA FLOW: ........... 50
3.5.2 PRIMARY RESEARCH: NUMBER OF INTERVIEWS CONDUCTED ..... 51
3.6 APPROACHES FOR MARKET SIZE ESTIMATION: ...... 51
3.6.1 CONSUMPTION & NET TRADE APPROACH .................. 51
3.6.2 REVENUE ANALYSIS APPROACH ............... 52
3.7 DATA FORECASTING......... 52
3.7.1 DATA FORECASTING TECHNIQUE .............. 53
3.8 DATA MODELING ................ 54
3.8.1 MICROECONOMIC FACTOR ANALYSIS: ...... 54
3.8.2 DATA MODELING: ... 56
3.9 TEAMS AND ANALYST CONTRIBUTION ..... 58
4 MARKET DYNAMICS .............. 60
4.1 INTRODUCTION .. 60
4.2 DRIVERS ................ 60
4.2.1 INCREASING DEVELOPMENT AND EXPANSION OF IOT DEVICES ... 60
4.2.2 TECHNOLOGICAL ADVANCEMENTS AND INNOVATION ................ 61
4.2.3 GROWING DEMAND FOR CONNECTED DEVICES AND IOT SOLUTIONS ............ 61
4.3 RESTRAINTS ....... 62
4.3.1 MAINTAINING QUALITY WITH COST-EFFICIENCY AND OBSOLETE ELECTRONIC COMPONENTS ........ 62
4.3.2 DECREASE IN THE PROFIT MARGINS OF MANUFACTURERS ......... 62
4.4 OPPORTUNITY .... 63
4.4.1 GROWING DEMAND FOR ROBOTS ACROSS THE INDUSTRY ........... 63
4.4.2 RISE OF RENEWABLE ENERGY SOLUTION .. 64
4.4.3 LARGE-SCALE ADOPTION OF INDUSTRIAL AUTOMATION SOLUTION.............. 64
4.5 IMPACT ANALYSIS OF COVID - 19 .................. 65
4.5.1 IMPACT OF COVID-19 ON THE SEMICONDUCTOR INDUSTRY ........ 65
4.5.2 ELECTRONIC COMPONENT SHORTAGE ..... 66
4.5.3 IMPACT ON OVERALL ELECTRONICS INDUSTRY ......... 66
5 MARKET FACTOR ANALYSIS ................. 68
5.1 VALUE CHAIN ANALYSIS ................ 68
5.1.1 DESIGN & DEVELOPMENT ........ 68
5.1.2 COMPONENT SUPPLY ............. 68
5.1.3 SYSTEM INTEGRATION ............ 69
5.1.4 END USERS ............ 69
5.2 PORTER'S FIVE FORCES MODEL .... 70
5.2.1 THREAT OF NEW ENTRANTS .... 71
5.2.2 BARGAINING POWER OF SUPPLIERS ......... 71
5.2.3 BARGAINING POWER OF BUYERS .............. 71
5.2.4 THREAT OF SUBSTITUTES ....... 71
5.2.5 INTENSITY OF RIVALRY ........... 71
5.3 MARKET SWOT ANALYSIS ............. 72
5.4 MARKET PESTEL ANALYSIS .......... 72
6 ELECTRONIC COMPONENTS MARKET INSIGHTS ................. 74
6.1 KEY ELECTRONIC COMPONENTS SUPPLY CHAINS ANALYZED ........... 74
6.1.1 ACTIVE ELECTRONIC COMPONENTS ......... 74
6.1.1.1 MANUFACTURERS ........... 74
6.1.1.2 SUPPLY CHAIN DISTRIBUTORS ......... 75
6.1.1.3 SUPPLY CHAIN DISRUPTIONS/ CHALLENGES FACED ........... 75
6.1.1.4 KEY END USERS .............. 75
6.1.2 PASSIVE ELECTRONIC COMPONENTS ....... 76
6.1.2.1 MANUFACTURERS ........... 76
6.1.2.2 SUPPLY CHAIN DISTRIBUTORS ......... 76
6.1.2.3 SUPPLY CHAIN DISRUPTIONS/ CHALLENGES FACED ........... 76
6.1.2.4 KEY END USERS .............. 77
6.2 ELECTRONIC COMPONENTS EMERGING TECHNOLOGICAL TRENDS ANALYZED ............ 77
6.2.1 ACTIVE ELECTRONIC COMPONENTS ......... 77
6.2.1.1 3D-PRINTED ELECTRONICS ............... 77
6.2.1.1.1 TREND ANALYSIS ...... 77
6.2.1.1.2 POTENTIAL MARKET IMPACT ...... 77
6.2.1.2 ADVANCED MATERIALS ... 78
6.2.1.2.1.1 TREND ANALYSIS 78
6.2.1.2.1.2 POTENTIAL MARKET IMPACT 78
6.2.1.3 FLEXIBLE AND STRETCHABLE ELECTRONICS ..... 78
6.2.1.3.1.1 TREND ANALYSIS 78
6.2.1.3.1.2 POTENTIAL MARKET IMPACT 79
6.2.1.4 BIOCOMPATIBLE PRODUCTS ............ 79
6.2.1.4.1.1 TREND ANALYSIS 79
6.2.1.4.1.2 POTENTIAL MARKET IMPACT 79
6.2.2 PASSIVE ELECTRONIC COMPONENTS ....... 80
6.3 CURRENT AND FUTURE MARKET TRENDS ACROSS ELECTRONIC COMPONENTS ......... 80
6.3.1 MINIATURIZATION AND HIGH INTEGRATION CAPABILITIES ......... 80
6.3.2 ADVANCED MATERIALS FOR IMPROVED PERFORMANCE ............. 80
6.3.3 ENERGY EFFICIENCY AND LOW-POWER DESIGNS ........ 81
6.3.4 INTEGRATION OF PASSIVE AND ACTIVE FUNCTIONS .. 81
6.3.5 EMERGING POWER SOURCES FOR ELECTRONIC COMPONENTS AND DEVICES ................ 81
6.3.6 IMPACT OF ARTIFICIAL INTELLIGENCE (AI) ON THE ELECTRONIC COMPONENTS INDUSTRY ............ 81
6.3.7 ORGANIC ELECTRONICS .......... 82
6.3.8 QUANTUM COMPUTING ........... 82
6.3.9 EMBEDDED SYSTEMS .............. 82
6.3.10 PRINTED ELECTRONICS ........... 83
6.3.11 INTERNET OF THINGS (IOT) ..... 83
6.3.12 WEARABLE DEVICES ................ 83
6.4 KEY END USERS/ OEMS COMPANY PROFILES ........... 83
6.4.1 EUROPE ................. 83
6.4.2 ASIA-PACIFIC ......... 86
6.4.3 US......... 89
6.5 REVENUE AND OPPORTUNITY POCKETS WITH SHORTER TIME-TO-MONEY .................. 91
6.5.1 HIGH-GROWTH, LOW-BARRIER MARKET SEGMENTS .... 91
6.5.2 FAST-MOVING END-USE VERTICALS .......... 91
6.5.3 STRATEGIC GAPS IN SUPPLY CHAINS ....... 92
6.5.4 CUSTOMER PAIN POINTS AND EMERGING NEEDS ...... 94
6.5.5 EMERGING TRENDS ................. 95
7 ELECTRONIC COMPONENTS MARKET, BY CATEGORY ....... 98
7.1 INTRODUCTION .. 98
7.2 ACTIVE ELECTRONIC COMPONENTS............ 99
7.3 PASSIVE ELECTRONIC COMPONENTS ......... 105
8 ELECTRONIC COMPONENTS MARKET, BY END-USE VERTICAL .......... 111
8.1 INTRODUCTION .. 111
8.2 CONSUMER ELECTRONICS .............. 113
8.3 AUTOMOTIVE ..... 113
8.4 AEROSPACE AND DEFENCE ............ 113
8.5 INDUSTRIAL ........ 114
8.6 MEDICAL ............... 114
8.7 TELECOMMUNICATIONS ................. 114
8.8 UTILITIES ............. 114
8.9 ROBOTICS ............. 115
8.10 OTHERS ................. 115
9 ELECTRONIC COMPONENTS MARKET, BY REGION ............. 116
9.1 OVERVIEW ........... 116
9.1.1 ELECTRONIC COMPONENTS MARKET, BY REGION, 2024 VS 2035 (USD MILLION) ........... 117
9.1.2 ELECTRONIC COMPONENTS MARKET, BY REGION, 2019–2035 (USD MILLION) ............... 117
9.2 US ........... 118
9.3 EUROPE ................. 129
9.3.1 EAST EUROPE ........ 140
9.3.1.1 BULGARIA ...... 150
9.3.1.2 HUNGARY ...... 156
9.3.1.3 POLAND ......... 162
9.3.1.4 ROMANIA ....... 168
9.3.1.5 RUSSIA .......... 174
9.3.1.6 SLOVAKIA ...... 180
9.3.1.7 CZECH REPUBLIC ............ 186
9.3.1.8 REST OF EAST EUROPE .... 192
9.3.2 WEST EUROPE ........ 198
9.3.2.1 BELGIUM........ 207
9.3.2.2 FRANCE ......... 213
9.3.2.3 GERMANY ...... 218
9.3.2.4 NETHERLANDS................ 224
9.3.2.5 AUSTRIA ........ 230
9.3.2.6 LUXEMBOURG ................. 236
9.3.2.7 REST OF WEST EUROPE ... 242
9.3.3 NORTHERN EUROPE ................ 248
9.3.3.1 FINLAND ........ 259
9.3.3.2 UK ................. 265
9.3.3.3 IRELAND ........ 271
9.3.3.4 NORWAY ........ 277
9.3.3.5 SWEDEN ........ 283
9.3.3.6 DENMARK ...... 288
9.3.3.7 REST OF NORTHERN EUROPE ........... 294
9.3.4 SOUTHERN EUROPE................. 302
9.3.4.1 SPAIN ............ 312
9.3.4.2 TURKEY ......... 318
9.3.4.3 PORTUGAL ..... 323
9.3.4.4 GREECE ......... 329
9.3.4.5 ITALY............. 335
9.3.4.6 CROATIA ........ 341
9.3.4.7 REST OF SOUTHERN EUROPE ............ 346
9.4 ASIA PACIFIC ...... 352
9.4.1 CHINA ... 364
9.4.2 INDIA .... 370
9.4.3 JAPAN .. 376
9.4.4 SOUTH KOREA ........ 382
9.4.5 MALAYSIA ............. 387
9.4.6 TAIWAN ................. 393
9.4.7 SINGAPORE ............ 399
9.4.8 REST OF APAC ....... 405
10 COMPETITIVE LANDSCAPE .. 413
10.1 INTRODUCTION .. 413
10.2 COMPETITOR DASHBOARD.............. 414
10.3 ELECTRONIC COMPONENTS MANUFACTURERS SHARE ANALYSIS, 2024 (%) .................. 417
10.3.1 ASIA-PACIFIC ......... 417
10.3.2 EUROPE ................. 417
10.3.3 US......... 418
10.4 ELECTRONIC COMPONENTS DISTRIBUTORS SHARE ANALYSIS, 2024 (%) ......... 419
10.4.1 US......... 419
10.4.2 ASIA-PACIFIC ......... 419
10.4.3 EUROPE ................. 420
10.5 KEY START-UPS AND MID-SIZED ANALYZED ........... 420
11 COMPANY PROFILES- ACTIVE ELECTRONIC COMPONENT MANUFACTURERS .. 422
11.1 TEXAS INSTRUMENTS INCORPORATED. .... 422
11.1.1 COMPANY OVERVIEW .............. 422
11.1.2 FINANCIAL OVERVIEW ............. 423
11.1.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED .............. 423
11.1.4 KEY DEVELOPMENTS ............... 424
11.1.5 SWOT ANALYSIS .... 424
11.1.6 KEY STRATEGIES .... 425
11.2 BROADCOM INC .. 426
11.2.1 COMPANY OVERVIEW .............. 426
11.2.2 FINANCIAL OVERVIEW ............. 426
11.2.3 PRODUCTS OFFERED ............... 427
11.2.4 KEY DEVELOPMENTSS ............. 428
11.2.5 SWOT ANALYSIS .... 428
11.2.6 KEY STRATEGIES .... 429
11.3 INFINEON TECHNOLOGIES AG ....... 430
11.3.1 COMPANY OVERVIEW .............. 430
11.3.2 FINANCIAL OVERVIEW ............. 430
11.3.3 PRODUCTS OFFERED ............... 431
11.3.4 KEY DEVELOPMENTSS ............. 432
11.3.5 SWOT ANALYSIS .... 433
11.3.6 KEY STRATEGIES .... 433
11.4 NXP SEMICONDUCTORS .. 434
11.4.1 COMPANY OVERVIEW .............. 434
11.4.2 FINANCIAL OVERVIEW ............. 434
11.4.3 PRODUCTS OFFERED ............... 436
11.4.4 KEY DEVELOPMENTSS ............. 437
11.4.5 SWOT ANALYSIS .... 438
11.4.6 KEY STRATEGIES .... 438
11.5 RENESAS ELECTRONICS CORPORATION ..... 439
11.5.1 COMPANY OVERVIEW .............. 439
11.5.2 FINANCIAL OVERVIEW ............. 439
11.5.3 PRODUCTS OFFERED ............... 440
11.5.4 KEY DEVELOPMENTS ............... 441
11.5.5 SWOT ANALYSIS .... 441
11.5.6 KEY STRATEGIES .... 442
11.6 STMICROELECTRONICS NV ............. 443
11.6.1 COMPANY OVERVIEW .............. 443
11.6.2 FINANCIAL OVERVIEW ............. 444
11.6.3 PRODUCTS OFFERED ............... 444
11.6.4 KEY DEVELOPMENTSS ............. 445
11.6.5 SWOT ANALYSIS .... 446
11.6.6 KEY STRATEGIES .... 446
11.7 MICROCHIP TECHNOLOGY INC. ...... 447
11.7.1 COMPANY OVERVIEW .............. 447
11.7.2 FINANCIAL OVERVIEW ............. 448
11.7.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED .............. 448
11.7.4 KEY DEVELOPMENTS ............... 449
11.7.5 SWOT ANALYSIS .... 450
11.7.6 KEY STRATEGIES .... 450
11.8 SILICON LABORATORIES .................. 451
11.8.1 COMPANY OVERVIEW .............. 451
11.8.2 FINANCIAL OVERVIEW ............. 452
11.8.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED .............. 452
11.8.4 KEY DEVELOPMENTS ............... 453
11.8.5 SWOT ANALYSIS .... 453
11.8.6 KEY STRATEGIES .... 453
11.9 PANASONIC INDUSTRIAL ................ 454
11.9.1 COMPANY OVERVIEW .............. 454
11.9.2 FINANCIAL OVERVIEW ............. 455
11.9.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED .............. 455
11.9.4 KEY DEVELOPMENTS ............... 456
11.9.5 SWOT ANALYSIS .... 457
11.9.6 KEY STRATEGIES .... 457
11.10 NORDIC SEMICONDUCTOR ............... 458
11.10.1 COMPANY OVERVIEW .............. 458
11.10.2 FINANCIAL OVERVIEW ............. 459
11.10.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED .............. 459
11.10.4 KEY DEVELOPMENTS ............... 460
11.10.5 SWOT ANALYSIS .... 460
11.10.6 KEY STRATEGIES .... 461
12 COMPANY PROFILES_ PASSIVE ........... 462
12.1 MURATA MANUFACTURING CO. LTD. ......... 462
12.1.1 COMPANY OVERVIEW .............. 462
12.1.2 FINANCIAL OVERVIEW ............. 463
12.1.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED .............. 463
12.1.4 KEY DEVELOPMENTS ............... 464
12.1.5 SWOT ANALYSIS .... 464
12.1.6 KEY STRATEGIES .... 465
12.2 SAGAMI ELEC CO., LTD. .... 466
12.2.1 COMPANY OVERVIEW .............. 466
12.2.2 FINANCIAL OVERVIEW ............. 467
12.2.3 PRODUCTS OFFERED ............... 467
12.2.4 KEY DEVELOPMENTS ............... 468
12.2.5 SWOT ANALYSIS .... 469
12.2.6 KEY STRATEGIES: ... 469
12.3 EREMU, SA ........... 470
12.3.1 COMPANY OVERVIEW .............. 470
12.3.2 FINANCIAL OVERVIEW ............. 471
12.3.3 PRODUCTS OFFERED ............... 471
12.3.4 KEY DEVELOPMENTS ............... 471
12.3.5 SWOT ANALYSIS .... 471
12.3.6 KEY STRATEGIES .... 472
12.4 KOA CORPORATION ........... 473
12.4.1 COMPANY OVERVIEW .............. 473
12.4.2 FINANCIAL OVERVIEW ............. 474
12.4.3 PRODUCTS OFFERED ............... 474
12.4.4 KEY DEVELOPMENTS ............... 475
12.4.5 SWOT ANALYSIS .... 476
12.4.6 KEY STRATEGIES .... 476
12.5 TDK CORPORATION ........... 477
12.5.1 COMPANY OVERVIEW .............. 477
12.5.2 FINANCIAL OVERVIEW ............. 478
12.5.3 PRODUCTS OFFERED ............... 479
12.5.4 KEY DEVELOPMENTS ............... 479
12.5.5 SWOT ANALYSIS .... 480
12.5.6 KEY STRATEGIES .... 480
12.6 VISHAY INTERTECHNOLOGY, INC ................. 481
12.6.1 COMPANY OVERVIEW .............. 481
12.6.2 FINANCIAL OVERVIEW ............. 482
12.6.3 PRODUCTS OFFERED ............... 483
12.6.4 KEY DEVELOPMENTS ............... 484
12.6.5 SWOT ANALYSIS .... 485
12.6.6 KEY STRATEGIES .... 485
12.7 AGILE MAGNETICS, INC. .. 486
12.7.1 COMPANY OVERVIEW .............. 486
12.7.2 FINANCIAL OVERVIEW ............. 487
12.7.3 PRODUCTS OFFERED ............... 487
12.7.4 KEY DEVELOPMENTS ............... 489
12.7.5 SWOT ANALYSIS .... 489
12.7.6 KEY STRATEGIES .... 490
12.8 GLEN MAGNETICS ............. 491
12.8.1 COMPANY OVERVIEW .............. 491
12.8.2 FINANCIAL OVERVIEW ............. 491
12.8.3 PRODUCTS OFFERED ............... 491
12.8.4 KEY DEVELOPMENTS ............... 492
12.8.5 SWOT ANALYSIS .... 492
12.8.6 KEY STRATEGIES .... 493
12.9 SAMSUNG ELECTRO-MECHANICS ................. 494
12.9.1 COMPANY OVERVIEW .............. 494
12.9.2 FINANCIAL OVERVIEW ............. 495
12.9.3 PRODUCTS OFFERED ............... 495
12.9.4 KEY DEVELOPMENTS ............... 496
12.9.5 SWOT ANALYSIS .... 496
12.9.6 KEY STRATEGIES .... 497
12.10 NIPPON CHEMI-CON CORPORATION. ............ 498
12.10.1 COMPANY OVERVIEW .............. 498
12.10.2 FINANCIAL OVERVIEW ............. 499
12.10.3 PRODUCTS OFFERED ............... 499
12.10.4 KEY DEVELOPMENTS ............... 500
12.10.5 SWOT ANALYSIS .... 500
12.10.6 KEY STRATEGIES .... 501
13 COMPANY PROFILES_ ELECTROMECHANICAL ELECTRONIC COMPONENT ....... 502
13.1 BROADCOM INC .. 502
13.1.1 COMPANY OVERVIEW .............. 502
13.1.2 FINANCIAL OVERVIEW ............. 503
13.1.3 PRODUCTS OFFERED ............... 503
13.1.4 KEY DEVELOPMENTSS ............. 504
13.1.5 SWOT ANALYSIS .... 504
13.1.6 KEY STRATEGIES .... 505
13.2 INFINEON TECHNOLOGIES AG ....... 506
13.2.1 COMPANY OVERVIEW .............. 506
13.2.2 FINANCIAL OVERVIEW ............. 506
13.2.3 PRODUCTS OFFERED ............... 507
13.2.4 KEY DEVELOPMENTSS ............. 508
13.2.5 SWOT ANALYSIS .... 508
13.2.6 KEY STRATEGIES .... 509
13.3 STMICROELECTRONICS NV ............. 510
13.3.1 COMPANY OVERVIEW .............. 510
13.3.2 FINANCIAL OVERVIEW ............. 511
13.3.3 PRODUCTS OFFERED ............... 511
13.3.4 KEY DEVELOPMENTSS ............. 512
13.3.5 SWOT ANALYSIS .... 513
13.3.6 KEY STRATEGIES .... 513
13.4 MICROCHIP TECHNOLOGY INC. ...... 514
13.4.1 COMPANY OVERVIEW .............. 514
13.4.2 FINANCIAL OVERVIEW ............. 515
13.4.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED .............. 515
13.4.4 KEY DEVELOPMENTS ............... 516
13.4.5 SWOT ANALYSIS .... 517
13.4.6 KEY STRATEGIES .... 517
13.5 SAMSUNG ELECTRO-MECHANICS ................. 518
13.5.1 COMPANY OVERVIEW .............. 518
13.5.2 FINANCIAL OVERVIEW ............. 519
13.5.3 PRODUCTS OFFERED ............... 519
13.5.4 KEY DEVELOPMENTS ............... 520
13.5.5 SWOT ANALYSIS .... 520
13.5.6 KEY STRATEGIES .... 520
13.6 NIPPON CHEMI-CON CORPORATION. ............ 521
13.6.1 COMPANY OVERVIEW .............. 521
13.6.2 FINANCIAL OVERVIEW ............. 522
13.6.3 PRODUCTS OFFERED ............... 522
13.6.4 KEY DEVELOPMENTS ............... 523
13.6.5 SWOT ANALYSIS .... 523
13.6.6 KEY STRATEGIES .... 523
13.7 TDK CORPORATION ........... 524
13.7.1 COMPANY OVERVIEW .............. 524
13.7.2 FINANCIAL OVERVIEW ............. 525
13.7.3 PRODUCTS OFFERED ............... 526
13.7.4 KEY DEVELOPMENTS ............... 526
13.7.5 SWOT ANALYSIS .... 526
13.7.6 KEY STRATEGIES .... 527
13.8 VISHAY INTERTECHNOLOGY, INC ................. 528
13.8.1 COMPANY OVERVIEW .............. 528
13.8.2 FINANCIAL OVERVIEW ............. 529
13.8.3 PRODUCTS OFFERED ............... 530
13.8.4 KEY DEVELOPMENTS ............... 530
13.8.5 SWOT ANALYSIS .... 531
13.8.6 KEY STRATEGIES .... 531
13.9 AGILE MAGNETICS, INC. .. 532
13.9.1 COMPANY OVERVIEW .............. 532
13.9.2 FINANCIAL OVERVIEW ............. 533
13.9.3 PRODUCTS OFFERED ............... 533
13.9.4 KEY DEVELOPMENTS ............... 534
13.9.5 SWOT ANALYSIS .... 534
13.9.6 KEY STRATEGIES .... 534
13.10 MURATA MANUFACTURING CO. LTD. ......... 535
13.10.1 COMPANY OVERVIEW .............. 535
13.10.2 FINANCIAL OVERVIEW ............. 536
13.10.3 PRODUCTS/SOLUTIONS/SERVICES OFFERED .............. 536
13.10.4 KEY DEVELOPMENTS ............... 537
13.10.5 SWOT ANALYSIS .... 537
13.10.6 KEY STRATEGIES .... 537
13.11 DATA CITATIONS ............... 540