Summary

The global radiation hardened electronics market is projected to grow from USD 2.04 billion in 2026 to USD 2.91 billion by 2032, at a CAGR of 6.1% during the forecast period. The radiation hardened electronics market is witnessing steady growth as intelligence, surveillance, and reconnaissance (ISR) platforms, including satellites, drones, and defense systems, increasingly depend on radiation-tolerant processors, controllers, memory devices, and mixed-signal ICs for reliable operation in harsh environments. Growing investments by defense agencies and space organizations in advanced ISR capabilities, secure communications, and situational awareness are strengthening demand for high-reliability rad-hard components. However, high development costs and limited availability of real-world radiation-testing environments continue to restrict market expansion. At the same time, rising space missions and increasing adoption of commercial-off-the-shelf (COTS) components are creating new opportunities, while highly customized requirements from end users continue to influence product development and competitive strategies. Power management segment accounted for the largest market share in 2025. Power management components are expected to hold the largest share of the radiation hardened electronics market in 2025, driven by their critical role in regulating and distributing power across space and defense electronic systems. Satellites, spacecraft, and military platforms require highly reliable power management ICs, voltage regulators, converters, and related components to ensure uninterrupted operation in radiation-intensive environments. The increasing number of electronic subsystems and higher power requirements of advanced payloads, communication systems, and onboard processors are further strengthening demand. Growing satellite launches, space exploration programs, and defense modernization initiatives are therefore supporting the dominant position of power management components in the market. Space applications are expected to register the highest growth rate during the forecast period. The space applications segment is expected to register the highest growth rate in the radiation hardened electronics market, driven by the rapid expansion of satellite constellations, deep-space missions, and commercial space activities. Increasing deployment of communication, Earth observation, navigation, and scientific satellites is creating strong demand for radiation-tolerant processors, memory, power management devices, and mixed-signal ICs. Growing participation of private space companies, along with rising government investments in lunar, planetary, and national-security space programs, is further accelerating adoption. As spacecraft become more autonomous and data-intensive, the need for reliable high-performance electronics capable of operating in harsh radiation environments is expected to increase significantly. The US is likely to account for the largest share of the radiation hardened electronics market in 2032. The US is expected to account for the largest market share of the radiation hardened electronics market, supported by strong government spending on space exploration, defense modernization, and national-security programs. The presence of leading aerospace, defense, and semiconductor companies further strengthens the country’s technological and manufacturing capabilities in rad-hard electronics. Significant investments by agencies such as NASA and the US Department of Defense continue to drive demand for reliable components used in satellites, missiles, spacecraft, and other mission-critical systems. In addition, the rapid growth of commercial space companies and satellite constellation programs is expected to sustain the US market’s leading position. Extensive primary interviews were conducted with key industry experts in the radiation hardened electronics market space to determine and verify the market size for various segments and subsegments gathered through secondary research. The breakdown of primary participants for the report is shown below. The study contains insights from various industry experts, from component suppliers to Tier 1 companies and OEMs. The breakdown of the primary participants is as follows: ・By Company Type: Tier 1 – 20%, Tier 2 – 25%, and Tier 3 – 55% ・By Designation: C-level Executives – 30%, Directors – 30%, and Others – 40% ・By Region: Asia Pacific – 30%, Europe – 20%, North America – 40%, and RoW – 10% Note: Other designations include technology heads, media analysts, sales managers, marketing managers, and product managers. The three tiers of companies are based on their total revenues as of 2025: Tier: >USD 1 billion, Tier 2: USD 500 million to 1 billion, and Tier 3:

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Table of Contents

1 INTRODUCTION 34
1.1 STUDY OBJECTIVES 34
1.2 MARKET DEFINITION 34
1.3 STUDY SCOPE 35
1.3.1 MARKETS COVERED AND REGIONAL SCOPE 35
1.3.2 YEARS CONSIDERED 36
1.3.3 INCLUSIONS AND EXCLUSIONS 36
1.4 CURRENCY CONSIDERED 37
1.5 UNIT CONSIDERED 37
1.6 STAKEHOLDERS 37
1.7 SUMMARY OF CHANGES 37
2 EXECUTIVE SUMMARY 39
2.1 KEY MARKET PARTICIPANTS: MAPPING OF STRATEGIC DEVELOPMENTS 40
2.2 DISRUPTIVE TRENDS IN RADIATION-HARDENED ELECTRONICS MARKET 41
2.3 HIGH-GROWTH SEGMENTS 42
2.4 REGIONAL SNAPSHOT: MARKET SIZE, GROWTH RATE, AND FORECAST 43
3 PREMIUM INSIGHTS 44
3.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN RADIATION-HARDENED ELECTRONICS MARKET 44
3.2 RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE 45
3.3 RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE 45
3.4 RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT 46
3.5 RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION 46
3.6 RADIATION-HARDENED ELECTRONICS MARKET, BY GEOGRAPHY 47
4 MARKET OVERVIEW 48
4.1 INTRODUCTION 48
4.2 RADIATION-HARDENED ELECTRONICS MARKET EVOLUTION 48
4.3 MARKET DYNAMICS 49
4.3.1 DRIVERS 50
4.3.1.1 Rising intelligence, surveillance, and reconnaissance (ISR) activities 50
4.3.1.2 Rapid advances in multicore processors for military and space applications 51
4.3.1.3 Growing emphasis on cost-effective satellite communication 51
4.3.1.4 Increasing demand for electronic systems resilient to severe nuclear environments 51
4.3.2 RESTRAINTS 52
4.3.2.1 Barriers to establishing real-world testing environments 52
4.3.2.2 High costs and long development cycles 53
4.3.3 OPPORTUNITIES 53
4.3.3.1 Increasing number of global space missions 53
4.3.3.2 Mounting demand for reconfigurable radiation-hardened FPGAs 54
4.3.3.3 Rising adoption of commercial off-the-shelf components in satellites 54
4.3.4 CHALLENGES 55
4.3.4.1 Complexities in scaling customized product offerings 55
4.4 INTERCONNECTED MARKETS AND CROSS-SECTOR OPPORTUNITIES 55
4.4.1 INTERCONNECTED MARKETS 56
4.4.2 CROSS-SECTOR OPPORTUNITIES 56
4.5 STRATEGIC MOVES BY TIER-1/2/3 PLAYERS 56
5 INDUSTRY TRENDS 57
5.1 PORTER’S FIVE FORCES ANALYSIS 57
5.1.1 INTENSITY OF COMPETITIVE RIVALRY 58
5.1.2 BARGAINING POWER OF SUPPLIERS 58
5.1.3 BARGAINING POWER OF BUYERS 59
5.1.4 THREAT OF SUBSTITUTES 59
5.1.5 THREAT OF NEW ENTRANTS 59
5.2 MACROECONOMIC OUTLOOK 59
5.2.1 INTRODUCTION 59
5.2.2 GDP TRENDS AND FORECAST 60
5.2.3 TRENDS IN GLOBAL SPACE INDUSTRY 60
5.2.3.1 Shift of satellite manufacturing toward Asia Pacific 60
5.2.3.2 Localization of space electronics supply chains 60
5.2.3.3 Increasing investment in satellite constellation programs 60
5.2.3.4 Growing public-private partnerships in space programs 60
5.2.4 TRENDS IN GLOBAL AEROSPACE & DEFENSE INDUSTRY 61
5.2.4.1 India’s emergence as a hub for defense electronics manufacturing 61
5.2.4.2 Accelerating modernization of next-generation defense platforms 61
5.2.4.3 Increasing investment in electronic warfare and missile defense systems 61
5.3 SUPPLY CHAIN ANALYSIS 61
5.4 ECOSYSTEM ANALYSIS 64
5.5 PRICING ANALYSIS 65
5.5.1 AVERAGE SELLING PRICE OF POWER MANAGEMENT PRODUCTS OFFERED BY KEY PLAYERS, BY TYPE, 2025 65
5.5.2 PRICING RANGE OF MIXED-SIGNAL ICS OFFERED BY KEY PLAYERS, BY TYPE, 2025 67
5.5.3 PRICING RANGE OF PROCESSORS & CONTROLLERS OFFERED BY KEY PLAYERS, BY TYPE, 2025 67
5.5.4 PRICING RANGE OF MEMORY PRODUCTS, BY KEY PLAYER, 2025 68
5.5.5 AVERAGE SELLING PRICE TREND OF RADIATION-HARDENED ELECTRONICS, BY REGION, 2022–2025 68
5.6 TRADE ANALYSIS 69
5.6.1 IMPORT SCENARIO (HS CODE 8541) 69
5.6.2 EXPORT SCENARIO (HS CODE 8541) 70
5.7 KEY CONFERENCES AND EVENTS, 2026–2027 71
5.8 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS 72
5.9 INVESTMENT AND FUNDING SCENARIO 73
5.10 CASE STUDY ANALYSIS 73
5.11 IMPACT OF US TARIFFS – RADIATION-HARDENED ELECTRONICS MARKET 76
5.11.1 INTRODUCTION 76
5.11.2 KEY TARIFF RATES 76
5.11.3 PRICE IMPACT ANALYSIS 77
5.11.4 KEY IMPACTS ON COUNTRIES/REGIONS 77
5.11.4.1 US 77
5.11.4.2 Europe 78
5.11.4.3 Asia Pacific 79
5.11.5 IMPACT ON APPLICATIONS 80
6 TECHNOLOGICAL ADVANCEMENTS, AI-DRIVEN IMPACT, PATENTS, INNOVATIONS, AND FUTURE APPLICATIONS 81
6.1 TECHNOLOGY ANALYSIS 81
6.1.1 KEY TECHNOLOGIES 81
6.1.1.1 Radiation-hardened semiconductors 81
6.1.1.2 Rad-hard design techniques 81
6.1.1.3 Rad-hard packaging 81
6.1.2 COMPLEMENTARY TECHNOLOGIES 82
6.1.2.1 Radiation testing and simulation tools 82
6.1.2.2 Thermal management solutions 82
6.1.3 ADJACENT TECHNOLOGIES 82
6.1.3.1 Satellite and space systems 82
6.1.3.2 Defense electronics and avionics 83
6.1.3.3 Cryogenic electronics 83
6.2 PATENT ANALYSIS 84
6.3 IMPACT OF AI/GEN AI ON RADIATION-HARDENED ELECTRONICS MARKET 86
6.3.1 TOP USE CASES AND MARKET POTENTIAL 86
6.3.2 BEST PRACTICES FOLLOWED BY MANUFACTURERS IN RADIATION-HARDENED ELECTRONICS MARKET 86
6.3.3 CASE STUDIES RELATED TO AI/GEN AI IMPLEMENTATION IN RADIATION-HARDENED ELECTRONICS MARKET 87
6.3.4 INTERCONNECTED ECOSYSTEMS AND IMPACT ON MARKET PLAYERS 87
6.3.5 CLIENTS’ READINESS TO ADOPT AI/GEN AI-INTEGRATED RADIATION-HARDENED ELECTRONICS 87
6.4 FUTURE APPLICATIONS 87
7 REGULATORY LANDSCAPE 88
7.1 REGIONAL REGULATIONS AND COMPLIANCE 88
7.1.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 88
7.1.2 STANDARDS AND REGULATIONS 90
7.1.2.1 North America 90
7.1.2.1.1 US 90
7.1.2.1.1.1 MIL-STD-750D 90
7.1.2.1.1.2 MIL-STD-750F 90
7.1.2.1.1.3 Radiation Hardness Assurance SSB1_005 91
7.1.2.1.1.4 MIL-STD-975M (NASA) 91
7.1.2.1.2 Canada 91
7.1.2.1.2.1 Radiation Emitting Devices Regulations (C.R.C., c. 1370) 91
7.1.2.2 Europe 91
7.1.2.2.1 ECSS-Q-60-01A 91
7.1.2.2.2 ECSS-Q-ST-60-15C 91
7.1.2.2.3 ECSS-Q-HB-60-02A 91
7.1.2.3 Asia Pacific 91
7.1.2.3.1 India 91
7.1.2.3.1.1 IS:1885 91
7.1.2.3.2 Japan 92
7.1.2.3.2.1 Japan Product Safety Compliance 92
7.1.2.3.2.2 JMR-001 92
7.2 REGULATORY POLICY INITIATIVES 92
8 CUSTOMER LANDSCAPE AND BUYER BEHAVIOR 93
8.1 INTRODUCTION 93
8.2 DECISION-MAKING PROCESS 93
8.3 KEY STAKEHOLDERS INVOLVED IN BUYING PROCESS AND THEIR EVALUATION CRITERIA 93
8.3.1 KEY STAKEHOLDERS IN BUYING PROCESS 93
8.3.2 BUYING CRITERIA 94
8.4 ADOPTION BARRIERS AND INTERNAL CHALLENGES 95
8.5 UNMET NEEDS OF VARIOUS APPLICATIONS 95
9 RADIATION-HARDENED ELECTRONICS MATERIALS AND PACKAGING TYPES 96
9.1 INTRODUCTION 96
9.2 MATERIALS 96
9.2.1 SILICON (SI) 96
9.2.2 SILICON CARBIDE (SIC) 97
9.2.3 GALLIUM NITRIDE (GAN) 97
9.2.4 GALLIUM ARSENIDE (GAAS) 98
9.3 PACKAGING TYPES 98
9.3.1 FLIP-CHIP 98
9.3.2 CERAMIC PACKAGES 99
10 RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT 100
10.1 INTRODUCTION 101
10.2 MIXED-SIGNAL ICS 102
10.2.1 A/D & D/A CONVERTERS 106
10.2.1.1 Ongoing trend of compact-sized satellites to contribute to segmental growth 106
10.2.2 MULTIPLEXERS & RESISTORS 108
10.2.2.1 Increasing space missions and use of data acquisition systems to bolster segmental growth 108
10.3 PROCESSORS & CONTROLLERS 109
10.3.1 MPU 114
10.3.1.1 Rising development in multicore processors for space and defense applications to fuel segmental growth 114
10.3.2 MCU 115
10.3.2.1 Proliferating deep space missions and planetary exploration to augment segmental growth 115
10.3.3 ASIC 116
10.3.3.1 High degree of flexibility and ability to address highly customized design requirements to spur demand 116
10.3.4 FPGA 118
10.3.4.1 Increasing use to eliminate costs related to redesigning or manual updating to expedite segmental growth 118
10.4 MEMORY 119
10.4.1 VOLATILE 124
10.4.1.1 DRAM 124
10.4.1.1.1 High node capacitance and gradual voltage scaling to foster segmental growth 124
10.4.1.2 SRAM 125
10.4.1.2.1 High adoption in image processing applications to accelerate segmental growth 125
10.4.2 NON-VOLATILE 126
10.4.2.1 MRAM 126
10.4.2.1.1 Non-volatile and power-efficient features to boost segmental growth 126
10.4.2.2 Flash 127
10.4.2.2.1 Ability to provide high-density memory capacity in small volumes to augment segmental growth 127
10.4.2.3 Other memory technologies 127
10.5 POWER MANAGEMENT 127
10.5.1 MOSFETS 132
10.5.1.1 Use to address high-reliability requirements and outer space applications to facilitate segmental growth 132
10.5.2 DIODES 133
10.5.2.1 High voltage and improved electrical radiation performance to contribute to segmental growth 133
10.5.3 THYRISTORS 134
10.5.3.1 Adoption in aerospace and defense applications to bolster segmental growth 134
10.5.4 IGBTS 136
10.5.4.1 High current density and low power dissipation to fuel segmental growth 136
10.6 IMAGE SENSORS 137
10.6.1 MOUNTING DEMAND FOR RELIABLE IMAGING SYSTEMS IN SPACE AND DEFENSE APPLICATIONS TO BOOST SEGMENTAL GROWTH 137
10.7 OTHER COMPONENTS 140
11 RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE 145
11.1 INTRODUCTION 146
11.2 RADIATION-HARDENED BY DESIGN 147
11.2.1 LOW CHIP COSTS, FLEXIBILITY IN HIGH-VOLUME PRODUCTION, AND LESS CUSTOMIZED PROCESSES TO FUEL SEGMENTAL GROWTH 147
11.2.2 TOTAL IONIZING DOSE 150
11.2.3 SINGLE EVENT EFFECT (SEE) 151
11.3 RADIATION-HARDENED BY PROCESS 151
11.3.1 INCREASING INVESTMENT AND STRATEGIC ADVANCEMENTS TO BOLSTER SEGMENTAL GROWTH 151
11.3.2 SILICON ON INSULATOR (SOI) 154
11.3.3 SILICON ON SAPPHIRE (SOS) 155
11.4 RADIATION-HARDENED BY SOFTWARE (QUALITATIVE) 155
12 RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE 156
12.1 INTRODUCTION 157
12.2 COMMERCIAL OFF-THE-SHELF 158
12.2.1 BURGEONING DEMAND FOR RELIABLE AND LOW-COST MICROELECTRONICS IN SPACE INDUSTRY TO FUEL SEGMENTAL GROWTH 158
12.3 CUSTOM-MADE 162
12.3.1 ABILITY TO WITHSTAND HIGH LEVELS OF RADIATION TO ACCELERATE SEGMENTAL GROWTH 162
13 RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION 166
13.1 INTRODUCTION 167
13.2 SPACE 168
13.2.1 COMMERCIAL 170
13.2.1.1 Escalating adoption of global positioning systems and navigation systems to expedite segmental growth 170
13.2.1.2 Small satellites 171
13.2.1.3 New space 171
13.2.1.4 Nanosatellites 171
13.2.2 MILITARY 172
13.2.2.1 Rising need for quality components that can withstand high levels of radiation to drive market 172
13.3 AEROSPACE & DEFENSE 172
13.3.1 WEAPONS & MISSILES 174
13.3.1.1 Use of processors with high radiation resistance and low power consumption to foster segmental growth 174
13.3.2 VEHICLES/AVIONICS 174
13.3.2.1 Requirement for electronics that operate effectively in harsh environments to expedite segmental growth 174
13.4 NUCLEAR POWER PLANTS 175
13.4.1 STRONG FOCUS ON ENVIRONMENT-FRIENDLY POWER GENERATION TO AUGMENT MARKET GROWTH 175
13.5 MEDICAL 176
13.5.1 IMPLANTABLE DEVICES 177
13.5.1.1 Advances in medical devices and chronic disease prevalence to facilitate segmental growth 177
13.5.2 RADIOLOGY 178
13.5.2.1 Growing prevalence of chronic diseases and aging population to facilitate segmental growth 178
13.6 OTHER APPLICATIONS 178
14 RADIATION-HARDENED ELECTRONICS MARKET, BY REGION 180
14.1 INTRODUCTION 181
14.2 NORTH AMERICA 183
14.2.1 US 185
14.2.1.1 Increasing investment in civil, defense, and commercial space programs to boost market growth 185
14.2.2 CANADA 190
14.2.2.1 Rising government initiatives in space exploration to contribute to market growth 190
14.2.3 MEXICO 194
14.2.3.1 Expanding satellite infrastructure and domestic space capabilities to foster market growth 194
14.3 EUROPE 194
14.3.1 UK 196
14.3.1.1 Increasing investment in satellite communications, in-orbit servicing, and national space infrastructure to drive market 196
14.3.2 GERMANY 201
14.3.2.1 Growing participation in space missions to contribute to market growth 201
14.3.3 FRANCE 205
14.3.3.1 Increasing partnership in space launch missions to bolster market growth 205
14.3.4 REST OF EUROPE 209
14.4 ASIA PACIFIC 210
14.4.1 CHINA 212
14.4.1.1 Increasing funding for military operations and technologies to expedite market growth 212
14.4.2 INDIA 217
14.4.2.1 Growing emphasis on satellite manufacturing, Earth observation, and advanced space exploration programs to drive market 217
14.4.3 JAPAN 221
14.4.3.1 Strong focus on developing advanced space technologies to accelerate market growth 221
14.4.4 SOUTH KOREA 222
14.4.4.1 Increasing investment in infrastructure, industrial, commercial, military, space, and defense projects to fuel market growth 222
14.4.5 REST OF ASIA PACIFIC 222
14.5 ROW 222
14.5.1 MIDDLE EAST 223
14.5.1.1 Saudi Arabia 224
14.5.1.1.1 Ambitious space and defense initiatives to support market growth 224
14.5.1.2 UAE 225
14.5.1.2.1 Expanding space program and focus on defense modernization to foster market growth 225
14.5.1.3 Rest of Middle East 225
14.5.2 SOUTH AMERICA 225
14.5.2.1 Rising partnership with foreign agencies for space missions to augment market growth 225
14.5.3 AFRICA 225
14.5.3.1 Increasing investment in satellite programs, defense upgrades, and space exploration initiatives to boost market growth 225
15 COMPETITIVE LANDSCAPE 227
15.1 OVERVIEW 227
15.2 KEY PLAYER COMPETITIVE STRATEGIES/RIGHT TO WIN, 2023–2026 227
15.3 REVENUE ANALYSIS, 2021–2025 229
15.4 MARKET SHARE ANALYSIS, 2025 229
15.5 COMPANY VALUATION AND FINANCIAL METRICS 232
15.6 BRAND/PRODUCT COMPARATIVE ANALYSIS 233
15.6.1 BAE SYSTEMS (UK) 233
15.6.2 MICROCHIP TECHNOLOGY (US) 234
15.6.3 STMICROELECTRONICS (SWITZERLAND) 234
15.6.4 RENESAS ELECTRONICS (JAPAN) 234
15.6.5 INFINEON TECHNOLOGIES (GERMANY) 234
15.7 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2025 234
15.7.1 STARS 234
15.7.2 EMERGING LEADERS 235
15.7.3 PERVASIVE PLAYERS 235
15.7.4 PARTICIPANTS 235
15.7.5 COMPANY FOOTPRINT: KEY PLAYERS, 2025 237
15.7.5.1 Company footprint 237
15.7.5.2 Region footprint 238
15.7.5.3 Component footprint 239
15.7.5.4 Manufacturing technique footprint 240
15.7.5.5 Product type footprint 241
15.7.5.6 Application footprint 242
15.8 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2025 243
15.8.1 PROGRESSIVE COMPANIES 243
15.8.2 RESPONSIVE COMPANIES 243
15.8.3 DYNAMIC COMPANIES 243
15.8.4 STARTING BLOCKS 243
15.8.5 COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2025 245
15.8.5.1 Detailed list of key startups/SMEs 245
15.8.5.2 Competitive benchmarking of key startups/SMEs 246
15.9 COMPETITIVE SCENARIO 248
15.9.1 PRODUCT LAUNCHES 248
15.9.2 DEALS 249
15.9.3 EXPANSIONS 250
16 COMPANY PROFILES 251
16.1 KEY PLAYERS 251
16.1.1 MICROCHIP TECHNOLOGY INC. 251
16.1.1.1 Business overview 251
16.1.1.2 Products/Solutions/Services offered 252
16.1.1.3 Recent developments 254
16.1.1.3.1 Product launches 254
16.1.1.3.2 Deals 256
16.1.1.3.3 Expansions 256
16.1.1.4 MnM view 257
16.1.1.4.1 Right to win 257
16.1.1.4.2 Strategic choices 257
16.1.1.4.3 Weaknesses and competitive threats 257
16.1.2 BAE SYSTEMS 258
16.1.2.1 Business overview 258
16.1.2.2 Products/Solutions/Services offered 259
16.1.2.3 Recent developments 261
16.1.2.3.1 Product launches 261
16.1.2.3.2 Deals 262
16.1.2.4 MnM view 263
16.1.2.4.1 Right to win 263
16.1.2.4.2 Strategic choices 263
16.1.2.4.3 Weaknesses and competitive threats 263
16.1.3 RENESAS ELECTRONICS CORPORATION 264
16.1.3.1 Business overview 264
16.1.3.2 Products/Solutions/Services offered 265
16.1.3.3 Recent developments 267
16.1.3.3.1 Product launches 267
16.1.3.3.2 Deals 267
16.1.3.4 MnM view 268
16.1.3.4.1 Right to win 268
16.1.3.4.2 Strategic choices 268
16.1.3.4.3 Weaknesses and competitive threats 268
16.1.4 INFINEON TECHNOLOGIES AG 269
16.1.4.1 Business overview 269
16.1.4.2 Products/Solutions/Services offered 270
16.1.4.3 Recent developments 272
16.1.4.3.1 Product launches 272
16.1.4.3.2 Deals 274
16.1.4.4 MnM view 274
16.1.4.4.1 Right to win 274
16.1.4.4.2 Strategic choices 275
16.1.4.4.3 Weaknesses and competitive threats 275
16.1.5 STMICROELECTRONICS 276
16.1.5.1 Business overview 276
16.1.5.2 Products/Solutions/Services offered 277
16.1.5.3 Recent developments 279
16.1.5.3.1 Product launches 279
16.1.5.3.2 Deals 280
16.1.5.4 MnM view 280
16.1.5.4.1 Right to win 280
16.1.5.4.2 Strategic choices 281
16.1.5.4.3 Weaknesses and competitive threats 281
16.1.6 ADVANCED MICRO DEVICES, INC. (AMD) 282
16.1.6.1 Business overview 282
16.1.6.2 Products/Solutions/Services offered 283
16.1.6.3 Recent developments 284
16.1.6.3.1 Product launches 284
16.1.6.3.2 Deals 284
16.1.7 TEXAS INSTRUMENTS INCORPORATED 285
16.1.7.1 Business overview 285
16.1.7.2 Products/Solutions/Services offered 286
16.1.7.3 Recent developments 288
16.1.7.3.1 Product launches 288
16.1.7.3.2 Deals 288
16.1.8 HONEYWELL INTERNATIONAL INC. 289
16.1.8.1 Business overview 289
16.1.8.2 Products/Solutions/Services offered 290
16.1.8.3 Recent developments 291
16.1.8.3.1 Product launches 291
16.1.8.3.2 Deals 292
16.1.9 TELEDYNE TECHNOLOGIES INCORPORATED 293
16.1.9.1 Business overview 293
16.1.9.2 Products/Solutions/Services offered 294
16.1.9.3 Recent developments 295
16.1.9.3.1 Product launches 295
16.1.9.3.2 Deals 296
16.1.10 TTM TECHNOLOGIES, INC. 297
16.1.10.1 Business overview 297
16.1.10.2 Products/Solutions/Services offered 298
16.1.10.3 Recent developments 299
16.1.10.3.1 Product launches 299
16.2 OTHER PLAYERS 300
16.2.1 THALES 300
16.2.2 ANALOG DEVICES, INC. 301
16.2.3 DATA DEVICE CORPORATION 302
16.2.4 3D PLUS 303
16.2.5 MERCURY SYSTEMS, INC. 304
16.2.6 PCB PIEZOTRONICS, INC. 305
16.2.7 VORAGO TECHNOLOGIES 306
16.2.8 GSI TECHNOLOGY, INC. 307
16.2.9 EVERSPIN TECHNOLOGIES INC. 308
16.2.10 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (ON SEMICONDUCTOR) 309
16.2.11 AITECH 310
16.2.12 MICROELECTRONICS RESEARCH DEVELOPMENT CORPORATION 311
16.2.13 TRIAD SEMICONDUCTOR 312
16.2.14 ZERO TEST SYSTEMS 313
16.2.15 RESILIENT COMPUTING 313
17 RESEARCH METHODOLOGY 314
17.1 RESEARCH DATA 314
17.1.1 SECONDARY AND PRIMARY RESEARCH 316
17.1.2 SECONDARY DATA 317
17.1.2.1 List of key secondary sources 317
17.1.2.2 Key data from secondary sources 317
17.1.3 PRIMARY DATA 318
17.1.3.1 Key data from primary sources 318
17.1.3.2 List of primary interview participants 318
17.1.3.3 Breakdown of primaries 319
17.1.3.4 Key industry insights 319
17.2 MARKET SIZE ESTIMATION 320
17.2.1 BOTTOM-UP APPROACH 320
17.2.1.1 Approach to obtain market size using bottom-up analysis 320
17.2.2 TOP-DOWN APPROACH 321
17.2.2.1 Approach to obtain market size using top-down analysis 321
17.3 DATA TRIANGULATION 322
17.4 RESEARCH ASSUMPTIONS 323
17.5 RESEARCH LIMITATIONS 323
17.6 RISK ANALYSIS 324
18 APPENDIX 325
18.1 DISCUSSION GUIDE 325
18.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 329
18.3 CUSTOMIZATION OPTIONS 331
18.4 RELATED REPORTS 331
18.5 AUTHOR DETAILS 332