Summary

The global market for Through Glass Via (TGV) Technology was estimated to be worth US$ 123 million in 2024 and is forecast to a readjusted size of US$ 475 million by 2031 with a CAGR of 20.2% during the forecast period 2025-2031.
Glass Through-Via (TGV, short for Through-Glass Via) is a miniaturization packaging technology used in semiconductor encapsulation and microelectronic devices. The TGV process enables the creation of precise through-holes (i.e., vias) in glass substrates, which are subsequently filled with conductive materials (such as metals) in subsequent processes. TGV features numerous through-holes in glass with diameters measured in micrometers, positioning it as a promising material for the next-generation semiconductor packaging substrates. High-quality TGV achieved through glass materials and hole processing technologies facilitates the miniaturization of devices in various markets, including data centers, 5G communication networks, and IoT devices, enabling high-density packaging and GHz-speed data processing.
The supply chain for TGV substrates typically involves upstream glass material suppliers, midstream laser drilling and copper filling processing plants, and downstream packaging houses and semiconductor manufacturers. Supplier concentration is relatively high, with significant technical barriers. Major suppliers are primarily located in the United States, Japan, South Korea, Europe, and a few regions in China.

TGV technology was initially developed by American, Japanese, and European companies to enable micro-interconnects for high-density packaging, addressing bottlenecks in high-speed and high-frequency signal transmission associated with silicon interconnects and traditional PCBs. In recent years, with the rapid development of 5G, optoelectronic devices, and sensors, TGV technology has gradually been applied in MEMS, optical modules, and high-frequency antenna packaging.
The primary industry prospects lie in high-frequency and high-speed packaging applications, such as 5G RF modules, optical communication devices, micro-sensors, and Micro-Electro-Mechanical Systems (MEMS) devices. The market for mid-to-low-end TGV products is relatively small, while high-end products maintain strong competitiveness due to their precision and reliability. In the future, with the growing demand for heterogeneous integration and advanced packaging, the TGV market is expected to continue expanding.

TGV substrate production involves processes such as glass cutting, laser drilling, cleaning, metallization, and electroplating. The production capacity of a single line is usually constrained by glass size, via diameter, and filling efficiency. A high-precision TGV production line can have an annual capacity ranging from several hundred thousand to millions of wafers, depending on the aperture, number of layers, and copper filling speed.
Due to complex processes and high technical barriers, TGV products generally yield high gross margins, typically within the range of 30% to 35%. The margin level is significantly influenced by the degree of production line automation, yield rate, and order scale.
Costs are primarily composed of raw materials (glass substrates account for approximately 50%-60%), processing technologies (laser drilling, copper deposition, electroplating, etc., accounting for 30%-40%), and equipment depreciation and labor (accounting for 10%-20%). High yield rates and high automation can significantly reduce unit costs.

After packaging is completed, TGV substrates are generally not sold separately but enter the market mainly as finished component devices. Production waste primarily consists of drilling debris, defective copper deposition products, and broken glass. Companies mitigate losses through recycling, reuse, or low-value disposal.
This report aims to provide a comprehensive presentation of the global market for Through Glass Via (TGV) Technology, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Through Glass Via (TGV) Technology by region & country, by Type, and by Application.
The Through Glass Via (TGV) Technology market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Through Glass Via (TGV) Technology.

Market Segmentation
By Company
Corning
LPKF
Samtec
SCHOTT
Xiamen Sky Semiconductor Technology
Tecnisco
PLANOPTIK
NSG Group
AGC
JNTC
Segment by Type
Panel-Level TGV Substrate
Wafer-Level TGV Substrate
Segment by Application
Consumer Electronics
Automotive Electronics
High-performance Computing and Data Centers
Others
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Through Glass Via (TGV) Technology company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of Through Glass Via (TGV) Technology in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of Through Glass Via (TGV) Technology in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

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Table of Contents

1 Market Overview
1.1 Through Glass Via (TGV) Technology Product Introduction
1.2 Global Through Glass Via (TGV) Technology Market Size Forecast (2020-2031)
1.3 Through Glass Via (TGV) Technology Market Trends & Drivers
1.3.1 Through Glass Via (TGV) Technology Industry Trends
1.3.2 Through Glass Via (TGV) Technology Market Drivers & Opportunity
1.3.3 Through Glass Via (TGV) Technology Market Challenges
1.3.4 Through Glass Via (TGV) Technology Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Through Glass Via (TGV) Technology Players Revenue Ranking (2024)
2.2 Global Through Glass Via (TGV) Technology Revenue by Company (2020-2025)
2.3 Key Companies Through Glass Via (TGV) Technology Manufacturing Base Distribution and Headquarters
2.4 Key Companies Through Glass Via (TGV) Technology Product Offered
2.5 Key Companies Time to Begin Mass Production of Through Glass Via (TGV) Technology
2.6 Through Glass Via (TGV) Technology Market Competitive Analysis
2.6.1 Through Glass Via (TGV) Technology Market Concentration Rate (2020-2025)
2.6.2 Global 5 and 10 Largest Companies by Through Glass Via (TGV) Technology Revenue in 2024
2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Through Glass Via (TGV) Technology as of 2024)
2.7 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Panel-Level TGV Substrate
3.1.2 Wafer-Level TGV Substrate
3.2 Global Through Glass Via (TGV) Technology Sales Value by Type
3.2.1 Global Through Glass Via (TGV) Technology Sales Value by Type (2020 VS 2024 VS 2031)
3.2.2 Global Through Glass Via (TGV) Technology Sales Value, by Type (2020-2031)
3.2.3 Global Through Glass Via (TGV) Technology Sales Value, by Type (%) (2020-2031)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Consumer Electronics
4.1.2 Automotive Electronics
4.1.3 High-performance Computing and Data Centers
4.1.4 Others
4.2 Global Through Glass Via (TGV) Technology Sales Value by Application
4.2.1 Global Through Glass Via (TGV) Technology Sales Value by Application (2020 VS 2024 VS 2031)
4.2.2 Global Through Glass Via (TGV) Technology Sales Value, by Application (2020-2031)
4.2.3 Global Through Glass Via (TGV) Technology Sales Value, by Application (%) (2020-2031)
5 Segmentation by Region
5.1 Global Through Glass Via (TGV) Technology Sales Value by Region
5.1.1 Global Through Glass Via (TGV) Technology Sales Value by Region: 2020 VS 2024 VS 2031
5.1.2 Global Through Glass Via (TGV) Technology Sales Value by Region (2020-2025)
5.1.3 Global Through Glass Via (TGV) Technology Sales Value by Region (2026-2031)
5.1.4 Global Through Glass Via (TGV) Technology Sales Value by Region (%), (2020-2031)
5.2 North America
5.2.1 North America Through Glass Via (TGV) Technology Sales Value, 2020-2031
5.2.2 North America Through Glass Via (TGV) Technology Sales Value by Country (%), 2024 VS 2031
5.3 Europe
5.3.1 Europe Through Glass Via (TGV) Technology Sales Value, 2020-2031
5.3.2 Europe Through Glass Via (TGV) Technology Sales Value by Country (%), 2024 VS 2031
5.4 Asia Pacific
5.4.1 Asia Pacific Through Glass Via (TGV) Technology Sales Value, 2020-2031
5.4.2 Asia Pacific Through Glass Via (TGV) Technology Sales Value by Region (%), 2024 VS 2031
5.5 South America
5.5.1 South America Through Glass Via (TGV) Technology Sales Value, 2020-2031
5.5.2 South America Through Glass Via (TGV) Technology Sales Value by Country (%), 2024 VS 2031
5.6 Middle East & Africa
5.6.1 Middle East & Africa Through Glass Via (TGV) Technology Sales Value, 2020-2031
5.6.2 Middle East & Africa Through Glass Via (TGV) Technology Sales Value by Country (%), 2024 VS 2031
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Through Glass Via (TGV) Technology Sales Value Growth Trends, 2020 VS 2024 VS 2031
6.2 Key Countries/Regions Through Glass Via (TGV) Technology Sales Value, 2020-2031
6.3 United States
6.3.1 United States Through Glass Via (TGV) Technology Sales Value, 2020-2031
6.3.2 United States Through Glass Via (TGV) Technology Sales Value by Type (%), 2024 VS 2031
6.3.3 United States Through Glass Via (TGV) Technology Sales Value by Application, 2024 VS 2031
6.4 Europe
6.4.1 Europe Through Glass Via (TGV) Technology Sales Value, 2020-2031
6.4.2 Europe Through Glass Via (TGV) Technology Sales Value by Type (%), 2024 VS 2031
6.4.3 Europe Through Glass Via (TGV) Technology Sales Value by Application, 2024 VS 2031
6.5 China
6.5.1 China Through Glass Via (TGV) Technology Sales Value, 2020-2031
6.5.2 China Through Glass Via (TGV) Technology Sales Value by Type (%), 2024 VS 2031
6.5.3 China Through Glass Via (TGV) Technology Sales Value by Application, 2024 VS 2031
6.6 Japan
6.6.1 Japan Through Glass Via (TGV) Technology Sales Value, 2020-2031
6.6.2 Japan Through Glass Via (TGV) Technology Sales Value by Type (%), 2024 VS 2031
6.6.3 Japan Through Glass Via (TGV) Technology Sales Value by Application, 2024 VS 2031
6.7 South Korea
6.7.1 South Korea Through Glass Via (TGV) Technology Sales Value, 2020-2031
6.7.2 South Korea Through Glass Via (TGV) Technology Sales Value by Type (%), 2024 VS 2031
6.7.3 South Korea Through Glass Via (TGV) Technology Sales Value by Application, 2024 VS 2031
6.8 Southeast Asia
6.8.1 Southeast Asia Through Glass Via (TGV) Technology Sales Value, 2020-2031
6.8.2 Southeast Asia Through Glass Via (TGV) Technology Sales Value by Type (%), 2024 VS 2031
6.8.3 Southeast Asia Through Glass Via (TGV) Technology Sales Value by Application, 2024 VS 2031
6.9 India
6.9.1 India Through Glass Via (TGV) Technology Sales Value, 2020-2031
6.9.2 India Through Glass Via (TGV) Technology Sales Value by Type (%), 2024 VS 2031
6.9.3 India Through Glass Via (TGV) Technology Sales Value by Application, 2024 VS 2031
7 Company Profiles
7.1 Corning
7.1.1 Corning Profile
7.1.2 Corning Main Business
7.1.3 Corning Through Glass Via (TGV) Technology Products, Services and Solutions
7.1.4 Corning Through Glass Via (TGV) Technology Revenue (US$ Million) & (2020-2025)
7.1.5 Corning Recent Developments
7.2 LPKF
7.2.1 LPKF Profile
7.2.2 LPKF Main Business
7.2.3 LPKF Through Glass Via (TGV) Technology Products, Services and Solutions
7.2.4 LPKF Through Glass Via (TGV) Technology Revenue (US$ Million) & (2020-2025)
7.2.5 LPKF Recent Developments
7.3 Samtec
7.3.1 Samtec Profile
7.3.2 Samtec Main Business
7.3.3 Samtec Through Glass Via (TGV) Technology Products, Services and Solutions
7.3.4 Samtec Through Glass Via (TGV) Technology Revenue (US$ Million) & (2020-2025)
7.3.5 Samtec Recent Developments
7.4 SCHOTT
7.4.1 SCHOTT Profile
7.4.2 SCHOTT Main Business
7.4.3 SCHOTT Through Glass Via (TGV) Technology Products, Services and Solutions
7.4.4 SCHOTT Through Glass Via (TGV) Technology Revenue (US$ Million) & (2020-2025)
7.4.5 SCHOTT Recent Developments
7.5 Xiamen Sky Semiconductor Technology
7.5.1 Xiamen Sky Semiconductor Technology Profile
7.5.2 Xiamen Sky Semiconductor Technology Main Business
7.5.3 Xiamen Sky Semiconductor Technology Through Glass Via (TGV) Technology Products, Services and Solutions
7.5.4 Xiamen Sky Semiconductor Technology Through Glass Via (TGV) Technology Revenue (US$ Million) & (2020-2025)
7.5.5 Xiamen Sky Semiconductor Technology Recent Developments
7.6 Tecnisco
7.6.1 Tecnisco Profile
7.6.2 Tecnisco Main Business
7.6.3 Tecnisco Through Glass Via (TGV) Technology Products, Services and Solutions
7.6.4 Tecnisco Through Glass Via (TGV) Technology Revenue (US$ Million) & (2020-2025)
7.6.5 Tecnisco Recent Developments
7.7 PLANOPTIK
7.7.1 PLANOPTIK Profile
7.7.2 PLANOPTIK Main Business
7.7.3 PLANOPTIK Through Glass Via (TGV) Technology Products, Services and Solutions
7.7.4 PLANOPTIK Through Glass Via (TGV) Technology Revenue (US$ Million) & (2020-2025)
7.7.5 PLANOPTIK Recent Developments
7.8 NSG Group
7.8.1 NSG Group Profile
7.8.2 NSG Group Main Business
7.8.3 NSG Group Through Glass Via (TGV) Technology Products, Services and Solutions
7.8.4 NSG Group Through Glass Via (TGV) Technology Revenue (US$ Million) & (2020-2025)
7.8.5 NSG Group Recent Developments
7.9 AGC
7.9.1 AGC Profile
7.9.2 AGC Main Business
7.9.3 AGC Through Glass Via (TGV) Technology Products, Services and Solutions
7.9.4 AGC Through Glass Via (TGV) Technology Revenue (US$ Million) & (2020-2025)
7.9.5 AGC Recent Developments
7.10 JNTC
7.10.1 JNTC Profile
7.10.2 JNTC Main Business
7.10.3 JNTC Through Glass Via (TGV) Technology Products, Services and Solutions
7.10.4 JNTC Through Glass Via (TGV) Technology Revenue (US$ Million) & (2020-2025)
7.10.5 JNTC Recent Developments
8 Industry Chain Analysis
8.1 Through Glass Via (TGV) Technology Industrial Chain
8.2 Through Glass Via (TGV) Technology Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Through Glass Via (TGV) Technology Sales Model
8.5.2 Sales Channel
8.5.3 Through Glass Via (TGV) Technology Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.1.1 Research Programs/Design
10.1.1.2 Market Size Estimation
10.1.1.3 Market Breakdown and Data Triangulation
10.1.2 Data Source
10.1.2.1 Secondary Sources
10.1.2.2 Primary Sources
10.2 Author Details
10.3 Disclaimer