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半導体製造装置の世界市場規模、シェア、動向、機会、予測、2018-2028F 装置タイプ別(前工程装置(リソグラフィ装置、エッチング装置、成膜装置、計測/検査装置、材料除去/洗浄装置、フォトレジスト処理装置)、後工程装置(ウェハ製造装置、アセンブリ&パッケージング装置、テスト装置))、次元別(2D、2.5D、3D)、サプライチェーンプロセス別(半導体組立・テスト委託(OSAT)、集積デバイスメーカー(IDM)、ファウンドリー)、地域別、競争状況


Semiconductor Manufacturing Equipment Market Global Industry Size, Share, Trends, Opportunity, and Forecast, 2018-2028F Segmented By Equipment Type (Front-end Equipment ((Lithography Equipment, Etching Equipment, Deposition Equipment, Metrology/Inspection Equipment, Material Removal/Cleaning Equipment, Photoresist Processing Equipment) and Back-end Equipment (Wafer Manufacturing Equipment, Assembly & Packaging Equipment, Test Equipment)), By Dimension (2D, 2.5D and 3D), By Supply Chain Process (Outsourced Semiconductor Assembly and Test (OSAT), Integrated Device Manufacturer (IDM), Foundry), By Region, Competition

世界の半導体製造装置市場は、予測期間を通じて急速なペースで成長すると予測されている。半導体は、電気通信、コンピュータ、バイオテクノロジー、軍事技術、航空、再生可能エネルギー、その他の分野での進歩を... もっと見る

 

 

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サマリー

世界の半導体製造装置市場は、予測期間を通じて急速なペースで成長すると予測されている。半導体は、電気通信、コンピュータ、バイオテクノロジー、軍事技術、航空、再生可能エネルギー、その他の分野での進歩を可能にする電子機器の重要なコンポーネントである。半導体製造装置は、ICチップ、メモリーチップ、回路、その他さまざまな製品の製造に使用される。当初、製造装置はシリコンウェーハを製造するために利用され、フォトリソグラフィ装置、エッチング装置、化学蒸着装置、測定装置、プロセス/品質管理装置などのウェーハ加工ツールが含まれる。市場は、IDM、OSAT、ファウンドリーを含むサプライチェーンプロセスに分けられる。
半導体製造装置市場の主な促進要因の1つは、スマートフォンやノートパソコンなどの民生用電子機器の需要が増加していることであり、これにより半導体の小型化、高速化、高効率化のニーズが高まっている。また、モノのインターネット(IoT)の発展も、デバイスの接続や相互通信を可能にする半導体の需要に拍車をかけている。さらに、小型化のトレンドは、より小さく精密な半導体への需要を促進し、特殊な装置を必要とする3D ICのような高度な半導体製造技術の発展につながっている。市場では激しい競争が繰り広げられているものの、業界は研究開発に投資し、革新的な製品を提供する資源を持つ少数の大手企業によって支配されているのが現状である。
技術の進歩
半導体製造装置市場は、半導体業界の技術進歩によって牽引されている。半導体の小型化、高速化、高効率化に対する需要が高まるにつれ、高度な製造技術に対するニーズも高まっている。このため、3D ICやFinFETなど、特殊な装置を必要とする革新的な半導体製造技術が開発されている。
電子機器需要の増加:スマートフォン、ノートパソコン、タブレット端末などの電子機器の需要は急速に増加している。半導体産業はエレクトロニクス産業の重要な構成要素であり、電子機器の需要が増加するにつれて、半導体の需要も増加する。そのため、半導体の製造に使用される半導体製造装置の需要も増加している。したがって、半導体市場における半導体製造装置の採用拡大が市場成長を押し上げると予想される。アジア太平洋地域などの新興市場では、急速な工業化と都市化が進んでおり、これが電子機器需要の増加につながっている。さらに、この地域の国々は人口が多く、テクノロジーの導入が進んでいるため、半導体デバイスの需要が増加している。これが、世界の半導体製造装置市場の需要を牽引している。
OSATベンダーの拡大を支えるサードパーティ製ICパッケージへの需要の高まり
アウトソーシング半導体組立・テスト(OSAT)サプライチェーンプロセス分野は、家電メーカーや自動車メーカーによる組立、パッケージング、テストサービスの利用により、予測期間中に発展すると予測される。
OSAT企業は、製造施設に統合する自動化された機械や技術を求めており、顧客は半導体や電子デバイスをアウトソーシングできるようになる。半導体の製造時間と生産能力を最大化する要求の高まりは、半導体の迅速で安定した供給を保証するOSATの参加を促している。
市場が直面する課題
装置コストの高騰は、半導体製造装置セクターが直面する大きな課題のひとつである。半導体製造装置の製造は高度で資本集約的なプロセスであり、研究開発に多額の投資を必要とする。その結果、装置のコストは相当なものとなり、中小企業の市場参入を困難にしている。
さらに、半導体製造装置業界は競争が激しく、複数のメーカーが同一商品を販売している。その結果、競争が激化し、価格と利幅が低下している。とはいえ、この業界は、研究開発費を投じ、斬新な商品を生み出す能力を持つ少数の大手企業によってまだ支配されている。
市場区分
機器の種類によって、市場はフロントエンド機器とバックエンド機器に区分される。寸法ベースでは、市場は2D、2.5D、3Dに区分される。サプライチェーンプロセスベースでは、市場はさらに半導体組立・テストアウトソーシング(OSAT)、集積デバイスメーカー(IDM)、ファウンドリーに分割される。
企業プロフィール
アプライド マテリアルズ、ASML ホールディング セミコンダクター、東京エレクトロン、ラムリサーチ、KLA Corporation、Veeco Instruments Inc、Screen Holdings Co.Ltd.、Teradyne Inc.、株式会社日立ハイテクノロジーズ、Ferrotec Holdings Corporationなどが、世界の半導体製造装置市場の成長を牽引する主要企業である。
レポートの範囲
本レポートでは、半導体製造装置の世界市場を以下のカテゴリーに分類し、さらに業界動向についても詳述しています:
- 半導体製造装置市場、装置タイプ別
o 前工程装置
 リソグラフィー装置
 エッチング装置
 蒸着装置
 測定/検査装置
 材料除去/洗浄装置
 フォトレジスト処理装置
o バックエンド装置
 ウェハー製造装置
 アセンブリおよびパッケージング装置
 テスト装置
- 半導体製造装置市場、寸法別
o 2次元
o 2.5D
o 3次元
- 半導体製造装置市場:サプライチェーンプロセス別
o 半導体組立・テストアウトソーシング(OSAT)
o 統合デバイスメーカー(IDM)
o ファウンドリ
- 半導体製造装置市場:地域別
o アジア太平洋
 中国
 日本
 インド
 オーストラリア
 韓国
北米
 米国
 カナダ
 メキシコ
ヨーロッパ
 イギリス
 ドイツ
 フランス
 スペイン
 イタリア
中東およびアフリカ
 イスラエル
 トルコ
 サウジアラビア
 アラブ首長国連邦
南米
 ブラジル
 アルゼンチン
 コロンビア
競争状況
企業プロフィール:世界の半導体製造装置市場における主要企業の詳細分析。
利用可能なカスタマイズ:
TechSci Research社は、与えられた市場データをもとに、企業固有のニーズに応じたカスタマイズを提供しています。本レポートでは以下のカスタマイズが可能です:
企業情報
- 追加市場プレイヤー(最大5社)の詳細分析とプロファイリング。

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目次

1. Product Overview
1.1. Market Definition
1.2. Scope of the Market
1.2.1. Markets Covered
1.2.2. Years Considered for Study
1.2.3. Key Market Segmentations
2. Research Methodology
2.1. Objective of the Study
2.2. Baseline Methodology
2.3. Key Industry Partners
2.4. Major Association and Secondary Sources
2.5. Forecasting Methodology
2.6. Data Triangulation & Validation
2.7. Assumptions and Limitations
3. Executive Summary
4. Voice of Customer
5. Global Semiconductor manufacturing equipment Market Outlook
5.1. Market Size & Forecast
5.1.1. By Value
5.2. Market Share & Forecast
5.2.1. By Equipment Type ((Front-end Equipment (Lithography Equipment, Etching Equipment, Deposition Equipment, Metrology/Inspection Equipment, Material Removal/Cleaning Equipment, Photoresist Processing Equipment), Back-end Equipment (Wafer Manufacturing Equipment, Assembly & Packaging Equipment, Test Equipment))
5.2.2. By Dimension (2D, 2.5D and 3D)
5.2.3. By Supply Chain Process (Outsourced Semiconductor Assembly and Test (OSAT), Integrated Device Manufacturer (IDM), Foundry)
5.2.4. By Region
5.3. By Company (2022)
5.4. Market Map
6. North America Semiconductor manufacturing equipment Market Outlook
6.1. Market Size & Forecast
6.1.1. By Value
6.2. Market Share & Forecast
6.2.1. By Equipment Type
6.2.2. By Dimension
6.2.3. By Supply Chain Process
6.2.4. By Country
6.3. North America: Country Analysis
6.3.1. United States Semiconductor manufacturing equipment Market Outlook
6.3.1.1. Market Size & Forecast
6.3.1.1.1. By Value
6.3.1.2. Market Share & Forecast
6.3.1.2.1. By Equipment Type
6.3.1.2.2. By Dimension
6.3.1.2.3. By Supply Chain Process
6.3.2. Canada Semiconductor manufacturing equipment Market Outlook
6.3.2.1. Market Size & Forecast
6.3.2.1.1. By Value
6.3.2.2. Market Share & Forecast
6.3.2.2.1. By Equipment Type
6.3.2.2.2. By Dimension
6.3.2.2.3. By Supply Chain Process
6.3.3. Mexico Semiconductor manufacturing equipment Market Outlook
6.3.3.1. Market Size & Forecast
6.3.3.1.1. By Value
6.3.3.2. Market Share & Forecast
6.3.3.2.1. By Equipment Type
6.3.3.2.2. By Dimension
6.3.3.2.3. By Supply Chain Process
7. Asia-Pacific Semiconductor manufacturing equipment Market Outlook
7.1. Market Size & Forecast
7.1.1. By Value
7.2. Market Share & Forecast
7.2.1. By Equipment Type
7.2.2. By Dimension
7.2.3. By Supply Chain Process
7.2.4. By Country
7.3. Asia-Pacific: Country Analysis
7.3.1. China Semiconductor manufacturing equipment Market Outlook
7.3.1.1. Market Size & Forecast
7.3.1.1.1. By Value
7.3.1.2. Market Share & Forecast
7.3.1.2.1. By Equipment Type
7.3.1.2.2. By Dimension
7.3.1.2.3. By Supply Chain Process
7.3.2. Japan Semiconductor manufacturing equipment Market Outlook
7.3.2.1. Market Size & Forecast
7.3.2.1.1. By Value
7.3.2.2. Market Share & Forecast
7.3.2.2.1. By Equipment Type
7.3.2.2.2. By Dimension
7.3.2.2.3. By Supply Chain Process
7.3.3. South Korea Semiconductor manufacturing equipment Market Outlook
7.3.3.1. Market Size & Forecast
7.3.3.1.1. By Value
7.3.3.2. Market Share & Forecast
7.3.3.2.1. By Equipment Type
7.3.3.2.2. By Dimension
7.3.3.2.3. By Supply Chain Process
7.3.4. India Semiconductor manufacturing equipment Market Outlook
7.3.4.1. Market Size & Forecast
7.3.4.1.1. By Value
7.3.4.2. Market Share & Forecast
7.3.4.2.1. By Equipment Type
7.3.4.2.2. By Dimension
7.3.4.2.3. By Supply Chain Process
7.3.5. Australia Semiconductor manufacturing equipment Market Outlook
7.3.5.1. Market Size & Forecast
7.3.5.1.1. By Value
7.3.5.2. Market Share & Forecast
7.3.5.2.1. By Equipment Type
7.3.5.2.2. By Dimension
7.3.5.2.3. By Supply Chain Process
8. Europe Semiconductor manufacturing equipment Market Outlook
8.1. Market Size & Forecast
8.1.1. By Value
8.2. Market Share & Forecast
8.2.1. By Equipment Type
8.2.2. By Dimension
8.2.3. By Supply Chain Process
8.2.4. By Country
8.3. Europe: Country Analysis
8.3.1. Germany Semiconductor manufacturing equipment Market Outlook
8.3.1.1. Market Size & Forecast
8.3.1.1.1. By Value
8.3.1.2. Market Share & Forecast
8.3.1.2.1. By Equipment Type
8.3.1.2.2. By Dimension
8.3.1.2.3. By Supply Chain Process
8.3.2. United Kingdom Semiconductor manufacturing equipment Market Outlook
8.3.2.1. Market Size & Forecast
8.3.2.1.1. By Value
8.3.2.2. Market Share & Forecast
8.3.2.2.1. By Equipment Type
8.3.2.2.2. By Dimension
8.3.2.2.3. By Supply Chain Process
8.3.3. France Semiconductor manufacturing equipment Market Outlook
8.3.3.1. Market Size & Forecast
8.3.3.1.1. By Value
8.3.3.2. Market Share & Forecast
8.3.3.2.1. By Equipment Type
8.3.3.2.2. By Dimension
8.3.3.2.3. By Supply Chain Process
8.3.4. Italy Semiconductor manufacturing equipment Market Outlook
8.3.4.1. Market Size & Forecast
8.3.4.1.1. By Value
8.3.4.2. Market Share & Forecast
8.3.4.2.1. By Equipment Type
8.3.4.2.2. By Dimension
8.3.4.2.3. By Supply Chain Process
8.3.5. Spain Semiconductor manufacturing equipment Market Outlook
8.3.5.1. Market Size & Forecast
8.3.5.1.1. By Value
8.3.5.2. Market Share & Forecast
8.3.5.2.1. By Equipment Type
8.3.5.2.2. By Dimension
8.3.5.2.3. By Supply Chain Process
9. South America Semiconductor manufacturing equipment Market Outlook
9.1. Market Size & Forecast
9.1.1. By Value
9.2. Market Share & Forecast
9.2.1. By Equipment Type
9.2.2. By Dimension
9.2.3. By Supply Chain Process
9.2.4. By Country
9.3. South America: Country Analysis
9.3.1. Brazil Semiconductor manufacturing equipment Market Outlook
9.3.1.1. Market Size & Forecast
9.3.1.1.1. By Value
9.3.1.2. Market Share & Forecast
9.3.1.2.1. By Equipment Type
9.3.1.2.2. By Dimension
9.3.1.2.3. By Supply Chain Process
9.3.2. Argentina Semiconductor manufacturing equipment Market Outlook
9.3.2.1. Market Size & Forecast
9.3.2.1.1. By Value
9.3.2.2. Market Share & Forecast
9.3.2.2.1. By Equipment Type
9.3.2.2.2. By Dimension
9.3.2.2.3. By Supply Chain Process
9.3.3. Colombia Semiconductor manufacturing equipment Market Outlook
9.3.3.1. Market Size & Forecast
9.3.3.1.1. By Value
9.3.3.2. Market Share & Forecast
9.3.3.2.1. By Equipment Type
9.3.3.2.2. By Dimension
9.3.3.2.3. By Supply Chain Process
10. Middle East & Africa Semiconductor manufacturing equipment Market Outlook
10.1. Market Size & Forecast
10.1.1. By Value
10.2. Market Share & Forecast
10.2.1. By Equipment Type
10.2.2. By Dimension
10.2.3. By Supply Chain Process
10.2.4. By Country
10.3. Middle East & Africa: Country Analysis
10.3.1. Israel Semiconductor manufacturing equipment Market Outlook
10.3.1.1. Market Size & Forecast
10.3.1.1.1. By Value
10.3.1.2. Market Share & Forecast
10.3.1.2.1. By Equipment Type
10.3.1.2.2. By Dimension
10.3.1.2.3. By Supply Chain Process
10.3.2. Turkey Semiconductor manufacturing equipment Market Outlook
10.3.2.1. Market Size & Forecast
10.3.2.1.1. By Value
10.3.2.2. Market Share & Forecast
10.3.2.2.1. By Equipment Type
10.3.2.2.2. By Dimension
10.3.2.2.3. By Supply Chain Process
10.3.3. UAE Semiconductor manufacturing equipment Market Outlook
10.3.3.1. Market Size & Forecast
10.3.3.1.1. By Value
10.3.3.2. Market Share & Forecast
10.3.3.2.1. By Equipment Type
10.3.3.2.2. By Dimension
10.3.3.2.3. By Supply Chain Process
10.3.4. Saudi Arabia Semiconductor manufacturing equipment Market Outlook
10.3.4.1. Market Size & Forecast
10.3.4.1.1. By Value
10.3.4.2. Market Share & Forecast
10.3.4.2.1. By Equipment Type
10.3.4.2.2. By Dimension
10.3.4.2.3. By Supply Chain Process
11. Market Dynamics
11.1. Drivers
11.1.1. Growing demand for electronics
11.1.2. Increasing investments in research and development
11.1.3. Increasing demand for cloud computing
11.2. Challenges
11.2.1. high cost of equipment
11.2.2. Supply chain disruptions
12. Market Trends & Developments
12.1. Rising Consumer Electronics Device Demand
12.2. AI, IoT, and Connected Device Proliferation Across Industrial Verticals
12.3. The growth of the IoT is driving demand for semiconductors.
12.4. The adoption of blockchain technology
12.5. AI is driving the development of new semiconductor applications.
13. Company Profiles
13.1. Applied Materials Inc
13.1.1. Business Overview
13.1.2. Key Revenue (If Available)
13.1.3. Recent Developments
13.1.4. Key Personnel
13.1.5. Key Product/Service Offered
13.2. ASML Holding Semiconductor Company
13.2.1. Business Overview
13.2.2. Key Revenue (If Available)
13.2.3. Recent Developments
13.2.4. Key Personnel
13.2.5. Key Product/Service Offered
13.3. Tokyo Electron Limited
13.3.1. Business Overview
13.3.2. Key Revenue (If Available)
13.3.3. Recent Developments
13.3.4. Key Personnel
13.3.5. Key Product/Service Offered
13.4. Lam Research Corporation
13.4.1. Business Overview
13.4.2. Key Revenue (If Available)
13.4.3. Recent Developments
13.4.4. Key Personnel
13.4.5. Key Product/Service Offered
13.5. KLA Corporation
13.5.1. Business Overview
13.5.2. Key Revenue (If Available)
13.5.3. Recent Developments
13.5.4. Key Personnel
13.5.5. Key Product/Service Offered
13.6. Veeco Instruments Inc
13.6.1. Business Overview
13.6.2. Key Revenue (If Available)
13.6.3. Recent Developments
13.6.4. Key Personnel
13.6.5. Key Product/Service Offered
13.7. Screen Holdings Co. Ltd
13.7.1. Business Overview
13.7.2. Key Revenue (If Available)
13.7.3. Recent Developments
13.7.4. Key Personnel
13.7.5. Key Product/Service Offered
13.8. Teradyne Inc
13.8.1. Business Overview
13.8.2. Key Revenue (If Available)
13.8.3. Recent Developments
13.8.4. Key Personnel
13.8.5. Key Product/Service Offered
13.9. Hitachi High -Technologies Corporation
13.9.1. Business Overview
13.9.2. Key Revenue (If Available)
13.9.3. Recent Developments
13.9.4. Key Personnel
13.9.5. Key Product/Service Offered
13.10. Ferrotec Holdings Corporation.
13.10.1. Business Overview
13.10.2. Key Revenue (If Available)
13.10.3. Recent Developments
13.10.4. Key Personnel
13.10.5. Key Product/Service Offered
14. Strategic Recommendations
15. About Us & Disclaimer
(Note: The companies list can be customized based on the client requirements.)

 

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Summary

Global Semiconductor manufacturing equipment market is predicted to grow at a rapid pace throughout the forecast period. A semiconductor is a critical component of electronic equipment that enables advancements in telecommunication, computers, biotechnology, military technology, aviation, renewable energy, and other sectors. Semiconductor manufacturing equipment is used to create IC chips, memory chips, circuits, and a variety of other products. Initially, manufacturing equipment is utilized to produce silicon wafers, including wafer processing tools such as photolithography tools, etching machines, chemical vapor deposition machines, measurement devices, and process/quality control equipment. The market is divided into supply chain processes, which include IDM, OSAT, and foundry.
One of the primary drivers of the semiconductor manufacturing equipment market is the increasing demand for consumer electronics, such as smartphones and laptops, which is driving the need for smaller, faster, and more efficient semiconductors. The development of the Internet of Things (IoT) has also fueled the demand for semiconductors, which can help connect devices and enable them to communicate with each other. Furthermore, the trend of miniaturization is driving the demand for smaller and more precise semiconductors, leading to the development of advanced semiconductor manufacturing technologies, such as 3D ICs, which require specialized equipment. Despite intense competition in the market, the industry is still dominated by a few large players who have the resources to invest in research and development and offer innovative products.
Technological advancements
The semiconductor manufacturing equipment market is driven by technological advancements in the semiconductor industry. With the increasing demand for smaller, faster, and more efficient semiconductors, the need for advanced manufacturing technologies has also increased. This has led to the development of innovative semiconductor manufacturing technologies such as 3D ICs, FinFETs, and others, which require specialized equipment.
Increasing demand for electronic devices: The demand for electronic devices such as smartphones, laptops, and tablets has been increasing rapidly. The semiconductor industry is a crucial component of the electronics industry, and as the demand for electronic devices increases, the demand for semiconductors also increases. This, in turn, drives the demand for semiconductor equipment, which is used in the manufacturing of semiconductors. Hence, the growing adoption of semiconductor manufacturing equipment in semiconductor market is expected to boost market growth. Emerging markets, such as Asia-Pacific, are experiencing rapid industrialization and urbanization, which has led to an increase in demand for electronic devices. Moreover, the countries in this region have a large population that is increasingly adopting technology, thereby increasing the demand for semiconductor devices. This, in turn, drives the demand for global semiconductor manufacturing equipment market.
Growing demand for third-party IC packaging to support OSAT vendor expansion
The outsourced semiconductor assembly and test (OSAT) supply chain process sector is predicted to develop during the forecast period, owing to the use of assembly, packaging, and testing services by consumer electronics and automotive manufacturers.
OSAT enterprises are looking for automated machinery and technology to integrate into their manufacturing facilities, allowing clients to outsource semiconductor and electronic devices. The increased requirement to maximize semiconductor fab time and capacity is encouraging OSAT participation to assure a speedier and consistent supply of semiconductors.
Challenges faced by the Market
The high cost of equipment is one of the major challenges that the semiconductor manufacturing equipment sector faces. Manufacturing semiconductor manufacturing equipment is a sophisticated and capital-intensive process that necessitates substantial investment in research and development. As a result, the cost of equipment is considerable, making it difficult for small and medium-sized businesses to enter the market.
Furthermore, the semiconductor manufacturing equipment industry is very competitive, with multiple manufacturers selling identical goods. This has resulted in increased rivalry, which has resulted in a drop in prices and margins. Yet, the industry is still controlled by a few major businesses with the ability to spend in R&D and create novel goods.
Market Segmentation
On the basis of Equipment Type, the market is segmented into Front-end Equipment and Back-end Equipment. On the basis of Dimension, the market is segmented into 2D, 2.5D and 3D. On the basis of Supply Chain Process, the market is further split into Outsourced Semiconductor Assembly and Test (OSAT), Integrated Device Manufacturer (IDM) and Foundry.
Company Profiles
Applied Materials Inc, ASML Holding Semiconductor Company, Tokyo Electron Limited, Lam Research Corporation, KLA Corporation, Veeco Instruments Inc, Screen Holdings Co. Ltd, Teradyne Inc, Hitachi High -Technologies Corporation, Ferrotec Holdings Corporation, are among the major players that are driving the growth of the global semiconductor manufacturing equipment market.
Report Scope:
In this report, the global semiconductor manufacturing equipment market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:
• Semiconductor manufacturing equipment Market, By Equipment Type:
o Front-end Equipment
 Lithography Equipment
 Etching Equipment
 Deposition Equipment
 Metrology/Inspection Equipment
 Material Removal/Cleaning Equipment
 Photoresist Processing Equipment
o Back-end Equipment
 Wafer Manufacturing Equipment
 Assembly & Packaging Equipment
 Test Equipment
• Semiconductor manufacturing equipment Market, By Dimension:
o 2D
o 2.5D
o 3D
• Semiconductor manufacturing equipment Market, By Supply Chain Process:
o Outsourced Semiconductor Assembly and Test (OSAT)
o Integrated Device Manufacturer (IDM)
o Foundry
• Semiconductor manufacturing equipment Market, By Region:
o Asia-Pacific
 China
 Japan
 India
 Australia
 South Korea
o North America
 United States
 Canada
 Mexico
o Europe
 United Kingdom
 Germany
 France
 Spain
 Italy
o Middle East & Africa
 Israel
 Turkey
 Saudi Arabia
 UAE
o South America
 Brazil
 Argentina
 Colombia
Competitive Landscape
Company Profiles: Detailed analysis of the major companies present in the global semiconductor manufacturing equipment market.
Available Customizations:
With the given market data, TechSci Research offers customizations according to a company’s specific needs. The following customization options are available for the report:
Company Information
• Detailed an analysis and profiling of additional market players (up to five).



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Table of Contents

1. Product Overview
1.1. Market Definition
1.2. Scope of the Market
1.2.1. Markets Covered
1.2.2. Years Considered for Study
1.2.3. Key Market Segmentations
2. Research Methodology
2.1. Objective of the Study
2.2. Baseline Methodology
2.3. Key Industry Partners
2.4. Major Association and Secondary Sources
2.5. Forecasting Methodology
2.6. Data Triangulation & Validation
2.7. Assumptions and Limitations
3. Executive Summary
4. Voice of Customer
5. Global Semiconductor manufacturing equipment Market Outlook
5.1. Market Size & Forecast
5.1.1. By Value
5.2. Market Share & Forecast
5.2.1. By Equipment Type ((Front-end Equipment (Lithography Equipment, Etching Equipment, Deposition Equipment, Metrology/Inspection Equipment, Material Removal/Cleaning Equipment, Photoresist Processing Equipment), Back-end Equipment (Wafer Manufacturing Equipment, Assembly & Packaging Equipment, Test Equipment))
5.2.2. By Dimension (2D, 2.5D and 3D)
5.2.3. By Supply Chain Process (Outsourced Semiconductor Assembly and Test (OSAT), Integrated Device Manufacturer (IDM), Foundry)
5.2.4. By Region
5.3. By Company (2022)
5.4. Market Map
6. North America Semiconductor manufacturing equipment Market Outlook
6.1. Market Size & Forecast
6.1.1. By Value
6.2. Market Share & Forecast
6.2.1. By Equipment Type
6.2.2. By Dimension
6.2.3. By Supply Chain Process
6.2.4. By Country
6.3. North America: Country Analysis
6.3.1. United States Semiconductor manufacturing equipment Market Outlook
6.3.1.1. Market Size & Forecast
6.3.1.1.1. By Value
6.3.1.2. Market Share & Forecast
6.3.1.2.1. By Equipment Type
6.3.1.2.2. By Dimension
6.3.1.2.3. By Supply Chain Process
6.3.2. Canada Semiconductor manufacturing equipment Market Outlook
6.3.2.1. Market Size & Forecast
6.3.2.1.1. By Value
6.3.2.2. Market Share & Forecast
6.3.2.2.1. By Equipment Type
6.3.2.2.2. By Dimension
6.3.2.2.3. By Supply Chain Process
6.3.3. Mexico Semiconductor manufacturing equipment Market Outlook
6.3.3.1. Market Size & Forecast
6.3.3.1.1. By Value
6.3.3.2. Market Share & Forecast
6.3.3.2.1. By Equipment Type
6.3.3.2.2. By Dimension
6.3.3.2.3. By Supply Chain Process
7. Asia-Pacific Semiconductor manufacturing equipment Market Outlook
7.1. Market Size & Forecast
7.1.1. By Value
7.2. Market Share & Forecast
7.2.1. By Equipment Type
7.2.2. By Dimension
7.2.3. By Supply Chain Process
7.2.4. By Country
7.3. Asia-Pacific: Country Analysis
7.3.1. China Semiconductor manufacturing equipment Market Outlook
7.3.1.1. Market Size & Forecast
7.3.1.1.1. By Value
7.3.1.2. Market Share & Forecast
7.3.1.2.1. By Equipment Type
7.3.1.2.2. By Dimension
7.3.1.2.3. By Supply Chain Process
7.3.2. Japan Semiconductor manufacturing equipment Market Outlook
7.3.2.1. Market Size & Forecast
7.3.2.1.1. By Value
7.3.2.2. Market Share & Forecast
7.3.2.2.1. By Equipment Type
7.3.2.2.2. By Dimension
7.3.2.2.3. By Supply Chain Process
7.3.3. South Korea Semiconductor manufacturing equipment Market Outlook
7.3.3.1. Market Size & Forecast
7.3.3.1.1. By Value
7.3.3.2. Market Share & Forecast
7.3.3.2.1. By Equipment Type
7.3.3.2.2. By Dimension
7.3.3.2.3. By Supply Chain Process
7.3.4. India Semiconductor manufacturing equipment Market Outlook
7.3.4.1. Market Size & Forecast
7.3.4.1.1. By Value
7.3.4.2. Market Share & Forecast
7.3.4.2.1. By Equipment Type
7.3.4.2.2. By Dimension
7.3.4.2.3. By Supply Chain Process
7.3.5. Australia Semiconductor manufacturing equipment Market Outlook
7.3.5.1. Market Size & Forecast
7.3.5.1.1. By Value
7.3.5.2. Market Share & Forecast
7.3.5.2.1. By Equipment Type
7.3.5.2.2. By Dimension
7.3.5.2.3. By Supply Chain Process
8. Europe Semiconductor manufacturing equipment Market Outlook
8.1. Market Size & Forecast
8.1.1. By Value
8.2. Market Share & Forecast
8.2.1. By Equipment Type
8.2.2. By Dimension
8.2.3. By Supply Chain Process
8.2.4. By Country
8.3. Europe: Country Analysis
8.3.1. Germany Semiconductor manufacturing equipment Market Outlook
8.3.1.1. Market Size & Forecast
8.3.1.1.1. By Value
8.3.1.2. Market Share & Forecast
8.3.1.2.1. By Equipment Type
8.3.1.2.2. By Dimension
8.3.1.2.3. By Supply Chain Process
8.3.2. United Kingdom Semiconductor manufacturing equipment Market Outlook
8.3.2.1. Market Size & Forecast
8.3.2.1.1. By Value
8.3.2.2. Market Share & Forecast
8.3.2.2.1. By Equipment Type
8.3.2.2.2. By Dimension
8.3.2.2.3. By Supply Chain Process
8.3.3. France Semiconductor manufacturing equipment Market Outlook
8.3.3.1. Market Size & Forecast
8.3.3.1.1. By Value
8.3.3.2. Market Share & Forecast
8.3.3.2.1. By Equipment Type
8.3.3.2.2. By Dimension
8.3.3.2.3. By Supply Chain Process
8.3.4. Italy Semiconductor manufacturing equipment Market Outlook
8.3.4.1. Market Size & Forecast
8.3.4.1.1. By Value
8.3.4.2. Market Share & Forecast
8.3.4.2.1. By Equipment Type
8.3.4.2.2. By Dimension
8.3.4.2.3. By Supply Chain Process
8.3.5. Spain Semiconductor manufacturing equipment Market Outlook
8.3.5.1. Market Size & Forecast
8.3.5.1.1. By Value
8.3.5.2. Market Share & Forecast
8.3.5.2.1. By Equipment Type
8.3.5.2.2. By Dimension
8.3.5.2.3. By Supply Chain Process
9. South America Semiconductor manufacturing equipment Market Outlook
9.1. Market Size & Forecast
9.1.1. By Value
9.2. Market Share & Forecast
9.2.1. By Equipment Type
9.2.2. By Dimension
9.2.3. By Supply Chain Process
9.2.4. By Country
9.3. South America: Country Analysis
9.3.1. Brazil Semiconductor manufacturing equipment Market Outlook
9.3.1.1. Market Size & Forecast
9.3.1.1.1. By Value
9.3.1.2. Market Share & Forecast
9.3.1.2.1. By Equipment Type
9.3.1.2.2. By Dimension
9.3.1.2.3. By Supply Chain Process
9.3.2. Argentina Semiconductor manufacturing equipment Market Outlook
9.3.2.1. Market Size & Forecast
9.3.2.1.1. By Value
9.3.2.2. Market Share & Forecast
9.3.2.2.1. By Equipment Type
9.3.2.2.2. By Dimension
9.3.2.2.3. By Supply Chain Process
9.3.3. Colombia Semiconductor manufacturing equipment Market Outlook
9.3.3.1. Market Size & Forecast
9.3.3.1.1. By Value
9.3.3.2. Market Share & Forecast
9.3.3.2.1. By Equipment Type
9.3.3.2.2. By Dimension
9.3.3.2.3. By Supply Chain Process
10. Middle East & Africa Semiconductor manufacturing equipment Market Outlook
10.1. Market Size & Forecast
10.1.1. By Value
10.2. Market Share & Forecast
10.2.1. By Equipment Type
10.2.2. By Dimension
10.2.3. By Supply Chain Process
10.2.4. By Country
10.3. Middle East & Africa: Country Analysis
10.3.1. Israel Semiconductor manufacturing equipment Market Outlook
10.3.1.1. Market Size & Forecast
10.3.1.1.1. By Value
10.3.1.2. Market Share & Forecast
10.3.1.2.1. By Equipment Type
10.3.1.2.2. By Dimension
10.3.1.2.3. By Supply Chain Process
10.3.2. Turkey Semiconductor manufacturing equipment Market Outlook
10.3.2.1. Market Size & Forecast
10.3.2.1.1. By Value
10.3.2.2. Market Share & Forecast
10.3.2.2.1. By Equipment Type
10.3.2.2.2. By Dimension
10.3.2.2.3. By Supply Chain Process
10.3.3. UAE Semiconductor manufacturing equipment Market Outlook
10.3.3.1. Market Size & Forecast
10.3.3.1.1. By Value
10.3.3.2. Market Share & Forecast
10.3.3.2.1. By Equipment Type
10.3.3.2.2. By Dimension
10.3.3.2.3. By Supply Chain Process
10.3.4. Saudi Arabia Semiconductor manufacturing equipment Market Outlook
10.3.4.1. Market Size & Forecast
10.3.4.1.1. By Value
10.3.4.2. Market Share & Forecast
10.3.4.2.1. By Equipment Type
10.3.4.2.2. By Dimension
10.3.4.2.3. By Supply Chain Process
11. Market Dynamics
11.1. Drivers
11.1.1. Growing demand for electronics
11.1.2. Increasing investments in research and development
11.1.3. Increasing demand for cloud computing
11.2. Challenges
11.2.1. high cost of equipment
11.2.2. Supply chain disruptions
12. Market Trends & Developments
12.1. Rising Consumer Electronics Device Demand
12.2. AI, IoT, and Connected Device Proliferation Across Industrial Verticals
12.3. The growth of the IoT is driving demand for semiconductors.
12.4. The adoption of blockchain technology
12.5. AI is driving the development of new semiconductor applications.
13. Company Profiles
13.1. Applied Materials Inc
13.1.1. Business Overview
13.1.2. Key Revenue (If Available)
13.1.3. Recent Developments
13.1.4. Key Personnel
13.1.5. Key Product/Service Offered
13.2. ASML Holding Semiconductor Company
13.2.1. Business Overview
13.2.2. Key Revenue (If Available)
13.2.3. Recent Developments
13.2.4. Key Personnel
13.2.5. Key Product/Service Offered
13.3. Tokyo Electron Limited
13.3.1. Business Overview
13.3.2. Key Revenue (If Available)
13.3.3. Recent Developments
13.3.4. Key Personnel
13.3.5. Key Product/Service Offered
13.4. Lam Research Corporation
13.4.1. Business Overview
13.4.2. Key Revenue (If Available)
13.4.3. Recent Developments
13.4.4. Key Personnel
13.4.5. Key Product/Service Offered
13.5. KLA Corporation
13.5.1. Business Overview
13.5.2. Key Revenue (If Available)
13.5.3. Recent Developments
13.5.4. Key Personnel
13.5.5. Key Product/Service Offered
13.6. Veeco Instruments Inc
13.6.1. Business Overview
13.6.2. Key Revenue (If Available)
13.6.3. Recent Developments
13.6.4. Key Personnel
13.6.5. Key Product/Service Offered
13.7. Screen Holdings Co. Ltd
13.7.1. Business Overview
13.7.2. Key Revenue (If Available)
13.7.3. Recent Developments
13.7.4. Key Personnel
13.7.5. Key Product/Service Offered
13.8. Teradyne Inc
13.8.1. Business Overview
13.8.2. Key Revenue (If Available)
13.8.3. Recent Developments
13.8.4. Key Personnel
13.8.5. Key Product/Service Offered
13.9. Hitachi High -Technologies Corporation
13.9.1. Business Overview
13.9.2. Key Revenue (If Available)
13.9.3. Recent Developments
13.9.4. Key Personnel
13.9.5. Key Product/Service Offered
13.10. Ferrotec Holdings Corporation.
13.10.1. Business Overview
13.10.2. Key Revenue (If Available)
13.10.3. Recent Developments
13.10.4. Key Personnel
13.10.5. Key Product/Service Offered
14. Strategic Recommendations
15. About Us & Disclaimer
(Note: The companies list can be customized based on the client requirements.)

 

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