Summary

The global market for Wafer Thinning Machine was estimated to be worth US$ 1042 million in 2024 and is forecast to a readjusted size of US$ 1699 million by 2031 with a CAGR of 7.1% during the forecast period 2025-2031.
Wafer thinning machines, also called grinders, use a centrally located robot to move wafers from the input station to the measurement station. After that, the wafer moves to the polishing station and the cleaning station in sequence. The robot can move the wafer from the cleaning station to the measuring station for measurement after grinding or directly to the output station.
The Wafer Thinning Machines market, primarily driven by the increasing demand for precision and efficiency in semiconductor manufacturing, is growing rapidly across the globe. Wafer Thinning Machines are integral in wafer thinning processes, where the primary applications include the processing of 200mm and 300mm wafers. Among the various types of Wafer Thinning Machines, the fully automatic Wafer Thinning Machines dominate the market, they have higher automation levels, allowing for increased efficiency and precision, accounting for approximately 52% of the global market share. The most significant application market is for 300mm wafers, which accounts for 83% of the global demand, primarily driven by the advanced semiconductor manufacturing processes that require thinner wafers with high precision. Geographically, the Asia-Pacific (APAC) region holds the largest consumption share, accounting for about 78% of the global market, driven by the robust semiconductor manufacturing ecosystem in countries like China, Japan, South Korea, and Taiwan.
Manufacturers, like Disco, TOKYO SEIMITSU, Okamoto Semiconductor Equipment Division, CETC, G&N, etc. are well-known for the wonderful performance of their Wafer Thinning Machine and related services. The top five players account for about 90% of the revenue market in 2024.
Market Drivers:
Technological Advancements in Semiconductor Manufacturing: As the demand for smaller, more powerful, and energy-efficient electronic devices grows, semiconductor manufacturers are continuously advancing their processes to meet these demands. This includes the need for thinner, more precisely engineered wafers, driving the demand for high-performance Wafer Thinning Machines. Fully automatic Wafer Thinning Machines, known for their precision and ability to handle larger volumes, are particularly in demand to meet these stringent manufacturing requirements.
Miniaturization of Electronic Devices: The global trend towards smaller, more compact electronic devices—such as smartphones, wearables, and IoT devices—requires thinner semiconductor wafers. As a result, there is a growing demand for wafer thinning solutions that can maintain high quality while reducing thickness. Fully automatic Wafer Thinning Machines are the preferred solution, as they offer high precision and productivity.
Surge in Semiconductor Demand: The semiconductor industry is experiencing significant growth, driven by the rise in demand for various electronic applications, including computing, communication, and automotive systems. As the industry's focus shifts towards advanced technology nodes, the demand for larger wafers, particularly 300mm wafers, is growing. These trends are contributing to the expansion of the Wafer Thinning Machine market, especially in regions such as APAC, which dominate semiconductor manufacturing.
Shift Towards Fully Automated Solutions: Fully automated Wafer Thinning Machines are gaining popularity due to their higher efficiency, reduced labor costs, and the ability to maintain consistency across large batches. As semiconductor manufacturers continue to scale production, automation becomes increasingly essential to meet high-volume production requirements without compromising quality.
Conclusion:
The Wafer Thinning Machine market is poised for significant growth, driven by advancements in semiconductor manufacturing, the increasing demand for thinner and more precise wafers, and the rise in 300mm wafer processing. Fully automatic Wafer Thinning Machines, which dominate the market with a 52% share, will continue to lead the market due to their higher efficiency and precision.
The APAC region remains the largest consumer of Wafer Thinning Machines. However, despite these strong growth drivers, challenges such as high initial investment costs and technological complexity may pose barriers to market entry for smaller players. Manufacturers will need to innovate and focus on automation, precision, and cost-effective solutions to capitalize on the growing demand for wafer thinning equipment.
This report aims to provide a comprehensive presentation of the global market for Wafer Thinning Machine, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Wafer Thinning Machine by region & country, by Type, and by Application.
The Wafer Thinning Machine market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Thinning Machine.
Market Segmentation
By Company
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
WAIDA MFG
Hunan Yujing Machine Industrial
SpeedFam
TSD
Engis Corporation
NTS
Segment by Type
Fully Automatic Wafer Grinders
Semi-Automatic Wafer Grinders
Segment by Application
Silicon Wafer
Compound Semiconductors
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Wafer Thinning Machine manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Wafer Thinning Machine in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Wafer Thinning Machine in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

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Table of Contents

1 Market Overview
1.1 Wafer Thinning Machine Product Introduction
1.2 Global Wafer Thinning Machine Market Size Forecast
1.2.1 Global Wafer Thinning Machine Sales Value (2020-2031)
1.2.2 Global Wafer Thinning Machine Sales Volume (2020-2031)
1.2.3 Global Wafer Thinning Machine Sales Price (2020-2031)
1.3 Wafer Thinning Machine Market Trends & Drivers
1.3.1 Wafer Thinning Machine Industry Trends
1.3.2 Wafer Thinning Machine Market Drivers & Opportunity
1.3.3 Wafer Thinning Machine Market Challenges
1.3.4 Wafer Thinning Machine Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Wafer Thinning Machine Players Revenue Ranking (2024)
2.2 Global Wafer Thinning Machine Revenue by Company (2020-2025)
2.3 Global Wafer Thinning Machine Players Sales Volume Ranking (2024)
2.4 Global Wafer Thinning Machine Sales Volume by Company Players (2020-2025)
2.5 Global Wafer Thinning Machine Average Price by Company (2020-2025)
2.6 Key Manufacturers Wafer Thinning Machine Manufacturing Base and Headquarters
2.7 Key Manufacturers Wafer Thinning Machine Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Wafer Thinning Machine
2.9 Wafer Thinning Machine Market Competitive Analysis
2.9.1 Wafer Thinning Machine Market Concentration Rate (2020-2025)
2.9.2 Global 5 and 10 Largest Manufacturers by Wafer Thinning Machine Revenue in 2024
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Thinning Machine as of 2024)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Fully Automatic Wafer Grinders
3.1.2 Semi-Automatic Wafer Grinders
3.2 Global Wafer Thinning Machine Sales Value by Type
3.2.1 Global Wafer Thinning Machine Sales Value by Type (2020 VS 2024 VS 2031)
3.2.2 Global Wafer Thinning Machine Sales Value, by Type (2020-2031)
3.2.3 Global Wafer Thinning Machine Sales Value, by Type (%) (2020-2031)
3.3 Global Wafer Thinning Machine Sales Volume by Type
3.3.1 Global Wafer Thinning Machine Sales Volume by Type (2020 VS 2024 VS 2031)
3.3.2 Global Wafer Thinning Machine Sales Volume, by Type (2020-2031)
3.3.3 Global Wafer Thinning Machine Sales Volume, by Type (%) (2020-2031)
3.4 Global Wafer Thinning Machine Average Price by Type (2020-2031)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Silicon Wafer
4.1.2 Compound Semiconductors
4.2 Global Wafer Thinning Machine Sales Value by Application
4.2.1 Global Wafer Thinning Machine Sales Value by Application (2020 VS 2024 VS 2031)
4.2.2 Global Wafer Thinning Machine Sales Value, by Application (2020-2031)
4.2.3 Global Wafer Thinning Machine Sales Value, by Application (%) (2020-2031)
4.3 Global Wafer Thinning Machine Sales Volume by Application
4.3.1 Global Wafer Thinning Machine Sales Volume by Application (2020 VS 2024 VS 2031)
4.3.2 Global Wafer Thinning Machine Sales Volume, by Application (2020-2031)
4.3.3 Global Wafer Thinning Machine Sales Volume, by Application (%) (2020-2031)
4.4 Global Wafer Thinning Machine Average Price by Application (2020-2031)
5 Segmentation by Region
5.1 Global Wafer Thinning Machine Sales Value by Region
5.1.1 Global Wafer Thinning Machine Sales Value by Region: 2020 VS 2024 VS 2031
5.1.2 Global Wafer Thinning Machine Sales Value by Region (2020-2025)
5.1.3 Global Wafer Thinning Machine Sales Value by Region (2026-2031)
5.1.4 Global Wafer Thinning Machine Sales Value by Region (%), (2020-2031)
5.2 Global Wafer Thinning Machine Sales Volume by Region
5.2.1 Global Wafer Thinning Machine Sales Volume by Region: 2020 VS 2024 VS 2031
5.2.2 Global Wafer Thinning Machine Sales Volume by Region (2020-2025)
5.2.3 Global Wafer Thinning Machine Sales Volume by Region (2026-2031)
5.2.4 Global Wafer Thinning Machine Sales Volume by Region (%), (2020-2031)
5.3 Global Wafer Thinning Machine Average Price by Region (2020-2031)
5.4 North America
5.4.1 North America Wafer Thinning Machine Sales Value, 2020-2031
5.4.2 North America Wafer Thinning Machine Sales Value by Country (%), 2024 VS 2031
5.5 Europe
5.5.1 Europe Wafer Thinning Machine Sales Value, 2020-2031
5.5.2 Europe Wafer Thinning Machine Sales Value by Country (%), 2024 VS 2031
5.6 Asia Pacific
5.6.1 Asia Pacific Wafer Thinning Machine Sales Value, 2020-2031
5.6.2 Asia Pacific Wafer Thinning Machine Sales Value by Region (%), 2024 VS 2031
5.7 South America
5.7.1 South America Wafer Thinning Machine Sales Value, 2020-2031
5.7.2 South America Wafer Thinning Machine Sales Value by Country (%), 2024 VS 2031
5.8 Middle East & Africa
5.8.1 Middle East & Africa Wafer Thinning Machine Sales Value, 2020-2031
5.8.2 Middle East & Africa Wafer Thinning Machine Sales Value by Country (%), 2024 VS 2031
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Wafer Thinning Machine Sales Value Growth Trends, 2020 VS 2024 VS 2031
6.2 Key Countries/Regions Wafer Thinning Machine Sales Value and Sales Volume
6.2.1 Key Countries/Regions Wafer Thinning Machine Sales Value, 2020-2031
6.2.2 Key Countries/Regions Wafer Thinning Machine Sales Volume, 2020-2031
6.3 United States
6.3.1 United States Wafer Thinning Machine Sales Value, 2020-2031
6.3.2 United States Wafer Thinning Machine Sales Value by Type (%), 2024 VS 2031
6.3.3 United States Wafer Thinning Machine Sales Value by Application, 2024 VS 2031
6.4 Europe
6.4.1 Europe Wafer Thinning Machine Sales Value, 2020-2031
6.4.2 Europe Wafer Thinning Machine Sales Value by Type (%), 2024 VS 2031
6.4.3 Europe Wafer Thinning Machine Sales Value by Application, 2024 VS 2031
6.5 China
6.5.1 China Wafer Thinning Machine Sales Value, 2020-2031
6.5.2 China Wafer Thinning Machine Sales Value by Type (%), 2024 VS 2031
6.5.3 China Wafer Thinning Machine Sales Value by Application, 2024 VS 2031
6.6 Japan
6.6.1 Japan Wafer Thinning Machine Sales Value, 2020-2031
6.6.2 Japan Wafer Thinning Machine Sales Value by Type (%), 2024 VS 2031
6.6.3 Japan Wafer Thinning Machine Sales Value by Application, 2024 VS 2031
6.7 South Korea
6.7.1 South Korea Wafer Thinning Machine Sales Value, 2020-2031
6.7.2 South Korea Wafer Thinning Machine Sales Value by Type (%), 2024 VS 2031
6.7.3 South Korea Wafer Thinning Machine Sales Value by Application, 2024 VS 2031
6.8 Southeast Asia
6.8.1 Southeast Asia Wafer Thinning Machine Sales Value, 2020-2031
6.8.2 Southeast Asia Wafer Thinning Machine Sales Value by Type (%), 2024 VS 2031
6.8.3 Southeast Asia Wafer Thinning Machine Sales Value by Application, 2024 VS 2031
6.9 India
6.9.1 India Wafer Thinning Machine Sales Value, 2020-2031
6.9.2 India Wafer Thinning Machine Sales Value by Type (%), 2024 VS 2031
6.9.3 India Wafer Thinning Machine Sales Value by Application, 2024 VS 2031
7 Company Profiles
7.1 Disco
7.1.1 Disco Company Information
7.1.2 Disco Introduction and Business Overview
7.1.3 Disco Wafer Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.1.4 Disco Wafer Thinning Machine Product Offerings
7.1.5 Disco Recent Development
7.2 TOKYO SEIMITSU
7.2.1 TOKYO SEIMITSU Company Information
7.2.2 TOKYO SEIMITSU Introduction and Business Overview
7.2.3 TOKYO SEIMITSU Wafer Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.2.4 TOKYO SEIMITSU Wafer Thinning Machine Product Offerings
7.2.5 TOKYO SEIMITSU Recent Development
7.3 G&N
7.3.1 G&N Company Information
7.3.2 G&N Introduction and Business Overview
7.3.3 G&N Wafer Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.3.4 G&N Wafer Thinning Machine Product Offerings
7.3.5 G&N Recent Development
7.4 Okamoto Semiconductor Equipment Division
7.4.1 Okamoto Semiconductor Equipment Division Company Information
7.4.2 Okamoto Semiconductor Equipment Division Introduction and Business Overview
7.4.3 Okamoto Semiconductor Equipment Division Wafer Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.4.4 Okamoto Semiconductor Equipment Division Wafer Thinning Machine Product Offerings
7.4.5 Okamoto Semiconductor Equipment Division Recent Development
7.5 CETC
7.5.1 CETC Company Information
7.5.2 CETC Introduction and Business Overview
7.5.3 CETC Wafer Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.5.4 CETC Wafer Thinning Machine Product Offerings
7.5.5 CETC Recent Development
7.6 Koyo Machinery
7.6.1 Koyo Machinery Company Information
7.6.2 Koyo Machinery Introduction and Business Overview
7.6.3 Koyo Machinery Wafer Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.6.4 Koyo Machinery Wafer Thinning Machine Product Offerings
7.6.5 Koyo Machinery Recent Development
7.7 Revasum
7.7.1 Revasum Company Information
7.7.2 Revasum Introduction and Business Overview
7.7.3 Revasum Wafer Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.7.4 Revasum Wafer Thinning Machine Product Offerings
7.7.5 Revasum Recent Development
7.8 WAIDA MFG
7.8.1 WAIDA MFG Company Information
7.8.2 WAIDA MFG Introduction and Business Overview
7.8.3 WAIDA MFG Wafer Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.8.4 WAIDA MFG Wafer Thinning Machine Product Offerings
7.8.5 WAIDA MFG Recent Development
7.9 Hunan Yujing Machine Industrial
7.9.1 Hunan Yujing Machine Industrial Company Information
7.9.2 Hunan Yujing Machine Industrial Introduction and Business Overview
7.9.3 Hunan Yujing Machine Industrial Wafer Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.9.4 Hunan Yujing Machine Industrial Wafer Thinning Machine Product Offerings
7.9.5 Hunan Yujing Machine Industrial Recent Development
7.10 SpeedFam
7.10.1 SpeedFam Company Information
7.10.2 SpeedFam Introduction and Business Overview
7.10.3 SpeedFam Wafer Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.10.4 SpeedFam Wafer Thinning Machine Product Offerings
7.10.5 SpeedFam Recent Development
7.11 TSD
7.11.1 TSD Company Information
7.11.2 TSD Introduction and Business Overview
7.11.3 TSD Wafer Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.11.4 TSD Wafer Thinning Machine Product Offerings
7.11.5 TSD Recent Development
7.12 Engis Corporation
7.12.1 Engis Corporation Company Information
7.12.2 Engis Corporation Introduction and Business Overview
7.12.3 Engis Corporation Wafer Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.12.4 Engis Corporation Wafer Thinning Machine Product Offerings
7.12.5 Engis Corporation Recent Development
7.13 NTS
7.13.1 NTS Company Information
7.13.2 NTS Introduction and Business Overview
7.13.3 NTS Wafer Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.13.4 NTS Wafer Thinning Machine Product Offerings
7.13.5 NTS Recent Development
8 Industry Chain Analysis
8.1 Wafer Thinning Machine Industrial Chain
8.2 Wafer Thinning Machine Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Wafer Thinning Machine Sales Model
8.5.2 Sales Channel
8.5.3 Wafer Thinning Machine Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.1.1 Research Programs/Design
10.1.1.2 Market Size Estimation
10.1.1.3 Market Breakdown and Data Triangulation
10.1.2 Data Source
10.1.2.1 Secondary Sources
10.1.2.2 Primary Sources
10.2 Author Details
10.3 Disclaimer