Summary

The global market for Thinning Machine was estimated to be worth US$ 1042 million in 2024 and is forecast to a readjusted size of US$ 1699 million by 2031 with a CAGR of 7.1% during the forecast period 2025-2031.
Thinning Machine uses a centrally located robot to move a wafer from an input station to a measuring station. Thereafter, the wafer is moved into a grind station and a wash station sequentially. The robot is able to move a wafer from the wash station to either the measuring station for after-grinding measurements or directly to an output station. During grinding of one wafer, a second wafer may be held between the measuring station and the grind station while a ground wafer is moved from the wash station to the measuring station for after-grinding measurements.
The Thinning Machines market, primarily driven by the increasing demand for precision and efficiency in semiconductor manufacturing, is growing rapidly across the globe. Thinning Machines are integral in wafer thinning processes, where the primary applications include the processing of 200mm and 300mm wafers. Among the various types of Thinning Machines, the fully automatic Thinning Machines dominate the market, they have higher automation levels, allowing for increased efficiency and precision, accounting for approximately 52% of the global market share. The most significant application market is for 300mm wafers, which accounts for 83% of the global demand, primarily driven by the advanced semiconductor manufacturing processes that require thinner wafers with high precision. Geographically, the Asia-Pacific (APAC) region holds the largest consumption share, accounting for about 78% of the global market, driven by the robust semiconductor manufacturing ecosystem in countries like China, Japan, South Korea, and Taiwan.
Manufacturers, like Disco, TOKYO SEIMITSU, Okamoto Semiconductor Equipment Division, CETC, G&N, etc. are well-known for the wonderful performance of their Thinning Machine and related services. The top five players account for about 90% of the revenue market in 2024.
Market Drivers:
Technological Advancements in Semiconductor Manufacturing: As the demand for smaller, more powerful, and energy-efficient electronic devices grows, semiconductor manufacturers are continuously advancing their processes to meet these demands. This includes the need for thinner, more precisely engineered wafers, driving the demand for high-performance Thinning Machines. Fully automatic Thinning Machines, known for their precision and ability to handle larger volumes, are particularly in demand to meet these stringent manufacturing requirements.
Miniaturization of Electronic Devices: The global trend towards smaller, more compact electronic devices—such as smartphones, wearables, and IoT devices—requires thinner semiconductor wafers. As a result, there is a growing demand for wafer thinning solutions that can maintain high quality while reducing thickness. Fully automatic Thinning Machines are the preferred solution, as they offer high precision and productivity.
Surge in Semiconductor Demand: The semiconductor industry is experiencing significant growth, driven by the rise in demand for various electronic applications, including computing, communication, and automotive systems. As the industry's focus shifts towards advanced technology nodes, the demand for larger wafers, particularly 300mm wafers, is growing. These trends are contributing to the expansion of the Thinning Machine market, especially in regions such as APAC, which dominate semiconductor manufacturing.
Growth in 300mm Wafer Demand: The 300mm wafer segment is the most significant application for Thinning Machines, accounting for 83% of the global market share. Larger wafers allow for more chips to be processed at once, reducing manufacturing costs per chip. This increase in 300mm wafer production is a significant growth factor for the Thinning Machine market, as manufacturers need specialized equipment to handle the larger wafers efficiently.
Shift Towards Fully Automated Solutions: Fully automated Thinning Machines are gaining popularity due to their higher efficiency, reduced labor costs, and the ability to maintain consistency across large batches. As semiconductor manufacturers continue to scale production, automation becomes increasingly essential to meet high-volume production requirements without compromising quality.
Market Restraints:
Despite the strong growth, several factors may restrain the expansion of the Thinning Machine market:
High Initial Investment: Fully automatic Thinning Machines come with a high initial cost, which could be prohibitive for smaller semiconductor manufacturers or emerging markets with limited capital. Additionally, the cost of maintaining and upgrading these high-tech machines can be a barrier for smaller players who may prefer less expensive, semi-automatic models.
Technological Complexity: Fully automatic Thinning Machines are highly complex systems that require specialized knowledge to operate, program, and maintain. This could limit the adoption of such systems in regions with a shortage of skilled technicians and engineers. The technical complexity can also result in extended downtime during maintenance or troubleshooting, affecting overall production efficiency.
Conclusion:
The Thinning Machine market is poised for significant growth, driven by advancements in semiconductor manufacturing, the increasing demand for thinner and more precise wafers, and the rise in 300mm wafer processing. Fully automatic Thinning Machines, which dominate the market with a 52% share, will continue to lead the market due to their higher efficiency and precision.
The APAC region remains the largest consumer of Thinning Machines, accounting for 78% of the global market. However, despite these strong growth drivers, challenges such as high initial investment costs and technological complexity may pose barriers to market entry for smaller players. Manufacturers will need to innovate and focus on automation, precision, and cost-effective solutions to capitalize on the growing demand for Thinning Machine.
In conclusion, the Thinning Machine market offers abundant opportunities for companies that can provide high-quality, efficient, and cost-effective wafer grinding solutions, particularly those that address the increasing demand for 300mm wafers and advanced semiconductor manufacturing processes.

This report aims to provide a comprehensive presentation of the global market for Thinning Machine, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Thinning Machine by region & country, by Type, and by Application.
The Thinning Machine market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Thinning Machine.
Market Segmentation
By Company
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
WAIDA MFG
Hunan Yujing Machine Industrial
SpeedFam
TSD
Engis Corporation
NTS
Segment by Type
Fully Automatic
Semi-Automatic
Segment by Application
200mm Wafer
300mm Wafer
Others
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Thinning Machine manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Thinning Machine in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Thinning Machine in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

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Table of Contents

1 Market Overview
1.1 Thinning Machine Product Introduction
1.2 Global Thinning Machine Market Size Forecast
1.2.1 Global Thinning Machine Sales Value (2020-2031)
1.2.2 Global Thinning Machine Sales Volume (2020-2031)
1.2.3 Global Thinning Machine Sales Price (2020-2031)
1.3 Thinning Machine Market Trends & Drivers
1.3.1 Thinning Machine Industry Trends
1.3.2 Thinning Machine Market Drivers & Opportunity
1.3.3 Thinning Machine Market Challenges
1.3.4 Thinning Machine Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Thinning Machine Players Revenue Ranking (2024)
2.2 Global Thinning Machine Revenue by Company (2020-2025)
2.3 Global Thinning Machine Players Sales Volume Ranking (2024)
2.4 Global Thinning Machine Sales Volume by Company Players (2020-2025)
2.5 Global Thinning Machine Average Price by Company (2020-2025)
2.6 Key Manufacturers Thinning Machine Manufacturing Base and Headquarters
2.7 Key Manufacturers Thinning Machine Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Thinning Machine
2.9 Thinning Machine Market Competitive Analysis
2.9.1 Thinning Machine Market Concentration Rate (2020-2025)
2.9.2 Global 5 and 10 Largest Manufacturers by Thinning Machine Revenue in 2024
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Thinning Machine as of 2024)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Fully Automatic
3.1.2 Semi-Automatic
3.2 Global Thinning Machine Sales Value by Type
3.2.1 Global Thinning Machine Sales Value by Type (2020 VS 2024 VS 2031)
3.2.2 Global Thinning Machine Sales Value, by Type (2020-2031)
3.2.3 Global Thinning Machine Sales Value, by Type (%) (2020-2031)
3.3 Global Thinning Machine Sales Volume by Type
3.3.1 Global Thinning Machine Sales Volume by Type (2020 VS 2024 VS 2031)
3.3.2 Global Thinning Machine Sales Volume, by Type (2020-2031)
3.3.3 Global Thinning Machine Sales Volume, by Type (%) (2020-2031)
3.4 Global Thinning Machine Average Price by Type (2020-2031)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 200mm Wafer
4.1.2 300mm Wafer
4.1.3 Others
4.2 Global Thinning Machine Sales Value by Application
4.2.1 Global Thinning Machine Sales Value by Application (2020 VS 2024 VS 2031)
4.2.2 Global Thinning Machine Sales Value, by Application (2020-2031)
4.2.3 Global Thinning Machine Sales Value, by Application (%) (2020-2031)
4.3 Global Thinning Machine Sales Volume by Application
4.3.1 Global Thinning Machine Sales Volume by Application (2020 VS 2024 VS 2031)
4.3.2 Global Thinning Machine Sales Volume, by Application (2020-2031)
4.3.3 Global Thinning Machine Sales Volume, by Application (%) (2020-2031)
4.4 Global Thinning Machine Average Price by Application (2020-2031)
5 Segmentation by Region
5.1 Global Thinning Machine Sales Value by Region
5.1.1 Global Thinning Machine Sales Value by Region: 2020 VS 2024 VS 2031
5.1.2 Global Thinning Machine Sales Value by Region (2020-2025)
5.1.3 Global Thinning Machine Sales Value by Region (2026-2031)
5.1.4 Global Thinning Machine Sales Value by Region (%), (2020-2031)
5.2 Global Thinning Machine Sales Volume by Region
5.2.1 Global Thinning Machine Sales Volume by Region: 2020 VS 2024 VS 2031
5.2.2 Global Thinning Machine Sales Volume by Region (2020-2025)
5.2.3 Global Thinning Machine Sales Volume by Region (2026-2031)
5.2.4 Global Thinning Machine Sales Volume by Region (%), (2020-2031)
5.3 Global Thinning Machine Average Price by Region (2020-2031)
5.4 North America
5.4.1 North America Thinning Machine Sales Value, 2020-2031
5.4.2 North America Thinning Machine Sales Value by Country (%), 2024 VS 2031
5.5 Europe
5.5.1 Europe Thinning Machine Sales Value, 2020-2031
5.5.2 Europe Thinning Machine Sales Value by Country (%), 2024 VS 2031
5.6 Asia Pacific
5.6.1 Asia Pacific Thinning Machine Sales Value, 2020-2031
5.6.2 Asia Pacific Thinning Machine Sales Value by Region (%), 2024 VS 2031
5.7 South America
5.7.1 South America Thinning Machine Sales Value, 2020-2031
5.7.2 South America Thinning Machine Sales Value by Country (%), 2024 VS 2031
5.8 Middle East & Africa
5.8.1 Middle East & Africa Thinning Machine Sales Value, 2020-2031
5.8.2 Middle East & Africa Thinning Machine Sales Value by Country (%), 2024 VS 2031
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Thinning Machine Sales Value Growth Trends, 2020 VS 2024 VS 2031
6.2 Key Countries/Regions Thinning Machine Sales Value and Sales Volume
6.2.1 Key Countries/Regions Thinning Machine Sales Value, 2020-2031
6.2.2 Key Countries/Regions Thinning Machine Sales Volume, 2020-2031
6.3 United States
6.3.1 United States Thinning Machine Sales Value, 2020-2031
6.3.2 United States Thinning Machine Sales Value by Type (%), 2024 VS 2031
6.3.3 United States Thinning Machine Sales Value by Application, 2024 VS 2031
6.4 Europe
6.4.1 Europe Thinning Machine Sales Value, 2020-2031
6.4.2 Europe Thinning Machine Sales Value by Type (%), 2024 VS 2031
6.4.3 Europe Thinning Machine Sales Value by Application, 2024 VS 2031
6.5 China
6.5.1 China Thinning Machine Sales Value, 2020-2031
6.5.2 China Thinning Machine Sales Value by Type (%), 2024 VS 2031
6.5.3 China Thinning Machine Sales Value by Application, 2024 VS 2031
6.6 Japan
6.6.1 Japan Thinning Machine Sales Value, 2020-2031
6.6.2 Japan Thinning Machine Sales Value by Type (%), 2024 VS 2031
6.6.3 Japan Thinning Machine Sales Value by Application, 2024 VS 2031
6.7 South Korea
6.7.1 South Korea Thinning Machine Sales Value, 2020-2031
6.7.2 South Korea Thinning Machine Sales Value by Type (%), 2024 VS 2031
6.7.3 South Korea Thinning Machine Sales Value by Application, 2024 VS 2031
6.8 Southeast Asia
6.8.1 Southeast Asia Thinning Machine Sales Value, 2020-2031
6.8.2 Southeast Asia Thinning Machine Sales Value by Type (%), 2024 VS 2031
6.8.3 Southeast Asia Thinning Machine Sales Value by Application, 2024 VS 2031
6.9 India
6.9.1 India Thinning Machine Sales Value, 2020-2031
6.9.2 India Thinning Machine Sales Value by Type (%), 2024 VS 2031
6.9.3 India Thinning Machine Sales Value by Application, 2024 VS 2031
7 Company Profiles
7.1 Disco
7.1.1 Disco Company Information
7.1.2 Disco Introduction and Business Overview
7.1.3 Disco Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.1.4 Disco Thinning Machine Product Offerings
7.1.5 Disco Recent Development
7.2 TOKYO SEIMITSU
7.2.1 TOKYO SEIMITSU Company Information
7.2.2 TOKYO SEIMITSU Introduction and Business Overview
7.2.3 TOKYO SEIMITSU Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.2.4 TOKYO SEIMITSU Thinning Machine Product Offerings
7.2.5 TOKYO SEIMITSU Recent Development
7.3 G&N
7.3.1 G&N Company Information
7.3.2 G&N Introduction and Business Overview
7.3.3 G&N Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.3.4 G&N Thinning Machine Product Offerings
7.3.5 G&N Recent Development
7.4 Okamoto Semiconductor Equipment Division
7.4.1 Okamoto Semiconductor Equipment Division Company Information
7.4.2 Okamoto Semiconductor Equipment Division Introduction and Business Overview
7.4.3 Okamoto Semiconductor Equipment Division Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.4.4 Okamoto Semiconductor Equipment Division Thinning Machine Product Offerings
7.4.5 Okamoto Semiconductor Equipment Division Recent Development
7.5 CETC
7.5.1 CETC Company Information
7.5.2 CETC Introduction and Business Overview
7.5.3 CETC Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.5.4 CETC Thinning Machine Product Offerings
7.5.5 CETC Recent Development
7.6 Koyo Machinery
7.6.1 Koyo Machinery Company Information
7.6.2 Koyo Machinery Introduction and Business Overview
7.6.3 Koyo Machinery Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.6.4 Koyo Machinery Thinning Machine Product Offerings
7.6.5 Koyo Machinery Recent Development
7.7 Revasum
7.7.1 Revasum Company Information
7.7.2 Revasum Introduction and Business Overview
7.7.3 Revasum Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.7.4 Revasum Thinning Machine Product Offerings
7.7.5 Revasum Recent Development
7.8 WAIDA MFG
7.8.1 WAIDA MFG Company Information
7.8.2 WAIDA MFG Introduction and Business Overview
7.8.3 WAIDA MFG Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.8.4 WAIDA MFG Thinning Machine Product Offerings
7.8.5 WAIDA MFG Recent Development
7.9 Hunan Yujing Machine Industrial
7.9.1 Hunan Yujing Machine Industrial Company Information
7.9.2 Hunan Yujing Machine Industrial Introduction and Business Overview
7.9.3 Hunan Yujing Machine Industrial Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.9.4 Hunan Yujing Machine Industrial Thinning Machine Product Offerings
7.9.5 Hunan Yujing Machine Industrial Recent Development
7.10 SpeedFam
7.10.1 SpeedFam Company Information
7.10.2 SpeedFam Introduction and Business Overview
7.10.3 SpeedFam Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.10.4 SpeedFam Thinning Machine Product Offerings
7.10.5 SpeedFam Recent Development
7.11 TSD
7.11.1 TSD Company Information
7.11.2 TSD Introduction and Business Overview
7.11.3 TSD Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.11.4 TSD Thinning Machine Product Offerings
7.11.5 TSD Recent Development
7.12 Engis Corporation
7.12.1 Engis Corporation Company Information
7.12.2 Engis Corporation Introduction and Business Overview
7.12.3 Engis Corporation Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.12.4 Engis Corporation Thinning Machine Product Offerings
7.12.5 Engis Corporation Recent Development
7.13 NTS
7.13.1 NTS Company Information
7.13.2 NTS Introduction and Business Overview
7.13.3 NTS Thinning Machine Sales, Revenue, Price and Gross Margin (2020-2025)
7.13.4 NTS Thinning Machine Product Offerings
7.13.5 NTS Recent Development
8 Industry Chain Analysis
8.1 Thinning Machine Industrial Chain
8.2 Thinning Machine Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Thinning Machine Sales Model
8.5.2 Sales Channel
8.5.3 Thinning Machine Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.1.1 Research Programs/Design
10.1.1.2 Market Size Estimation
10.1.1.3 Market Breakdown and Data Triangulation
10.1.2 Data Source
10.1.2.1 Secondary Sources
10.1.2.2 Primary Sources
10.2 Author Details
10.3 Disclaimer