Summary

The global market for Semiconductor Underfill was estimated to be worth US$ 721 million in 2024 and is forecast to a readjusted size of US$ 1445 million by 2031 with a CAGR of 10.5% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Semiconductor Underfill cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
According to market research, the global output of semiconductor underfill in 2024 is estimated to be approximately 250–300 tons. Prices vary significantly depending on product specifications, with an overall price range of $2,500–3,000 per kilogram.

Semiconductor underfill is a type of material used to fill the gap between the chip and the substrate in semiconductor packaging. Its primary purpose is to enhance the mechanical strength and thermal shock resistance of semiconductor packages. Typically composed of resin, hardeners, and fillers, underfill materials infiltrate the gap between the chip and substrate and form a robust network structure during thermal curing. As semiconductor technology continues to advance, particularly with increasing integration, the demand for packaging technology has grown significantly, and underfill materials, as a key component in packaging, are seeing a rising demand.
In recent years, the rapid development of sectors like 5G communication, the Internet of Things (IoT), and automotive electronics has spurred growth in the semiconductor industry, driving innovation in packaging technologies. In particular, underfill materials play a critical role in enhancing packaging reliability, extending service life, and improving thermal management, driven by the demands for miniaturization, high frequency, and low power consumption. As a result, the underfill market holds promising potential, with major semiconductor packaging companies increasing their research and development efforts to drive market growth.

The semiconductor underfill market is experiencing unprecedented opportunities, particularly with the fast growth of industries such as 5G, IoT, and automotive electronics. As the demand for high-performance, highly reliable semiconductor packaging continues to rise, underfill materials, an essential part of the packaging process, significantly contribute to improving the reliability and stability of semiconductor packages. Additionally, advancements in underfill material technologies, along with the introduction of new materials and technologies, are enhancing the market competitiveness of underfill materials.
Despite its promising market outlook, the semiconductor underfill industry faces several challenges. On one hand, the materials and processing technologies for underfill are still developing, leading to high research and development costs. On the other hand, there is a broad range of products introduced by various manufacturers, with varying levels of product performance and quality, leading to intense market competition. Additionally, fluctuations in raw material prices and the complexity of the production process may pose risks to the industry's growth.

With the rise of industries such as 5G, automotive electronics, and artificial intelligence, downstream demand for semiconductor packaging is becoming more diverse. In these applications, the demand for high-performance, highly reliable, and low-power packaging technologies is increasing, which is driving the growth of the semiconductor underfill market. In particular, the need for better thermal management and signal integrity is making the demand for underfill materials more diversified, and this trend is expected to continue, sustaining growth in the field in the future.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Underfill, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Semiconductor Underfill by region & country, by Type, and by Application.
The Semiconductor Underfill market size, estimations, and forecasts are provided in terms of sales volume (Tons) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Underfill.

Market Segmentation
By Company
Henkel
NAMICS
LORD Corporation
Panacol
Won Chemical
Showa Denko
Shin-Etsu Chemical
AIM Solder
Zymet
Master Bond
Bondline
Segment by Type
CUF
NCP/NCF
Segment by Application
Automotive
Telecommunication
Consumer Electronics
Other
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Semiconductor Underfill manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Semiconductor Underfill in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Semiconductor Underfill in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

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Table of Contents

1 Market Overview
1.1 Semiconductor Underfill Product Introduction
1.2 Global Semiconductor Underfill Market Size Forecast
1.2.1 Global Semiconductor Underfill Sales Value (2020-2031)
1.2.2 Global Semiconductor Underfill Sales Volume (2020-2031)
1.2.3 Global Semiconductor Underfill Sales Price (2020-2031)
1.3 Semiconductor Underfill Market Trends & Drivers
1.3.1 Semiconductor Underfill Industry Trends
1.3.2 Semiconductor Underfill Market Drivers & Opportunity
1.3.3 Semiconductor Underfill Market Challenges
1.3.4 Semiconductor Underfill Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Semiconductor Underfill Players Revenue Ranking (2024)
2.2 Global Semiconductor Underfill Revenue by Company (2020-2025)
2.3 Global Semiconductor Underfill Players Sales Volume Ranking (2024)
2.4 Global Semiconductor Underfill Sales Volume by Company Players (2020-2025)
2.5 Global Semiconductor Underfill Average Price by Company (2020-2025)
2.6 Key Manufacturers Semiconductor Underfill Manufacturing Base and Headquarters
2.7 Key Manufacturers Semiconductor Underfill Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Semiconductor Underfill
2.9 Semiconductor Underfill Market Competitive Analysis
2.9.1 Semiconductor Underfill Market Concentration Rate (2020-2025)
2.9.2 Global 5 and 10 Largest Manufacturers by Semiconductor Underfill Revenue in 2024
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor Underfill as of 2024)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 CUF
3.1.2 NCP/NCF
3.2 Global Semiconductor Underfill Sales Value by Type
3.2.1 Global Semiconductor Underfill Sales Value by Type (2020 VS 2024 VS 2031)
3.2.2 Global Semiconductor Underfill Sales Value, by Type (2020-2031)
3.2.3 Global Semiconductor Underfill Sales Value, by Type (%) (2020-2031)
3.3 Global Semiconductor Underfill Sales Volume by Type
3.3.1 Global Semiconductor Underfill Sales Volume by Type (2020 VS 2024 VS 2031)
3.3.2 Global Semiconductor Underfill Sales Volume, by Type (2020-2031)
3.3.3 Global Semiconductor Underfill Sales Volume, by Type (%) (2020-2031)
3.4 Global Semiconductor Underfill Average Price by Type (2020-2031)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Automotive
4.1.2 Telecommunication
4.1.3 Consumer Electronics
4.1.4 Other
4.2 Global Semiconductor Underfill Sales Value by Application
4.2.1 Global Semiconductor Underfill Sales Value by Application (2020 VS 2024 VS 2031)
4.2.2 Global Semiconductor Underfill Sales Value, by Application (2020-2031)
4.2.3 Global Semiconductor Underfill Sales Value, by Application (%) (2020-2031)
4.3 Global Semiconductor Underfill Sales Volume by Application
4.3.1 Global Semiconductor Underfill Sales Volume by Application (2020 VS 2024 VS 2031)
4.3.2 Global Semiconductor Underfill Sales Volume, by Application (2020-2031)
4.3.3 Global Semiconductor Underfill Sales Volume, by Application (%) (2020-2031)
4.4 Global Semiconductor Underfill Average Price by Application (2020-2031)
5 Segmentation by Region
5.1 Global Semiconductor Underfill Sales Value by Region
5.1.1 Global Semiconductor Underfill Sales Value by Region: 2020 VS 2024 VS 2031
5.1.2 Global Semiconductor Underfill Sales Value by Region (2020-2025)
5.1.3 Global Semiconductor Underfill Sales Value by Region (2026-2031)
5.1.4 Global Semiconductor Underfill Sales Value by Region (%), (2020-2031)
5.2 Global Semiconductor Underfill Sales Volume by Region
5.2.1 Global Semiconductor Underfill Sales Volume by Region: 2020 VS 2024 VS 2031
5.2.2 Global Semiconductor Underfill Sales Volume by Region (2020-2025)
5.2.3 Global Semiconductor Underfill Sales Volume by Region (2026-2031)
5.2.4 Global Semiconductor Underfill Sales Volume by Region (%), (2020-2031)
5.3 Global Semiconductor Underfill Average Price by Region (2020-2031)
5.4 North America
5.4.1 North America Semiconductor Underfill Sales Value, 2020-2031
5.4.2 North America Semiconductor Underfill Sales Value by Country (%), 2024 VS 2031
5.5 Europe
5.5.1 Europe Semiconductor Underfill Sales Value, 2020-2031
5.5.2 Europe Semiconductor Underfill Sales Value by Country (%), 2024 VS 2031
5.6 Asia Pacific
5.6.1 Asia Pacific Semiconductor Underfill Sales Value, 2020-2031
5.6.2 Asia Pacific Semiconductor Underfill Sales Value by Region (%), 2024 VS 2031
5.7 South America
5.7.1 South America Semiconductor Underfill Sales Value, 2020-2031
5.7.2 South America Semiconductor Underfill Sales Value by Country (%), 2024 VS 2031
5.8 Middle East & Africa
5.8.1 Middle East & Africa Semiconductor Underfill Sales Value, 2020-2031
5.8.2 Middle East & Africa Semiconductor Underfill Sales Value by Country (%), 2024 VS 2031
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Semiconductor Underfill Sales Value Growth Trends, 2020 VS 2024 VS 2031
6.2 Key Countries/Regions Semiconductor Underfill Sales Value and Sales Volume
6.2.1 Key Countries/Regions Semiconductor Underfill Sales Value, 2020-2031
6.2.2 Key Countries/Regions Semiconductor Underfill Sales Volume, 2020-2031
6.3 United States
6.3.1 United States Semiconductor Underfill Sales Value, 2020-2031
6.3.2 United States Semiconductor Underfill Sales Value by Type (%), 2024 VS 2031
6.3.3 United States Semiconductor Underfill Sales Value by Application, 2024 VS 2031
6.4 Europe
6.4.1 Europe Semiconductor Underfill Sales Value, 2020-2031
6.4.2 Europe Semiconductor Underfill Sales Value by Type (%), 2024 VS 2031
6.4.3 Europe Semiconductor Underfill Sales Value by Application, 2024 VS 2031
6.5 China
6.5.1 China Semiconductor Underfill Sales Value, 2020-2031
6.5.2 China Semiconductor Underfill Sales Value by Type (%), 2024 VS 2031
6.5.3 China Semiconductor Underfill Sales Value by Application, 2024 VS 2031
6.6 Japan
6.6.1 Japan Semiconductor Underfill Sales Value, 2020-2031
6.6.2 Japan Semiconductor Underfill Sales Value by Type (%), 2024 VS 2031
6.6.3 Japan Semiconductor Underfill Sales Value by Application, 2024 VS 2031
6.7 South Korea
6.7.1 South Korea Semiconductor Underfill Sales Value, 2020-2031
6.7.2 South Korea Semiconductor Underfill Sales Value by Type (%), 2024 VS 2031
6.7.3 South Korea Semiconductor Underfill Sales Value by Application, 2024 VS 2031
6.8 Southeast Asia
6.8.1 Southeast Asia Semiconductor Underfill Sales Value, 2020-2031
6.8.2 Southeast Asia Semiconductor Underfill Sales Value by Type (%), 2024 VS 2031
6.8.3 Southeast Asia Semiconductor Underfill Sales Value by Application, 2024 VS 2031
6.9 India
6.9.1 India Semiconductor Underfill Sales Value, 2020-2031
6.9.2 India Semiconductor Underfill Sales Value by Type (%), 2024 VS 2031
6.9.3 India Semiconductor Underfill Sales Value by Application, 2024 VS 2031
7 Company Profiles
7.1 Henkel
7.1.1 Henkel Company Information
7.1.2 Henkel Introduction and Business Overview
7.1.3 Henkel Semiconductor Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
7.1.4 Henkel Semiconductor Underfill Product Offerings
7.1.5 Henkel Recent Development
7.2 NAMICS
7.2.1 NAMICS Company Information
7.2.2 NAMICS Introduction and Business Overview
7.2.3 NAMICS Semiconductor Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
7.2.4 NAMICS Semiconductor Underfill Product Offerings
7.2.5 NAMICS Recent Development
7.3 LORD Corporation
7.3.1 LORD Corporation Company Information
7.3.2 LORD Corporation Introduction and Business Overview
7.3.3 LORD Corporation Semiconductor Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
7.3.4 LORD Corporation Semiconductor Underfill Product Offerings
7.3.5 LORD Corporation Recent Development
7.4 Panacol
7.4.1 Panacol Company Information
7.4.2 Panacol Introduction and Business Overview
7.4.3 Panacol Semiconductor Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
7.4.4 Panacol Semiconductor Underfill Product Offerings
7.4.5 Panacol Recent Development
7.5 Won Chemical
7.5.1 Won Chemical Company Information
7.5.2 Won Chemical Introduction and Business Overview
7.5.3 Won Chemical Semiconductor Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
7.5.4 Won Chemical Semiconductor Underfill Product Offerings
7.5.5 Won Chemical Recent Development
7.6 Showa Denko
7.6.1 Showa Denko Company Information
7.6.2 Showa Denko Introduction and Business Overview
7.6.3 Showa Denko Semiconductor Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
7.6.4 Showa Denko Semiconductor Underfill Product Offerings
7.6.5 Showa Denko Recent Development
7.7 Shin-Etsu Chemical
7.7.1 Shin-Etsu Chemical Company Information
7.7.2 Shin-Etsu Chemical Introduction and Business Overview
7.7.3 Shin-Etsu Chemical Semiconductor Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
7.7.4 Shin-Etsu Chemical Semiconductor Underfill Product Offerings
7.7.5 Shin-Etsu Chemical Recent Development
7.8 AIM Solder
7.8.1 AIM Solder Company Information
7.8.2 AIM Solder Introduction and Business Overview
7.8.3 AIM Solder Semiconductor Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
7.8.4 AIM Solder Semiconductor Underfill Product Offerings
7.8.5 AIM Solder Recent Development
7.9 Zymet
7.9.1 Zymet Company Information
7.9.2 Zymet Introduction and Business Overview
7.9.3 Zymet Semiconductor Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
7.9.4 Zymet Semiconductor Underfill Product Offerings
7.9.5 Zymet Recent Development
7.10 Master Bond
7.10.1 Master Bond Company Information
7.10.2 Master Bond Introduction and Business Overview
7.10.3 Master Bond Semiconductor Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
7.10.4 Master Bond Semiconductor Underfill Product Offerings
7.10.5 Master Bond Recent Development
7.11 Bondline
7.11.1 Bondline Company Information
7.11.2 Bondline Introduction and Business Overview
7.11.3 Bondline Semiconductor Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
7.11.4 Bondline Semiconductor Underfill Product Offerings
7.11.5 Bondline Recent Development
8 Industry Chain Analysis
8.1 Semiconductor Underfill Industrial Chain
8.2 Semiconductor Underfill Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Semiconductor Underfill Sales Model
8.5.2 Sales Channel
8.5.3 Semiconductor Underfill Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.1.1 Research Programs/Design
10.1.1.2 Market Size Estimation
10.1.1.3 Market Breakdown and Data Triangulation
10.1.2 Data Source
10.1.2.1 Secondary Sources
10.1.2.2 Primary Sources
10.2 Author Details
10.3 Disclaimer