Power electronics is no longer confined to specialist applications. Its influence now spans electric vehicles, renewable energy systems, industrial automation, data-centre infrastructure and advanced consumer equipment. What links these sectors is the need to move energy more efficiently and at higher power densities. The global power electronics market is experiencing unprecedented growth and transformation, driven by the electrification of transportation, renewable energy expansion, and surging demand for data center infrastructure. This dynamic sector encompasses the critical components that convert and control electrical power across virtually every modern application, from electric vehicle powertrains to grid-scale energy storage systems. At the heart of this market evolution is a fundamental technology transition from traditional silicon-based devices to wide bandgap (WBG) semiconductors, specifically silicon carbide (SiC) and gallium nitride (GaN). This paradigm shift represents the most significant advancement in power electronics since the introduction of IGBTs in the 1980s. SiC MOSFETs offer compelling advantages over silicon IGBTs, including higher temperature operation, superior thermal conductivity, switching speeds up to five times faster, and the potential to increase electric vehicle range by approximately 7%. These characteristics enable more compact, efficient power conversion systems with smaller passive components and reduced cooling requirements.

 

The electric vehicle sector stands as the primary growth driver for power electronics demand. Key components include traction inverters, onboard chargers (OBCs), and DC-DC converters, with the market increasingly adopting 800V architectures to enable faster charging and improved efficiency. SiC MOSFETs are rapidly gaining market share in EV inverters, with projections indicating they will become the majority technology by 2035. Meanwhile, GaN devices are making significant inroads in lower-power applications such as onboard chargers and DC-DC converters, where their high-frequency switching capabilities enable dramatic reductions in size and weight.

 

The supply chain for power electronics is undergoing significant restructuring, with vertical integration emerging as a key strategic trend. Major automotive OEMs and semiconductor suppliers are securing supply through acquisitions, partnerships, and in-house development of SiC capabilities. The transition from 150mm to 200mm SiC wafers represents a critical milestone that will substantially increase production capacity and reduce costs, with multiple suppliers worldwide scaling up 200mm wafer production. Chinese manufacturers have entered the market aggressively, with four Chinese companies now ranking among the top 20 global power device suppliers.

 

Data centers represent another rapidly expanding application, driven by artificial intelligence workloads that demand unprecedented power levels. Power supply units are evolving to meet stringent efficiency standards, with the 80 PLUS Ruby certification requiring up to 96.5% efficiency. Wide bandgap adoption is accelerating in this sector, with hybrid designs combining silicon, SiC, and GaN emerging as the preferred approach for maximizing efficiency across different power conversion stages.

 

The industry is also witnessing a conceptual evolution from discrete converter design toward integrated system-level approaches. This "Power Electronics 2.0" paradigm emphasizes energy management over simple power conversion, incorporating smart grid integration, distributed control architectures, and mission-oriented efficiency metrics. Multi-cell converter architectures are gaining traction, offering advantages including switching frequency multiplication, improved redundancy, and standardization benefits.

 

Despite the rapid advancement of WBG technologies, silicon devices continue to hold significant market share due to their maturity, established supply chains, and cost advantages. The market is characterized by intense cost pressure, particularly in price-sensitive segments like solar inverters and battery energy storage systems. Looking forward, the global power electronics market is projected to grow with a compound annual growth rate exceeding 8%, adding more than $15 billion in market value by 2030, driven by the continued expansion of electric mobility, renewable energy deployment, and digital infrastructure requirements.

 

The Global Power Electronics Market 2026-2036 provides comprehensive analysis of the rapidly evolving power semiconductor industry, examining the transformative shift from silicon-based devices to wide bandgap (WBG) technologies including silicon carbide (SiC) MOSFETs and gallium nitride (GaN) HEMTs. This in-depth market intelligence report delivers granular 10-year forecasts covering market size in US dollars and gigawatts across key segments including electric vehicle inverters, onboard chargers, DC-DC converters, data center power supply units, renewable energy systems, and industrial applications.

 

The report analyzes critical technology trends driving market growth, including the transition from 400V to 800V EV architectures, the evolution from 150mm to 200mm SiC wafer production, and the emergence of integrated power electronics modules. Detailed supply chain analysis covers the complete value chain from raw materials and wafer production through device manufacturing, packaging, and system integration, with particular focus on vertical integration strategies and the rising influence of Chinese manufacturers in the global market.

 

Regional market analysis examines growth dynamics across China, Europe, North America, Japan, South Korea, and emerging markets, while competitive landscape assessment provides market share rankings, M&A activity tracking, and strategic partnership analysis. The report includes over 90 detailed company profiles spanning semiconductor device manufacturers, GaN specialists, SiC wafer suppliers, tier-1 automotive suppliers, automotive OEMs, and system integrators.

 

Report Contents include

 

• Market Analysis & Forecasts
• Global power electronics market size and 10-year growth projections (2026-2036)
• Device-level forecasts for Si IGBTs, SiC MOSFETs, and GaN devices by voltage class
• Application-level forecasts for EV inverters, onboard chargers, and DC-DC converters in units, GW, and US$
• Regional market forecasts for China, Europe, North America, and Asia-Pacific
• Price trend analysis and cost reduction projections for WBG semiconductors
• Technology Analysis
• Comprehensive comparison of Si, SiC, and GaN semiconductor properties and performance
• Technology S-curve analysis and paradigm shift to Power Electronics 2.0
• Multi-cell converter architectures including parallel and series interleaving
• Packaging evolution including single-sided and double-sided cooling technologies
• 150mm to 200mm SiC wafer transition timeline and cost advantages
• Application Markets
• Electric vehicle power electronics including 400V vs 800V architecture analysis
• Traction inverter, onboard charger, and DC-DC converter technology benchmarking
• Data center PSU market including AI server power requirements
• Renewable energy applications covering solar PV, wind, and battery energy storage
• Grid infrastructure including smart grid, solid-state transformers, and HVDC systems
• Supply Chain Analysis
• Complete Si, SiC, and GaN supply chain mapping from raw materials to end applications
• SiC wafer supplier market share and 200mm production roadmap
• Vertical integration trends and OEM acquisition strategies
• Packaging and assembly supply chain including die attach technologies
• Passive component technology roadmap for capacitors and magnetics
• Competitive Landscape
• Top 20 power device supplier rankings and market share analysis
• Recent mergers, acquisitions, and strategic partnerships
• Manufacturing capacity expansion plans by region and technology
• OEM-supplier relationship mapping for SiC MOSFETs and Si IGBTs
• Future Technology Trends
• Power Electronics 2.0 vision: from converters to systems
• SiC and GaN technology roadmaps through 2035
• Emerging WBG materials including Ga₂O₃ and diamond
• Virtual prototyping and digital twin design methodologies

Companies Profiled include ABB, Advanced Energy Industries, Alpha & Omega Semiconductor, Bimotal, BMW, BorgWarner, Bosch, BYD, Cambridge GaN Devices, China Resources Microelectronics (CR Micro), CM Materials, Coherent, CRRC Corporation, Dana Incorporated, Delta Electronics, Denso, Diodes Incorporated, Dynex Semiconductor, Dynolt Technologies, Eaton, Efficient Power Conversion (EPC), Entuple E-Mobility, Fuji Electric, General Motors, GlobalWafers, HBN Technology, Heron Power, Hitachi Astemo, Hitachi Energy, Huawei, Hyundai Motor Group, Infineon Technologies, Innoscience, Inovance Technology, Lite-On Technology, Littelfuse, Lucid Motors, Magna International, Microchip Technology, Mitsubishi Electric, Navitas Semiconductor, Nexperia, NXP Semiconductors, onsemi and more.

1             EXECUTIVE SUMMARY           

 

 

 

2             MARKET OVERVIEW AND DEFINITIONS      

2.1        Power Electronics Fundamentals   

2.1.1    What is Power Electronics?  

2.1.2    Value Chain Economics and Margin Structure        

2.1.3    Key Applications and End Markets  

2.1.4    Electric Vehicle Power Electronics  

2.1.5    Data Center Power Demand Transformation           

2.1.6    Power Conversion Technologies Overview

2.1.7    ETH Zurich VIENNA Rectifier Development Generations 

2.2        Market Segmentation              

2.2.1    By Product Type (Inverters, Converters, Rectifiers)              

2.2.1.1 Inverter Market Dynamics    

2.2.1.2 DC-DC Converter Market Dynamics             

2.2.1.3 Rectifier/Charger Market Dynamics              

2.2.2    By Semiconductor Material (Si, SiC, GaN) 

2.2.2.1 Silicon Market Dynamics      

2.2.2.2 Silicon Carbide Market Dynamics   

2.2.2.3 Gallium Nitride Market Dynamics   

2.2.3    By Application Sector              

2.2.3.1 Automotive & EV Sector Deep Dive

2.2.4    By Voltage Class         

2.3        Performance Indices and Metrics    

2.3.1    Power Density (kW/dm³)        

2.3.2    Efficiency and Loss Analysis              

2.3.3    Cost per kW Trends   

2.3.4    Reliability and Failure Rate Metrics

 

 

3             TECHNOLOGY ANALYSIS      

3.1        Evolution of Power Electronics Technology               

3.1.1    Historical Development: SCRs to WBG       

3.1.2    Technology S-Curve Analysis             

3.1.2.1 Semiconductor S-Curves     

3.1.2.2 Passive Component S-Curves           

3.1.3    Paradigm Shift to Power Electronics 2.0     

3.1.3.1 From Power to Energy Metrics           

3.1.3.2 Multi-Objective Optimization and Pareto Fronts   

3.1.3.3 System-Level Integration      

3.2        Silicon-Based Power Devices             

3.2.1    Silicon IGBT Technology and Performance

3.2.2    IGBT Market Segmentation  

3.2.3    Silicon MOSFET Applications             

3.2.4    Super-Junction Technology Advances          

3.2.5    Si Device Roadmap and Limitations             

3.2.5.1 Fundamental Silicon Limitations    

3.3        Silicon Carbide (SiC) Technology     

3.3.1    SiC Material Properties and Advantages     

3.3.2    SiC Device Figureof Merit Analysis

3.3.3    SiC MOSFET Technology Development        

3.3.4    SiC MOSFET Manufacturer Comparison    

3.3.5    SiC vs Si IGBT Performance Comparison   

3.3.6    Efficiency Across Load Range            

3.3.7    SiC Device Packaging Evolution       

3.3.8    150mm to 200mm Wafer Transition              

3.3.9    200mm SiC Wafer Production Status            

3.3.10 SiC Cost Reduction Roadmap          

3.4        Gallium Nitride (GaN) Technology   

3.4.1    GaN Material Properties and Potential        

3.4.2    GaN HEMT and FET Technologies    

3.4.3    GaN-on-Si vs Alternative Substrates             

3.4.4    GaN Voltage Limitations and Solutions       

3.4.5    GaN Device Roadmap for Automotive          

3.5        Converter Topology Analysis              

3.5.1    Multi-Cell Converter Architectures 

3.5.2    Parallel and Series Interleaving         

3.5.3    DC-Transformer Concepts   

3.5.4    Three-Level Inverter Designs              

3.6        Packaging and Thermal Management          

3.6.1    Power Module Packaging Evolution

3.6.2    Single-Sided vs Double-Sided Cooling        

3.6.3    Thermal Interface Materials (TIM)   

3.6.4    Advanced Packaging Technologies (P4, p²pack)    

 

 

4             APPLICATION MARKETS ANALYSIS 

4.1        Electric Vehicles (EVs)            

4.1.1    EV Market Overview and Growth Trends     

4.1.2    Powertrain Mix Evolution       

4.1.3    EV Price Segment Distribution          

4.1.4    Traction Inverter Technologies           

4.1.4.1 Traction Inverter Market Size and Growth   

4.1.4.2 Semiconductor Technology Transition        

4.1.4.3 Inverter Topology Evolution 

4.1.4.4 Traction Inverter Competitive Landscape  

4.1.4.5 Inverter-Motor Integration Trends    

4.1.5    Onboard Charger (OBC) Systems    

4.1.5.1 OBC Market Size and Growth             

4.1.5.2 OBC Power Level Distribution           

4.1.5.3 OBC Semiconductor Technology Transition            

4.1.5.4 Bidirectional OBC Functionality       

4.1.5.5 OBC Competitive Landscape            

4.1.6    DC-DC Converter Requirements     

4.1.6.1 DC-DC Converter Market Size and Growth

4.1.6.2 Output Voltage Architecture Evolution        

4.1.6.3 DC-DC Converter Semiconductor Transition          

4.1.7    400V vs 800V Architecture Analysis              

4.1.7.1 800V Architecture Benefits  

4.1.7.2 800V Architecture Adoption Timeline           

4.1.7.3 400V Charging Compatibility Solutions       

4.1.8    Power Electronics Integration Trends            

4.1.8.1 Integration Level Evolution   

4.1.8.2 Integrated OBC with DC-DC Converter        

4.1.8.3 Traction-Integrated Onboard Charger (TiOBC)       

4.1.9    Heavy-Duty Vehicle Applications    

4.1.9.1 Heavy-Duty EV Market Overview      

4.1.9.2 Heavy-Duty Power Electronics Requirements        

4.1.9.3 Heavy-Duty Power Electronics Market         

4.2        Renewable Energy     

4.2.1    Solar PV Inverter Market        

4.2.1.1 Solar Inverter Market Size and Growth         

4.2.1.2 Solar Inverter Market Segmentation              

4.2.1.3 Solar Inverter Semiconductor Technology 

4.2.1.4 Solar Inverter Competitive Landscape        

4.2.2    Wind Power Converters          

4.2.2.1 Wind Power Converter Market           

4.2.3    Battery Energy Storage Systems (BESS)      

4.2.3.1 BESS Market Size and Growth           

4.3        Data Centers and Computing            

4.3.1    Power Supply Unit (PSU) Market       

4.3.1.1 Data Center Power Demand Transformation           

4.3.1.2 PSU Market Size and Growth              

4.3.1.3 PSU Efficiency Standards     

4.3.1.4 Data Center PSU Competitive Landscape

4.3.2    AI Server Power Requirements          

4.3.2.1 AI Server Power Architecture              

4.3.2.2 Power Delivery Architecture Evolution         

4.4        Grid Infrastructure     

4.4.1    Smart Grid and Energy Management            

4.4.1.1 Smart Grid Power Electronics Market           

4.4.1.2 Hierarchical Grid Architecture           

4.4.2    Solid-State Transformers      

4.4.2.1 Solid-State Transformer Characteristics    

4.4.3    HVDC Transmission Systems            

4.4.3.1 HVDC Market Overview         

4.5        Industrial Applications           

4.5.1    Motor Drives and Variable Frequency Drives            

4.5.1.1 VFD Market Size and Growth              

4.5.1.2 VFD Market Segmentation   

4.5.1.3 VFD Competitive Landscape             

4.5.2    Industrial Power Supplies     

4.6        Consumer Electronics            

4.6.1    Fast Charging Technologies

4.6.1.1 Consumer Fast Charger Market        

4.6.1.2 Consumer Charger Competitive Landscape           

 

 

5             REGIONAL MARKET ANALYSIS           

5.1        China 

5.1.1    Market Size and Growth         

5.1.2    China EV Market Dynamics 

5.1.3    Domestic Manufacturing Expansion             

5.1.3.1 China Power Semiconductor Production   

5.1.3.2 Manufacturing Capacity Expansion

5.1.4    SiC Wafer Production Scale-up         

5.1.4.1 China SiC Wafer Production Status

5.1.4.2 SiC Wafer Quality Comparison         

5.1.4.3 Government Support for SiC Development               

5.2        Europe               

5.2.1    Market Overview and Regulations   

5.2.2    European EV Market Characteristics            

5.2.3    EU Emissions Targets Impact             

5.2.4    European Semiconductor Initiatives             

5.3        United States

5.3.1    Market Trends and Policy Drivers     

5.3.2    US EV Market Dynamics        

5.3.3    CHIPS Act and Manufacturing Incentives  

5.3.4    US Power Semiconductor Manufacturing Expansion        

5.3.5    US-Based Supply Chain Analysis    

5.4        Japan and South Korea           

5.4.1    Technology Leadership Positions    

5.4.2    Japanese Power Semiconductor Leadership           

5.4.3    Automotive OEM Strategies 

5.4.3.1 Hyundai E-GMP Platform Analysis 

5.4.4    South Korea Power Electronics Market        

5.5        Rest of World

5.5.1    India Market Potential             

5.5.2    India EV Market Development            

5.5.3    India Manufacturing Development 

5.5.4    Southeast Asia Manufacturing Hub

 

 

6             SUPPLY CHAIN ANALYSIS     

6.1        Value Chain Structure             

6.1.1    Power Electronics Value Chain Overview   

6.1.2    Value Chain Cost Buildup    

6.1.3    Vertical Integration Strategies            

6.1.3.1 Semiconductor Supplier Forward Integration         

6.1.3.2 OEM Backward Integration  

6.1.3.3 Integration Economics           

6.1.4    Supply Chain Vulnerabilities              

6.1.4.1 Geographic Concentration Risk       

6.1.4.2 Single-Source Dependencies             

6.1.4.3 Supply Chain Disruption History     

6.2        SiC Supply Chain       

6.2.1    SiC Wafer Suppliers  

6.2.1.1 Global SiC Wafer Market Overview 

6.2.1.2 SiC Wafer Supplier Competitive Landscape            

6.2.1.3 Wafer Supply Agreements    

6.2.2    SiC Device Manufacturers   

6.2.2.1 SiC Device Market Overview               

6.2.2.2 SiC Device Technology Comparison             

6.2.3    SiC Device Production Capacity      

6.2.4    SiC Module and System Integration               

6.2.4.1 SiC Power Module Market     

6.3        GaN Supply Chain     

6.3.1    GaN Device Ecosystem         

6.3.1.1 GaN Supply Chain Structure               

6.3.1.2 GaN Device Supplier Landscape     

6.3.1.3 GaN Manufacturing Capacity            

6.3.2    GaN Foundry Dynamics        

6.3.2.1 TSMC GaN Exit Impact           

6.3.2.2 Alternative GaN Foundry Options   

6.4        Silicon Supply Chain

6.4.1    Si IGBT and MOSFET Suppliers          

6.4.1.1 Silicon Power Device Market Overview        

6.4.1.2 Silicon Device Technology Roadmap           

6.4.2    Silicon Wafer Supply

6.5        Passive Component Supply

6.5.1    Capacitor Suppliers 

6.5.1.1 Power Electronics Capacitor Market             

6.5.2    Magnetic Component Suppliers      

6.6        Packaging and Module Assembly    

6.6.1    Power Module Packaging Suppliers

6.6.1.1 Power Module Packaging Market     

6.6.1.2 Packaging Technology Evolution      

6.6.2    Die Attach and Interconnect Materials        

6.6.2.1 Die Attach Material Suppliers            

6.7        Thermal Management Supply Chain             

6.7.1    Cooling System Suppliers    

6.7.2    Thermal Interface Materials

6.8        Supply Chain Resilience and Strategic Considerations    

6.8.1    Supply Chain Risk Assessment        

6.8.2    Multi-sourcing Strategies      

6.8.3    Regional Supply Chain Development            

 

 

7             MARKET FORECASTS               

7.1        Key Forecast Assumptions  

7.1.1    Scenario Framework

7.1.2    Market Definitions and Scope            

7.1.3    Geographic Scope     

7.2        Total Market Forecast              

7.2.1    Global Power Electronics Market Overview              

7.2.2    Market Growth Phase Analysis         

7.2.3    Market Forecast by Application        

7.2.4    Application Share Evolution

7.2.5    Market Forecast by Semiconductor Technology    

7.2.6    Technology Share Evolution

7.2.7    Market Forecast by Region  

7.2.8    Regional Share Evolution      

7.3        Electric Vehicle Power Electronics Forecast            

7.3.1    EV Unit Volume Projections 

7.3.2    Regional EV Volume Distribution     

7.3.3    Traction Inverter Forecast     

7.3.4    Inverter Technology Mix Forecast    

7.3.5    Inverter Value by Technology              

7.3.6    Onboard Charger Forecast  

7.3.6.1 OBC Power Level Distribution           

7.3.6.2 OBC Semiconductor Technology Forecast

7.3.7    DC-DC Converter Forecast  

7.3.7.1 DC-DC Technology Mix Forecast     

7.3.8    Architecture Adoption Forecast       

7.3.8.1 EV Power Electronics Summary Forecast  

7.3.9    EV Power Electronics Content per Vehicle

7.4        Data Center Power Electronics Forecast    

7.4.1    Data Center Power Demand

7.4.2    PSU and Power Infrastructure Forecast       

7.4.3    PSU Technology Transition  

7.5        Renewable Energy Forecast

7.5.1    Solar Inverter Forecast           

7.5.2    Solar Inverter Semiconductor Technology 

7.5.3    Wind Power Converter Forecast       

7.5.4    Energy Storage Inverter Forecast     

7.6        Industrial and Other Applications Forecast              

7.6.1    Industrial Motor Drive Forecast        

7.6.2    Consumer Fast Charger Forecast   

7.6.3    EV Charging Infrastructure Forecast              

7.7        Semiconductor Technology Forecasts         

7.7.1    SiC Market Detailed Forecast            

7.7.2    SiC Wafer Demand Forecast              

7.7.3    GaN Market Detailed Forecast          

7.7.4    Silicon Power Device Forecast          

7.7.5    Si IGBT Application Mix Evolution    

7.8        Regional Market Forecasts  

7.8.1    China Detailed Forecast        

7.8.2    Europe Detailed Forecast     

7.8.3    North America Detailed Forecast    

7.9        Scenario Analysis      

7.9.1    Scenario Comparison            

7.9.2    Scenario Assumptions Detailed      

7.9.3    Risk Factors and Sensitivities            

7.10     Forecast Summary   

7.10.1 Key Forecast Highlights         

 

 

8             COMPETITIVE LANDSCAPE 

8.1        Market Share Analysis            

8.1.1    Top 20 Power Device Suppliers Ranking     

8.1.2    Market Leadership Analysis

8.1.3    Financial Profile Analysis     

8.1.4    Market Share Trend Analysis              

8.1.5    Market Share by Technology Segment          

8.1.5.1 Silicon IGBT Market Share    

8.1.5.2 Silicon Carbide MOSFET Market Share        

8.1.6    Gallium Nitride Market Share             

8.1.7    Regional Market Share Distribution

8.1.7.1 China Market Share  

8.1.7.2 Europe Market Share

8.1.7.3 North America Market Share              

8.1.8    Regional Market Share Summary    

8.2        Competitive Strategies           

8.2.1    Vertical Integration Approaches       

8.2.1.1 Integration Strategy Typology             

8.2.1.2 Semiconductor Supplier Integration Analysis         

8.2.1.3 STMicroelectronics Vertical Integration Strategy   

8.2.1.4 OEM Backward Integration Analysis              

8.2.1.5 Tesla Vertical Integration Economics            

8.2.1.6 BYD Semiconductor: Full Integration Case Study 

8.2.2    OEM Partnership Models      

8.2.2.1 Partnership Model Taxonomy             

8.2.2.2 Major OEM-Supplier Partnership Overview               

8.2.2.3 Tesla-STMicroelectronics Partnership Analysis     

8.2.2.4 GM-Wolfspeed Strategic Partnership           

8.2.2.5 Partnership Economics and Risk Allocation             

8.3        Capacity Expansion Plans   

8.3.1    Si Fab Expansion Projects    

8.3.1.1 Silicon Fab Capacity Overview          

8.3.1.2 Silicon Fab Expansion Projects Detail          

8.3.2    SiC Manufacturing Investments       

8.3.2.1 SiC Capacity Expansion Overview  

8.3.2.2 Major SiC Fab Expansion Projects  

8.3.2.3 Chinese SiC Capacity Expansion    

8.3.3    GaN Production Scale-up     

8.3.3.1 GaN Capacity Overview         

8.3.3.2 GaN Capacity Expansion Projects  

 

 

9             FUTURE TECHNOLOGY TRENDS     

9.1        Power Electronics 2.0 Vision              

9.1.1    From Converters to Systems              

9.1.2    Energy Management Paradigm         

9.1.3    Smart Grid Integration            

9.2        Device Technology Roadmap            

9.2.1    SiC Technology Evolution     

9.2.2    GaN High-Voltage Development       

9.2.3    Emerging Materials (Ga₂O₃, Diamond)        

9.3        System-Level Innovations    

9.3.1    Integrated Power Electronics Modules        

9.3.2    Multi-Cell and Modular Architectures           

9.3.3    Virtual Prototyping and Digital Twins             

9.4        Passives and EMI Challenges             

9.4.1    Advanced Magnetic Materials           

9.4.2    Capacitor Technology Trends             

9.4.3    EMI Reduction Strategies      

9.5        Future Technology Summary             

9.5.1    Technology Roadmap Synthesis      

9.5.2    Research and Development Priorities          

 

 

10          COMPANY PROFILES               

10.1     Semiconductor Device Manufacturers (20 company profiles)

10.2     GaN Specialists (7 company profiles)

10.3     SiC Wafer and Material Suppliers  (10 company profiles)

10.4     Tier-1 Automotive Suppliers (8 company profiles)

10.5     Automotive OEMs with In-House Development (9 company profiles)

10.6     Chinese Power Electronics Companies (9 company profiles)

10.7     Module and System Integrators   (6 company profiles)

10.8     Data Centre and Industrial Power  (7 company profiles)

10.9     Other Companies (8 company profiles)

 

11          REFERENCES

 

 

List of Tables

Table1 Global Power Electronics Market Summary 2026-2036 (US$ Billion)

Table2 Key Market Metrics by Segment     

Table3 Technology Comparison: Si vs SiC vs GaN             

Table4 Regional Market Share Distribution             

Table5 Power Electronics Market Size by Component Category 2024-2036 (US$ Billion)       

Table6 Power Electronics Value Chain Economics           

Table7 Power Electronics Demand by Application Sector 2024-2036  

Table8 EV Power Electronics Content by Vehicle Segment          

Table9 Data Center Power Architecture Evolution             

Table10 Converter Topology Selection by Application     

Table11 VIENNA Rectifier Performance Evolution (10kW, 3-phase, 400V input)            

Table12 Power Electronics Market by Product Category 2024-2036 (US$ Billion)        

Table13 EV Traction Inverter Competitive Landscape 2024        

Table14 Automotive DC-DC Converter Evolution

Table15 Onboard Charger Market Segmentation by Power Level             

Table16 Power Semiconductor Market by Material 2024-2036 (US$ Billion)    

Table17 Silicon Device Application Outlook          

Table18 SiC MOSFET Market by Application 2024-2036 (US$ Billion)  

Table19 SiC vs Si IGBT Cost and Performance Comparison (Automotive Inverter)       

Table20 GaN Device Market by Application 2024-2036 (US$ Million)   

Table21 Power Electronics Market by Application Sector 2024-2036 (US$ Billion)      

Table22 Automotive Power Electronics Segmentation 2024-2036 (US$ Billion)            

Table23 Power Semiconductor Market by Voltage Class 2024-2036 (US$ Billion)       

Table24 1200V Device Market Competition           

Table25 Power Density Benchmarks by Application         

Table26 Power Converter Efficiency Benchmarks              

Table27 Loss Breakdown Analysis - 150kW EV Traction Inverter               

Table28 Power Electronics Cost Structure by Application ($/kW)           

Table29 SiC Cost Reduction Roadmap     

Table30 Reliability Requirements by Application

Table31 Power Cycling Capability Comparison   

Table32 Si vs SiC vs GaN Material Properties        

Table33 Power Electronics Technology Generations        

Table34 Technology Adoption Timeline Patterns 

Table35 Silicon IGBT Generational Improvements             

Table36 SiC MOSFET Performance Trajectory      

Table37 Passive Component Improvement Rates              

Table38 Power Electronics 1.0 vs 2.0 Paradigm Comparison    

Table39 Rated-Point vs Mission Efficiency Comparison

Table40 Converter Performance Trade-offs           

Table41 EV Powertrain Integration Levels 

Table42 IGBT Technology Comparison by Manufacturer (1200V, 100A class) 

Table43 IGBT Market by Voltage Class 2024          

Table44 Silicon MOSFET Market by Voltage Class 2024 

Table45 Super-Junction MOSFET Performance Evolution             

Table46 Silicon Power Device Roadmap  

Table47 Silicon Material Limits vs Current Devices           

Table48 SiC vs Silicon Material Properties              

Table49 Device Figureof Merit Comparison (1200V class)          

Table50 SiC MOSFET Technology Generations     

Table51 SiC MOSFET Technology Comparison by Manufacturer (1200V, 75mΩ class)             

Table52 SiC MOSFET vs Si IGBT Performance Comparison (150kW EV Inverter)            

Table53 Efficiency vs. Switching Frequency Performance Comparison              

Table54 Inverter Efficiency vs Load Comparison

Table55 Power Module Package Evolution              

Table56 Double-Sided Cooling Module Comparison      

Table57 150mm vs 200mm SiC Wafer Economics            

Table58 200mm SiC Wafer Production Timeline by Manufacturer          

Table59 SiC Cost Reduction Drivers 2024-2030 

Table60 SiC System Cost Parity Timeline by Application               

Table61 GaN Material Properties vs Si and SiC    

Table62 GaN Device Architecture Comparison   

Table63  GaN Device Comparison by Manufacturer (650V class)            

Table64  GaN Substrate Comparison         

Table65 GaN Voltage Rating Evolution       

Table66 GaN Automotive Application Roadmap

Table67 GaN OBC Performance vs Alternatives   

Table68 Multi-Cell Converter Benefits and Challenges  

Table69 Parallel Interleaving Performance vs Cell Count              

Table70 Series Cell R_DS(on) Advantage vs Single High-Voltage Device             

Table71 DC-Transformer vs Regulated DC-DC Converter             

Table72 Inverter Topology Comparison    

Table73 Power Module Packaging Technology Generations        

Table74 Single-Sided vs Double-Sided Cooling Comparison     

Table75 Double-Sided Cooling Adoption by Application

Table76 Thermal Interface Material Comparison

Table77 Die Attach Technology Comparison        

Table78 P4 vs Conventional Module Comparison             

Table79 p²pack Demonstrator Specifications       

Table80 Global Electric Vehicle Sales by Region 2020-2036 (Million Units)     

Table81 Global EV Sales by Powertrain Type 2024-2036 (Million Units)

Table82 Power Electronics Content by Powertrain Type 

Table83 Global BEV Sales by Price Segment 2024-2036 (Million Units)              

Table84 Global Traction Inverter Market 2024-2036        

Table85 Traction Inverter Semiconductor Technology Mix 2024-2036 

Table86 Traction Inverter Semiconductor Technology by Vehicle Segment 2024 vs 2030       

Table87 Traction Inverter Performance Benchmarking by OEM

Table88 Traction Inverter Topology Comparison 

Table89 Traction Inverter Supplier Market Share 2024    

Table90 Traction Inverter Supplier Strategic Positioning

Table91 Powertrain Integration Levels in Production Vehicles   

Table92 Global Onboard Charger Market 2024-2036      

Table93 OBC Market by Power Level 2024-2036 (Unit Share)     

Table94 OBC Semiconductor Technology Mix 2024-2036           

Table95 OBC Technology Comparison by Semiconductor           

Table96 Bidirectional OBC Adoption and Functionality 

Table97 Onboard Charger Supplier Market Share 2024 

Table98 Automotive DC-DC Converter Market 2024-2036          

Table99 Low-Voltage Architecture Evolution         

Table100 Automotive DC-DC Converter Semiconductor Technology Mix          

Table101 DC-DC Converter Performance by Semiconductor Technology          

Table102 400V vs 800V Architecture Comparison             

Table103 800V Architecture Adoption by Market Segment           

Table104 800V Platform Vehicles in Production or Announced (as of 2024)    

Table105 400V Charging Compatibility Approaches        

Table106 Power Electronics Integration Level Definitions and Adoption             

Table107 Integrated Power Electronics Examples             

Table108 Integrated OBC + DC-DC Converter Benefits  

Table109 Traction-Integrated OBC Approaches  

Table110 Heavy-Duty Electric Vehicle Market 2024-2036 (Thousand Units)    

Table111 Heavy-Duty vs Passenger Vehicle Power Electronics Requirements

Table112 Heavy-Duty Power Electronics Market 2024-2036 (US$ Million)        

Table113 Heavy-Duty Inverter Specifications by Application     

Table114 Global Solar PV Inverter Market 2024-2036     

Table115 Solar Inverter Market by Type 2024-2036 (US$ Billion)             

Table116 Solar Inverter Semiconductor Technology Mix

Table117 Solar Inverter Efficiency Impact of SiC Adoption          

Table118 Solar Inverter Supplier Market Share 2024       

Table119 Global Wind Power Converter Market 2024-2036        

Table120 Wind Turbine Converter Specifications by Rating        

Table121 Global Battery Energy Storage Market 2024-2036       

Table122 BESS Converter Technology by Application      

Table123 Data Center Power Consumption Evolution    

Table124 Data Center PSU Market 2024-2036    

Table125 80 PLUS Efficiency Standards   

Table126 PSU Semiconductor Technology Mix    

Table127 PSU Power Density Evolution by Technology   

Table128 Data Center PSU Supplier Market Share 2024

Table129 AI Server Power Breakdown (8-GPU Configuration)    

Table130 AI Server Power Trends by GPU Generation      

Table131 Power Distribution Architecture Comparison 

Table132 Smart Grid Power Electronics Market 2024-2036 (US$ Billion)           

Table133 Hierarchical Grid Structure          

Table134 Solid-State Transformer vs Conventional Transformer             

Table135 Solid-State Transformer Market Outlook            

Table136 Global HVDC Market 2024-2036            

Table137 HVDC Technology Comparison

Table138 Global Variable Frequency Drive Market 2024-2036  

Table139 VFD Market by Power Range 2024          

Table140 Variable Frequency Drive Supplier Market Share 2024             

Table141 Industrial Power Supply Market 2024-2036 (US$ Billion)        

Table142 Consumer Fast Charger Market 2024-2036    

Table143 Consumer Fast Charger Technology Comparison       

Table144 Consumer GaN Charger Supplier Market Share 2024

Table145 China Power Electronics Market Size 2024-2036 (US$ Billion)            

Table146 China EV Market Characteristics vs Global      

Table147 China EV Sales by Price Segment 2024              

Table148 China Power Semiconductor Self-Sufficiency by Technology               

Table149 China Power Semiconductor Manufacturers by Technology 

Table150 Major China Power Semiconductor Capacity Expansion Projects     

Table151 China SiC Wafer Manufacturers Capacity and Roadmap       

Table152 SiC Wafer Quality Comparison by Origin           

Table153 China Government Support for SiC Industry   

Table154 Europe Power Electronics Market Size 2024-2036 (US$ Billion)         

Table155 European EV Market vs China Comparison     

Table156 EU CO2 Emissions Targets for Passenger Vehicles      

Table157 EU EV Sales Trajectory Required for Compliance         

Table158 European Chips Act Power Semiconductor Investments        

Table159 United States Power Electronics Market Size 2024-2036 (US$ Billion)          

Table160 US EV Market Characteristics   

Table161 US Policy Incentives for Power Electronics       

Table162 Major US Power Semiconductor Capacity Projects     

Table163 US-Headquartered Power Semiconductor Companies           

Table164 Japan Power Electronics Market Size 2024-2036 (US$ Billion)            

Table165 Major Japanese Power Semiconductor Companies   

Table166 Japan/Korea Automotive OEM Electrification Strategies          

Table167 Hyundai E-GMP Platform Specifications            

Table168 South Korea Power Electronics Market Size 2024-2036 (US$ Billion)             

Table169 India Power Electronics Market Size 2024-2036 (US$ Billion)              

Table170 India EV Market Projections        

Table171 India Power Electronics Manufacturing Initiatives       

Table172 Southeast Asia Power Electronics Manufacturing Presence 

Table173 Regional Power Electronics Market Summary 2024-2036     

Table174 Power Electronics Value Chain Stage Characteristics              

Table175 SiC Power Module Value Chain Cost Buildup (Representative 1200V/200A Module)           

Table176 Semiconductor Supplier Vertical Integration Strategies           

Table177 OEM Vertical Integration Strategies       

Table178 Vertical Integration Economic Impact Analysis             

Table179 Power Electronics Supply Chain Geographic Concentration

Table180 Critical Single/Dual Source Dependencies       

Table181 Major Power Electronics Supply Chain Disruptions 2020-2024         

Table182 Global SiC Wafer Market 2024-2030    

Table183 SiC Wafer Supplier Market Share and Capacity 2024

Table184 Major SiC Wafer Long-Term Supply Agreements           

Table185 SiC Device Market by Manufacturer 2024         

Table186 SiC MOSFET Technology Comparison by Manufacturer           

Table187 SiC Device Production Capacity by Manufacturer 2024-2028            

Table188 SiC Power Module Market 2024-2030 

Table189 SiC Power Module Supplier Market Share 2024            

Table190 GaN Power Device Supply Chain Models          

Table191 GaN Power Device Supplier Analysis 2024      

Table192 GaN Power Device Manufacturing Capacity 2024-2028         

Table193 TSMC GaN Foundry Exit Analysis            

Table194 GaN Foundry Alternative Assessment 

Table195 Silicon Power Device Market by Supplier 2024              

Table196 Silicon Power Device Technology Evolution     

Table197 Silicon Power Wafer Suppliers  

Table198 Power Electronics Capacitor Market by Type 2024     

Table199 DC Link Film Capacitor Supplier Market Share 2024 

Table200 Power Magnetics Market Overview 2024           

Table201 Power Magnetics Supplier Landscape 

Table202 Power Module Packaging Market 2024-2030  

Table203 Power Module Packaging Supplier Market Share 2024             

Table204 Power Module Packaging Technology Generations      

Table205 Die Attach Technology Comparison      

Table206 Silver Sintering Paste Supplier Analysis              

Table207 Power Electronics Cooling Market 2024-2030

Table208 Power Electronics Cooling Supplier Analysis  

Table209 Thermal Interface Material Market 2024            

Table210 TIM Supplier Market Analysis    

Table211 Power Electronics Supply Chain Risk Matrix    

Table212 OEM Multisourcing Adoption by Component  

Table213 Multisourcing Cost-Benefit Analysis    

Table214 Regional Supply Chain Development Status   

Table215 Supply Chain Localization Requirements by Region  

Table216 Baseline Forecast Assumptions              

Table217 Forecast Scenario Definitions   

Table218 Market Scope Definitions             

Table219 Regional Market Definitions       

Table220 Global Power Electronics Market Forecast 2024-2036 (US$ Billion)

Table221 Market Growth Phase Characteristics 

Table222 Power Electronics Market by Application 2024-2036 (US$ Billion)   

Table223 Power Electronics Market Share by Application 2024-2036  

Table224 Power Semiconductor Market by Technology 2024-2036 (US$ Billion)          

Table225 Power Semiconductor Market Share by Technology 2024-2036        

Table226 Power Electronics Market by Region 2024-2036 (US$ Billion)             

Table227 Power Electronics Market Share by Region 2024-2036            

Table228 Global EV Sales Forecast by Powertrain 2024-2036 (Million Units)  

Table229 EV Sales by Region 2024-2036 (Million Units)

Table230 Global Traction Inverter Market Forecast 2024-2036

Table231 Traction Inverter Semiconductor Technology Mix 2024-2036 (Unit Share)   

Table232 Traction Inverter Market Value by Technology 2024-2036 (US$ Billion)         

Table233 Global Onboard Charger Market Forecast 2024-2036              

Table234 OBC Market by Power Level 2024-2036 (Unit Share)  

Table235 OBC Semiconductor Technology Mix 2024-2036 (Unit Share)             

Table236 Automotive DC-DC Converter Market Forecast 2024-2036  

Table237 Automotive DC-DC Converter Technology Mix 2024-2036 (Unit Share)        

Table238 800V Architecture Adoption by Segment 2024-2036 (Unit Share)     

Table239 Total EV Power Electronics Market Forecast 2024-2036 (US$ Billion)            

Table240 Average Power Electronics Content per EV 2024-2036            

Table241 Global Data Center Power Demand Forecast 2024-2036       

Table242 Data Center Power Electronics Market Forecast 2024-2036 (US$ Billion)   

Table243 Data Center PSU Technology Mix 2024-2036 (Value Share)  

Table244 Global Solar PV Inverter Market Forecast 2024-2036

Table245 Solar Inverter Semiconductor Technology Mix 2024-2036 (Value Share)      

Table246 Global Wind Power Converter Market Forecast 2024-2036  

Table247 Global Battery Energy Storage Inverter Market Forecast 2024-2036

Table248 Global Variable Frequency Drive Market Forecast 2024-2036            

Table249 Consumer Fast Charger Market Forecast 2024-2036

Table250 EV Charging Infrastructure Market Forecast 2024-2036          

Table251 SiC Power Semiconductor Market Forecast 2024-2036 (US$ Billion)             

Table252 SiC Wafer Demand Forecast 2024-2036 (Thousand Wafers)

Table253 GaN Power Semiconductor Market Forecast 2024-2036 (US$ Billion)          

Table254 Silicon Power Device Market Forecast 2024-2036 (US$ Billion)         

Table255 Si IGBT Market by Application 2024-2036 (Value Share)          

Table256 China Power Electronics Market Detailed Forecast 2024-2036 (US$ Billion)            

Table257 Europe Power Electronics Market Detailed Forecast 2024-2036 (US$ Billion)          

Table258 North America Power Electronics Market Detailed Forecast 2024-2036 (US$ Billion)         

Table259 Total Market Forecast by Scenario 2024-2036 (US$ Billion)  

Table260 Key Scenario Assumptions         

Table261 Forecast Sensitivity Analysis     

Table262 Power Electronics Market Forecast Summary

Table263 Technology Transition Milestones           

Table264 Top 20 Global Power Device Suppliers Ranking 2024

Table265 Top 20 Power Device Supplier Financial Metrics 2024              

Table266 Market Share Evolution 2020-2024-2028E       

Table267 Si IGBT Market Share by Supplier 2024

Table268 SiC MOSFET Market Share by Supplier 2024   

Table269 SiC MOSFET Technology Comparison by Supplier       

Table270 GaN Power Device Market Share by Supplier 2024     

Table271 China Power Semiconductor Market Share 2024         

Table272 Europe Power Semiconductor Market Share 2024      

Table273 North America Power Semiconductor Market Share 2024     

Table274 Regional Market Share by Supplier Headquarters 2024           

Table275 Vertical Integration Strategy Categories              

Table276 Semiconductor Supplier Vertical Integration Scope   

Table277 STMicroelectronics SiC Integration Economics             

Table278 Automotive OEM Power Electronics Integration Status            

Table279 Tesla Power Electronics Vertical Integration Analysis

Table280 BYD Semiconductor Integration Roadmap       

Table281 OEM-Supplier Partnership Model Categories  

Table282 Significant Power Electronics Partnerships 2022-2024           

Table283 Tesla-STMicroelectronics Partnership Characteristics             

Table284 GM-Wolfspeed Partnership Structure  

Table285 Partnership Model Risk-Reward Analysis          

Table286 Major Silicon Power Semiconductor Fab Capacity 2024         

Table287 Announced Silicon Power Fab Expansion Projects 2024-2030           

Table288 Global SiC Manufacturing Capacity Expansion 2024-2030   

Table289 Significant SiC Manufacturing Investment Projects    

Table290 Major Chinese SiC Expansion Projects

Table291 Global GaN Power Device Capacity 2024-2030           

Table292 Major GaN Capacity Expansion Projects            

Table293 Power Electronics 1.0 vs. 2.0 Paradigm Comparison

Table294 Performance Metric Evolution  

Table295 Multi-Objective Pareto Optimization Parameters         

Table296 Power Electronics Technology S-Curve Assessment 

Table297 Research Priority Evolution         

Table298 Power vs. Energy Management Perspectives   

Table299 Mission Efficiency vs. Rated Efficiency Examples        

Table300 Energy Control Center Functional Requirements         

Table301 DER Integration Power Electronics Requirements       

Table302 Hierarchical Smart Grid Structure           

Table303 Solid-State Transformer vs. Conventional Transformer            

Table304 Solid-State Transformer Application Analysis

Table305 Solid-State Transformer Market Forecast 2024-2036

Table306 FREEDM System Key Elements 

Table307 SiC MOSFET Technology Roadmap 2024-2035             

Table308 SiC MOSFET Gate Structure Comparison and Roadmap        

Table309 SiC Wafer Technology Evolution 2024-2035    

Table310 Advanced SiC Manufacturing Technologies     

Table311 Cold Split Technology Benefits 

Table312 GaN Power Device Voltage Rating Roadmap  

Table313 High-Voltage GaN Technology Comparison     

Table314 Vertical GaN vs. Lateral GaN Comparison        

Table315 GaN HEMT Technology Roadmap 2024-2035

Table316 Ultra-Wide Bandgap Material Properties            

Table317 Ga₂O₃ Technology Status and Roadmap            

Table318 Major Ga₂O₃ Technology Developers     

Table319 Diamond Power Semiconductor Status              

Table320 Emerging Material Commercialization Timeline            

Table321 Power Electronics Integration Levels    

Table322 Automotive Power Electronics Integration Evolution  

Table323 BYD 8-in-1 Powertrain Specifications   

Table324 Integrated OBC/DC-DC Market Analysis           

Table325 Traction-Integrated OBC Concept          

Table326 Multi-Cell Converter Architecture Advantages               

Table327 Parallel Interleaving Performance Scaling         

Table328 Series Interleaving R_DS(on) Advantage             

Table329 ETH Zurich 99.36% PFC Rectifier Specifications           

Table330 Modular Multilevel Converter (MMC) Applications      

Table331 Power Electronics Design Process Evolution  

Table332 Multi-Domain Simulation Integration   

Table333 Power Electronics Digital Twin Use Cases        

Table334 Digital Twin Technology Stack   

Table335 Power Electronics Loss Distribution Evolution               

Table336 Power Magnetic Core Material Comparison    

Table337 Emerging Magnetic Material Technologies        

Table338 Magnetic Component Design Evolution             

Table339 Power Electronics Capacitor Technology Comparison            

Table340 DC Link Capacitor Development Roadmap     

Table341 Emerging Capacitor Technologies for Power Electronics         

Table342 Passive Component Trade-offs at Increasing Frequency         

Table343 EMI Impact of WBG Semiconductor Adoption

Table344 EMI Reduction Strategy Classification

Table345 Active Gate Drive Technology     

Table346 ETH Zurich Closed-Loop Gate Drive Specifications    

Table347 EMI Filter Technology Roadmap              

Table348 Integrated EMI Mitigation Approaches 

Table349 Power Electronics Technology Roadmap Summary 2024-2035         

Table350 Power Electronics Performance Trajectory 2024-2035            

Table351 Power Electronics R&D Priority Matrix 2025-2035       

Table352 Technology Investment Recommendations by Company Type            

 

 

List of Figures

Figure1 Global Power Electronics Market Summary 2026-2036 (US$ Billion)

Figure2 Power Electronics Market Size by Component Category 2024-2036 (US$ Billion)

Figure3 SiC MOSFET Market by Application 2024-2036 (US$ Billion)

Figure4 GaN Device Market by Application 2024-2036 (US$ Million)

Figure5 Power Electronics Market by Application Sector 2024-2036 (US$ Billion)       

Figure6 Automotive Power Electronics Segmentation 2024-2036 (US$ Billion)             

Figure7 Super-Junction Technology Cross-Section           

Figure8 GaN HEMT Structure Schematic

Figure9 Single vs Double-Sided Cooling Schematic         

Figure10 Frame-based power module uses a metal base plate, ceramic substrate, wire bonding and copper terminals. The cavity is filled with silicone gel for insulation

Figure11 Global Electric Vehicle Sales by Region 2020-2036 (Million Units)   

Figure12 Global EV Sales by Powertrain Type 2024-2036 (Million Units)            

Figure13 EV Power Electronics System Architecture        

Figure14 Inverter Benchmarking: Si, SiC, GaN     

Figure15 Heavy-Duty Power Electronics Market 2024-2036 (US$ Million)         

Figure16 Solid-State Transformer Architecture    

Figure17 Smart Grid Power Electronics Market 2024-2036 (US$ Billion)            

Figure18 China Power Electronics Market Size 2024-2036 (US$ Billion)             

Figure19 Europe Power Electronics Market Size 2024-2036 (US$ Billion)          

Figure20 United States Power Electronics Market Size 2024-2036 (US$ Billion)           

Figure21 SiC power module packaging structure

Figure22 GaN technology in various power sectors          

Figure23 Power Electronics Market by Region 2024-2036 (US$ Billion)

Figure24 China Power Electronics Market Detailed Forecast 2024-2036 (US$ Billion)             

Figure25 Europe Power Electronics Market Detailed Forecast 2024-2036 (US$ Billion)           

Figure26 North America Power Electronics Market Detailed Forecast 2024-2036 (US$ Billion)         

Figure27 Schematic of configurations for normally on AlGaN/GaN HEMTs with (a) Schottky gate; and (b) and insulated gate              

Figure28 Comparison of diamond properties with other materials. Diamond has the largest bandgap, breakdown electric field, thermal conductivity, and hole mobility. Besides GaAs, diamond has the highest electron mobility

Figure29 Device schematic of different diamond diodes: (a) LSBDs; (b) pVSBDs; (c) VSBDs; (d) PNDs; (e) SPNDs; and (f) SPINDs