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組込みモジュール:コンパクトパッケージのバンドリング価値

Embedded Modules: Bundling Value in Compact Packages

Part of the Strategic Insights 2017 IoT & Embedded Technology Research Program: Track 6, Topic 3

 

出版社 出版年月価格 ページ数
VDC Research Group
VDCリサーチグループ社
2017年6月お問い合わせください 27

サマリー

この調査レポートは組込みモジュールの世界市場概要や地域別予測、垂直市場毎の比較予測、競争環境などの分析・解説しています。

Inside This Report

Embedded modules have evolved in step with the semiconductor landscape to support a variety of advanced computing applications across several different industries. This report investigates the expanding use cases, form factors, and competitive landscape for embedded modules with extensive market sizing, segmentation, and forecasting by vertical market, integrated features, and more.

What questions are addressed?

  • Who leads the markets for COMs and wireless modules?
  • What are the key vectors for differentiation of embedded module products?
  • Where are different module types being shipped, and what is influencing broader adoption?
  • How will various module form factors perform through the next several years?
  • Why are more engineering teams increasing their use of embedded modules?
  • Which connectivity technologies will see the greatest uptick in support by wireless modules?

Who should read this report?

This research program is intended for those making critical decisions regarding product, market, channel, and competitive strategy and tactics. This report is written for senior decision-makers who are developing embedded technology, including those in the following roles:

  • CEO and other C-suite executives
  • Corporate development and M&A teams
  • Marketing executives
  • Business development and sales leaders
  • Product development and product strategy leaders
  • Channel management and channel strategy leaders

Vendors mentioned in this Report

  • Abaco Systems
  • Actis Computer
  • ADLINK Technology
  • Advantech
  • congatec
  • DFI
  • Gemalto
  • Huawei
  • IBASE Technology
  • Kontron
  • Laird
  • Libelium
  • Link Labs
  • MEN Mikro
  • Microchip
  • MSC Technologies (Avnet)
  • Murata Manufacturing
  • NORCO
  • PFU Systems Limited
  • Portwell
  • Radisys
  • SECO
  • Semtech
  • Sierra Wireless
  • SIMCom
  • Skyworks Solutions
  • Telit
  • Texas Instruments
  • Trimble
  • u-blox
  • ZTEWelink

 



目次

Table of Contents

Inside This Report
Executive Summary
Global Market Overview
Regional Forecasts
Comparative Forecast by Vertical Market
Competitive Landscape
End-User Insights
Appendix: Market Definitions
About VDC Research

List of Exhibits

Exhibit 1: Global Shipments of Embedded Modules, 2016-2021
Exhibit 2: Global Shipments of Computer-on-Modules Segmented by Form Factor, 2016-2021
Exhibit 3: Global Shipments of Wireless Modules Segmented by Packaging/Form Factor, 2016-2021
Exhibit 4: Global Shipments of COMs and Merchant COM Carriers Segmented by Geography, 2016-2021
Exhibit 5: Global Shipments of Wireless Modules Segmented by Geography, 2016-2021
Exhibit 6: Global Shipments of COMs and Merchant COM Carriers Segmented by Vertical Market, 2016 & 2021
Exhibit 7: Global Shipments of Wireless Modules Segmented by Vertical Market, 2016 & 2021
Exhibit 8: Global Shipments of COMs and Merchant COM Carriers, Segmented by Leading Vendor, 2016
Exhibit 9: Global Shipments of Wireless Modules, Segmented by Leading Vendor, 2016
Exhibit 10: Schedule Adherence and Total Project Length
Exhibit 11: Global Shipments of Wireless Modules Segmented by Connectivity, 2016 & 2021
Exhibit 12: Expected Uptake in Connectivity Technologies Segmented by Region
Exhibit 13: Primary Factor Driving Respondents’ Organizations to Utilize/Deploy IoT Capabilities Segmented by
Vertical Market

 

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