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半導体製造用スパッタリングターゲット材市場調査

Sputtering Targets for Semiconductor Manufacturing Applications

 

出版社 出版年月電子版価格 ページ数図表数
Techcet
テクセット社
2019年8月US$8,468
サイトライセンス
254 286

サマリー

半導体材料専門の米国の調査会社テクセット社の調査レポート「半導体製造用スパッタリングターゲット材市場調査 - Sputtering Targets for Semiconductor Manufacturing Applications」は、半導体製造用スパッタリングターゲット材市場について、広範な調査・分析を行っています。

主な掲載内容 (目次より抜粋)

  1. エグゼクティブサマリー
  2. 調査範囲とメソドロジー
  3. 半導体市場概要
  4. ビジネス動向と分析
  5. 原材料のサプライチェーン
    1. タンタル
    2. アルミニウム
    3. チタンスポンジ
    4. タングステン
    5. コバルト
    6. 貴金属
    7. 希土類金属(レアアースメタル)
    8. レアメタル - スカンジウム
  6. サプライチェーン分析と価格
    1. タンタル
    2. アルミニウム
    3. チタン
    4. タングステン
    5. その他
    6. ターゲット材
    7. 貴金属
  7. 技術動向
  8. 法規制の最新情報
  9. サプライヤ情報と会社概要

This report provides supply chain information as well as business and technical trends on sputter targets used for semiconductor devices.

  • Provides a detailed look and analysis of the sputter targets market and supply chain
  •  as applied to semiconductor device manufacturing
  • Included are raw material supply chain dynamics and companies, target manufacturing cost considerations, pricing trends and more
  • Provides focused information for supply-chain managers, process integration and R&D directors, as well as business development and financial analysts
  • Covers information about key suppliers, issues/trends in the material supply chain, estimates on supplier market share, and forecast for the material segments


目次

Table of Contents

1: Executive Summary………..……..........…11
2: Scope & Methodology…….……..........…19

3: Semiconductor Market Overview………......23

3.1 Current Market Outlook..............24
3.2 Electronics/Semiconductor Ecosystem.....27
3.3 Global GDP Outlook..................28
3.4 Electronic Systems................29
3.5 Semiconductor Industry Outlook........33
3.6 Capital Spending Outlook..............36
3.7 200mm Fab Capacity Outlook...........38
3.8 China Semiconductor Market...........39
3.9 Wafer Start Forecast................42
3.10 Overview Summary.................43

4: Business Trends and Analysis.............44

4.1 2018 Supplier Market Share...........45
4.2 Target Production..................46
4.3 China Perspective...................49
4.4 Competitive Environment..............50
4.5 Trade & Tariffs......................52

5: Raw Material Supply Chain…............53

5.1 Copper….......................54
5.2 Tantalum.......................59
5.3 Aluminum.....................66
5.4 Titanium .......................72
4.5 Tungsten.......................77
5.6 Cobalt……………………………………..82
5.7 Precious Metals…………………………..88
5.8 Rare Earth Metals………………………..93
5.9 Minor Metals- Scandium…..…………….95

6: Supply Chain Analysis & Pricing...........96

6.1 Copper........................97
6.2. Tantalum.....................102
6.3 Aluminum....................106
6.4 Titanium.......................110
6.5 Tungsten......................114
6.6 Other.........................118
6.7 Total Targets...................120
6.8 Precious Metals.................122

7: Technology Trends.....................124

7.1 Wafer Size........................125
7.2 Metallization Trends................127
7.3 Barrier Layers.....................132
7.4 Other Materials.....................136
7.5 PVD in Packaging...................138

8: Regulatory Update.....................147

9: Supplier News and Profiles............153

9.1 Furuya Metals..................154
9.2 GO Element.....................159
9.3 Grikin.........................162
9.4 Honeywell....................168
9.5 KFMI........................172
9.6 JX Nippon.....................177
9.7 Materion.......................182
9.8 Pioneer Materials.................187
9.9 Praxair........................191
9.10 Sumitomo....................196
9.11 Tanaka........................200
9.12 Tosoh SMD...................204
9.13 Umicore.....................209
9.14 VEM.........................212
9.15 Vital Materials.................217

Appendices..........................222

A Key Cost Components….............223

A.1 Key Cost Drivers................224
A.2 Key Cost Drivers Copper Targets.......227
A.3 Key Cost Drivers Tantalum Targets……..231
A.4 Key Cost Drivers Aluminum Targets.....236
A.5 Key Cost Drivers Titanium Targets.....240
A.6 Key Cost Drivers Tungsten Targets....244

B. Tantalum Smelters.................249
C. Tungsten Smelters..................251
D. Cobalt Smelters...................253
E. Regulatory Update (history)...........254

List of Figures

Figure 1.1 Sputtering Target Total Revenue………..12
Figure 3.1 Monthly WSTS Trends............25
Figure 3.2 Global Purchasing Managers Index.....26
Figure 3.3: Global Electronics Supply Chain......27
Figure 3.4: Global Electronics Systems.........29
Figure 3.5: Automotive Semiconductor Market....32
Figure 3.6: 2019 Semiconductor Market Growth...33
Figure 3.7: Semiconductor Unit Growth……..…..…35
Figure 3.8: 200mm Fab Capacity.……………..…..…38
Figure 3.9: China IC Production/Consumption....…...39
Figure 3.10: TECHCET Wafer Start Forecast.…...….42
Figure 4.1: 2018 Target Supplier Market Share.....45
Figure 4.2: 2018 Target Unit Volume Production.....46
Figure 5.1: 2018 Cu Mine Production………………....54
Figure 5.2: Global Refined Cu Production…..…...….55
Figure 5.3: LME Cu Price Chart……………..…..…….57
Figure 5.4: Cu Process Summary……..……..….…….58
Figure 5.5: 2018 Ta Mine Production............59
Figure 5.6: 2017 Ta Product Demand……….….…..60
Figure 5.7: Ta Process Summary……...........65
Figure 5.8: 2018 Al Smelting Production……......66
Figure 5.9: 2017 Semi-Finished Al Demand….…...….67
Figure 5.10: LME Al Price Chart…………….………..70
Figure 5.11: Al Process Summary..............…71
Figure 5.12: 2018 Global Ti Sponge Capacity......72
Figure 5.13: 2017 Ti Mill Product Output…......……73
Figure 5.14: Ti Process Summary…………………..76
Figure 5.15: 2018 W Mine Production……………...77
Figure 5.16: 2016 W Demand……………….......78
Figure 5.17: APT Price Chart…................80
Figure 5.18: W Process Summary………….......81
Figure 5.19: 2018 Co Mine Production…………...….82
Figure 5.20 International Cobalt’s NA Mines......83
Figure 5.21 : 2017 Co Demand………….…………....84
Figure 5.22: LME Co Price Chart……….........87
Figure 5.23 Precious Metals Price Chart…………...89
Figure 5.24: Ru Metal Fix Price……………………..91
Figure 6.1: Cu Price Trends..................100
Figure 6.2: Cu Target Revenue Forecast…………...101
Figure 6.3 Ta Price Trends……………………………..104
Figure 6.4: Ta Target Revenue Forecast…......…...105
Figure 6.5 Al Price Trends………………........…108
Figure 6.6: Al Target Revenue Forecast............109
Figure 6.7: Ti Price Trends...................112
Figure 6.8: Ti Target Revenue Forecast………………113
Figure 6.9: W Price Trend……………………………..116
Figure 6.10: W Target Revenue Forecast..........117
Figure 6.11 Other Target Mat’ls Revenue Forecast…...118
Figure 6.12 Total Sputtering Target Forecast…………120
Figure 6.13 Total Sputtering Target by Mat’l Share…..121
Figure 6.14 Precious Metal Target Forecast………….123
Figure 7.1: MOL & BEOL Roadmap..............127
Figure 7.2: AMAT Co Metallization Technology....129
Figure 7.3 Why Cobalt.................……..130
Figure 7.4: 5nm BEOL Approaches.............131
Figure 7.5: Barrier l Thickness Limits …..........132
Figure 7.6: AlSc Phase Diagram………………….…..137
Figure 7.7: ASE FO Chip on Substrate Process.....139
Figure 7.8: FO Panel........................141

List of Tables

Table 3.1: Global Industry Trends................….24
Table 3:2: Global GDP Forecasts…………………….……..…28
Table 3.3: Semiconductor Device Segment Forecast.......34
Table 3.4: Semiconductor Equipment Outlook……………..36
Table 3.5: Top IDM/Foundry Capex Spenders..........37
Table 5.1: Co Refining Production...................85
Table 5.2: Co Refining Production continued……………....86
Table 5.3: Precious Metal Target Suppliers……………..….90
Table 5.4: Ru Target Suppliers….………..…………………92
Table 6.1: Cu Target Supplier Supply Chain Integration…...97
Table 6.2: Ta Target Supplier Supply Chain Integration...102
Table 6.3: Al Target Supplier Supply Chain Integration…..106
Table 6.4: Ti Target supplier Supply Chain Integration…...110
Table 6.5: W Target Supplier Supply Chain Integration…...114
Table 6.6: PCRAM Target Suppliers………………………...119
Table 6.7: MRAM Target Suppliers…...............119
Table 7.1: Package PVD Materials & Application..........143
Table 7.2: Package PVD Equipment Makers...........145

 

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