Summary

The global market for Silicon Carbide Wafer Grinder was estimated to be worth US$ 112 million in 2024 and is forecast to a readjusted size of US$ 337 million by 2031 with a CAGR of 17.0% during the forecast period 2025-2031.
A silicon carbide wafer grinder is a special equipment used to grind SiC (silicon carbide) wafers. It is mainly driven by an electric or pneumatic motor to drive a rotating shaft, and the material is removed through the saw teeth on the cutting disc or with a cutting blade. During the grinding process, the SiC wafer grinder uses tools made of cemented carbide or superhard materials to perform high-speed rotational cutting on the surface of the workpiece, causing the blank to deform and lose its stability, and then separate from the whole. This equipment plays an important role in the production and processing of SiC wafers due to its high efficiency, accuracy and good adaptability to the hardness and corrosion resistance of SiC materials.
The global Silicon Carbide Wafer Grinders market is witnessing significant growth, driven by the increasing demand for semiconductors in various industries such as consumer electronics, automotive, and telecommunications. The Asia-Pacific region remains the largest consumer market, accounting for over 60% of the global market share. This trend is expected to continue due to the region's strong semiconductor industry, technological advancements, and growing demand for energy-efficient power devices.
The global key manufacturers of Silicon Carbide Wafer Grinder include Disco, TSD, etc. In 2024, the global top five players had a share approximately 82% in terms of revenue.
Among different types of Silicon Carbide Wafer Grinder, fully automated systems dominate the market, capturing approximately 77% of the total share in 2024. This reflects the industry's growing demand for precision, scalability, and high-efficiency production processes. Fully automated equipment provides improved throughput and minimizes the risk of human error, making it the preferred choice for manufacturers aiming to scale their operations and ensure high-quality output.
Interms of applications, wafers sized 6 inches and below are the primary demand drivers. These smaller wafers make up approximately 70% of the market in 2024. The widespread use of smaller wafers in power electronics and semiconductor devices, particularly in electric vehicles and renewable energy applications, supports this demand. As SiC continues to gain traction in the power semiconductor sector, the demand for wafer thinning equipment for smaller wafer sizes is expected to increase.
Market Driving Factors
Expansion of the Electric Vehicle (EV) Market: SiC materials are particularly suitable for use in power modules for electric vehicles (EVs) due to their superior thermal conductivity and high voltage tolerance. With the rapid growth of the electric vehicle market, the demand for SiC wafers is increasing, which in turn drives the demand for wafer thinning equipment.
Advances in Energy Conversion and Storage Technologies: In high-efficiency energy conversion and storage fields, such as solar inverters and battery management systems, the use of SiC materials can significantly improve efficiency. The market's demand for high-performance components has driven the production and thinning of SiC wafers.
Demand for 5G and High-Frequency Electronics: The demand for SiC materials is rising in 5G networks and other high-frequency electronic devices due to SiC's excellent performance in high-frequency and high-power applications. This has led to an increase in the demand for SiC wafer production and processing equipment.
Market Restraints
Process Complexity: The wafer thinning process for SiC wafers involves high-precision techniques and is technically challenging. The instability of the process may lead to quality issues, affecting market confidence.
Intensifying Competition: As the SiC market rapidly develops, more companies are entering the field, and market competition is becoming increasingly intense. This may lead to price wars and margin compression.
Technological Iteration: With the fast pace of technological updates, the introduction of new technologies and equipment may quickly render existing equipment obsolete. Companies need to continue investing in research and development to maintain competitiveness.
This report aims to provide a comprehensive presentation of the global market for Silicon Carbide Wafer Grinder, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Silicon Carbide Wafer Grinder by region & country, by Type, and by Application.
The Silicon Carbide Wafer Grinder market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Silicon Carbide Wafer Grinder.
Market Segmentation
By Company
Disco
TSD
TOKYO SEIMITSU
Engis Corporation
Okamoto Semiconductor Equipment Division
Revasum
Koyo Machinery
G&N
Segment by Type
6-inch and Smaller
8-inch and Larger
Segment by Application
Power Device
Electronics & Optoelectronics
Wireless Infrastructure
Others
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Silicon Carbide Wafer Grinder manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Silicon Carbide Wafer Grinder in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Silicon Carbide Wafer Grinder in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

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Table of Contents

1 Market Overview
1.1 Silicon Carbide Wafer Grinder Product Introduction
1.2 Global Silicon Carbide Wafer Grinder Market Size Forecast
1.2.1 Global Silicon Carbide Wafer Grinder Sales Value (2020-2031)
1.2.2 Global Silicon Carbide Wafer Grinder Sales Volume (2020-2031)
1.2.3 Global Silicon Carbide Wafer Grinder Sales Price (2020-2031)
1.3 Silicon Carbide Wafer Grinder Market Trends & Drivers
1.3.1 Silicon Carbide Wafer Grinder Industry Trends
1.3.2 Silicon Carbide Wafer Grinder Market Drivers & Opportunity
1.3.3 Silicon Carbide Wafer Grinder Market Challenges
1.3.4 Silicon Carbide Wafer Grinder Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Silicon Carbide Wafer Grinder Players Revenue Ranking (2024)
2.2 Global Silicon Carbide Wafer Grinder Revenue by Company (2020-2025)
2.3 Global Silicon Carbide Wafer Grinder Players Sales Volume Ranking (2024)
2.4 Global Silicon Carbide Wafer Grinder Sales Volume by Company Players (2020-2025)
2.5 Global Silicon Carbide Wafer Grinder Average Price by Company (2020-2025)
2.6 Key Manufacturers Silicon Carbide Wafer Grinder Manufacturing Base and Headquarters
2.7 Key Manufacturers Silicon Carbide Wafer Grinder Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Silicon Carbide Wafer Grinder
2.9 Silicon Carbide Wafer Grinder Market Competitive Analysis
2.9.1 Silicon Carbide Wafer Grinder Market Concentration Rate (2020-2025)
2.9.2 Global 5 and 10 Largest Manufacturers by Silicon Carbide Wafer Grinder Revenue in 2024
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Silicon Carbide Wafer Grinder as of 2024)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 6-inch and Smaller
3.1.2 8-inch and Larger
3.2 Global Silicon Carbide Wafer Grinder Sales Value by Type
3.2.1 Global Silicon Carbide Wafer Grinder Sales Value by Type (2020 VS 2024 VS 2031)
3.2.2 Global Silicon Carbide Wafer Grinder Sales Value, by Type (2020-2031)
3.2.3 Global Silicon Carbide Wafer Grinder Sales Value, by Type (%) (2020-2031)
3.3 Global Silicon Carbide Wafer Grinder Sales Volume by Type
3.3.1 Global Silicon Carbide Wafer Grinder Sales Volume by Type (2020 VS 2024 VS 2031)
3.3.2 Global Silicon Carbide Wafer Grinder Sales Volume, by Type (2020-2031)
3.3.3 Global Silicon Carbide Wafer Grinder Sales Volume, by Type (%) (2020-2031)
3.4 Global Silicon Carbide Wafer Grinder Average Price by Type (2020-2031)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Power Device
4.1.2 Electronics & Optoelectronics
4.1.3 Wireless Infrastructure
4.1.4 Others
4.2 Global Silicon Carbide Wafer Grinder Sales Value by Application
4.2.1 Global Silicon Carbide Wafer Grinder Sales Value by Application (2020 VS 2024 VS 2031)
4.2.2 Global Silicon Carbide Wafer Grinder Sales Value, by Application (2020-2031)
4.2.3 Global Silicon Carbide Wafer Grinder Sales Value, by Application (%) (2020-2031)
4.3 Global Silicon Carbide Wafer Grinder Sales Volume by Application
4.3.1 Global Silicon Carbide Wafer Grinder Sales Volume by Application (2020 VS 2024 VS 2031)
4.3.2 Global Silicon Carbide Wafer Grinder Sales Volume, by Application (2020-2031)
4.3.3 Global Silicon Carbide Wafer Grinder Sales Volume, by Application (%) (2020-2031)
4.4 Global Silicon Carbide Wafer Grinder Average Price by Application (2020-2031)
5 Segmentation by Region
5.1 Global Silicon Carbide Wafer Grinder Sales Value by Region
5.1.1 Global Silicon Carbide Wafer Grinder Sales Value by Region: 2020 VS 2024 VS 2031
5.1.2 Global Silicon Carbide Wafer Grinder Sales Value by Region (2020-2025)
5.1.3 Global Silicon Carbide Wafer Grinder Sales Value by Region (2026-2031)
5.1.4 Global Silicon Carbide Wafer Grinder Sales Value by Region (%), (2020-2031)
5.2 Global Silicon Carbide Wafer Grinder Sales Volume by Region
5.2.1 Global Silicon Carbide Wafer Grinder Sales Volume by Region: 2020 VS 2024 VS 2031
5.2.2 Global Silicon Carbide Wafer Grinder Sales Volume by Region (2020-2025)
5.2.3 Global Silicon Carbide Wafer Grinder Sales Volume by Region (2026-2031)
5.2.4 Global Silicon Carbide Wafer Grinder Sales Volume by Region (%), (2020-2031)
5.3 Global Silicon Carbide Wafer Grinder Average Price by Region (2020-2031)
5.4 North America
5.4.1 North America Silicon Carbide Wafer Grinder Sales Value, 2020-2031
5.4.2 North America Silicon Carbide Wafer Grinder Sales Value by Country (%), 2024 VS 2031
5.5 Europe
5.5.1 Europe Silicon Carbide Wafer Grinder Sales Value, 2020-2031
5.5.2 Europe Silicon Carbide Wafer Grinder Sales Value by Country (%), 2024 VS 2031
5.6 Asia Pacific
5.6.1 Asia Pacific Silicon Carbide Wafer Grinder Sales Value, 2020-2031
5.6.2 Asia Pacific Silicon Carbide Wafer Grinder Sales Value by Region (%), 2024 VS 2031
5.7 South America
5.7.1 South America Silicon Carbide Wafer Grinder Sales Value, 2020-2031
5.7.2 South America Silicon Carbide Wafer Grinder Sales Value by Country (%), 2024 VS 2031
5.8 Middle East & Africa
5.8.1 Middle East & Africa Silicon Carbide Wafer Grinder Sales Value, 2020-2031
5.8.2 Middle East & Africa Silicon Carbide Wafer Grinder Sales Value by Country (%), 2024 VS 2031
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Silicon Carbide Wafer Grinder Sales Value Growth Trends, 2020 VS 2024 VS 2031
6.2 Key Countries/Regions Silicon Carbide Wafer Grinder Sales Value and Sales Volume
6.2.1 Key Countries/Regions Silicon Carbide Wafer Grinder Sales Value, 2020-2031
6.2.2 Key Countries/Regions Silicon Carbide Wafer Grinder Sales Volume, 2020-2031
6.3 United States
6.3.1 United States Silicon Carbide Wafer Grinder Sales Value, 2020-2031
6.3.2 United States Silicon Carbide Wafer Grinder Sales Value by Type (%), 2024 VS 2031
6.3.3 United States Silicon Carbide Wafer Grinder Sales Value by Application, 2024 VS 2031
6.4 Europe
6.4.1 Europe Silicon Carbide Wafer Grinder Sales Value, 2020-2031
6.4.2 Europe Silicon Carbide Wafer Grinder Sales Value by Type (%), 2024 VS 2031
6.4.3 Europe Silicon Carbide Wafer Grinder Sales Value by Application, 2024 VS 2031
6.5 China
6.5.1 China Silicon Carbide Wafer Grinder Sales Value, 2020-2031
6.5.2 China Silicon Carbide Wafer Grinder Sales Value by Type (%), 2024 VS 2031
6.5.3 China Silicon Carbide Wafer Grinder Sales Value by Application, 2024 VS 2031
6.6 Japan
6.6.1 Japan Silicon Carbide Wafer Grinder Sales Value, 2020-2031
6.6.2 Japan Silicon Carbide Wafer Grinder Sales Value by Type (%), 2024 VS 2031
6.6.3 Japan Silicon Carbide Wafer Grinder Sales Value by Application, 2024 VS 2031
6.7 South Korea
6.7.1 South Korea Silicon Carbide Wafer Grinder Sales Value, 2020-2031
6.7.2 South Korea Silicon Carbide Wafer Grinder Sales Value by Type (%), 2024 VS 2031
6.7.3 South Korea Silicon Carbide Wafer Grinder Sales Value by Application, 2024 VS 2031
6.8 Southeast Asia
6.8.1 Southeast Asia Silicon Carbide Wafer Grinder Sales Value, 2020-2031
6.8.2 Southeast Asia Silicon Carbide Wafer Grinder Sales Value by Type (%), 2024 VS 2031
6.8.3 Southeast Asia Silicon Carbide Wafer Grinder Sales Value by Application, 2024 VS 2031
6.9 India
6.9.1 India Silicon Carbide Wafer Grinder Sales Value, 2020-2031
6.9.2 India Silicon Carbide Wafer Grinder Sales Value by Type (%), 2024 VS 2031
6.9.3 India Silicon Carbide Wafer Grinder Sales Value by Application, 2024 VS 2031
7 Company Profiles
7.1 Disco
7.1.1 Disco Company Information
7.1.2 Disco Introduction and Business Overview
7.1.3 Disco Silicon Carbide Wafer Grinder Sales, Revenue, Price and Gross Margin (2020-2025)
7.1.4 Disco Silicon Carbide Wafer Grinder Product Offerings
7.1.5 Disco Recent Development
7.2 TSD
7.2.1 TSD Company Information
7.2.2 TSD Introduction and Business Overview
7.2.3 TSD Silicon Carbide Wafer Grinder Sales, Revenue, Price and Gross Margin (2020-2025)
7.2.4 TSD Silicon Carbide Wafer Grinder Product Offerings
7.2.5 TSD Recent Development
7.3 TOKYO SEIMITSU
7.3.1 TOKYO SEIMITSU Company Information
7.3.2 TOKYO SEIMITSU Introduction and Business Overview
7.3.3 TOKYO SEIMITSU Silicon Carbide Wafer Grinder Sales, Revenue, Price and Gross Margin (2020-2025)
7.3.4 TOKYO SEIMITSU Silicon Carbide Wafer Grinder Product Offerings
7.3.5 TOKYO SEIMITSU Recent Development
7.4 Engis Corporation
7.4.1 Engis Corporation Company Information
7.4.2 Engis Corporation Introduction and Business Overview
7.4.3 Engis Corporation Silicon Carbide Wafer Grinder Sales, Revenue, Price and Gross Margin (2020-2025)
7.4.4 Engis Corporation Silicon Carbide Wafer Grinder Product Offerings
7.4.5 Engis Corporation Recent Development
7.5 Okamoto Semiconductor Equipment Division
7.5.1 Okamoto Semiconductor Equipment Division Company Information
7.5.2 Okamoto Semiconductor Equipment Division Introduction and Business Overview
7.5.3 Okamoto Semiconductor Equipment Division Silicon Carbide Wafer Grinder Sales, Revenue, Price and Gross Margin (2020-2025)
7.5.4 Okamoto Semiconductor Equipment Division Silicon Carbide Wafer Grinder Product Offerings
7.5.5 Okamoto Semiconductor Equipment Division Recent Development
7.6 Revasum
7.6.1 Revasum Company Information
7.6.2 Revasum Introduction and Business Overview
7.6.3 Revasum Silicon Carbide Wafer Grinder Sales, Revenue, Price and Gross Margin (2020-2025)
7.6.4 Revasum Silicon Carbide Wafer Grinder Product Offerings
7.6.5 Revasum Recent Development
7.7 Koyo Machinery
7.7.1 Koyo Machinery Company Information
7.7.2 Koyo Machinery Introduction and Business Overview
7.7.3 Koyo Machinery Silicon Carbide Wafer Grinder Sales, Revenue, Price and Gross Margin (2020-2025)
7.7.4 Koyo Machinery Silicon Carbide Wafer Grinder Product Offerings
7.7.5 Koyo Machinery Recent Development
7.8 G&N
7.8.1 G&N Company Information
7.8.2 G&N Introduction and Business Overview
7.8.3 G&N Silicon Carbide Wafer Grinder Sales, Revenue, Price and Gross Margin (2020-2025)
7.8.4 G&N Silicon Carbide Wafer Grinder Product Offerings
7.8.5 G&N Recent Development
8 Industry Chain Analysis
8.1 Silicon Carbide Wafer Grinder Industrial Chain
8.2 Silicon Carbide Wafer Grinder Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Silicon Carbide Wafer Grinder Sales Model
8.5.2 Sales Channel
8.5.3 Silicon Carbide Wafer Grinder Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.1.1 Research Programs/Design
10.1.1.2 Market Size Estimation
10.1.1.3 Market Breakdown and Data Triangulation
10.1.2 Data Source
10.1.2.1 Secondary Sources
10.1.2.2 Primary Sources
10.2 Author Details
10.3 Disclaimer