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フレキシブルハイブリッドエレクトロニクス 2020-2030年:用途、課題、革新、予測:プリンテッドエレクトロニクス、フレキシブルIC、プリンテッドセンサ、導電性インク、R2R製造、スマートパッケージング

Flexible Hybrid Electronics 2020-2030: Applications, Challenges, Innovations and Forecasts

Printed electronics, Flexible ICs, Printed Sensors, Conductive Inks, R2R manufacturing, Smart Packaging

 

出版社 出版年月電子版価格 ページ数
IDTechEx
アイディーテックエックス
2020年4月GBP4,650
電子ファイル(1-5ユーザライセンス)
407

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サマリー

このレポートはフレキシブルハイブリッドエレクトロニクス市場の技術的課題や市場機会を包括的に分析し、市場予測と20社以上の企業のプロフィールをインタビューをベースに掲載しています。

主な掲載内容  ※目次より抜粋

  • エグゼクティブサマリ
  • FHE(フレキシブルハイブリッドエレクトロニクス)のイントロダクション
  • FHE向けのフレキシブル基板
  • 部品接着素材
  • フレキシブルロジックとフレキシブルメモリに向けて
  • 導電性インク
  • フレキシブル薄膜電源
  • プリンテッドセンサ
  • FHEの組み立て
  • 行政政府の調査センタとプロジェクトサポート
  • 用途と事例研究
  • 市場予測
  • 企業プロフィール

 

Report Details

This IDTechEx Research report covers the rapidly emerging field of flexible hybrid electronics. Such circuits are a compromise that aims to capture the benefits of flexible printed electronics while retaining the processing capability of conventional circuits. This combination of attributes has a vast array of applications, ranging from smart packaging to wearable technology, all of which are comprehensively examined in our report.
 
 
Flexible hybrid electronics circuit (left), comprising at a minimum conductive interconnects printed onto a flexible substrate and a placed integrated circuit. Additional functionality may include thin film photovoltaics (PV), a thin film battery and printed sensors. A market forecast of the total revenue from FHE over the next 10 years (right, excluding printed RFID outside smart packaging), divided into major categories. Each category is made up of multiple individually forecast subcategories and component prices, given in the main report. We forecast that while wearable/healthcare applications (especially skin patches) will dominate over the next 5 years, smart packaging will ultimately become the largest application.
IDTechEx analyses and concludes in this report how the global demand for flexible hybrid electronic circuits will reach a value of over $3 billion in 2030 – more if the infrastructure, software and services are included. Our detailed and highly granular market forecasts take account of projected demand for a wide range of applications, along with the technological readiness level of the required components. Based on an impartial analysis across over 20 application sub-categories, ranging from skin patches to industrial monitoring and from automotive temperature sensors to printed RFID tags, IDTechEx expects that almost 5 bn FHE circuits will be produced in 2030.
 
We define FHE as a circuit that comprises a flexible substrate, printed functionality and an externally manufactured integrated circuit (IC). Manufacturing such circuits requires many current and developing emerging technologies which are essential to FHE circuits. These include:
• Low cost thermally stabilised PET substrates that are dimensionally stable.
• Component attachment materials compatible with flexible thermally fragile substrates, such as low temperature solder and field aligned anisotropic conductive adhesives.
• Flexible integrated circuits, based on both thinned Si and metal oxides.
• Conductive inks, based on both silver and copper.
• Thin film batteries, especially if printable.
• Printed sensors of all types.
• Manufacturing methods for mounting components on flexible substrates.
Each of these technologies is reviewed in detail, based on our interviews and visits to many of the suppliers, and the merits of different approaches compared. Furthermore, we profile multiple government research centres and a range of collaborative projects from around the world that support the adoption of flexible hybrid electronics, demonstrating the major players and technological themes.
 
Based on this analysis of the technology and our interviews with many players in the field, we identify many technological trends and innovation opportunities. In terms of substrates, R2R manufacturing of hybrid electronics is made difficult by PET's dimensional instability and low glass transition temperature. As such more complex FHE circuits will require higher performance substrates. Thermally fragile substrates mean that replacements for SAC solder are required. While conductive adhesives are currently used to attach RFID chips to PET, these are likely to be replaced to some extent with low temperature solder since it enables self-alignment.
 
An especially clear innovation opportunity is flexible ICs, which would enable the whole circuit to bend and hence be compatible with continuous R2R manufacturing. There are arguably two approaches: thinned Si chips for more complex applications, and natively flexible ICs based on metal oxides for simpler applications like RFID. At present flexible ICs are still a long way from widespread adoption, but the demand is sure to grow as flexible hybrid electronics becomes more established due to the demand for low cost circuits and hence continuous manufacturing methods. Rapid placement of these flexible ICs on flexible substrates, which is very difficult for current pick-and-place technology, is another substantial opportunity.
 
As a technology that spans so many different applications, there are many drivers for the adoption of FHE. The most significant are the rapidly developing 'Internet of Things' and 'Smart packaging' applications, which require low cost electronics to be integrated into many everyday items. Such circuits are basically RFID tags with greater functionality, and will require similar continuous manufacturing methods and low cost materials. Unlike conventional electronics, these requirements are well suited to FHE. Wearable technology, in which flexibility/stretchability are highly desirable, is another rapidly growing application space. Additional drivers are the desire for differentiation in consumer products by adding flexibility through removing the form factor constraint of PCBs, and for electronic circuits in vehicles (especially planes and electric vehicles) to be lighter.
 
This report from IDTechEx provides a comprehensive overview of the flexible hybrid electronics market, including the technological challenges and the opportunities they create, market forecasts and over 20 interview-based company profiles.

 



目次

Table of Contents

1. EXECUTIVE SUMMARY
1.1. What is flexible hybrid electronics (FHE)?
1.2. What advantages does FHE promise?
1.3. Enabling technologies for FHE
1.4. Transition from PI to cheaper substrates
1.5. Low temperature component attachment
1.6. Development of flexible ICs
1.7. Conductive inks: Silver to copper
1.8. Assembling FHE circuits
1.9. Government backed research centres
1.10. Main addressable markets for FHE
1.11. SWOT Analysis for FHE
1.12. Predicted manufacturing trends
1.13. Total FHE circuits forecast
1.14. Total FHE circuits forecast (volume)
2. INTRODUCTION TO FLEXIBLE HYBRID ELECTRONICS (FHE)
2.1. The existing printed/flexible electronics market
2.1.1. Printed/flexible/organic electronics market size
2.1.2. Description and analysis of the main technology components of printed, flexible and organic electronics
2.1.3. Market potential and profitability
2.1.4. Route to market strategies: Pros and Cons
2.1.5. Printed/flexible electronics value chain is unbalanced
2.1.6. Many manufacturers now provide complete solutions
2.1.7. Many printed electronic technologies are an enabler but not an obvious product
2.2. Conventional electronics: Rigid and flexible PCBs
2.2.1. Types of printed circuit boards (PCBs)
2.2.2. Comparing PCB, FPCB and FHE
2.2.3. Multilayer PCBs - a challenge for FHE
2.3. Summary: Introduction
3. FLEXIBLE SUBSTRATES FOR FHE
3.1. Low temperature polymer substrates
3.1.1. Cost and maximum temperature are correlated
3.1.2. Substrates for flexible electronics
3.1.3. Qualitative comparison of plastic substrates properties
3.1.4. Manipulating polyester film microstructure for improved properties.
3.1.5. Substrate stiffness
3.1.6. Dimensional stability: Importance and effect of environment
3.1.7. External debris and protection/cleaning strategies
3.2. Stretchable substrates
3.2.1. Requirements for stretchable electronics
3.2.2. Thermosetting resin as a flexible substrate.
3.2.3. Stress strain curves of flexible substrates
3.2.4. Nikkan Industries: An alternative stretchable substrate
3.3. Paper substrates
3.3.1. Paper substrates: Advantages and disadvantages
3.3.2. Paper substrates can have comparable roughness
3.3.3. Thermal properties of paper substrates
3.3.4. Paper substrate case studies
3.3.5. Sustainable RFID tags with antennae printed on paper.
3.4. Summary: Flexible substrates for FHE
3.4.1. Roadmap for flexible substrate adoption
4. COMPONENT ATTACHMENT MATERIALS
4.1. Low temperature solder
4.1.1. Low temperature solder enables thermally fragile substrates
4.1.2. Substrate compatibility with existing infrastructure
4.1.3. Solder facilitates rapid component assembly via self alignment
4.1.4. Low temperature solder alloys
4.1.5. Low temperature soldering with core-shell nanoparticles
4.1.6. Supercooled liquid solder
4.2. Photonic soldering
4.2.1. Photonic soldering: A step up from sintering
4.2.2. Photonic soldering: Substrate dependence.
4.3. Electrically conductive adhesives
4.3.1. Electrically conductive adhesives: Two different approaches
4.3.2. Example of conductive adhesives on flexible substrates
4.3.3. Magnetically aligned ACA
4.3.4. Electrically aligned ACA
4.3.5. Conductive paste bumping on flexible substrates
4.3.6. Ag pasted for die attachment.
4.4. Summary: Component attachment materials
4.4.1. Component attachment materials for FHE roadmap
4.4.2. Component attachment materials for FHE roadmap
5. TOWARDS FLEXIBLE LOGIC AND MEMORY
5.1. Printed thin film transistors
5.1.1. Printed TFTs aimed to enable simpler processing
5.1.2. Technical challenges in printing thin film transistors
5.1.3. Printed TFT architecture
5.1.4. Organic semiconductors for TFTs
5.1.5. Organic transistor materials
5.1.6. OTFT mobility overestimation
5.1.7. Merck's Organic TFT
5.1.8.

 

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