目次
価格・ご注文について 半導体材料専門の米国の調査会社テクセット社の調査レポート「半導体製造用スパッタリングターゲット材市場調査 2011年版 - Sputtering Targets:for Semiconductor Fabrication」は、半導体製造用スパッタリングターゲット材のサプライヤ、技術動向、そしてチタンやタンタルなどの関連材料について、広範囲にわたる調査・分析を行っています。
主な調査内容 (目次から抜粋)
- スパッタリングターゲット材のサプライヤ状況
- 純物質サプライヤ/鉱石精製業者
- 金属鉱石サプライヤ
- タンタル源と供給
- チタン源と供給
- タングステン源と供給
- 銅供給における問題
- ルテニウムの需要と供給
- リサイクル
- 技術動向と課題
- 今後の市場 - 太陽電池と薄膜トランジスタ
Table of Contents
1 HIGHLIGHTS
1.1 Sputtering Target Market
1.2 Supply Issues
1.3 Technical Trends and Issues
2 INTRODUCTION
3 SPUTTERING TARGET MARKET
4 SUPPLIER STATUS
4.1 Honeywell Electronics Materials (HEM)
4.2 JX Nikko Mining & Metals (previously Nikko Materials)
4.3 Praxair-MRC
4.4 Tosoh SMD
5 PURE MATERIAL SUPPLIERS / REFINERS OF ORE
5.1 Metal Purity
6 METAL ORE SUPPLIERS
7 TANTALUM SOURCE AND SUPPLY
7.1 Tantalum Powder Supply Issues History/Background
7.2 Tantalum Ore
7.3 Tantalum Plate suppliers
7.4 Tantalum Sputtering Target Market
8 TITANIUM SOURCE AND SUPPLY
8.1 Titanium Consumption by Application
9 TUNGSTEN SOURCE AND SUPPLY
10 COPPER SUPPLY ISSUES
11 RUTHENIUM SUPPLY AND DEMAND
12 RECYCLING
13 TECHNICAL TRENDS AND ISSUES
13.1 Barrier Technology for Copper Wiring
13.2 Ruthenium
13.3 Silicides: Cobalt Silicide and Nickel Alloy Silicides
13.4 Silicides: Nickel Silicide
14 FUTURE MARKETS - SOLAR CELLS AND THIN FILM TRANSISTORS
APPENDIX A: CHINA’S GROWING INFLUENCE ON THE METALS MARKETS
APPENDIX B: TANTALUM APPLICATIONS
APPENDIX C: ALUMINUM TARGET MANUFACTURING FLOW
APPENDIX D: TITANIUM TUNGSTEN (TI.W) TARGET MANUFACTURING FLOW
APPENDIX E: TITANIUM TARGET MANUFACTURING FLOW
APPENDIX F: PROCESS FLOW FOR PURIFYING TITANIUM
APPENDIX G: PROCESS FLOW FOR PURIFYING TANTALUM
APPENDIX H: TANTALUM SHORTAGE OF 2000
APPENDIX I: 2006/2007 TECHNICAL TRENDS
List of Figures
Figure 1: Sputter Target Revenues for ICs, History and Forecast
Figure 2: Sputtering Target Supply Chain
Figure 3: Sputtering Target Revenues History and Forecast
Figure 4: 2010 and 2015 Semiconductor Sputtering Target Type as a
Percentage of Worldwide Revenue
Figure 6: 2010 Estimated Worldwide Revenue by Region
Figure 7: Praxair AdvanTage. Tantalum Targets - Uniform Microstructure
Figure 8: Tantalum Supply Chain
Figure 9: Worldwide Tantalum Ore Mines 2000 and 2010 Estimate Source USGS
Figure 12: Tantalum Sputtering Target Revenues and Forecast
Figure 13: Titanium Sponge Production Capacity by Country 2008 & 2012 Source USGS
Figure 14: Titanium Supply Chain - Ore to Targets
Figure 15: Tungsten Mining by Percentage of Worldwide Production
Figure 17: Copper Ore Mining Production 2010
Figure 18: China’s Net Import of Copper 2005-09
Figure 19: The Rising Price of Copper
Figure 20: Ruthenium Pricing End of 2009
Figure 21: Precious Metals (Ruthenium) Mining Production (from USGS)
Figure 22: Ruthenium Sputtering Target Supply Chain
Figure B1: 2005/06 Tantalum Applications as a Percent of Total Volume by Weight
Figure I1: Comparison of Traditional vs. ECAE Target Surface Roughness
List of Tables
Table 1: HEM - Manufacturing sites
Table 2: Alta Group of HEM (Honeywell) - Manufacturing sites
Table 3: Nippon Mining & Metals Group - Manufacturing Sites
Table 4: Praxair-MRC - Manufacturing Sites
Table 5: Tosoh SMD Manufacturing Sites
Table 6: Pure Material Suppliers
Table 7: Metal Purities Currently Available
Table 8: Ta Mine Production (metric tons) 2008 to 2011 Estimate
Table 9: Growing Titanium Content in Newer Planes
Table A1: The Five Stages of Industrialization
