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半導体製造用スパッタリングターゲット材市場調査

Sputtering Targets for Semiconductor Manufacturing Applications

 

出版社 出版年月電子媒体価格ページ数
Techcet
テクセット社
2017年8月US$8,268
サイトライセンス
154

サマリー

半導体材料専門の米国の調査会社テクセット社の調査レポート「半導体製造用スパッタリングターゲット材市場調査 - Sputtering Targets for Semiconductor Manufacturing Applications」は、半導体製造用スパッタリングターゲット材市場について、広範な調査・分析を行っています。

主な掲載内容 (目次より抜粋)

  • エグゼクティブサマリー
  • 調査範囲とメソドロジー
  • 半導体市場概要
  • 原材料の経済的概観
    • タンタル
    • アルミニウム
    • チタンスポンジ
    • タングステン
  • サプライチェーンの最新情報
  • サプライチェーン分析と価格
    • タンタル
    • アルミニウム
    • チタン
    • タングステン
    • その他
    • 合計
    • 累計ターゲット材価格予測
  • 技術動向
  • 法規制の最新情報
  • 事業動向と分析
  • サプライヤ情報と会社概要
  • 別表A:主要製造コストの促進要因
  • 別表B:原材料加工概観
  • 別表C:中国市場
  • 別表D:問題解決へのアプローチ

This report provides supply chain information as well as business and technical trends on sputter targets used for semiconductor devices.

 



目次

Table of Contents

1: Executive Summary...................................10
2: Scope & Methodology..............................14

3: Semiconductor Market Overview.............18

3.1 Forecast Trends...............................20
3.2 Wafer StartForecast........................21

4: Raw Material Economic Overview..........22

4.1 Copper............................................23
4.2 Tantalum.........................................25
4.3 Aluminum........................................27
4.4 Titanium Sponge.............................29
4.5 Tungsten..........................................31

5: Supply Chain Update..........................33

5.1 Copper Supply Tightens..................34
5.2 Titanium.........................................35
5.3 Tungsten China Update..................36

6: Supply Chain Analysis & Pricing..........................37

6.1 Copper......................................................44
6.2. Tantalum.................................................46
6.3 Aluminum................................................48
6.4 Titanium...................................................52
6.5 Tungsten...................................................56
6.6 Other........................................................60
6.7 Total..........................................................61
6.8 Cumulative Target Price Forecast..........62

7: Technology Trends..............................................64

7.1 Technology Updates...............................65
7.2 Cobalt Integration...................................66
7.3 Material Challenges.................................67
7.4 Beyond Copper........................................68
7.5 Approaches to Solve Barrier Problems.69
7.6 TSV............................................................70

8: Regulatory Updates..............................................72

8.1 Conflict Minerals: Dodd Frank.................73
8.2 European Union (EU) Commission, Council and
Parliament.......................................................77

9: Business Trends and Analysis...................78

9.1 2013 Supplier Market Share ........79
9.2 Target Production........................80
9.3 Competitive Environment – Cu &
Al.........................................................82
9.4 Tungsten.......................................83
9.5 Cobalt ...........................................84
9.6 Sn Update.....................................85
9.7 Conflict Minerals .........................86
9.8 Precious Metals ...........................87
9.9 Rare Earths ..................................88
9.10 Summary ....................................89

10: Supplier News and Profiles.....................90

10.1 Honeywell....................................91
10.2 JX Nippon....................................94
10.3 Praxair.........................................97
10.4 Tosoh SMD.................................101
10.2 KFMI...........................................105
10.3 Grikin..........................................108

Appendix A: Key Manufacturing Cost Drivers......114

A.1 Cost Components.....................................115
A.2 Key Cost Drivers of Copper Targets.........118
A.3 Key Cost Drivers of Tantalum Targets....122
A.4 Key Cost Drivers of Aluminum Targets....127
A.5 Key Cost Drivers of Titanium Targets.......131
A.6 Key Cost Drivers of Tungsten Targets......135

Appendix B: Raw Materials Process Overview.....140

B.1 Copper: Process
Overview.....................................................141
B.2 Tantalum: Process Overview.................142
B.3 Aluminum: Process Overview........143
B.4 Titanium: Process Overview..................144
A.5 Tungsten: Overview................................145

Appendix C: China Perspective...............................146

C.1 China Perspective....................................147
Appendix D: Approaches to Solve Barrier Problems....148
D.1 Approaches to Solve Barrier Problems.........149

Appendix E: Technology Trends.....................................150

E.1 200mm devices................................................151
300mm devices.....................................................152
Limits of Barrier Thickness..................................154

List of Figures

Figure 1.1: Sputtering Target Total Revenue.............12
Figure 3.1: Wafer Starts by Device Type...................19
Figure 3.2: Wafer Start Forecast...............................21
Figure 4.1: 2016 Global Cu Mine Production.........23
Figure 4.2: 2015 Global Cu Consumption............24
Figure 4.3: 2015 Ta Mine Production...............25
Figure 4.4: 2015 Global Ta Metal Demand...........26
Figure 4.5: 2015 WW Al Production................30
Figure 4.6: 2015 US Domestic Al Demand..................28
Figure 4.7: 2016 Ti Sponge Production..............29
Figure 4.8: 2016 Global Ti Sponge Demand. ........34
Figure 4.9: 2015 W Mine Production.................31
Figure 4.10: 2015 Global W Metal Demand............32
Figure 4.15: W Process Summary............................38
Figure 6.1 Global growth in Cu: Changes and Surprise ..40
Figure 6.2: Cu Target Price Forecast...............42
Figure 6.3 : Cu Sputtering Target Revenue Forecast.......... 42
Figure 6.4: Ta Target Price Forecast.................................46
Figure 6.5 : Ta Sputtering Target Revenue Forecast.........47
Figure 6.6: Al Target Price Forecast...................................50
Figure 6.7 : Al Sputtering Target Revenue Forecast.........51
Figure 6.8: Ti Target Price Forecast.....................................54
Figure 6.9 : Ti Sputtering Target Revenue Forecast........55
Figure 6.11 W Target Price Forecast....................................58
Figure 6.10: W Sputtering Target Revenue Forecast.........59
Figure 6.12: Other Sputtering Target Revenue Forecast.....60
Figure 6.13: Sputtering Target Market Share by Application..61
Figure 6.14: Sputtering Target Cumulative Price Forecast....62
Figure 6.15: Sputtering Target Cumulative Revenue Forecast..63
Figure 7.1 Interconnect metallization Roadmap............66
Figure 7.2: Contact Resistance Comparison with Cobalt ......67
Figure 7.3: TSV Middle Process v. Standard TSV Last Process...71
Figure 9.1: 2015Target Supplier Market Share..........................79
Figure 9.2a: 2014 Target Unit Production .................................80
Figure 9.2b: 2019 Target Unit Production ..................................80
Figure A.1: Copper Raw Material Cost Driver...........................118
Figure A.2: Copper Purification/Consolidation Cost Driver......119
Figure A.3: Copper Forming Cost Driver..............................120
Figure A.4: Copper Machining and Bonding Cost....................121
Figure A.5: Ta Raw Material Cost Driver...............................122
Figure A.6: Ta Purification Cost Driver................................123
Figure A.7: Ta Consolidation Cost Driver..........................124
Figure A.8: Ta Forming Cost Driver..................................125
Figure A.9: Ta Machining and Bonding Cost Driver..........126
Figure A.10: Al Raw Material Cost Driver.........................127
Figure A.11: Al Purification/Consolidation Cost Driver........128
Figure A.12: Al Forming Cost Driver.........................129
Figure A.13: Al Machining and Bonding Cost Driver......130
Figure A.14: Ti Raw Material Cost Driver......................131
Figure A.15: Ti Purification/Consolidation Cost Driver....132
Figure A.16: Ti Forming Cost Driver.........................133
Figure A.17: Ti Machining and Bonding Cost Driver.......134
Figure A.18: W Raw Material Cost Driver.......................135
Figure A.19: W Purification Cost Driver.........,............136
Figure A.20: W Consolidation Cost Driver............................137
Figure A.21: W Forming Cost Driver..................................138
Figure A.22: W Machining and Bonding Cost Driver.......139
Figure B.1: Cu Process Summary......................141
Figure B.2: Ta Process Summary......................142
Figure B.3: Al Process Summary......................143
Figure B.4: Ti Process Summary......................144
Figure B.5: W Process Summary......................145
Figure C.1 China Target Market Share%.........147
Figure E.1 5nm BEOL Approaches..........153
Figure E.2 Barrier Limits.................154

Tables

Table 6.1: CU Target Supplier Supply Chain Integration.....38
Table 6.2: Ta Target Supplier Supply Chain Integration.......44
Table 6.3: Al Target Supplier Supply Chain Integration ........48
Table 6.4: Ti Target Supplier Supply Chain Integration.......52
Table 6.5: W Target Supplier Supply Chain Integration ....... 56
Table 7.1: Alternatives to Cu, Resistivity Comparison.......68
Table 10.1: KFMI Target Specifications ...................106
Table 10.2 Grikin Target Specifications....................110
Table A.1: Process to Manufacture High‐Purity Grade
Sputtering Targets....................................116

 

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