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半導体製造用スパッタリングターゲット材市場調査

Sputtering Targets for Semiconductor Manufacturing Applications

 

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Techcet
テクセット社
2017年8月US$8,268
サイトライセンス
113

サマリー

半導体材料専門の米国の調査会社テクセット社の調査レポート「半導体製造用スパッタリングターゲット材市場調査 2016年版 - Critical Materials Report on Sputtering Targets」は、半導体製造用スパッタリングターゲット材市場について、広範な調査・分析を行っています。

主な掲載内容 (目次より抜粋)

  • エグゼクティブサマリー
  • 調査範囲とメソドロジー
  • 半導体市場概要
  • 原材料の経済的概観
    • タンタル
    • アルミニウム
    • チタンスポンジ
    • タングステン
  • サプライチェーンの最新情報
  • サプライチェーン分析と価格
    • タンタル
    • アルミニウム
    • チタン
    • タングステン
    • その他
    • 合計
    • 累計ターゲット材価格予測
  • 技術動向
  • 法規制の最新情報
  • 事業動向と分析
  • サプライヤ情報と会社概要
  • 別表A:主要製造コストの促進要因
  • 別表B:原材料加工概観
  • 別表C:中国市場
  • 別表D:問題解決へのアプローチ

This report provides supply chain information as well as business and technical trends on sputter targets used for semiconductor devices.

 



目次

Table of Contents

1: Executive Summary.................................10
2: Scope & Methodology............................14

3: Semiconductor Market Overview.............18

3.1 Forecast Trends...............................20
3.2 Wafer StartForecast........................21

4: Raw Material Economic Overview........22

4.1 Copper..........................................23
4.2 Tantalum.........................................25
4.3 Aluminum........................................27
4.4 Titanium Sponge.............................29
4.5 Tungsten..........................................31

5: Supply Chain Update................33

5.1 Copper Supply Tightens..................34
5.2 Titanium.......................................35
5.3 Tungsten China Update..................36

6: Supply Chain Analysis & Pricing..........................37

6.1 Copper......................................................44
6.2. Tantalum.................................................46
6.3 Aluminum................................................48
6.4 Titanium...................................................52
6.5 Tungsten...................................................56
6.6 Other........................................................60
6.7 Total..........................................................61
6.8 Cumulative Target Price Forecast..........62

7: Technology Trends..............................................64

7.1 Technology Updates...............................65
7.2 Cobalt Integration...................................66
7.3 Material Challenges.................................67
7.4 Beyond Copper........................................68
7.5 Approaches to Solve Barrier Problems.69
7.6 TSV............................................................70

8: Regulatory Updates..............................................72

8.1 Conflict Minerals: Dodd Frank.................73
8.2 European Union (EU) Commission, Council and Parliament.............77

9: Business Trends and Analysis...................78

9.1 2013 Supplier Market Share ........79
9.2 Target Production........................80
9.3 Competitive Environment - Cu &Al.........................................................82
9.4 Tungsten.......................................83
9.5 Cobalt ...........................................84
9.6 Sn Update.....................................85
9.7 Conflict Minerals .........................86
9.8 Precious Metals ...........................87
9.9 Rare Earths ..................................88
9.10 Summary ....................................89

10: Supplier News and Profiles.....................90

10.1 Honeywell....................................91
10.2 JX Nippon....................................94
10.3 Praxair.........................................97
10.4 Tosoh SMD.................................101
10.2 KFMI...........................................105
10.3 Grikin..........................................108

Appendix A: Key Manufacturing Cost Drivers..114

A.1 Cost Components...................................115
A.2 Key Cost Drivers of Copper Targets.........118
A.3 Key Cost Drivers of Tantalum Targets..122
A.4 Key Cost Drivers of Aluminum Targets....127
A.5 Key Cost Drivers of Titanium Targets.......131
A.6 Key Cost Drivers of Tungsten Targets......135

Appendix B: Raw Materials Process Overview.....140

B.1 Copper: Process Overview...................................................141
B.2 Tantalum: Process Overview.................142
B.3 Aluminum: Process Overview143
B.4 Titanium: Process Overview..................144
A.5 Tungsten: Overview................................145

Appendix C: China Perspective...............................146

C.1 China Perspective....................................147

Appendix D: Approaches to Solve Barrier Problems....148

D.1 Approaches to Solve Barrier Problems.........149

Appendix E: Technology Trends.....................................150

E.1 200mm devices................................................151
300mm devices.....................................................152
Limits of Barrier Thickness..................................154

 

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プレスリリース

[プレスリリース原文]

SPUTTER TARGETS MARKET OVERVIEW AND TRENDS

The Semiconductor Metallization Sputtering Target Market in 2014 was $506 million, a 3.8% increase from 2013 revenues of $488 M.  Revenues for 2015 are expected to reach  ~$540 M growing ~8%.

Tantalum contributes 38% to total target revenues, but represents ~ 15% of target unit shipments .  Both of these shares are expected to grow relative to the total as tantalum volumes and pricing are both expected to climb, per TECHCET's newly released Sputtering Target Market and Supply Chain Report 2015.

May 12, 2015

The recent US Congress seeks to repeal parts of the Dodd-Frank Act of 2010.  This Act directs the US SEC to issue rules requiring certain companies to disclose their use of conflict minerals. The current US republican led Congress has started pick apart the Act in hopes of minimizing the impact and related expense on US businesses.  

 Just on the other side of the Atlantic the EU has been working to configure its own version of the Dodd Frank Act.  For more details, see Techcet's 2015 Targets Report.

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