目次
価格・ご注文について このレポートは、SiC (シリコンカーバイド)半導体の市場動向やサプライチェーンを調査・分析しています。
主な調査内容 (目次から抜粋)
- 製法
- 多様なシリコンカーバイド
- 市場シェア
- 世界市場規模
- 品質と流通
- サプライチェーン
Indirect materials includes quartz, graphite, ceramics, SiC, and other materials that are not part of the device, but are present in the process or the OEM tools. Although silicon is frequently used as a primary direct material, it can also be used as an indirect material for parts and fabware.
Table of Contents
1. HIGHLIGHTS
2. DISCUSSION
SiC Advantages over Quartz
3. MANUFACTURING METHODS
Conversion Process from Graphite
4. DIFFERENT TYPES OF SILICON CARBIDE
4.1 The Quartz Advantage
5. MARKET SHARE
6. WORLDWIDE MARKET SIZE
6.1 SELECTED WORLDWIDE GROWTH MARKETS
7. QUALITY AND DISTRIBUTION
8. SUPPLY CHAIN
8.1 Coors Tec, Inc. and recent acquisition Saint Gobain / Crystar Components (sintered process SiC)
8.2 Toshiba
8.3 Asahi Glass Electronic Materials Inc. (AGEM)
8.4 Entegris, Inc. SiC (Previously Poco Graphite, referred to as “Poco brand”)
8.5 Luch
8.6 Bridgestone
8.7 Dow Chemical Advanced Materials (formerly Rohm and Haas, Inc. CVD SiC)
8.8 SCHUNK
9. CONCLUSION
List of Figures
Figure 1 Typical Sintered Material Process
Figure 2 2010 SiC Market in US $ by Manufacturing Method (chart does not include 1-2% for silicon parts/carriers) Does not include PTV wafers.
Figure 3 SiC Market Share, WW Estimate, 2010 in $ Volume as a % of Total
Figure 4 Estimated WW Market for Semiconductor SiC in $M USD.
Figure 5: Estimated 2010 Quartz vs. SiC Market Split
Figure 6A & B: Future Projected Quartz vs. SiC Market Split 2011
Figure 7 Estimated 2010 SiC Percent of OEM Sales by Application
List of Tables
Table 1 Projected Regional Estimates for indirect Materials Consumption (expressed as a % of WW consumption) for IC Producers
Table 2: Estimated Asia/Pacific Semiconductor SiC Market size (2010 estimates in Millions of US$, Japan not included)