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半導体材料専門の米国の調査会社テクセット社の調査レポート「フォトレジストおよび関連化学品に関する市場調査 2011年版 - Photoresists And Photoresist Ancillaries」は、半導体製造過程で使用するフォトレジストのサプライヤや価格などについての調査結果を提供しています。また関連化学品についても調査を行い、市場シェア、サプライチェーン情報などを提供しています。

主な調査内容 (目次から抜粋)

• フォトレジスト
  1. フォトレジスト概要
  2. 市場概観
  3. 背景
  4. 主要技術動向とタイミング
  5. 技術的背景
  6. フォトレジストサプライヤの比較と差別化
  7. 浸漬液
  8. トップコート材料
  9. 極端紫外線リソグラフィ (EUVL)の問題
  10. 市場規模
  11. 市場シェア
  12. サプライヤ拠点
  13. 製品別米国市場
  14. 価格
  15. サプライヤの提携/合併
  16. 生産能力問題/原材料/サプライチェーン
  17. 技術と今後
• フォトレジスト付属薬品
  1. フォトレジスト付属薬品概要
  2. 化学品のキーポイント
  3. 開発会社
  4. ARC
  5. その他の付属化学品
  6. 市場シェアと市場現況

Table of Contents

1. PHOTORESISTS

1.1 Photoresist Summary
1.2 Overview
1.3 Background
1.4 Key Technical Trends and Timing
1.5 Technical Background
1.6 Photoresist Supplier Competition and Differentiation
1.7 Immersion Fluids
1.8 Topcoat Materials
1.9 The Difficulty with EUVL
1.10 Market Size
1.11 Market Share
1.12 Supplier Base
1.12.1 Dow Chemical Electronic Materials (formerly Rohm & Haas Electronic Materials, Inc. and prior to that, Shipley Company)
1.12.2 JSR
1.12.3 AZ Electronic Materials (formerly Clariant, formerly Azoplate)
1.12.4 Fuji Photo Film (formerly Arch Microelectronic Chemicals)
1.12.5 TOK
1.12.6 Sumitomo/Sumika Electronic Products
1.12.7 Shin-Etsu MicroSi, Inc
1.12.8 Dong Jin
1.13 U.S. Market by Product
1.14 Pricing
1.14.1 Competitive Position
1.14.2 Future Pricing
1.14.3 Phasing Out of Universal Resists
1.15 Alliances / Mergers & Changes to Supply
1.16 Capacity Issues / Raw Material / Supply Chain
1.17 Technology and the Future

2.0 PHOTORESIST ANCILLARIES

2.1 Photoresist Ancillaries Summary
2.2 Key points, Ancillaries
2.2.1 Strippers/Removers
2.3 Developers
2.4 ARC’s
2.5 Other Ancillary Chemicals
2.6 Market Share and Market Status
2.6.1 Strippers/Removers
2.6.1.1 The Good and the Bad
2.6.2 Antireflective Coatings (ARCs)
2.6.3 Developers
2.6.4 Other Ancillary Products (EBR, Primers or Adhesion Promoters, Specialty Solvents)
2.6.5 Capacity Issues/Raw Material/Supply Chain

Figures

Figure 1. Process Flow for Single and Double Patterning
Figure 2. Illustration of the defect 4/5/2009to reduction accomplishments since 2004
Figure 3. Lithography Exposure Tool and Technology Roadmap from ITRS 2006
Figure 4. 1.2 NA Water Immersion Lens
Figure 5. Lithography Tool Cost as a Function of Time
Figure 6. The Increase in Numerical Aperture as a Function of First Year of Manufacture
Figure 7. Average Time Required to Develop a “Mature” Resist & Process
Figure 8. Percent Photoresist Market by Technology Node (in US$)
Figure 9: Schematics of Wet versus Dry Lithography
Figure 10: Three Alternatives to Traditional Topcoats that Allow the Adjustment of the Surface Properties without Affecting the Resist Performance
Figure 11. Schematic of a Prototype EUVL System from ASML
Figure 12. Evolution of the EUVL Source Power from 1996 to 2009
Figure 13. Worldwide Estimated Photoresist Market Size (in US$)
Figure 14: 2010 Estimated WW Resist Market Shares
Figure 15: 2010 Estimated U.S. only Resist Market Shares
Figure 16. Photo Bleachable Contrast Enhancement
Figure 17. Worldwide Market Share, Strippers and Removers Rough Estimate for 2010
Figure 18. World Wide Estimated Market Size, Strippers/Removers
Figure 19. The 2010 Est. WW Estimated Market Shares for All ARCs, By $ Revenue
Figure 20. Total Estimated World Wide Market Size, All ARCs
Figure 21. World Wide Estimated and forecasted Developer Market Size, in US$

Tables

Table 1. International Technology Roadmap for Semiconductors Technology Node Evolution
Table 2 . Results of a Recent Survey of Lithography Experts Regarding the Likely Insertion Date for EUV Lithography.
Table 3. Stoplight chart for Gen . 1 Immersion Lithography’s Technology Challenges as Defined During the 1st Sematech Workshop.
Table 4. Stoplight Chart for the Three Defined Immersion Lithography Generations from the 2010 Sematech Workshop.
Table 5. The k1 Values for Each Technology Node as a Function of Exposure λ
Table 6. Estimated Worldwide Regional Consumption of Photoresist (%Share of $)