Summary
This report covers the market landscape and supply-chain for Precursors used in semiconductor device fabrication. It includes information about key suppliers, issues/trends in the material supply chain, estimates on supplier market share, and forecast for the material segments.
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Provides market and technical trend information on organic and inorganic precursors, addressing CVD, ALD, and SOD applications including ILDs & low-κ dielectrics, hard masks, sidewall spacers and etch stop layers
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Provides focused information for supply-chain managers, process integration and R&D directors, as well as business development and financial analysts
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Covers information about key dielectric precursor suppliers, issues/trends in the material supply chain, estimates on supplier market share, and forecast for the electronics material segments
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Includes 3 Quarterly Updates, with updates on market trends and forecasts from the analyst
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Table of Contents
TECHCET-CMR-CVDALDSODDIELECTRICS-06232025VB
1 EXECUTIVE SUMMARY
1.1 PRECURSORS MARKET TRENDS
1.2 MARKET TRENDS IMPACTING 2025 OUTLOOK
1.3 DIELECTRIC PRECURSORS 5-YEAR REVENUE FORECAST BY SEGMENT
1.4 PRECURSOR SEGMENT TRENDS
1.5 TECHNOLOGY TRENDS
1.6 DIELECTRIC PRECURSORS PRODUCTION CAPACITY OF TOP SUPPLIERS
1.7 CURRENT QUARTER TOP-5 PRECURSOR SUPPLIERS' ACTIVITIES & REPORTED REVENUES
1.8 EHS, TRADE, AND/OR LOGISTICS ISSUES/CONCERNS
1.9 ANALYST ASSESSMENT OF METAL, HIGH-K & DIELECTRIC PRECURSORS MATERIALS
2 SCOPE, PURPOSE AND METHODOLOGY
2.1 SCOPE, PURPOSE & METHODOLOGY
2.2 OVERVIEW OF OTHER TECHCET CMR(TM) OFFERINGS
3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK
3.1 WORLDWIDE ECONOMY AND OUTLOOK
3.2 WORLDWIDE ECONOMY AND OVERVIEW
3.2.1 WORLDWIDE ECONOMY AND SEMICONDUCTOR MARKET OVERVIEW
3.2.2 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
3.2.3 SEMICONDUCTOR SALES GROWTH
3.2.4 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
3.3 CHIPS SALES BY ELECTRONIC GOODS SEGMENT
3.3.1 FACTORS IMPACTING ELECTRONIC SYSTEMS OUTLOOK
3.3.2 PC OUTLOOK
3.3.3 SMARTPHONE OUTLOOK
3.3.4 AUTOMOTIVE INDUSTRY OUTLOOK
3.3.5 SERVERS / IT MARKET
3.4 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
3.4.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS
3.4.2 PUBLIC FUNDS STIMULATING PRIVATE INVESTMENTS IN EXPANSION ACROSS THE GLOBE
3.4.3 SEMICONDUCTOR SUPPLY CHAIN ANNOUNCED EXPANSIONS IN THE US
3.4.4 EQUIPMENT SPENDING TRENDS
3.4.5 TECHNOLOGY ROADMAPS
3.5 POLICY & TRADE TRENDS AND IMPACT
3.6 SEMICONDUCTOR PRODUCTION (WAFER STARTS*) AND MATERIALS OVERVIEW
3.6.1 TECHCET WAFER STARTS FORECAST THROUGH 2029
3.6.2 TECHCET ELECTRONIC MATERIALS MARKET FORECAST THROUGH 2028
4 PRECURSOR MARKETTRENDS
4.1 PRECURSORS MARKET TRENDS
4.1.1 PRECURSOR MARKET OUTLOOK
4.1.2 2023 PRECURSOR MARKET LEADING INTO 2024
4.2 MARKET DRIVERS FROM LOGIC DEVICE GROWTH
4.2.1 LOGIC MARKET OUTLOOK
4.3 MARKET DRIVERS FROM DRAM DEVICE GROWTH
4.3.1 DRAM MARKET OUTLOOK
4.4 MARKET DRIVERS FROM 3DNAND DEVICE GROWTH
4.4.1 3DNAND MARKET OUTLOOK
4.5 MARKET STATISTICS - DIELECTRIC PRECURSORS 5-YEAR REVENUE FORECAST BY SEGMENT
4.5.1 DIELECTRIC PRECURSORS SUPPLIER MARKET SHARES
4.5.2 DIELECTRIC PRECURSOR REVENUE BY REGION
4.6 PRECURSOR PRODUCTION CAPACITY EXPANSIONS
4.6.1 INVESTMENT ANNOUNCEMENTS OVERVIEW
4.6.2 INVESTMENT ACTIVITY ADDITIONAL COMMENTS
4.7 PRICING TRENDS
4.8 TECHNOLOGY TRENDS/TECHNICAL DRIVERS - OUTLINE
4.8.1 DRAM TECHNOLOGY TRENDS
4.8.2 3DNAND TECHNOLOGY TRENDS
4.8.3 LOGIC TECHNOLOGY TRENDS
4.8.4 LOGIC TECHNOLOGY ROADMAP
4.9 DIELECTRIC PRECURSOR TECHNOLOGY TRENDS AND DEVELOPMENTS
4.9.1 DIELECTRIC PRECURSOR GENERAL TECHNOLOGY OVERVIEW
4.9.2 RECENT TRENDS ADVANCES IN DIELECTRIC ALD SIO2 AND SIN
4.9.3 RECENT TRENDS IN BIS(DIISOPROPYLAMINO)DISILANE (BDIPADS) FOR LOW TEMPERATURE ALD OF SIO2
4.9.4 PATENT FILING FOR BDIPADS
4.9.5 BDIPADS, TIER 2 SUPPLIERS
4.9.6 PATENT FILING FOR DIODOSILANE
4.9.7 PATENT FILING FOR DIODOSILANE – ASM, TOPOLOGICAL SELECTIVE DEPOSITION
4.9.8 PATENT FILING FOR DIODOSILANE – ASM, TOPOLOGICAL & MATERIAL SELECTIVE DEPOSITION 84
4.9.9 RECENT PROGRESS IN SPIN ON DIELECTRICS – INDUSTRY TREND
4.9.10 RECENT PROGRESS IN SPIN ON DIELECTRICS – DRAM
4.10 IP FILING CVD AND ALD SINCE 2001
4.11 REGIONAL CONSIDERATIONS – IP FILING IN CVD AND ALD
4.11.1 REGIONAL ASPECTS AND DRIVERS
4.12 EHS AND TRADE/LOGISTIC ISSUES
4.12.1 EHS ISSUES
4.12.2 TRADE/LOGISTICS ISSUES
4.13 ANALYST ASSESSMENT OF PRECURSOR MARKET TRENDS
5 SUPPLY-SIDE MARKET ACTIVITY
5.1 LEADING SUPPLIERS - ACTIVITIES & REPORTED REVENUES
5.1.1 CURRENT QUARTER ACTIVITY – AIR LIQUIDE Q1/2025
5.1.2 CURRENT QUARTER ACTIVITY – MERCK (EMD) Q1/2025
5.1.3 CURRENT QUARTER ACTIVITY – ADEKA Q4/2024
5.1.4 CURRENT QUARTER ACTIVITY – DUPONT Q1/2025
5.2 DIVESTITURES, M&A AND PARTNERSHIPS
5.2.1 DIVESTITURES, M&A AND PARTNERSHIPS - QNITY
5.2.2 DIVESTITURES, M&A AND PARTNERSHIPS - HONEYWELL
5.2.3 DIVESTITURES, M&A AND PARTNERSHIPS - KOREAN SUPPLIERS
5.2.4 DIVESTITURES, M&A AND PARTNERSHIPS - JSR
5.2.5 DIVESTITURES, M&A AND PARTNERSHIPS - NAGASE
5.3 PLANT CLOSURES
5.4 NEW ENTRANTS – NONE TO REPORT
5.5 SUPPLIERS OR PARTS/PRODUCT LINES THAT ARE AT RISK OF DISCONTINUATIONS - NONE
5.6 TECHCET ANALYST ASSESSMENT OF PRECURSOR SUPPLIERS
6 SUB-TIER SUPPLY CHAIN, MATERIAL
6.1 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW
6.2 SUB-TIER SUPPLY CHAIN: KEY MANUFACTURING SOURCES OF PRECURSORS
6.3 ALD/CVD EQUIPMENT M&A OF THE OEM SUB-TIER
6.4 INDUSTRIAL VS. SEMICONDUCTOR-GRADE - TIER-1 VS. SUB-TIER QUALITY
6.5 SUB-TIER SUPPLY CHAIN: SUB-TIER PRECURSOR MARKET RANKING
6.5.1 RAW MATERIALS CAPACITY EXPANSIONS
6.6 SHIFT TO LOCAL INVESTMENT IN THE SUB-TIER SUPPLY-CHAIN
6.7 SUB-TIER SUPPLY-CHAIN EHS AND LOGISTICS ISSUES
6.7.1 SUB-TIER SUPPLY-CHAIN EHS AND LOGISTICS ISSUES – LISTED MATERIAL TYPE
6.8 SUB-TIER SUPPLY-CHAIN PLANT CLOSURES – NONE TO DATE
7 SUPPLIER PROFILES
ADEKA CORPORATION
AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER)
AZMAX CO., LTD
CITY CHEMICAL LLC
DNF CO., LTD
AND MORE …
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List of Tables/Graphs
FIGURES
FIGURE 1.1: DIELECTRIC PRECURSORS REVENUE FORECAST BY SEGMENT (US $M'S)
FIGURE 1.2: WW MARKET SHARE - DIELECTRIC PRECURSORS 2024 (U$ 815 M)
FIGURE 1.3: TOP-5 PUBLIC PRECURSOR MAKERS' QUARTERLY COMBINED SALES
FIGURE 3.1: HISTORICAL AND FORECASTED GDP GROWTH (2000 – 2029)
FIGURE 3.2: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2024)
FIGURE 3.3: WORLDWIDE SEMICONDUCTOR SALES ($B)
FIGURE 3.4: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSI) MOMENTUM TRACKER
FIGURE 3.5: 2024 SEMICONDUCTOR CHIP APPLICATIONS
FIGURE 3.6: SMARTPHONE SHIPMENTS, WW ESTIMATES
FIGURE 3.7: GLOBAL LIGHT VEHICLE PRODUCTION FORECAST (IN MILLIONS OF UNITS)
FIGURE 3.8: US EV RETAIL SHARE FORECAST
FIGURE 3.9: AUTOMOTIVE SEMICONDUCTOR REVENUES HISTORY AND FORECAST (ESTIMATED, B$'S USD)
FIGURE 3.10: AI VALUE FORECAST ($B'S USD)
FIGURE 3.11: SCALE OF TODAY'S AI-CENTRIC DATA CENTERS
FIGURE 3.12: TSMC PHOENIX FAB INVESTMENT TO EXCEED US $65B
FIGURE 3.13: ESTIMATED GLOBAL FAB INVESTMENT 2024-2029 ($858.6B)
FIGURE 3.14: ANNOUNCED PUBLIC STIMULUS AND RESPECTIVE SEMICONDUCTOR CHIP MANUFACTURING REGIONS
FIGURE 3.15: SEMICONDUCTOR SUPPLY CHAIN EXPANSIONS WITHIN THE US
FIGURE 3.16: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M)
FIGURE 3.17: TSMC LOGIC ROADMAP BY NODE
FIGURE 3.18: TECHCET WAFER START FORECAST BY NODE SEGMENTS MILLIONS OF 200MM EQUIVALENTS PER YEAR
FIGURE 3.19: TECHCET WORLDWIDE ELECTRONIC MATERIALS FORECAST ($M USD)
FIGURE 4.1: LOGIC WAFER STARTS, SUB 65 NM
FIGURE 4.2: INCREASED ALD AND EPI SAM WITH MOVE TO GAA
FIGURE 4.3: LOGIC WAFER STARTS, GAA-FET NODES
FIGURE 4.4: DRAM WAFER STARTS
FIGURE 4.5: HBM STACKING CONFIGURATIONS
FIGURE 4.6: NAND WAFER STARTS
FIGURE 4.7: LAM RESEARCH'S ALTUS(R) HALO
FIGURE 4.8: DIELECTRIC PRECURSORS REVENUE FORECAST BY SEGMENT (US$ M'S)
FIGURE 4.9: WW MARKET SHARE - DIELECTRIC PRECURSORS 2024 (U$ 815 M) 62
FIGURE 4.10: DIELECTRIC PRECURSOR REVENUE BY REGION
FIGURE 4.11: ADVANCED DEVICE TECHNOLOGY DRIVE DEMAND FOR MORE ALD PRECURSORS
FIGURE 4.12: ADVANCED DEVICE TECHNOLOGY ROADMAP – HVM DRAM, INCLUDING RISK STARTS
FIGURE 4.13: ADVANCED DEVICE TECHNOLOGY ROADMAP OVERVIEW – HVM 3D NAND, INCLUDING RISK STARTS
FIGURE 4.14: ADVANCED DEVICE TECHNOLOGY ROADMAP OVERVIEW – HVM LOGIC/FOUNDRY, INCLUDING RISK STARTS
FIGURE 4.15: SEMS OF LOGIC GATE STRUCTURES 2009 TO BEYOND 2025
FIGURE 4.16: ADVANCED 3DNAND STAIRSTEPS
FIGURE 4.17: LOW TEMPERATURE GROWTH OF HIGH QUALITY SIO2 FILMS
FIGURE 4.18: PATENT FAMILIES AND APPLICATIONS FOR BDIPADS
FIGURE 4.19: BDIPADS PATENT CITATION VELOCITY
FIGURE 4.20: PATENT FAMILIES AND APPLICATIONS FOR DIS
FIGURE 4.21: DIELECTRIC SELECTIVE DEPOSITION SEQUENCE BY ASM
FIGURE 4.22: ASD OF DIELECTRIC ON METAL (DOM)
FIGURE 4.23: THE INDUSTRY TREND FOR SPIN-ON DIELECTRICS (SOD)
FIGURE 4.24: THE APPLICATION OF SOD IN VARIOUS REGIONS OF A DRAM STRUCTURES
FIGURE 4.25: PHPS (PERHYDRO-POLYSILAZANE)
FIGURE 4.26: PHPS (PERHYDRO-POLYSILAZANE)
FIGURE 4.27: CVD AND ALD PATENT FILING SINCE 2001 BY COMPANY
FIGURE 4.28: NUMBER OF CVD AND ALD PATENT FILING SINCE 2001
FIGURE 4.29: MAPPING LOCATION OF CVD AND ALD PATENT FILING SINCE 2001
FIGURE 4.30: ENVIRONMENTAL FOOTPRINT OF MOORES LAW - CO2 EMISSIONS (ENERGY CONSUMPTION RAMP OF LEADING EDGE NODES)
FIGURE 4.31: IMPACT OF EUV - ELECTRICAL ENERGY CONSUMPTION
FIGURE 4.32: INTEL AND TSMC SUSTAINABILITY GOALS
FIGURE 5.1: TOP-5 PUBLIC PRECURSOR MAKERS' QUARTERLY COMBINED SALES
FIGURE 5.2: AIR LIQUIDE CURRENT QUARTER FINANCIALS
FIGURE 5.3: MERCK CURRENT QUARTER FINANCIALS
FIGURE 5.4: ADEKA CURRENT QUARTER FINANCIALS
FIGURE 5.5: DUPONT CURRENT QUARTER FINANCIALS
FIGURE 6.1: CHIP FAB MANUFACTURING CAPACITY OF ASIA VS. US 1990-2023
FIGURE 6.2: REE REFINING PROCESS FLOW (I.E., COBALT)
TABLES
TABLE 1.1: REVENUE FORECASTS
TABLE 1.2: ESTIMATED MARKET SHARE BY SUPPLIER
TABLE 3.1: GLOBAL GDP AND SEMICONDUCTOR REVENUES
TABLE 3.2: INITIALLY ANNOUNCED* US RECIPROCAL TARIFF SCHEDULE
TABLE 3.3: WORLDWIDE PC FORECAST BY SEGMENT
TABLE 3.4: IT MARKET SPENDING FORECAST, 2025
TABLE 4.1: REVENUE FORECASTS
TABLE 4.2: ESTIMATED MARKET SHARE BY SUPPLIER – DIELECTRIC PRECURSORS
TABLE 4.3: OVERVIEW OF ANNOUNCED 2024/2025 PRECURSOR SUPPLIER INVESTMENTS
TABLE 4.4: DIELECTRIC FILMS AND PROCESS APPLICATIONS
TABLE 4.5: BDIPADS SUPPLIERS TIER 2, OVERVIEW
TABLE 4.6: DESCRIPTIONS OF PRECURSOR MARKET DYNAMICS BY REGION
TABLE 4.7: ESG REPORTING BY INDUSTRY LEADERS IN SEMICONDUCTOR MANUFACTURING
TABLE 6.1: SUB-TIER PRECURSOR DEMAND SEMICONDUCTOR VS. ELECTRONIC VS. INDUSTRIAL
TABLE 6.2: 2024 EXCLUSIVE SUB-TIER PRECURSOR SUPPLIERS RANKING OF THE TOP 3
Press Release
Oct 1, 2025 | Press Release
ALD/CVD Materials Market Bright Outlook
San Diego, CA,
TECHCET, the electronic materials advisory firm providing semiconductor materials supply chain information, reported strong momentum in the ALD/CVD dielectric and metallization precursors. Revenues for dielectric precursors rebounded in 2024 with an 18% increase, while metallization precursors are expected to post 11% YoY growth from 2025 to 2026. Looking longer term, 2024–2029 CAGRs are forecast at 9% for dielectrics and 7% for metals, according to TECHCET’s 2025-2026 Critical Materials Report(TM) on ALD/CVD Precursors.
Hight K and Metal Precursors Revenue Forecast 2024-2029
*Each color represents a different material segment
The market is being propelled by increased demand for Low-K and high aspect ratio (AR) dielectrics to enable scaling in advanced logic and memory, with the DIPAS/BDEAS segment expected to lead dielectric growth. At the same time, alternative metals such as molybdenum (Mo) are gaining traction for backside power delivery and 3D NAND structures, alongside rising use of Zr, Hf, Co, and W. New opportunities are also emerging for Mo and Ru in advanced metallization, with Tier 1 suppliers and OEMs already reporting Mo ramping for leading-edge logic and 3D NAND metal gates. Together, these trends highlight the growing importance of dielectric and metal precursors in enabling next-generation device performance and semiconductor scaling.
