目次
価格・ご注文について 半導体材料専門の米国の調査会社テクセット社の調査レポート「化学機械研磨(CMP)消耗品に関する市場調査 2011年版 - CMP CONSUMABLES 2011」は、CMP消耗品の市場動向や技術を調査し、関連製品のサプライヤ情報を掲載しています。
主な調査内容 (目次から抜粋)
- 半導体の進化とCMPへ与える影響
- CMP業界ロードマップの技術促進要因
- CMP消耗品ビジネス環境の最新情報
- 関連サプライヤ情報
- CMPスラリーと研磨剤
- CMP研磨パッド
- CMP後のクリーニング
- パッドコンディショナー
- PVAブラシ
- CMPフィルター
- CMP装置
- リテーニングリングとキャリアパーツ
- その他の関連製品
- 大学調査
- CMPのプロセスフロー
Table of Contents
EXECUTIVE SUMMARY
1 SEMICONDUCTOR EVOLUTION AND ITS IMPLICATIONS FOR CMP
1.1 HISTORY OF CMP USE IN SEMICONDUCTOR FABRICATION
1.2 CMP TECHNOLOGY: 2011 TO 2016
2 TECHNOLOGY DRIVERS FOR THE CMP INDUSTRY ROADMAP
2.1 CMP: SEMICONDUCTOR DRIVERS IN BUSINESS AND TECHNOLOGY
2.2 NON-SEMICONDUCTOR DRIVERS
3 CMP CONSUMABLES BUSINESS ENVIRONMENT UPDATE
3.1 SLURRY BUSINESS ENVIRONMENT
3.1.1 ILD
3.1.2 Selective STI
3.1.3 Tungsten
3.1.4 Copper
3.1.5 Polysilicon
3.1.6 Emerging Applications
3.1.7 Abrasive Supplier Business Environment
3.1.8 Slurry Supply Chain Threats
3.2 PAD BUSINESS ENVIRONMENT
3.2.1 Pad Design
3.2.2 Pad Patents
3.2.3 Subpads
3.2.4 Wafer Carrier Films
3.2.5 Pad Supply Chain Threats
3.3 BUSINESS ENVIRONMENT FOR OTHER CMP SEGMENTS
3.3.1 Post-CMP Cleaning Business Environment
3.3.1.1 ILD
3.3.1.2 STI
3.3.1.3 Tungsten
3.3.1.4 Copper
3.3.1.5 PCMP Supply Chain Threats
3.3.2 Pad Conditioners
3.3.3 PVA Brushes
3.3.4 Slurry Filters
3.3.5 CMP Equipment
3.3.6 Metrology
3.3.7 Services
3.3.7.1 NCCAVS CMPUG
3.3.7.2 SemiNeedle
3.3.7.3 USPTO
3.4 THREATS TO THE CMP CONSUMABLE BUSINESS
4 CMP SLURRY & ABRASIVE SUPPLIERS
4.1 ADCON LAB, INC.
4.2 ANJI MICROELECTRONICS, INC.
4.3 ASAHI GLASS COMPANY, LTD
4.4 AZ ELECTRONIC MATERIALS
4.5 BAIKOWSKI
4.6 BASF SE
4.7 CABOT CORPORATION
4.8 CABOT MICROELECTRONICS CORPORATION
4.9 CHEIL INDUSTRIES INC
4.10 DONGJIN SEMICHEM COMPANY, LTD.
4.11 DOW ELECTRONIC MATERIALS
4.12 DUPONT AIR PRODUCTS NANOMATERIALS, LLC
4.13 EKA CHEMICAL
4.14 ELKEM AS
4.15 EMINESS TECHNOLOGIES, INC.
4.16 EVONIK INDUSTRIES AG
4.17 FERRO
4.18 FUJIFILM PLANAR SOLUTIONS, LLC
4.19 FUJIMI INCORPORATED
4.20 FUSO CHEMICAL COMPANY, LTD.
4.21 W.R. GRACE & COMPANY
4.22 HITACHI CHEMICAL CO., LTD.
4.23 INNOVATIVE ORGANICS
4.24 INTERSURFACE DYNAMICS
4.25 JGC CATALYSTS & CHEMICALS
4.26 JSR MICRO, INC.
4.27 KC TECH COMPANY, LTD.
4.28 KEMESYS
4.29 MITSUI MINING & SMELTING COMPANY, LTD.
4.30 NALCO COMPANY
4.31 NANOPHASE TECHNOLOGIES CORPORATION
4.32 NISSAN CHEMICAL INDUSTRIES, LTD.
4.33 NITTA-HAAS INCORPORATED
4.34 PRECISION COLLOIDS, LLC
4.35 RHODIA SA
4.36 SHOWA DENKO KK
4.37 SILBOND CORPORATION
4.38 SAINT-GOBAIN SA
4.39 TECHNO SEMICHEM COMPANY, LTD
4.40 UK ABRASIVES, INC
4.41 UMICORE GROUP
4.42 UNIVERSAL PHOTONICS
4.43 UWIZ TECHNOLOGY
4.44 WACKER CHEMIE AG
4.45 OTHERS
5 CMP PAD SUPPLIERS
5.1 3M
5.2 CABOT MICROELECTRONICS CORPORATION
5.3 DOW ELECTRONIC MATERIALS
5.4 EMINESS TECHNOLOGIES INC.
5.5 FUJIBO HOLDINGS, INC.
5.6 INNOPAD, INC
5.7 IVT
5.8 JSR MICRO, INC.
5.9 KPX CHEMICAL CO., LTD.
5.10 NEXPLANAR CORPORATION
5.11 NIHON MICRO COATING COMPANY, LTD.
5.12 NITTA-HAAS INCORPORATED
5.13 PLANAR LABS CORP.
5.14 PRAXAIR TECHNOLOGY, INC.
5.15 ROGERS CORPORATION
5.16 SK CHEMICALS CO., LTD
5.17 SPARTAN FELT COMPANY
5.18 THOMAS WEST INCORPORATED
5.19 TORAY INDUSTRIES, INC.
5.20 TOYO TIRE & RUBBER CO., LTD.
5.21 TOYOBO COMPANY, LTD
5.22 OTHERS
6 POST-CMP CLEANING SUPPLIERS
6.1 AIR PRODUCTS AND CHEMICALS, INC.
6.2 ANJI MICROELECTRONICS, INC.
6.3 ATMI INC.
6.4 BASF
6.5 CABOT MICROELECTRONICS CORP
6.6 DUPONT EKC TECHNOLOGY
6.7 J.T. BAKER
6.8 KANTO CHEMICAL COMPANY, INC
6.9 MITSUBISHI CHEMICAL CORPORATION
6.10 SHANGHAI SINYANG SEMICONDUCTOR MATERIALS CO., LTD.
6.11 TECHNIC FRANCE
6.12 WAKO PURE CHEMICAL INDUSTRIES, LTD.
6.13 OTHERS
7 PAD CONDITIONER SUPPLIERS
7.1 3M
7.2 ABRASIVE TECHNOLOGY, INC
7.3 ADVANCED DIAMOND SOLUTIONS, INC.
7.4 ADVANCED DIAMOND TECHNOLOGIES, INC
7.5 ASAHI DIAMOND INDUSTRIAL CO., LTD.
7.6 EHWA DIAMOND INDUSTRIAL CO., LTD.
7.7 KINIK COMPANY LTD
7.8 MITSUBISHI MATERIALS CORPORATION
7.9 MORGAN TECHNICAL CERAMICS
7.10 NORITAKE COMPANY, LTD.
7.11 SAESOL DIAMOND INDUSTRIAL CO., LTD
7.12 SHINHAN DIAMOND INDUSTRIAL CO., LTD.
7.13 SAINT-GOBAIN SA
7.14 TBW INDUSTRIES, INC.
7.15 OTHERS
8 PVA BRUSH SUPPLIERS
8.1 AION CO., LTD
8.2 BRUSHTEK
8.3 ENTEGRIS, INC.
8.4 ITW RIPPEY
8.5 OTHERS
9 CMP FILTER SUPPLIERS
9.1 3M
9.2 ENTEGRIS, INC.
9.3 GRAVER TECHNOLOGIES
9.4 MEISSNER FILTRATION PRODUCTS, INC
9.5 PALL CORPORATION
9.6 PARKER HANNIFIN CORPORATION
9.7 ROKI TECHNO CO., LTD
9.8 WHATMAN PLC
9.9 OTHERS
10 CMP EQUIPMENT SUPPLIERS
10.1 ACCRETECH
10.2 ALPSITEC SARL
10.3 APPLIED MATERIALS, INC
10.4 DAINIPPON SCREEN MFG. CO., LTD.
10.5 EBARA CORPORATION
10.6 G&P TECHNOLOGIES
10.7 KC TECH COMPANY, LTD.
10.8 NOVELLUS SYSTEMS, INC.
10.9 SOLID STATE EQUIPMENT CORPORATION
10.10 STRASBAUGH
10.11 OTHERS
11 RETAINING RINGS & CARRIER PARTS SUPPLIERS
11.1 DUPONT
11.2 ENTEGRIS, INC.
11.3 NIPPON POLYPENCO LTD.
11.4 QUADRANT AG
11.5 SEMICONDUCTOR PRODUCTS MANUFACTURING INCORPORATED
11.6 SAINT-GOBAIN PLASTICS
11.7 SEMPLASTICS, LLC
11.8 VICTREX PLC
11.9 OTHERS
12 OTHER SUPPORT PRODUCT SUPPLIERS
12.1 ADCON LAB, INC.
12.2 ADVANTIV TECHNOLOGIES, INC.
12.3 AIR LIQUIDE SA
12.4 ARACA, INC.
12.5 ATMI INC.
12.6 AXUS TECHNOLOGY
12.7 CMP CONSULTING
12.8 DIVIND LLC
12.9 ECO PHYSICS AG
12.10 EDWARDS LIMITED
12.11 ENTEGRIS, INC.
12.12 ENTREPIX, INC.
12.13 FATH GMBH
12.14 JETALON SOLUTIONS, INC.
12.15 KIEFER TECH CO. LTD
12.16 KINETIC SYSTEMS, INC
12.17 LAREDO TECHNOLOGIES
12.18 LEVITRONIX, LLC
12.19 MALEMA ENGINEERING CORPORATION
12.20 NETMOTION, INC
12.21 SAINT-GOBAIN
12.22 SILYB WAFER SERVICES, INC.
12.23 SKW ASSOCIATES, INC.
12.24 SVTC TECHNOLOGIES LLC
12.25 OTHERS
13 UNIVERSITY RESEARCH
13.1 ALBANY NANOTECH
13.2 CARNEGIE MELLON
13.3 CLARKSON UNIVERSITY
13.4 COLORADO SCHOOL OF MINES
13.5 DRESDEN UNIVERSITY OF TECHNOLOGY
13.6 FRAUNHOFER INSTITUTE
13.7 GEORGIA INSTITUTE OF TECHNOLOGY
13.8 HANYANG UNIVERSITY
13.9 IMEC
13.10 IOWA STATE UNIVERSITY
13.11 KYUSHU UNIVERSITY
13.12 MASSACHUSETTS INSTITUTE OF TECHNOLOGY
13.13 NORTHEASTERN UNIVERSITY
13.14 PUSAN NATIONAL UNIVERSITY
13.15 RENSSELAER POLYTECHNIC INSTITUTE
13.16 ROCHESTER INSTITUTE OF TECHNOLOGY
13.17 SUNGKYUNKWAN UNIVERSITY
13.18 TOHOKU UNIVERSITY
13.19 TUFTS UNIVERSITY
13.20 UNIVERSITY OF ALBERTA
13.21 UNIVERSITY OF ARIZONA
13.22 UNIVERSITY OF CALIFORNIA - BERKELEY
13.23 UNIVERSITY OF FLORIDA
13.24 UNIVERSITY OF SOUTH FLORIDA
14 CMP PROCESS FLOWS
14.1 FEOL
14.1.1 STI
14.1.2 PRE-METAL DIELECTRIC HKMG
14.1.3 POLY OPEN POLISH FOR METAL GATES
14.1.4 ALUMINUM FOR METAL GATES
14.1.5 TUNGSTEN CONTACTS
14.1.6 POLY CONTACTS
14.2 BEOL
14.2.1 COPPER
14.2.2 BARRIER
14.2.3 TUNGSTEN
14.2.4 ILD
14.3 THROUGH SILICON VIAS
14.3.1 TSV FRONT SIDE
14.3.2 TSV BACK SIDE
Figures
Figure 2. Transition to Copper Contact Plug
Figure 2.1a. Annual Wafer Starts (200mm Equivalent)
Figure 2.1b. Global Semiconductor Sales Revenue ($M)
Figure 2.1c. Introduction of New CMP Steps in Advanced Nodes
Figure 3a. Total Pads & Slurry Consumables Revenue Forecast by Process Type
Figure 3b. Total Pads & Slurry Consumables Revenue Forecast
Figure 3c. CMP Process Demand Forecast by Process Type
Figure 3d. Typical CMP Costs
Figure 3.1a. Slurry Revenue Forecast by Process Type
Figure 3.1b. Point of Use Slurry Volume Forecast by Process Type
Figure 3.1c. Overall Slurry Revenue Market Share by Process
Figure 3.2a. Pad Revenue Forecast by Process Type
Figure 3.2b. Pad Revenue for 300mm as a Percent of Total by Process Type
Figure 3.2c. Pad Usage (Number of Pads) Forecast by Process Type
Figure 3.2d. Pad Usage for 300mm as a Percent of Total Pads Used by Process Type Tables
Table 1. Process Learning and Process Options Reflected in the Changes Over More Than 15 Years of CMP Technology
Table 2a. FEP14: STI Process Requirements (2010 Interconnect ITRS)
Table 2b. INTC15: Planarization Applications and Equipment Potential Solutions (2010 Interconnect ITRS)
Table 2c. Air Gap Dielectric
Table 2d. Barrier Resistivity
Table 2e. INTC11: Barrier Potential Solutions (2009 Interconnect ITRS)
Table 2f. INTC13: Conductor Potential Solutions (2009 Interconnect ITRS)
Table 2g. INTC16: Planarization Consumables Potential Solutions (2010 Interconnect ITRS)
Table 2h. INTC9: Interconnect Surface Preparation Potential Solutions (2009 Interconnect ITRS)
Table 3.4. Competitive Technology Threats to Conventional CMP
Table 4. CMP Slurry and Abrasive Suppliers
Table 5. Polishing Pad Suppliers
Table 6. Post-CMP Cleaning Chemistry Suppliers
Table 7. CMP Pad Conditioner Suppliers
Table 8. PVA Brush Suppliers
Table 9. CMP Slurry Filter Suppliers
Table 10. CMP Equipment Suppliers
Table 11. Retaining Rings and Miscellaneous Carrier Parts Suppliers
Table 12. Other CMP Support Product Suppliers
Table 13. CMP-related University Research Institutions
