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ダイボンダ用機器市場:タイプ毎、技術毎、サプライチェーン参加者毎、機器毎、用途毎、地域毎 - 2024年までの世界市場予測

Die Bonder Equipment Market by Type (Semiautomatic Die Bonder, Fully Automatic Die Bonder), Bonding Technique, Supply Chain Participant (IDM Firms, OSAT Companies), Device, Application (Consumer Electronics), and Region - Global Forecast to 2024

 

出版社 出版年月電子版価格 ページ数図表数
MarketsandMarkets
マーケッツアンドマーケッツ
2019年11月US$4,950
シングルユーザライセンス
168 171

サマリー

幅広い市場に関する調査レポートを出版しているマーケッツアンドマーケッツ(MarketsandMarkets)のダイボンダ用機器市場に関する調査レポートです。

“Die bonder equipment market is projected to grow at CAGR of 3.5% from 2019 to 2024”

The global die bonder equipment market size is projected to grow from USD 820 million in 2019 to USD 972 million by 2024, at a CAGR of 3.5% from 2019 to 2024. Key factors fueling the growth of this market include the growing demand for miniature electronic components and the increasing adoption of stacked die technology in IoT devices.

“Market for fully automatic die bonders  is projected to grow at highest CAGR during forecast period”

Among different types, fully automatic die bonders are projected to lead the market from 2019 to 2024. Fully automatic die bonders can work on different modules, such as wire bonding, wedge bonding, flip chip bonding, and die bonding. Fully automatic die bonders are required for the assembly and packaging of the high volume of consumer products. In addition, fully automatic die bonder equipment provide micron-level placement accuracy, ranging from ± 1.5μm to ± 0.5μm, necessary for the fabrication of electronic components used in medical devices, automobile systems, and consumer electronics, which is expected to propel the market growth in the near future.

“ Market for eutectic bonding technique is projected to grow at highest CAGR during 2019-2024”

Among bonding techniques, the eutectic bonding technique is projected to witness the highest CAGR in the die bonder equipment market from 2019 to 2024. This technique requires higher operating temperature during the bonding process, and the bond created is not only robust but can also remain intact even in harsh environments. Semiconductor components fabricated using the eutectic bonding technique are suitable for products that are used in automotive, telecommunications, and industrial applications due to their robustness, which is expected to contribute significantly to the growth of the market for the eutectic bonding technique in the near future.

“Consumer electronics application accounted for largest market share in 2018”

Among applications, the consumer electronics segment is projected to lead the die bonder equipment market from 2019 to 2024. The largest market size is due to the high demand for miniaturized consumer electronic products such as smartphones, wearables, and white goods that provide advantages such as compactness and durability. These miniaturized products make use of several devices, such as optoelectronics, MEMS, and MOEMS. All these devices require die bonding equipment in the assembly process of these components.

 “Asia Pacific (APAC) is expected to hold largest share of die bonder equipment market in 2024”

APAC is expected to hold the largest share of the die bonder equipment industry in 2024. More than 60% of OSAT players present across the world have their headquarters in the APAC region. These OSAT companies use die bonding equipment in the semiconductor fabrication process. Additionally, an increasing number of IDMs in the region is expected to boost the die bonder equipment market growth in the near future. Similarly, the mass production of electronic products, such as smartphones, wearables, and white goods, in China and Taiwan is also expected to accelerate market growth in APAC.

Breakdown of profiles of primary participants:

- By Company: Tier 1 = 45%, Tier 2 = 35%, and Tier 3 = 20%
- By Designation: C-level Executives = 35%, Managers = 43%, and Others (Managers, Scientists, and University Researchers) = 22%
- By Region: APAC = 38%, Americas = 37%, and EMEA = 25%

Major players profiled in this report:

- BE Semiconductor Industries N.V.
- ASM Pacific Technology Ltd.
- Kulicke & Soffa
- Mycronic AB
- Palomar Technologies, Inc.
- West-Bond, Inc.
- MicroAssembly Technologies, Ltd.
- Finetech GmbH & Co. KG
- Dr. Tresky AG
- Smart Equipment Technology

Research coverage

This report offers detailed insights into the die bonder equipment market based on type, bonding technique, supply chain participant, device, application, and region. Based on type, the die bonder equipment industry has been segmented into manual, semiautomatic, and fully automatic die bonders. Based on bonding technique, the market has been divided into epoxy, eutectic, soft solder, and other bonding techniques. Based on supply chain participant, the die bonder equipment market has been classified into IDM firms and OSAT companies. Based on device, the market has been divided into optoelectronics, MEMS and MOEMS, and power devices. Based on application, the die bonder equipment market has been classified into consumer electronics, automotive, industrial, telecommunications, healthcare, and aerospace & defense. The market has been studied for Asia Pacific (APAC), the Americas; and Europe, the Middle East, and Africa (EMEA).

Reasons to buy the report

The report is expected to help market leaders/new entrants in this market in the following ways:

1. This report segments the die bonder equipment market comprehensively and provides the closest approximations of the overall size of the market, as well as its segments and subsegments.
2. The report is expected to help stakeholders understand the pulse of the market and provide them with information about key drivers, restraints, challenges, and opportunities.
3. This report aims at helping stakeholders in obtaining an improved understanding of their competitors and gaining insights to enhance their position in the market. The competitive landscape section includes the competitor ecosystem of the market, as well as growth strategies such as product launches, expansions, agreements, partnerships, collaborations, and acquisitions adopted by major market players.



目次

1 INTRODUCTION 19
1.1 STUDY OBJECTIVES 19
1.2 MARKET DEFINITION AND SCOPE 19
1.2.1 INCLUSIONS AND EXCLUSIONS 20
1.3 SCOPE 21
1.3.1 MARKETS COVERED 21
1.3.2 YEARS CONSIDERED 21
1.4 CURRENCY 22
1.5 LIMITATIONS 22
1.6 MARKET STAKEHOLDERS 22
2 RESEARCH METHODOLOGY 23
2.1 RESEARCH DATA 23
2.1.1 SECONDARY DATA 24
2.1.1.1 Secondary sources 24
2.1.2 PRIMARY DATA 25
2.1.2.1 Breakdown of primary interviews 25
2.1.2.2 Key data from primary sources 26
2.2 MARKET SIZE ESTIMATION 27
2.2.1 BOTTOM-UP APPROACH 29
2.2.1.1 Approach for capturing market size by bottom-up
analysis (demand side) 29
2.2.2 TOP-DOWN APPROACH 30
2.2.2.1 Approach for capturing market share by top-down
analysis (supply side) 30
2.3 MARKET BREAKDOWN AND DATA TRIANGULATION 31
2.4 RESEARCH ASSUMPTIONS 32
3 EXECUTIVE SUMMARY 33
4 PREMIUM INSIGHTS 38
4.1 ATTRACTIVE GROWTH OPPORTUNITIES IN DIE BONDER EQUIPMENT MARKET 38
4.2 DIE BONDER EQUIPMENT MARKET, BY COUNTRY 39
4.3 DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE 39
4.4 DIE BONDER EQUIPMENT MARKET, BY APPLICATION AND REGION 40
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5 MARKET OVERVIEW 41
5.1 INTRODUCTION 41
5.2 MARKET DYNAMICS 41
5.2.1 DRIVERS 42
5.2.1.1 Growing demand for miniature electronic components 42
5.2.1.2 Increasing adoption of stacked die technology in IoT devices 42
5.2.2 RESTRAINTS 43
5.2.2.1 High cost of ownership 43
5.2.3 OPPORTUNITIES 44
5.2.3.1 Increasing demand for 3D semiconductor assembly and packaging 44
5.2.4 CHALLENGES 45
5.2.4.1 Mechanical unbalance of moving parts 45
5.3 VALUE CHAIN ANALYSIS 46
5.3.1 DIE BONDER EQUIPMENT VALUE CHAIN 46
6 DIE BONDER EQUIPMENT MARKET, BY TYPE 48
6.1 INTRODUCTION 49
6.2 MANUAL DIE BONDERS 50
6.2.1 MANUAL DIE BONDERS PLAY SIGNIFICANT ROLE IN R&D, TESTING, AND PROTOTYPING APPLICATIONS 50
6.3 SEMIAUTOMATIC DIE BONDERS 53
6.3.1 SEMIAUTOMATIC DIE BONDERS ARE EASY TO USE AND FLEXIBLE 53
6.4 FULLY AUTOMATIC DIE BONDERS 57
6.4.1 FULLY AUTOMATIC DIE BONDERS TO CONTINUE TO REGISTER HIGHEST CAGR AND LARGEST MARKET SIZE DURING 2019-2024 57
7 DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE 61
7.1 INTRODUCTION 62
7.2 EPOXY 63
7.2.1 EPOXY BONDING TO ACCOUNT FOR LARGEST SHARE OF DIE BONDER EQUIPMENT MARKET DUE TO LOW COST AND LOW CURING TEMPERATURE 63
7.3 EUTECTIC 64
7.3.1 DIE BONDER EQUIPMENT MARKET FOR EUTECTIC BONDING TECHNIQUE TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 64
7.4 SOFT SOLDER 65
7.4.1 SOFT SOLDER BOIDNG PLAYS SIGNIFICANT ROLE IN FABRICATION OF POWER DEVICES 65
7.5 OTHERS 67
7.5.1 ASSEMBLY OF TEMPERATURE-RESTRICTED PRODUCTS FUEL GROWTH OF MARKET FOR OTHER BONDING TECHNIQUES 67
-
8 DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT 68
8.1 INTRODUCTION 69
8.2 OSAT COMPANIES 70
8.2.1 OSAT COMPANIES TO PLAY SIGNIFICANT ROLE OWING TO CHALLENGES FACED BY FOUNDRIES RELATED TO ASSEMBLY AND PACKAGING 70
8.3 IDM FIRMS 73
8.3.1 IDM FIRMS TO CONTINUE TO LEAD DIE BONDER EQUIPMENT MARKET OWING TO THEIR ABILITY TO PROGRESS RAPIDLY WITH INNOVATIVE TECHNOLOGIES DURING FORECAST PERIOD 73
9 DIE BONDER EQUIPMENT MARKET, BY DEVICE 77
9.1 INTRODUCTION 78
9.2 OPTOELECTRONICS 79
9.2.1 OPTOELECTRONICS TO CONTINUE TO ACCOUNT FOR LARGEST SHARE OF DIE BONDER EQUIPMENT MARKET DURING FORECAST PERIOD 79
9.3 MEMS AND MOEMS 83
9.3.1 AUTOMOTIVE, CONSUMER ELECTRONICS, HEALTHCARE, AND TELECOMMUNICATIONS SECTORS CONTRIBUTE MOST TO HIGHEST CAGR OF MEMS AND MOEMS DEVICES IN COMING YEARS 83
9.4 POWER DEVICES 87
9.4.1 DIE ATTACH PACKAGING METHODOLOGY ENABLES POWER DEVICES TO WITHSTAND EXTREME OPERATING CONDITIONS 87
10 DIE BONDER EQUIPMENT MARKET, BY APPLICATION 91
10.1 INTRODUCTION 92
10.2 CONSUMER ELECTRONICS 93
10.2.1 INCREASING ADOPTION OF MINIATURIZED AND LIGHTWEIGHT ELECTRONIC PRODUCTS ACCELERATES DEMAND FOR DIE BONDERS 93
10.3 AUTOMOTIVE 95
10.3.1 RISING USE OF MEMS TO ENSURE IMPROVED PASSENGER SAFETY WOULD SPUR DEMAND FOR DIE BONDERS IN AUTOMOTIVE APPLICATIONS 95
10.4 INDUSTRIAL 96
10.4.1 GROWING IMPLEMENTATION OF INDUSTRIAL IOT TO DRIVE GROWTH OF DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS 96
10.5 TELECOMMUNICATIONS 98
10.5.1 RISING DEPLOYMENT OF 5G NETWORK INFRASTRUCTURE CONTRIBUTING TO GROWTH OF DIE BONDER EQUIPMENT MARKET FOR TELECOMMUNICATIONS APPLICATIONS 98
10.6 HEALTHCARE 99
10.6.1 SURGING DEMAND FOR NANO-SIZED AND LIGHTWEIGHT HEALTHCARE GADGETS AUGMENTS ADOPTION OF DIE BONDERS IN HEALTHCARE APPLICATIONS 99
10.7 AEROSPACE & DEFENSE 101
10.7.1 INCREASING DEMAND FOR ROBUST COMPONENTS BOOSTING DIE BONDER MARKET GROWTH FOR AEROSPACE & DEFENSE APPLICATIONS 101
11 GEOGRAPHIC ANALYSIS 103
11.1 INTRODUCTION 104
11.2 APAC 105
11.2.1 TAIWAN 107
11.2.1.1 Presence of many key OSAT companies drives market growth in Taiwan 107
11.2.2 CHINA 108
11.2.2.1 Growing trend of miniaturization in consumer electronic products spurs growth of market in China 108
11.2.3 JAPAN 109
11.2.3.1 Increasing demand for passenger cars and commercial vehicles and expanding presence of market players in country fuels growth of die bonder equipment market in Japan 109
11.2.4 SOUTH KOREA 110
11.2.4.1 South Korea to continue to account for largest size of market in APAC during 2019-2024 110
11.2.5 REST OF APAC 110
11.2.5.1 Strong presence of die bonder equipment manufactures accelerates market growth in Rest of APAC 110
11.3 AMERICAS 111
11.3.1 US 113
11.3.1.1 US to continue to lead die bonder equipment market in Americas during 2019-2024 113
11.3.2 CANADA 114
11.3.2.1 Government initiatives toward developing electric vehicle infrastructure to create growth opportunities for die bonder equipment market in near future 114
11.3.3 REST OF AMERICAS 115
11.3.3.1 Increasing demand for IoT and 5G surging demand for die bonding equipment in Rest of Americas 115
11.4 EMEA 116
11.4.1 GERMANY 119
11.4.1.1 Adoption of smart homes and connected cars to spur demand in Germany 119
11.4.2 UK 119
11.4.2.1 Deployment of 5G infrastructure fueling market growth in UK 119
11.4.3 ISRAEL 120
11.4.3.1 Presence of fabrication plants of IDM companies including Intel and Tower Jazz to boost market growth in Israel 120
11.4.4 FRANCE 121
11.4.4.1 Developed communication network has prompted market growth in France 121
11.4.5 REST OF EMEA 122
11.4.5.1 Initiatives of die bonder equipment manufacturers to propel market growth in Rest of EMEA 122
12 COMPETITIVE LANDSCAPE 123
12.1 INTRODUCTION 123
12.2 MARKET RANKING ANALYSIS, 2018 124
12.3 COMPETITIVE SCENARIO 125
12.3.1 PRODUCT LAUNCHES 125
12.3.2 PARTNERSHIPS, COLLABORATIONS, CONTRACTS AND AGREEMENTS 126
12.3.3 ACQUISITIONS 127
12.3.4 EXPANSIONS 127
12.4 COMPETITIVE LEADERSHIP MAPPING 128
12.4.1 VISIONARY LEADERS 128
12.4.2 DYNAMIC DIFFERENTIATORS 128
12.4.3 INNOVATORS 129
12.4.4 EMERGING COMPANIES 129
12.5 STRENGTH OF PRODUCT PORTFOLIO 130
12.6 BUSINESS STRATEGY EXCELLENCE 131
13 COMPANY PROFILES 132
13.1 KEY PLAYERS 132
(Business overview, Products offered, Recent Developments, SWOT Analysis, MNM view)*
13.1.1 BE SEMICONDUCTOR INDUSTRIES N.V. 132
13.1.2 ASM PACIFIC TECHNOLOGY LTD. 136
13.1.3 KULICKE & SOFFA 139
13.1.4 MYCRONIC AB 142
13.1.5 PALOMAR TECHNOLOGIES, INC. 145
13.1.6 WEST-BOND, INC. 148
13.1.7 MICROASSEMBLY TECHNOLOGIES, LTD. 149
13.1.8 FINETECH GMBH & CO. KG 150
13.1.9 DR. TRESKY AG 152
13.1.10 SMART EQUIPMENT TECHNOLOGY 153
13.2 RIGHT TO WIN 154
13.3 OTHER KEY PLAYERS 155
13.3.1 HYBOND, INC. 155
13.3.2 SHIBUYA CORPORATION 155
13.3.3 ANZA TECHNOLOGY, INC. 156
13.3.4 PAROTEQ GMBH 156
13.3.5 TRESKY GMBH 157
13.3.6 DIAS AUTOMATION (HK) LTD 157
13.3.7 SHINKAWA LTD. 158
13.3.8 FOUR TECHNOS CO., LTD. 158
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13.3.9 FASFORD TECHNOLOGY CO., LTD. 159
13.3.10 UNITEMP GMBH 159
13.3.11 TPT WIRE BONDER GMBH & CO. KG 160
*Details on Business overview, Products offered, Recent Developments, SWOT Analysis, MNM view might not be captured in case of unlisted companies.
14 APPENDIX 161
14.1 DISCUSSION GUIDE 161
14.2 KNOWLEDGE STORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 164
14.3 AVAILABLE CUSTOMIZATIONS 166
14.4 RELATED REPORTS 166
14.5 AUTHOR DETAILS 167

 

LIST OF TABLES

TABLE 1 DIE BONDER EQUIPMENT MARKET, BY TYPE, 2016-2024 (USD MILLION) 49
TABLE 2 MANUAL DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE,
2016-2024 (USD MILLION) 50
TABLE 3 MANUAL DIE BONDER EQUIPMENT MARKET, BY DEVICE,
2016-2024 (USD MILLION) 50
TABLE 4 MANUAL DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS,
BY APPLICATION, 2016-2024 (USD MILLION) 51
TABLE 5 MANUAL DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS,
BY APPLICATION, 2016-2024 (USD MILLION) 51
TABLE 6 MANUAL DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES,
BY APPLICATION, 2016-2024 (USD MILLION) 52
TABLE 7 MANUAL DIE BONDER EQUIPMENT MARKET, BY APPLICATION,
2016-2024 (USD MILLION) 53
TABLE 8 MANUAL DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION) 53
TABLE 9 SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE, 2016-2024 (USD MILLION) 54
TABLE 10 SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET, BY DEVICE,
2016-2024 (USD MILLION) 54
TABLE 11 SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS,
BY APPLICATION, 2016-2024 (USD MILLION) 54
TABLE 12 SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS,
BY APPLICATION, 2016-2024 (USD MILLION) 55
TABLE 13 SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES,
BY APPLICATION, 2016-2024 (USD MILLION) 55
TABLE 14 SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET, BY APPLICATION,
2016-2024 (USD MILLION) 56
TABLE 15 SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION) 56
TABLE 16 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE, 2016-2024 (USD MILLION) 57
TABLE 17 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET, BY DEVICE,
2016-2024 (USD MILLION) 58
TABLE 18 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS,
BY APPLICATION, 2016-2024 (USD MILLION) 58
TABLE 19 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS,
BY APPLICATION, 2016-2024 (USD MILLION) 58
TABLE 20 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES,
BY APPLICATION, 2016-2024 (USD MILLION) 59
TABLE 21 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET, BY APPLICATION,
2016-2024 (USD MILLION) 60
TABLE 22 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION) 60
TABLE 23 DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE,
2016-2024 (USD MILLION) 63
TABLE 24 DIE BONDER EQUIPMENT MARKET FOR EPOXY BONDING TECHNIQUE,
BY TYPE, 2016-2024 (USD MILLION) 64
TABLE 25 DIE BONDER EQUIPMENT MARKET FOR EUTECTIC BONDING TECHNIQUE,
BY TYPE, 2016-2024 (USD MILLION) 65
TABLE 26 DIE BONDER EQUIPMENT MARKET FOR SOFT SOLDER BONDING TECHNIQUE,
BY TYPE, 2016-2024 (USD MILLION) 66
TABLE 27 DIE BONDER EQUIPMENT MARKET FOR OTHER BONDING TECHNIQUES,
BY TYPE, 2016-2024 (USD MILLION) 67
TABLE 28 DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT,
2016-2024 (USD MILLION) 69
TABLE 29 DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES, BY TYPE,
2016-2024 (USD MILLION) 70
TABLE 30 DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES, BY DEVICE,
2016-2024 (USD MILLION) 71
TABLE 31 DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS IN OSAT COMPANIES, BY REGION, 2016-2024 (USD MILLION) 71
TABLE 32 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS IN OSAT COMPANIES, BY REGION, 2016-2024 (USD MILLION) 71
TABLE 33 DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES IN OSAT COMPANIES,
BY REGION, 2016-2024 (USD THOUSAND) 72
TABLE 34 DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES, BY REGION,
2016-2024 (USD MILLION) 72
TABLE 35 DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES, BY APPLICATION, 2016-2024 (USD MILLION) 73
TABLE 36 DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS, BY TYPE,
2016-2024 (USD MILLION) 74
TABLE 37 DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS, BY DEVICE,
2016-2024 (USD MILLION) 74
TABLE 38 DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS IN IDM FIRMS,
BY REGION, 2016-2024 (USD THOUSAND) 74
TABLE 39 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS IN IDM FIRMS,
BY REGION, 2016-2024 (USD MILLION) 75
TABLE 40 DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES IN IDM FIRMS,
BY REGION, 2016-2024 (USD MILLION) 75
TABLE 41 DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS, BY REGION,
2016-2024 (USD MILLION) 75
TABLE 42 DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS, BY APPLICATION,
2016-2024 (USD THOUSAND) 76
TABLE 43 DIE BONDER EQUIPMENT MARKET, BY DEVICE, 2016-2024 (USD MILLION) 78
TABLE 44 DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY TYPE,
2016-2024 (USD MILLION) 80
TABLE 45 DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION) 80
TABLE 46 DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY APPLICATION, 2016-2024 (USD MILLION) 80
TABLE 47 DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY REGION,
2016-2024 (USD MILLION) 81
TABLE 48 DIE BONDER EQUIPMENT MARKET IN APAC FOR OPTOELECTRONICS, BY COUNTRY, 2016-2024 (USD MILLION) 82
TABLE 49 DIE BONDER EQUIPMENT MARKET IN AMERICAS FOR OPTOELECTRONICS,
BY COUNTRY, 2016-2024 (USD MILLION) 82
TABLE 50 DIE BONDER EQUIPMENT MARKET IN EMEA FOR OPTOELECTRONICS,
BY COUNTRY, 2016-2024 (USD THOUSAND) 83
TABLE 51 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY TYPE,
2016-2024 (USD MILLION) 84
TABLE 52 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION) 84
TABLE 53 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY APPLICATION, 2016-2024 (USD MILLION) 85
TABLE 54 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY REGION,
2016-2024 (USD MILLION) 85
TABLE 55 DIE BONDER EQUIPMENT MARKET IN APAC FOR MEMS AND MOEMS,
BY COUNTRY, 2016-2024 (USD MILLION) 85
TABLE 56 DIE BONDER EQUIPMENT MARKET IN AMERICAS FOR MEMS AND MOEMS,
BY COUNTRY, 2016-2024 (USD MILLION) 86
TABLE 57 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS IN EMEA,
BY COUNTRY, 2016-2024 (USD THOUSAND) 87
TABLE 58 DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY TYPE,
2016-2024 (USD MILLION) 87
TABLE 59 DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION) 88
TABLE 60 DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY APPLICATION,
2016-2024 (USD MILLION) 88
TABLE 61 DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY REGION,
2016-2024 (USD MILLION) 89
TABLE 62 DIE BONDER EQUIPMENT MARKET IN APAC FOR POWER DEVICES,
BY COUNTRY, 2016-2024 (USD MILLION) 89
TABLE 63 DIE BONDER EQUIPMENT MARKET IN AMERICAS FOR POWER DEVICES,
BY COUNTRY, 2016-2024 (USD MILLION) 89
TABLE 64 DIE BONDER EQUIPMENT MARKET IN EMEA FOR POWER DEVICES,
BY COUNTRY, 2016-2024 (USD THOUSAND) 90
TABLE 65 DIE BONDER EQUIPMENT MARKET, BY APPLICATION, 2016-2024 (USD MILLION) 93
TABLE 66 DIE BONDER EQUIPMENT MARKET FOR CONSUMER ELECTRONICS APPLICATIONS, BY TYPE, 2016-2024 (USD MILLION) 94
TABLE 67 DIE BONDER EQUIPMENT MARKET FOR CONSUMER ELECTRONICS APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION) 94
TABLE 68 DIE BONDER EQUIPMENT MARKET FOR CONSUMER ELECTRONICS APPLICATIONS, BY DEVICE, 2016-2024 (USD MILLION) 94
TABLE 69 DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATIONS,
BY TYPE, 2016-2024 (USD MILLION) 96
TABLE 70 DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION) 96
TABLE 71 DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATIONS, BY DEVICE, 2016-2024 (USD MILLION) 96
TABLE 72 DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS,
BY TYPE, 2016-2024 (USD MILLION) 97
TABLE 73 DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION) 97
TABLE 74 DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS, BY DEVICE, 2016-2024 (USD MILLION) 98
TABLE 75 DIE BONDER EQUIPMENT MARKET FOR TELECOMMUNICATIONS APPLICATIONS,
BY TYPE, 2016-2024 (USD MILLION) 98
TABLE 76 DIE BONDER EQUIPMENT MARKET FOR TELECOMMUNICATIONS APPLICATIONS,
BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION) 99
TABLE 77 DIE BONDER EQUIPMENT MARKET FOR TELECOMMUNICATIONS APPLICATIONS,
BY DEVICE, 2016-2024 (USD MILLION) 99
TABLE 78 DIE BONDER EQUIPMENT MARKET FOR HEALTHCARE APPLICATIONS,
BY TYPE, 2016-2024 (USD MILLION) 100
TABLE 79 DIE BONDER EQUIPMENT MARKET FOR HEALTHCARE APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION) 101
TABLE 80 DIE BONDER EQUIPMENT MARKET FOR HEALTHCARE APPLICATIONS, BY DEVICE, 2016-2024 (USD MILLION) 101
TABLE 81 DIE BONDER EQUIPMENT MARKET FOR AEROSPACE & DEFENSE APPLICATIONS, BY TYPE, 2016-2024 (USD MILLION) 102
TABLE 82 DIE BONDER EQUIPMENT MARKET FOR AEROSPACE & DEFENSE APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD THOUSAND) 102
TABLE 83 DIE BONDER EQUIPMENT MARKET FOR AEROSPACE & DEFENSE APPLICATIONS, BY DEVICE, 2016-2024 (USD MILLION) 102
TABLE 84 DIE BONDER EQUIPMENT MARKET, BY REGION, 2016-2024 (USD MILLION) 104
TABLE 85 DIE BONDER EQUIPMENT MARKET IN APAC, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION) 106
TABLE 86 DIE BONDER EQUIPMENT MARKET IN APAC, BY DEVICE,
2016-2024 (USD MILLION) 106
TABLE 87 DIE BONDER EQUIPMENT MARKET IN APAC, BY COUNTRY,
2016-2024 (USD MILLION) 106
TABLE 88 DIE BONDER EQUIPMENT MARKET IN TAIWAN, BY DEVICE,
2016-2024 (USD MILLION) 107
TABLE 89 DIE BONDER EQUIPMENT MARKET IN CHINA, BY DEVICE,
2016-2024 (USD MILLION) 108
TABLE 90 DIE BONDER EQUIPMENT MARKET IN JAPAN, BY DEVICE,
2016-2024 (USD MILLION) 110
TABLE 91 DIE BONDER EQUIPMENT MARKET IN SOUTH KOREA, BY DEVICE,
2016-2024 (USD MILLION) 110
TABLE 92 DIE BONDER EQUIPMENT MARKET IN REST OF APAC, BY DEVICE,
2016-2024 (USD MILLION) 111
TABLE 93 DIE BONDER EQUIPMENT MARKET IN AMERICAS, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION) 112
TABLE 94 DIE BONDER EQUIPMENT MARKET IN AMERICAS, BY DEVICE,
2016-2024 (USD MILLION) 113
TABLE 95 DIE BONDER EQUIPMENT MARKET IN AMERICAS, BY COUNTRY,
2016-2024 (USD MILLION) 113
TABLE 96 DIE BONDER EQUIPMENT MARKET IN US, BY DEVICE, 2016-2024 (USD MILLION) 114
TABLE 97 DIE BONDER EQUIPMENT MARKET IN CANADA, BY DEVICE,
2016-2024 (USD THOUSAND) 115
TABLE 98 DIE BONDER EQUIPMENT MARKET IN REST OF AMERICAS, BY DEVICE,
2016-2024 (USD MILLION) 116
TABLE 99 DIE BONDER EQUIPMENT MARKET IN EMEA, BY SUPPLY CHAIN PARTICIPANT, 2016-2024 (USD MILLION) 117
TABLE 100 DIE BONDER EQUIPMENT MARKET IN EMEA, BY DEVICE,
2016-2024 (USD MILLION) 118
TABLE 101 DIE BONDER EQUIPMENT MARKET IN EMEA, BY COUNTRY,
2016-2024 (USD MILLION) 118
TABLE 102 DIE BONDER EQUIPMENT MARKET IN GERMANY, BY DEVICE,
2016-2024 (USD MILLION) 119
TABLE 103 DIE BONDER EQUIPMENT MARKET IN UK, BY DEVICE,
2016-2024 (USD THOUSAND) 120
TABLE 104 DIE BONDER EQUIPMENT MARKET IN ISRAEL, BY DEVICE,
2016-2024 (USD THOUSAND) 120
TABLE 105 DIE BONDER EQUIPMENT MARKET IN FRANCE, BY DEVICE,
2016-2024 (USD THOUSAND) 121
TABLE 106 DIE BONDER EQUIPMENT MARKET IN REST OF EMEA, BY DEVICE,
2016-2024 (USD THOUSAND) 122
TABLE 107 PRODUCT LAUNCHES, 2017-2019 125
TABLE 108 PARTNERSHIPS, COLLABORATIONS, CONTRACTS AND AGREEMENTS,
2017-2019 126
TABLE 109 ACQUISITIONS, 2018 127
TABLE 110 EXPANSIONS, 2017-2019 127

 

LIST OF FIGURES

FIGURE 1 DIE BONDER EQUIPMENT MARKET: RESEARCH DESIGN 23
FIGURE 2 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 1 (SUPPLY SIDE): REVENUE GENERATED FROM PRODUCTS IN DIE BONDER EQUIPMENT MARKET 27
FIGURE 3 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 2 BOTTOM-UP
(SUPPLY SIDE): ILLUSTRATIVE EXAMPLE OF COMPANY IN DIE BONDER EQUIPMENT MARKET 27
FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 2 - BOTTOM-UP (DEMAND SIDE): SUPPLY CHAIN PARTICIPANTS COVERED UNDER DIE BONDER EQUIPMENT MARKET 28
FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 3 - BOTTOM-UP MARKET ESTIMATION FOR DIE BONDER EQUIPMENT, BY TYPE 29
FIGURE 6 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH 30
FIGURE 7 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH 31
FIGURE 8 DATA TRIANGULATION 31
FIGURE 9 RESEARCH STUDY ASSUMPTIONS 32
FIGURE 10 MARKET FOR FULLY AUTOMATIC DIE BONDER EQUIPMENT TO GROW AT HIGHEST CAGR DURING 2019-2024 34
FIGURE 11 DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS TO GROW AT HIGHER CAGR DURING 2019-2024 35
FIGURE 12 AUTOMOTIVE APPLICATION TO WITNESS HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET DURING 2019-2024 36
FIGURE 13 APAC TO BE FASTEST-GROWING REGION IN DIE BONDER EQUIPMENT MARKET DURING FORECAST PERIOD 37
FIGURE 14 INCREASING DEMAND FOR MINIATURIZED ELECTRONIC DEVICES TO SPUR DIE BONDER EQUIPMENT MARKET GROWTH DURING FORECAST PERIOD 38
FIGURE 15 CHINA TO RECORD HIGHEST CAGR IN OVERALL DIE BONDER EQUIPMENT MARKET DURING FORECAST PERIOD 39
FIGURE 16 EPOXY BONDING TECHNIQUE TO CONTINUE TO ACCOUNT FOR LARGEST SHARE OF DIE BONDER EQUIPMENT MARKET TILL 2024 39
FIGURE 17 CONSUMER ELECTRONICS AND APAC LIKELY TO BE LARGEST SHAREHOLDERS IN OVERALL DIE BONDER EQUIPMENT MARKET, BY APPLICATION AND REGION, RESPECTIVELY, IN 2024 40
FIGURE 18 GROWING DEMAND OF MINIATURIZATION OF ELECTRONIC DEVICES TO DRIVE DIE BONDER EQUIPMENT MARKET 41
FIGURE 19 DIE BONDER EQUIPMENT MARKET DRIVERS AND THEIR IMPACT 43
FIGURE 20 DIE BONDER EQUIPMENT MARKET RESTRAINTS AND THEIR IMPACT 44
FIGURE 21 DIE BONDER EQUIPMENT MARKET OPPORTUNITIES AND THEIR IMPACT 45
FIGURE 22 DIE BONDER EQUIPMENT MARKET CHALLENGES AND THEIR IMPACT 46
FIGURE 23 DIE BONDER EQUIPMENT ECOSYSTEM: MAJOR VALUE IS ADDED BY PRODUCT MANUFACTURERS 47
FIGURE 24 DIE BONDER EQUIPMENT MARKET, BY TYPE 49
FIGURE 25 MARKET FOR FULLY AUTOMATIC DIE BONDERS TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 49
FIGURE 26 MANUAL DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATION TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 52
FIGURE 27 IDM FIRMS TO EXHIBIT HIGHER CAGR IN SEMIAUTOMATIC DIE BONDING EQUIPMENT MARKET DURING FORECAST PERIOD 56
FIGURE 28 FULLY DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATION TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 59
FIGURE 29 DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE 62
FIGURE 30 MARKET FOR EUTECTIC BONDING TECHNIQUE TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 62
FIGURE 31 FULLY AUTOMATIC SOFT SOLDER DIE BONDERS TO DOMINATE MARKET DURING FORECAST PERIOD 66
FIGURE 32 DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT 69
FIGURE 33 IDM FIRMS TO COMMAND DIE BONDER EQUIPMENT MARKET
DURING 2019-2024 69
FIGURE 34 APAC TO REGISTER HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES DURING FORECAST PERIOD 72
FIGURE 35 AUTOMOTIVE APPLICATION TO RECORD HIGHEST CAGR IN DIE BONDER MARKET FOR IDM FIRMS DURING FORECAST PERIOD 76
FIGURE 36 DIE BONDER EQUIPMENT MAREKT, BY DEVICE 78
FIGURE 37 DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS DEVICES TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 78
FIGURE 38 APAC TO REGISTER HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS DURING FORECAST PERIOD 81
FIGURE 39 FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS DEVICES TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 84
FIGURE 40 GERMANY TO DOMINATE DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS DURING FORECAST PERIOD 86
FIGURE 41 AUTOMOTIVE APPLICATION TO WITNESS HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES DURING FORECAST PERIOD 88
FIGURE 42 DIE BONDER EQUIPMENT MAREKT, BY APPLICATION 92
FIGURE 43 DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATION TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 92
FIGURE 44 FULLY AUTOMATIC DIE BONDERS TO DOMINATE MARKET FOR AUTOMOTIVE APPLICATIONS DURING FORECAST PERIOD 95
FIGURE 45 MEMS AND MOEMS DEVICES TO EXHIBIT HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS DURING FORECAST PERIOD 97
FIGURE 46 IDM FIRMS TO LEAD DIE BONDER EQUIPMENT MARKET FOR HEALTHCARE APPLICATIONS DURING FORECAST PERIOD 100
FIGURE 47 DIE BONDER EQUIPMENT IN APAC TO GROW AT HIGHEST CARG DURING
FORECAST PERIOD 104
FIGURE 48 APAC: DIE BONDER EQUIPMENT MARKET SNAPSHOT 105
FIGURE 49 MEMS AND MOEMS DEVICES TO RECORD HIGHEST CARG IN DIE BONDER EQUIPMENT MARKET IN JAPAN DURING FORECAST PERIOD 109
FIGURE 50 AMERICAS: DIE BONDER EQUIPMENT MARKET SNAPSHOT 112
FIGURE 51 DIE BONDER EQUIPMENT MARKET IN CANADA FOR MEMS AND MOEMS DEVICES TO GROW AT HIGHEST CARG DURING FORECAST PERIOD 115
FIGURE 52 EMEA: DIE BONDER EQUIPMENT MARKET SNAPSHOT 117
FIGURE 53 GERMANY TO REGISTER HIGHEST CARG IN DIE BONDER EQUIPMENT MARKET IN EMEA DURING FORECAST PERIOD 118
FIGURE 54 MEMES AND MOEMS DEVICES TO EXHIBIT HIGHEST CARG IN FRENCH DIE BONDER EQUIPMENT MARKET DURING FORECAST PERIOD 121
FIGURE 55 COMPANIES ADOPTED PRODUCT LAUNCHES AS KEY GROWTH STRATEGIES
FROM 2017 TO 2019 123
FIGURE 56 RANKING OF TOP 5 PLAYERS IN DIE BONDER EQUIPMENT MARKET 124
FIGURE 57 DIE BONDER EQUIPMENT MARKET (GLOBAL) COMPETITIVE LEADERSHIP
MAPPING, 2018 129
FIGURE 58 BE SEMICONDUCTOR INDUSTRIES N.V.: COMPANY SNAPSHOT 133
FIGURE 59 ASM PACIFIC TECHNOLOGY LTD: COMPANY SNAPSHOT 136
FIGURE 60 KULICKE & SOFFA: COMPANY SNAPSHOT 139
FIGURE 61 MYCRONIC AB: COMPANY SNAPSHOT 142

 

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