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成形回路部品(MID)市場:プロセス毎(LDS、2ショット射出、フィルム技術)、製品毎(アンテナ・接続モジュール、コネクタ・スイッチ、センサ、照明)、産業毎、地域毎 - 2023年までの世界市場予測

Molded Interconnect Device (MID) Market by Process (LDS, 2-Shot Molding, Film Techniques), Product (Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting), Industry, and Geography - Global Forecast to 2023

 

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MarketsandMarkets
マーケッツアンドマーケッツ
2018年8月US$5,650
シングルユーザライセンス
92 55

サマリー

幅広い市場に関する調査レポートを出版しているマーケッツアンドマーケッツ(MarketsandMarkets)の成形回路部品(MID)市場に関する調査レポートです。

MID market to grow at significant rate during 2018-2023

The MID market is expected to reach USD 1,798.3 million by 2023 from USD 894.1 million in 2018, at a CAGR of 15.0% from 2018 to 2023. Key factors driving the growth of the MID market include the increasing use of MID in medical devices, rising demand for miniaturization in the consumer electronics industry, and growing need to reduce e-waste. However, the technological monopoly of LDS equipment manufacturer is a major factor restraining the growth of the market.

Sensors to boost MID market growth during forecast period

MIDs are used in sensors for a variety of industrial and automotive applications. Industrial applications include temperature sensors, motion sensors, pressure sensors, and flow sensors, among others. In automotive, MID-based sensors are used in adaptive cruise control system, central locking, and climate control applications. MID miniaturizes devices, which helps reduce the weight of the overall sensor system and increases functionality, resulting in low-cost end-use devices. The use of MID will increase in sensors, which will further drive the MID market growth in the coming years.

Asia Pacific to account for largest size of MID market during forecast period

APAC is expected to offer lucrative opportunities for the MID market growth owing to the growing base for communication infrastructure, communication devices, and consumer electronics. APAC is one of the key regions for players dealing with smartphones and wearable devices. The trend of miniaturization of components in smartphones and wearables will drive the MID market in this region. This region is expected to witness mass commercialization of 5G by 2020.

Following is the breakup of the profiles of primary participants for the report:

- By Company Type: Tier 1 - 20%, Tier 2 - 55%, and Tier 3 - 25%
- By Designation: C-Level Executives - 45%, Directors - 30%, and Others - 25%
- By Region: North America - 45%, Europe - 30%, APAC - 20%, and RoW - 5%

Key players operating in the MID market are Molex (US), LPKF (Germany), TE Connectivity (Switzerland), HARTING (Germany), APC (US), JOHNAN (Japan), MID Solutions (Germany), 2E mechatronic (Germany), and Multiple Dimensions (Switzerland).

Research Coverage

This research report categorizes the MID market by process, product type, industry, and geography. By process, the market has been segmented into LDS, 2-shot molding, and film techniques. By product type, the MID market has been classified into antennae & connectivity modules, connectors & switches, sensors, lighting, and others. By industry, the market has been segmented into telecommunications, consumer electronics, automotive, medical, and industrial. Moreover, the report covers the market in 4 major regions-North America, Europe, APAC, and RoW.

Key Benefits of Buying This Report

  •   Illustrative segmentation, analysis, and forecast for the market based on process, product type, industry, and geography have been conducted to give an overall view of the MID market.
  •   Major drivers, restraints, opportunities, and challenges pertaining to the MID market have been detailed in this report.
  •   A detailed competitive landscape, including the revenues of key players, has been presented.


目次

1 INTRODUCTION 12
1.1 STUDY OBJECTIVES 12
1.2 DEFINITION 12
1.3 STUDY SCOPE 13
1.3.1 YEARS CONSIDERED FOR STUDY 13
1.4 CURRENCY 14
1.5 STAKEHOLDERS 14

2 RESEARCH METHODOLOGY 15
2.1 RESEARCH DATA 15
2.1.1 SECONDARY DATA 16
2.1.1.1 Key data from secondary sources 16
2.1.2 PRIMARY DATA 17
2.1.2.1 Key data from primary sources 17
2.1.2.2 Breakdown of primaries 18
2.2 MARKET SIZE ESTIMATION 18
2.2.1 BOTTOM-UP APPROACH 19
2.2.2 TOP-DOWN APPROACH 20
2.3 MARKET BREAKDOWN AND DATA TRIANGULATION 21
2.4 RESEARCH ASSUMPTIONS 22

3 EXECUTIVE SUMMARY 23

4 PREMIUM INSIGHT 27
4.1 ATTRACTIVE OPPORTUNITIES FOR MOLDED INTERCONNECT DEVICE MARKET GROWTH 27
4.2 MOLDED INTERCONNECT DEVICE MARKET FOR CONSUMER ELECTRONICS INDUSTRY, BY PRODUCT TYPE 28
4.3 MOLDED INTERCONNECT DEVICE MARKET FOR ANTENNAE AND CONNECTIVITY MODULES, BY INDUSTRY 28
4.4 MOLDED INTERCONNECT DEVICE MARKET IN EUROPE, BY PROCESS 29
4.5 MOLDED INTERCONNECT DEVICE MARKET, BY REGION 30
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5 MARKET OVERVIEW 31
5.1 INTRODUCTION 31
5.2 MARKET DYNAMICS 31
5.2.1 DRIVERS 32
5.2.1.1 Increasing use of MID in medical devices 32
5.2.1.2 Rising demand for miniaturization in consumer electronics industry 32
5.2.1.3 Increasing need to reduce e-waste 32
5.2.2 RESTRAINTS 32
5.2.2.1 Technological monopoly of LDS equipment manufacturer 32
5.2.3 OPPORTUNITIES 33
5.2.3.1 Rising use of MID in automotive industry 33
5.2.3.2 Growth in IoT devices 33
5.2.4 CHALLENGES 33
5.2.4.1 Incompatibility with electronic packages 33

6 INDUSTRY TRENDS 34
6.1 INTRODUCTION 34
6.2 IN-MOLD ELECTRONICS (IME) 34
6.2.1 APPLICATIONS 34
6.2.2 BUILDING BLOCKS 34

7 MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS 35
7.1 INTRODUCTION 36
7.2 LASER DIRECT STRUCTURING 36
7.3 2-SHOT MOLDING 36
7.4 FILM TECHNIQUES 36

8 MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE 37
8.1 INTRODUCTION 38
8.2 ANTENNAE AND CONNECTIVITY MODULES 38
8.3 SENSORS 39
8.4 CONNECTORS AND SWITCHES 40
8.5 LIGHTING 40
8.6 OTHERS 41

9 MOLDED INTERCONNECT DEVICE MARKET, BY INDUSTRY 42
9.1 INTRODUCTION 43
9.2 TELECOMMUNICATIONS 43
9.3 CONSUMER ELECTRONICS 44
9.4 AUTOMOTIVE 45
9.5 MEDICAL 46
9.6 INDUSTRIAL 47

10 GEOGRAPHIC ANALYSIS 48
10.1 INTRODUCTION 49
10.2 NORTH AMERICA 51
10.2.1 US 53
10.2.2 CANADA 53
10.3 EUROPE 54
10.3.1 GERMANY 56
10.3.2 SWITZERLAND 56
10.3.3 FRANCE 56
10.3.4 REST OF EUROPE 56
10.4 ASIA PACIFIC (APAC) 57
10.4.1 CHINA 59
10.4.2 JAPAN 59
10.4.3 SOUTH KOREA 59
10.4.4 REST OF APAC 59
10.5 REST OF THE WORLD (ROW) 59
10.5.1 SOUTH AMERICA 61
10.5.2 MIDDLE EAST AND AFRICA 61

11 COMPETITIVE LANDSCAPE 62
11.1 INTRODUCTION 62
11.2 MARKET PLAYER RANKING ANALYSIS 63
11.3 COMPETITIVE SITUATIONS AND TRENDS 64
11.3.1 EXPANSIONS 64
11.3.2 MERGER AND ACQUISITIONS 64
11.3.3 PRODUCT DEVELOPMENT 65
11.3.4 AGREEMENT 65

12 COMPANY PROFILES 66
12.1 INTRODUCTION 66
12.2 KEY PLAYERS 67
(Business overview, Products offered, Recent developments, MNM view, SWOT analysis)*
12.2.1 MOLEX 67
12.2.2 LPKF LASER & ELECTRONICS 69
12.2.3 TE CONNECTIVITY 71
12.2.4 HARTING 73
12.2.5 ARLINGTON PLATING COMPANY 75
12.2.6 JOHNAN 77
12.2.7 MID SOLUTIONS 78
12.2.8 2E MECHATRONIC 79
12.2.9 MULTIPLE DIMENSIONS 80
*Business overview, Products offered, Recent developments, MNM view, SWOT analysis might not be captured in case of unlisted companies.
12.3 OTHER IMPORTANT PLAYERS 81
12.3.1 LASER MICRONICS 81
12.3.2 TEPROSA 81
12.3.3 AXON CABLE 82
12.3.4 S2P 82
12.3.5 SUZHOU CICOR TECHNOLOGY CO. LTD 82
12.3.6 IME VENDORS 83
12.3.6.1 DowDUPont 83
12.3.6.2 TactoTek 83
12.3.6.3 Dura Tech Industries 84
12.3.6.4 Tekra 84
12.3.6.5 Yomura Technologies 84

13 APPENDIX 85
13.1 INSIGHTS OF INDUSTRY EXPERTS 85
13.2 DISCUSSION GUIDE 86
13.3 KNOWLEDGE STORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 88
13.4 AVAILABLE CUSTOMIZATIONS 90
13.5 RELATED REPORTS 90
13.6 AUTHOR DETAILS 91
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LIST OF TABLES

TABLE 1 MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS,
2015-2023 (USD MILLION) 36
TABLE 2 MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE,
2015-2023 (USD MILLION) 38
TABLE 3 MOLDED INTERCONNECT DEVICE MARKET FOR ANTENNAE AND CONNECTIVITY MODULES, BY INDUSTRY, 2015-2023 (USD MILLION) 39
TABLE 4 MOLDED INTERCONNECT DEVICE MARKET FOR SENSORS, BY INDUSTRY,
2015-2023 (USD MILLION) 39
TABLE 5 MOLDED INTERCONNECT DEVICE MARKET FOR CONNECTORS AND SWITCHES,
BY INDUSTRY, 2015-2023 (USD MILLION) 40
TABLE 6 MOLDED INTERCONNECT DEVICE MARKET FOR LIGHTING, BY INDUSTRY,
2015-2023 (USD MILLION) 41
TABLE 7 MOLDED INTERCONNECT DEVICE MARKET FOR OTHERS, BY INDUSTRY,
2015-2023 (USD MILLION) 41
TABLE 8 MOLDED INTERCONNECT DEVICE MARKET, BY INDUSTRY,
2015-2023 (USD MILLION) 43
TABLE 9 MOLDED INTERCONNECT DEVICE MARKET FOR TELECOMMUNICATIONS,
BY PRODUCT TYPE, 2015-2023 (USD MILLION) 44
TABLE 10 MOLDED INTERCONNECT DEVICE MARKET FOR CONSUMER ELECTRONICS,
BY PRODUCT TYPE, 2015-2023 (USD MILLION) 45
TABLE 11 MOLDED INTERCONNECT DEVICE MARKET FOR AUTOMOTIVE, BY PRODUCT TYPE, 2015-2023 (USD MILLION) 45
TABLE 12 MOLDED INTERCONNECT DEVICE MARKET FOR MEDICAL, BY PRODUCT TYPE, 2015-2023 (USD MILLION) 46
TABLE 13 MOLDED INTERCONNECT DEVICE MARKET FOR INDUSTRIAL, BY PRODUCT TYPE, 2015-2023 (USD MILLION) 47
TABLE 14 MOLDED INTERCONNECT DEVICE MARKET, BY REGION,
2015-2023 (USD MILLION) 50
TABLE 15 MOLDED INTERCONNECT DEVICE MARKET IN NORTH AMERICA, BY COUNTRY, 2015-2023 (USD MILLION) 52
TABLE 16 MOLDED INTERCONNECT DEVICE MARKET IN NORTH AMERICA, BY PROCESS, 2015-2023 (USD MILLION) 52
TABLE 17 MOLDED INTERCONNECT DEVICE MARKET IN NORTH AMERICA, BY INDUSTRY, 2015-2023 (USD MILLION) 52
TABLE 18 MOLDED INTERCONNECT DEVICE MARKET IN EUROPE, BY COUNTRY,
2015-2023 (USD MILLION) 55
TABLE 19 MOLDED INTERCONNECT DEVICE MARKET IN EUROPE, BY PROCESS,
2015-2023 (USD MILLION) 55
TABLE 20 MOLDED INTERCONNECT DEVICE MARKET IN EUROPE, BY INDUSTRY,
2015-2023 (USD MILLION) 55
TABLE 21 MOLDED INTERCONNECT DEVICE MARKET IN APAC, BY COUNTRY,
2015-2023 (USD MILLION) 58
TABLE 22 MOLDED INTERCONNECT DEVICE MARKET IN APAC, BY PROCESS,
2015-2023 (USD MILLION) 58
TABLE 23 MOLDED INTERCONNECT DEVICE MARKET IN APAC, BY INDUSTRY,
2015-2023 (USD MILLION) 58
TABLE 24 MOLDED INTERCONNECT DEVICE MARKET IN ROW, BY REGION,
2015-2023 (USD MILLION) 59
TABLE 25 MOLDED INTERCONNECT DEVICE MARKET IN ROW, BY PROCESS,
2015-2023 (USD MILLION) 60
TABLE 26 MOLDED INTERCONNECT DEVICE MARKET IN ROW, BY INDUSTRY,
2015-2023 (USD MILLION) 60
TABLE 27 RANKING OF KEY PLAYERS IN MOLDED INTERCONNECT DEVICE MARKET (2017) 63
TABLE 28 EXPANSIONS 2017-2018 64
TABLE 29 MERGER AND ACQUISITIONS, 2015-2017 64
TABLE 30 PRODUCT DEVELOPMENT, 2017 65
TABLE 31 AGREEMENT, 2017 65


LIST OF FIGURES

FIGURE 1 MOLDED INTERCONNECT DEVICE MARKET SEGMENTATION 13
FIGURE 2 MOLDED INTERCONNECT DEVICES MARKET: REPORT DESIGN 15
FIGURE 3 PROCESS FLOW 18
FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH 19
FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH 20
FIGURE 6 DATA TRIANGULATION 21
FIGURE 7 ASSUMPTIONS FOR RESEARCH STUDY 22
FIGURE 8 LASER DIRECT STRUCTURING TO LEAD MOLDED INTERCONNECT DEVICE MARKET DURING FORECAST PERIOD 23
FIGURE 9 ANTENNAE AND CONNECTIVITY MODULES TO HOLD LARGEST SIZE OF MOLDED INTERCONNECT DEVICE MARKET BY 2023 24
FIGURE 10 MOLDED INTERCONNECT DEVICE MARKET FOR AUTOMOTIVE TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 25
FIGURE 11 MOLDED INTERCONNECT DEVICE MARKET TO GROW AT HIGHEST CAGR IN GERMANY DURING FORECAST PERIOD 26
FIGURE 12 INCREASING USE OF MOLDED INTERCONNECT DEVICES IN AUTOMOTIVE INDUSTRY TO OFFER OPPORTUNITIES FOR MARKET GROWTH 27
FIGURE 13 ANTENNAE AND CONNECTIVITY MODULES TO LEAD MOLDED INTERCONNECT DEVICE MARKET FOR CONSUMER ELECTRONICS DURING FORECAST PERIOD 28
FIGURE 14 AUTOMOTIVE TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD 28
FIGURE 15 LASER DIRECT STRUCTURING HELD LARGEST SHARE OF MOLDED INTERCONNECT DEVICE MARKET IN EUROPE IN 2017 29
FIGURE 16 MOLDED INTERCONNECT DEVICE MARKET TO GROW AT HIGHEST CAGR IN EUROPE FROM 2018 TO 2023 30
FIGURE 17 RISING DEMAND FOR MINIATURIZATION IN CONSUMER ELECTRONICS INDUSTRY DRIVING THE MID MARKET 31
FIGURE 18 MOLDED INTERCONNECT DEVICE MARKET: GEOGRAPHIC SNAPSHOT 49
FIGURE 19 MOLDED INTERCONNECT DEVICE MARKET SNAPSHOT: NORTH AMERICA 51
FIGURE 20 MOLDED INTERCONNECT DEVICE MARKET SNAPSHOT: EUROPE 54
FIGURE 21 MOLDED INTERCONNECT DEVICE MARKET SNAPSHOT: APAC 57
FIGURE 22 COMPANIES ADOPTED EXPANSION AS KEY GROWTH STRATEGY DURING
2016-2018 62
FIGURE 23 LPKF: COMPANY SNAPSHOT 69
FIGURE 24 TE CONNECTIVITY: COMPANY SNAPSHOT 71

 

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プレスリリース

[プレスリリース原文]

Molded Interconnect Device (MID) Market worth $1,798.3 million by 2023


August 31, 2018

According to the new market research report on "Molded Interconnect Device (MID) Market by Process (LDS, 2-Shot Molding, Film Techniques), Product (Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting), Industry, and Geography - Global Forecast to 2023", the MID market is expected to reach USD 1,798.3 million by 2023 from USD 894.1 million in 2018, at a CAGR of 15.0% from 2018 to 2023. Major factors driving the growth of the MID market are the increasing use of MID in medical devices, rising demand for miniaturization in the consumer electronics industry, and growing need to reduce e-waste.

Laser direct structuring (LDS) to hold major share of MID market throughout the forecast period

LDS equipment is used to manufacture MIDs. LDS consists of various steps, such as injection molding, laser activation, metallization, and assembly. LPKF is the sole manufacturer of LDS equipment. LDS allows to eliminate components in electronic devices, such as antennae in smartphones, thus reducing assembly time and device production cost. Increasing demand for integrating more electronic circuits into smaller spaces is fueling the growth of LDS in the MID market. Moreover, the introduction of 5G mobile communications technology will lead to the rise in demand for smartphone antennae, which in turn will increase demand for LDS equipment.

MID market for sensors to grow at high CAGR during forecast period

MIDs are used in sensors for a variety of industrial and automotive applications. Industrial applications include temperature sensors, motion sensors, pressure sensors, and flow sensors, among others. In automotive, MID-based sensors are used in adaptive cruise control system, central locking, and climate control applications. MID miniaturizes devices, which helps reduce the weight of the overall sensor system and increases functionality, resulting in low-cost end-use devices.

Automotive to grow at highest CAGR during forecast period

MIDs have a thriving market in the automotive industry. This is largely due to the wide-scale adoption of MID in various automotive applications, such as steering wheel hubs, brake sensors, position sensors, and lighting. In automotive, MID reduces the wiring and combines the connector and housing in 1 piece, and through selective plating, it incorporates all the required circuitry. Such benefits of MIDs encourage this industry to adopt MID technology, thereby fueling the MID market growth.

MID market in Europe to grow at highest CAGR during forecast period

The presence of LDS equipment manufacturers such as LPKF and leading MID manufacturers such as Harting (Germany), TE Connectivity (Switzerland), 2E mechatronic (Germany), and Multiple Dimensions (Switzerland) positively impacts the MID market in this region. Furthermore, the presence of prominent automotive OEMs in this region, which are using MID for applications such as seatbelt safety systems, position sensors, and light fixtures, is expected to boost the MID market growth in Europe.

The report profiles the most promising players in the MID market. Some of the key players in the market are Molex (US), LPKF (Germany), TE Connectivity (Switzerland), HARTING (Germany), APC (US), JOHNAN (Japan), MID Solutions (Germany), 2E mechatronic (Germany), and Multiple Dimensions (Switzerland).

 

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