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システムインパッケージ(SiP)市場:パッケージング技術毎(2D IC、2.5D IC、3D IC)、パッケージタイプ毎(BGA、SOP)、パッケージング方法毎(フリップチップ、ワイヤボンド)、デバイス毎(RFフロントエンド、RFアンプリファイア)、用途毎(家電、通信) - 2023年までの世界市場予測

System in Package Market by Packaging Technology (2D IC, 2.5D IC, 3D IC), Package Type (BGA, SOP), Packaging Method (Flip Chip, Wire Bond), Device (RF Front-End, RF Amplifier), Application (Consumer Electronics, Communications) - Global Forecast to 2023

 

出版社 出版年月電子媒体価格ページ数図表数
MarketsandMarkets
マーケッツアンドマーケッツ
2017年11月US$5,650
シングルユーザライセンス
156 108

サマリー

幅広い市場に関する調査レポートを出版しているマーケッツアンドマーケッツ(MarketsandMarkets)のシステムインパッケージ(SiP)市場に関する調査レポートです。

“System in package market expected to grow at a significant rate between 2017 and 2023”

The system in package market is expected to grow from USD 5.79 billion in 2017 to USD 9.07 billion by 2023, at a CAGR of 9.4% during 2017-2023. The key factors driving the growth of the system in package market are the development strategies such as product launches and developments, mergers and acquisitions, expansions, agreements, collaborations, joint ventures, and partnerships implemented by the players operating in the system in package market, growing demand for miniaturization of electronic devices, and impact of Internet of Things (IoT). However, the major restraining factors for the growth of this market is the higher level of integration that leads to thermal issues.

“3D IC expected to grow at the highest CAGR of the system in package market on the basis of packaging technology during the forecast period”

The 3D IC market is expected to grow at the highest CAGR during the forecast period. The compact structure of 3D IC packaging technology further increases its demand in various smart technologies. Moreover, the major factors driving the system in package market for 3D IC packaging technology include the highest interconnect density and greater space efficiencies in 3D IC compared with all other types of packaging technology such as 2D and 2.5 D.

“Consumer electronics application expected to hold the largest share of the overall system in package market in 2017”

Smartphones and tablets are observed to have the highest adoption among all the consumer electronic devices owing to their small form factor and better performance requirements to operate at a higher bandwidth. As a result, many ICs need to be incorporated into a single chip module for reducing the board space while considering cost and the overall time-to-market. In addition, consumer electronics products, such as mobile phones, tablets, netbook PCs, digital video cameras, and gaming controllers are adopting the advanced architecture. These products address features that increase the demand for miniaturized electronic devices with improved performance in consumer electronics. Owing to these factors, the consumer electronics application expected to hold the largest share of the overall system in package market in 2017.

“System in package market in APAC expected to hold the largest share in 2017”

The overall system in package market in APAC is expected to hold the largest share in 2017, and because of the presence of major IC packaging and wafer suppliers in this region. This makes the integration of 2D, 2.5D, and 3D IC packaging technology in APAC much easier.

The break-up of the profiles of primary participants for the report has been given below.

- By Company Type: Tier 1 = 45%, Tier 2 = 30%, and Tier 3 = 25%
- By Designation: C-Level Executives = 40%  and Managers = 60%
- By Region: Americas = 35%, APAC = 45%, Europe = 15%, and RoW = 5%

ASE Group (Taiwan), Amkor Technology (US), SPIL (Taiwan), Powertech Technology (Taiwan), UTAC (Global A&T Electronics) (Singapore), Intel (US), Samsung Electronics (South Korea), JCET (China), Chipmos Technologies (Taiwan), Chipbond Technology (Taiwan), KYEC (Taiwan), Texas Instruments (US), Signetics (South Korea), Unisem (Malaysia), Carsem (Malaysia), FATC (Taiwan), Inari Amertron Berhad (Malaysia), Ardentec (Taiwan), Alchip (Taiwan), Hana-Micron (South Korea), OSE (Taiwan), Greatek Electronics (Taiwan), Tainshui Huatian Technology (China), AOI Electronics (Japan), Lingsen Precision Industry (Taiwan), Nepes (South Korea), Tongfu Microelectronics (China), and Sigurd Microelectronics (Taiwan) are the key players operating in the system in package market.

Research Coverage:

The research report on the system in package market covers the market segmented on the basis of the following segments: packaging technology, package type, packaging method, device, application, and geography. The market has been segmented on the basis of packaging technology into 2D, 2.5D, and 3D IC. Based on package type, the system in package market has been classified into ball grid array, surface mount package, pin grid array, flat package, and small outline package. The market has been segmented on the basis of packaging method into wire bond and die attach, flip chip, and fan-out wafer level packaging. Based on device, the system in package market has been classified into RF front-end, RF power amplifier, PMIC, MEMS, application processor, baseband processor, and others. The market on the basis of application has been segmented into consumer electronics, communications, automotive & transportation, industrial, aerospace & defense, healthcare, and emerging and others.

Key Benefits of Buying the Report:

  •   Illustrative segmentation, analysis, and forecast for the market on the basis of packaging technology, package type, packaging method, device, application, and geography have been conducted to give the overall view of the system in package market.
  •   The value chain analysis is provided to provide an in-depth insight into the system in package market.
  •   The major drivers, restraints, opportunities, and challenges for the system in package market have been detailed in this report.
  •   The report includes a detailed competitive landscape, in-depth DIVE analysis, and revenue of the key players.


目次

1 INTRODUCTION 13
1.1 OBJECTIVES OF THE STUDY 13
1.2 DEFINITION 13
1.3 MARKET SEGMENTATION 14
1.3.1 MARKETS COVERED 14
1.3.2 GEOGRAPHIC SCOPE 15
1.3.3 YEARS CONSIDERED FOR THE STUDY 15
1.4 CURRENCY 15
1.5 LIMITATIONS 16
1.6 MARKET STAKEHOLDERS 16

2 RESEARCH METHODOLOGY 17
2.1 RESEARCH DATA 17
2.1.1 SECONDARY DATA 18
2.1.1.1 Secondary sources 18
2.1.2 PRIMARY DATA 18
2.1.2.1 Primary sources 19
2.1.2.2 Key industry insights 20
2.1.2.3 Breakdown of primaries 20
2.2 MARKET SIZE ESTIMATION 21
2.2.1 BOTTOM-UP APPROACH 22
2.2.2 TOP-DOWN APPROACH 23
2.3 MARKET BREAKDOWN AND DATA TRIANGULATION 24
2.4 RESEARCH ASSUMPTIONS 25

3 EXECUTIVE SUMMARY 26

4 PREMIUM INSIGHTS 31
4.1 ATTRACTIVE OPPORTUNITIES IN THE SIP MARKET 31
4.2 SIP MARKET, BY PACKAGING TECHNOLOGY 31
4.3 SIP MARKET, BY REGION AND APPLICATION 32
4.4 SIP MARKET, BY REGION 33
4.5 SIP MARKET SIZE, BY PACKAGING METHOD, 2017-2023 33
4.6 SIP MARKET, BY PACKAGE TYPE 34
-
5 MARKET OVERVIEW 35
5.1 INTRODUCTION 35
5.2 MARKET DYNAMICS 35
5.2.1 DRIVERS 35
5.2.1.1 Growing demand for miniaturization of electronic devices 35
5.2.1.2 Impact of Internet of Things (IoT) 36
5.2.1.3 Reduced time-to-market 36
5.2.2 RESTRAINTS 37
5.2.2.1 Higher level of integration leads to thermal issues 37
5.2.3 OPPORTUNITIES 37
5.2.3.1 Potential use of RF components in developing advanced 5G infrastructure 37
5.2.4 CHALLENGES 37
5.2.4.1 Effective supply chain management 37
5.3 VALUE CHAIN ANALYSIS 38
5.4 COMPARISON OF TECHNOLOGY 40
5.4.1 BENCHMARKING OF SIP AND SOC 40
5.4.2 MARKET TRENDS FOR SIP 40
5.4.3 MARKET TRENDS FOR SOC 40

6 SIP MARKET, BY PACKAGING TECHNOLOGY 41
6.1 INTRODUCTION 42
6.2 2D IC PACKAGING TECHNOLOGY 44
6.3 2.5D IC PACKAGING TECHNOLOGY 45
6.4 3D IC PACKAGING TECHNOLOGY 46

7 SIP MARKET, BY PACKAGE TYPE 47
7.1 INTRODUCTION 48
7.2 BALL GRID ARRAY (BGA) 49
7.2.1 PLASTIC BALL GRID ARRAY (PBGA) 50
7.2.2 SUPER BALL GRID ARRAY (SBGA) 50
7.2.3 FINE PITCH BALL GRID ARRAY (FBGA) 50
7.2.4 FLIP CHIP BALL GRID ARRAY (FCBGA) 50
7.2.5 OTHERS 50
7.3 SURFACE MOUNT PACKAGE 51
7.3.1 LAND GRID ARRAY (LGA) 51
7.3.2 CERAMIC COLUMN GRID ARRAY (CCGA) 51
7.3.3 OTHERS 52
7.4 PIN GRID ARRAY (PGA) 52
7.4.1 FLIP CHIP PIN GRID ARRAY (PGA) 52
7.4.2 CERAMIC PIN GRID ARRAY (CPGA) 52
7.4.3 OTHERS 53
7.5 FLAT PACKAGE (FP) 53
7.5.1 QUAD FLAT NO-LEADS (QFN) 53
7.5.2 ULTRA THIN QUAD FLAT NO-LEADS (UTQFN) 53
7.5.3 OTHERS 54
7.6 SMALL OUTLINE PACKAGE 54
7.6.1 THIN SMALL OUTLINE PACKAGE (TSOP) 54
7.6.2 THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP) 54
7.6.3 OTHERS 55

8 SIP MARKET, BY PACKAGING METHOD 56
8.1 INTRODUCTION 57
8.2 WIRE BOND AND DIE ATTACH 58
8.3 FLIP CHIP 59
8.4 FAN-OUT WAFER LEVEL PACKAGING (FOWLP) 60
8.5 COMPARISON OF WIRE BOND, FLIP CHIP, AND FOWLP PACKAGING METHODS 61
8.6 ADVANTAGES AND LIMITATIONS OF WIRE BOND, FLIP CHIP, AND FOWLP PACKAGING METHODS 62
8.7 TRENDS IN EACH PACKAGING METHOD 63

9 SIP MARKET, BY DEVICE 64
9.1 INTRODUCTION 65
9.2 POWER MANAGEMENT INTEGRATED CIRCUIT (PMIC) 67
9.3 MICROELECTROMECHANICAL SYSTEMS (MEMS) 68
9.4 RF FRONT-END 70
9.5 RF POWER AMPLIFIER 71
9.6 BASEBAND PROCESSOR 72
9.7 APPLICATION PROCESSOR 73
9.8 OTHERS 74

10 SIP MARKET, BY APPLICATION 76
10.1 INTRODUCTION 77
10.2 CONSUMER ELECTRONICS 79
10.3 COMMUNICATIONS 80
10.4 INDUSTRIAL 81
10.5 AUTOMOTIVE & TRANSPORTATION 82
10.6 AEROSPACE & DEFENSE 83
10.7 HEALTHCARE 84
10.8 EMERGING & OTHERS 85
-
11 SIP MARKET, BY GEOGRAPHY 87
11.1 INTRODUCTION 88
11.2 APAC 89
11.2.1 CHINA AND TAIWAN 90
11.2.2 JAPAN 91
11.2.3 SOUTH KOREA 91
11.2.4 REST OF APAC 91
11.3 NORTH AMERICA 92
11.3.1 US 93
11.3.2 CANADA 94
11.3.3 MEXICO 94
11.4 EUROPE 95
11.4.1 GERMANY 96
11.4.2 FRANCE 96
11.4.3 REST OF EUROPE 97
11.5 ROW 97
11.5.1 MIDDLE EAST AND AFRICA 98
11.5.2 SOUTH AMERICA 98

12 COMPETITIVE LANDSCAPE 99
12.1 INTRODUCTION 99
12.2 RANKING ANALYSIS OF MARKET PLAYERS 100
12.3 COMPETITIVE SCENARIO 101
12.3.1 BATTLE FOR THE MARKET SHARE 102
12.3.2 PRODUCT LAUNCHES AND DEVELOPMENTS 102
12.3.3 AGREEMENTS, COLLABORATIONS, PARTNERSHIPS, AND JOINT VENTURES 103
12.3.4 ACQUISITIONS AND EXPANSIONS 104

13 COMPANY PROFILES 105
(Overview, Service offered, Strength of Product Portfolio, Business Strategy Excellence, Recent Developments, and Key Relationships)*
13.1 AMKOR TECHNOLOGY 105
13.2 ASE GROUP 109
13.3 CHIPBOND TECHNOLOGY 113
13.4 CHIPMOS TECHNOLOGIES 116
13.5 FATC 119
13.6 INTEL 121
13.7 JCET 124
13.8 POWERTECH TECHNOLOGY 127
13.9 SAMSUNG ELECTRONICS 131
13.10 SPIL 134
13.11 TEXAS INSTRUMENTS 137
13.12 UNISEM 140
13.13 UTAC (GLOBAL A&T ELECTRONICS) 143
*Details on Overview, Service offered, Strength of Product Portfolio, Business Strategy Excellence, Recent Developments, and Key Relationships* might not be captured in case of unlisted companies.

14 APPENDIX 146
14.1 DISCUSSION GUIDE 146
14.2 KNOWLEDGE STORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 149
14.3 INTRODUCING RT: REAL-TIME MARKET INTELLIGENCE 151
14.4 AVAILABLE CUSTOMIZATIONS 153
14.5 RELATED REPORTS 153
14.6 AUTHOR DETAILS 154

 

LIST OF TABLES

TABLE 1 recent iot acquisition 36
TABLE 2 sip MARKET, BY packaging technology, 2015-2023 (USD MILLION) 43
TABLE 3 sip market, BY package type, 2015-2023 (USD MILLION) 49
TABLE 4 sip market for bga, by PACKAGE SUBTYPE, 2015-2023 (USD MILLION) 50
TABLE 5 sip market for smt, by PACKAGE SUBTYPE, 2015-2023 (USD MILLION) 52
TABLE 6 sip market for pga, by PACKAGE SUBTYPE, 2015-2023 (USD MILLION) 53
TABLE 7 sip market for fp, by PACKAGE SUBTYPE, 2015-2023 (USD MILLION) 54
TABLE 8 sip market for sop, by PACKAGE SUBTYPE, 2015-2023 (USD MILLION) 55
TABLE 9 sip MARKET, BY packaging method, 2015-2023 (USD MILLION) 58
TABLE 10 sip MARKET for wire bond and die attach, BY device,
2015-2023 (USD MILLION) 59
TABLE 11 sip MARKET for flip chip, BY device, 2015-2023 (USD MILLION) 60
TABLE 12 sip MARKET for FOWLP, BY device, 2015-2023 (USD MILLION) 60
TABLE 13 sip market, BY device, 2015-2023 (Billion units) 66
TABLE 14 sip market, BY device, 2015-2023 (USD MILLION) 67
TABLE 15 sip market size for pmic, BY application, 2015-2023 (USD MILLION) 67
TABLE 16 sip market size for pmic, BY packaging method, 2015-2023 (USD MILLION) 68
TABLE 17 sip market size for mems, BY application, 2015-2023 (USD MILLION) 69
TABLE 18 sip market size for MEMS, BY packaging method,
2015-2023 (USD MILLION) 69
TABLE 19 sip market size for rf front-end, BY application,
2015-2023 (USD MILLION) 70
TABLE 20 sip market size for RF Front-end, BY packaging method,
2015-2023 (USD MILLION) 70
TABLE 21 sip market size for rf power amplifier, BY application,
2015-2023 (USD MILLION) 71
TABLE 22 sip market size for RF power amplifier, BY packaging method, 2015-2023 (USD MILLION) 71
TABLE 23 sip market size for baseband processor, BY application,
2015-2023 (USD MILLION) 72
TABLE 24 sip market size for baseband processor, BY packaging method, 2015-2023 (USD MILLION) 72
TABLE 25 sip market size for application processor, BY application,
2015-2023 (USD MILLION) 73
TABLE 26 sip market size for application processor, BY packaging method, 2015-2023 (USD MILLION) 74
TABLE 27 sip market size for others, BY application, 2015-2023 (USD MILLION) 74
TABLE 28 sip market size for others, BY packaging method,
2015-2023 (USD MILLION) 75
TABLE 29 sip market, BY application, 2015-2023 (USD MILLION) 78
TABLE 30 sip market for consumer electronics, BY device,
2015-2023 (USD MILLION) 79
TABLE 31 sip market for consumer electronics, BY region,
2015-2023 (USD MILLION) 79
TABLE 32 sip market for communications, BY device, 2015-2023 (USD MILLION) 80
TABLE 33 sip market for communications, BY region, 2015-2023 (USD MILLION) 80
TABLE 34 sip market for industrial, BY device, 2015-2023 (USD MILLION) 81
TABLE 35 sip market for industrial, BY region, 2015-2023 (USD MILLION) 81
TABLE 36 sip market for automotive & transportation, BY device,
2015-2023 (USD MILLION) 82
TABLE 37 sip market for automotive & transportation, BY region,
2015-2023 (USD MILLION) 82
TABLE 38 sip market for aerospace & defense, BY device, 2015-2023 (USD MILLION) 83
TABLE 39 sip market for aerospace & defense, BY region,
2015-2023 (USD MILLION) 83
TABLE 40 sip market for healthcare, BY device, 2015-2023 (USD MILLION) 84
TABLE 41 sip market for healthcare, BY region, 2015-2023 (USD MILLION) 85
TABLE 42 sip market for EMERGING & others, BY device, 2015-2023 (USD MILLION) 85
TABLE 43 sip market for emerging & others, BY region, 2015-2023 (USD MILLION) 86
TABLE 44 sip MARKET, BY geography, 2015-2023 (USD MILLION) 88
TABLE 45 sip MARKET size in apac, BY country, 2015-2023 (USD MILLION) 90
TABLE 46 sip MARKET size in apac, BY application, 2015-2023 (USD MILLION) 90
TABLE 47 sip MARKET size in north america, BY country, 2015-2023 (USD MILLION) 93
TABLE 48 sip MARKET size in north america, BY application,
2015-2023 (USD MILLION) 93
TABLE 49 sip MARKET size in europe, BY country, 2015-2023 (USD MILLION) 96
TABLE 50 sip MARKET size in europe, BY application, 2015-2023 (USD MILLION) 96
TABLE 51 sip MARKET size in row, BY country, 2015-2023 (USD MILLION) 97
TABLE 52 sip MARKET size in row, BY application, 2015-2023 (USD MILLION) 97
TABLE 53 Ranking of TOP 5 PLAYERS IN THE Sip MARKET, 2016 100
TABLE 54 10 key product Launches, pRODUCT developments, AND TECHNOLOGY DEVELOPMENTS 102
TABLE 55 10 key agreements, COLLABORATIONS, PARTNERSHIPS, AND joint ventures 103
TABLE 56 5 key acquisitions and expansions 104

 

LIST OF FIGURES

FIGURE 1 SIP MARKET SEGMENTATION 14
FIGURE 2 SIP MARKET: RESEARCH DESIGN 17
FIGURE 3 RESEARCH FLOW OF MARKET SIZE ESTIMATION 21
FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH 22
FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH 23
FIGURE 6 DATA TRIANGULATION 24
FIGURE 7 SIP MARKET FOR 3D IC PACKAGING TECHNOLOGY EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD 26
FIGURE 8 SIP MARKET FOR FOWLP PACKAGING METHOD EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD 27
FIGURE 9 RF FRONT-END DEVICE EXPECTED TO HOLD THE LARGEST SIZE OF SIP MARKET FOR PACKAGING METHODS IN 2017 28
FIGURE 10 SIP MARKET FOR HEALTHCARE APPLICATION EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD 29
FIGURE 11 APAC EXPECTED TO HOLD THE LARGEST MARKET SHARE IN 2017 30
FIGURE 12 INCREASING DEMAND FOR MINIATURIZATION ALONG WITH HIGH-PERFORMANCE ELECTRONIC DEVICES DRIVES THE GROWTH OF THE SIP MARKET 31
FIGURE 13 2D IC PACKAGING TECHNOLOGY EXPECTED TO HOLD THE LARGEST MARKET SIZE DURING THE FORECAST PERIOD 31
FIGURE 14 CONSUMER ELECTRONICS APPLICATION AND RF FRONT-END DEVICE EXPECTED TO HOLD THE LARGEST SHARE OF THE SIP MARKET BY 2023 32
FIGURE 15 SIP MARKET IN ROW EXPECTED TO GROW AT THE HIGHEST CAGR
DURING 2017-2023 33
FIGURE 16 FOWLP PACKAGING EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD 33
FIGURE 17 BGA PACKAGING EXPECTED TO HOLD THE LARGEST SIZE OF THE SIP MARKET DURING THE FORECAST PERIOD 34
FIGURE 18 VALUE CHAIN ANALYSIS OF THE SIP MARKET 38
FIGURE 19 SIP MARKET, BY PACKAGING TECHNOLOGY 42
FIGURE 20 SIP MARKET FOR 3D IC PACKAGING TECHNOLOGY EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD 43
FIGURE 21 STRUCTURE OF 2D IC PACKAGING TECHNOLOGY 44
FIGURE 22 STRUCTURE OF 2.5D IC PACKAGING TECHNOLOGY 45
FIGURE 23 STRUCTURE OF 3D IC PACKAGING TECHNOLOGY 46
FIGURE 24 SIP MARKET, BY PACKAGE TYPE 48
FIGURE 25 SIP MARKET FOR SOP PACKAGING EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD 49
FIGURE 26 SIP MARKET, BY PACKAGING METHOD 57
FIGURE 27 SIP MARKET FOR FOWLP PACKAGING METHOD EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD 58
FIGURE 28 SIP MARKET, BY DEVICE 65
FIGURE 29 SIP MARKET FOR MEMS EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD 66
FIGURE 30 AUTOMOTIVE & TRANSPORTATION APPLICATION MARKET FOR MEMS EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD 68
FIGURE 31 SIP MARKET, BY APPLICATION 77
FIGURE 32 SIP MARKET FOR HEALTHCARE APPLICATION EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD 78
FIGURE 33 APAC MARKET FOR HEALTHCARE APPLICATION EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD 84
FIGURE 34 SIP MARKET IN APAC EXPECTED TO HOLD THE LARGEST SIZE IN 2017 88
FIGURE 35 APAC: SNAPSHOT OF SIP MARKET 89
FIGURE 36 NORTH AMERICA: SNAPSHOT OF SIP MARKET 92
FIGURE 37 EUROPE: SNAPSHOT OF SIP MARKET 95
FIGURE 38 COMPANIES ADOPTED AGREEMENTS, COLLABORATIONS, PARTNERSHIPS, JOINT VENTURES AS KEY GROWTH STRATEGIES BETWEEN
JANUARY 2013 AND OCTOBER 2017 99
FIGURE 39 SIP MARKET EVALUATION FRAMEWORK 101
FIGURE 40 AMKOR TECHNOLOGY: COMPANY SNAPSHOT 105
FIGURE 41 ASE GROUP: COMPANY SNAPSHOT 109
FIGURE 42 CHIPBOND TECHNOLOGY: COMPANY SNAPSHOT 113
FIGURE 43 CHIPMOS TECHNOLOGIES: COMPANY SNAPSHOT 116
FIGURE 44 FATC: COMPANY SNAPSHOT 119
FIGURE 45 INTEL: COMPANY SNAPSHOT 121
FIGURE 46 JCET: COMPANY SNAPSHOT 124
FIGURE 47 POWERTECH TECHNOLOGY: COMPANY SNAPSHOT 127
FIGURE 48 SAMSUNG ELECTRONICS: COMPANY SNAPSHOT 131
FIGURE 49 SPIL: COMPANY SNAPSHOT 134
FIGURE 50 TEXAS INSTRUMENTS: COMPANY SNAPSHOT 137
FIGURE 51 UNISEM: COMPANY SNAPSHOT 140
FIGURE 52 UTAC: COMPANY SNAPSHOT 143

 

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プレスリリース

[プレスリリース原文]

System in Package Market worth 9.07 Billion USD by 2023


November 30, 2017

According to the new market research report "System in Package Market by Packaging Technology (2D IC, 2.5D IC, 3D IC), Package Type (BGA, SOP), Packaging Method (Flip Chip, Wire Bond), Device (RF Front-End, RF Amplifier), Application (Consumer Electronics, Communications) - Global Forecast to 2023", the system in package market is expected to grow from USD 5.79 Billion in 2017 to USD 9.07 Billion by 2023, at a CAGR of 9.4%. The factors that are driving the growth of this market are the growing demand for miniaturization of electronics devices, the impact of Internet of Things (IoT), and reduced time-to-market.

“System in package market for 3D IC expected to grow at the highest rate during the forecast period”

The market for 3D IC is expected to grow at the highest CAGR between 2017 and 2023. The growth of this market is mainly driven by the increasing need for advanced architecture in electronics products, growing need for miniaturized electronic devices, and growing use of tablets, smartphones, and gaming devices.

“System in package market for FOWLP expected to grow at the highest rate during the forecast period”

The market for FOWLP is expected to grow at the highest CAGR between 2017 and 2023. This growth is mainly attributed to the rising demand for semiconductor ICs for IoT application that allows devices to assemble data using sensors and actuators and transmit data to a centralized location on a real-time basis.

“The consumer electronics application expected to lead the system in package market between 2017 and 2023”

Among various applications, the consumer electronics application expected to account the largest size of the overall system in package market between 2017 and 2023. Consumer electronics products, such as mobile phones, tablets, netbook PCs, digital video cameras, navigation devices, and gaming controllers, are adopting the advanced architecture. Moreover, these products address features that increase the demand for miniaturized electronic devices with improved performance in consumer electronics. With all this development in the consumer electronics application, the demand for system in package would also rise.

“APAC expected to lead the system in package market between 2017 and 2023”

APAC is expected to hold the largest size of the system in package market during the forecast period. The major factors driving the market in APAC are the presence of major semiconductor foundries and outsourced semiconductor assembly and test (OSAT) players including TSMC (Taiwan), UMC (Taiwan), ASE Group (Taiwan), SPIL (Taiwan), and JCET (China), proximity to major downstream electronics manufacturing operations, government-sponsored infrastructure support, tax incentives, and availability of skilled engineers and labor at a relatively low cost.

ASE Group (Taiwan), Amkor Technology (US), JCET (China), Chipmos Technologies (Taiwan), Chipbond Technology (Taiwan), KYEC (Taiwan), Intel (US), Samsung Electronics (South Korea), Texas Instruments (US), and Signetics (South Korea) are the major players operating in the system in package market.

 

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