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米国の調査会社ライトリーディング社の調査レポート「4Gの市場:モバイルWiMaxとLTEの組み込みモジュール」は、モバイルWiMAXとLTE向けの組み込みモジュールに関連する主な技術とビジネス事項に焦点を当て、進化する4G市場を分析している。モバイル技術のトップサプライや9社のプロファイルを記載し、4Gサービスと組み込みデバイスの戦略を考察している。

This report analyzes the evolving 4G market, focusing on the key technical and commercial issues affecting embedded modules based on mobile WiMax and LTE. The report includes profiles of nine leading suppliers of mobile technologies and explores their strategies for 4G services and embedded devices.

概要

Demand for 3G mobile data service has been driven not by mobile handsets, but by laptops equipped with data cards, universal serial bus (USB) dongles, and embedded modules. It's already clear that embedded modules will be an essential ingredient in the success of forthcoming data services based on next-generation mobile WiMax and Long Term Evolution (LTE) technologies.

For those so-called 4G data services to succeed, however, embedded technologies must find their way into a wider range of end-user devices – not just notebooks and handsets, but also consumer electronics, surveillance cameras, automotive communications systems, and more. The ultimate key to success will be the ability of chip makers to develop higher-performance, lower-power, smaller, and cheaper chips. The brains to develop these chips are arguably out there, but the economies of scale needed to drive down costs will only come with sufficient demand, which is linked to network coverage – which, in turn, is linked to a complex mix of spectrum, technology, intellectual property rights, and industrial politics.

Progress toward a robust mobile data services future is being made. The 3.5G High Speed Packet Access (HSPA) technology – positioned as a stepping stone to LTE – offers higher data speeds and lower latency. The system is also flanked with a broad array of mobile data devices and suppliers as well as new flat-rate services, all aimed at enhancing the user experience. The GSM community's vision of LTE, with Ericsson as one of its biggest cheerleaders, is to multiply the HSPA user experience by a factor of four or more.

Pre-4G networks are evolving on such similar technology paths that they are presently best distinguished by time-to-market, ecosystems, and business models. Mobile data devices, particularly embedded modules, will be the major focus, as these will play a crucial role in kick-starting the next-generation mobile broadband technologies.

This report analyzes the evolving 4G market, focusing on the key technical and commercial issues affecting embedded modules based on mobile WiMax and LTE. It evaluates the ecosystems and business models for LTE and mobile WiMax within the framework of decisions that device makers must take regarding which, if any, embedded systems to build into their products. The report explores the primary issues that will affect the deployment of embedded modules, including spectrum requirements, intellectual property rights, pricing, and chip requirements. The report includes profiles of nine leading suppliers of mobile technologies and explores their strategies for 4G services and embedded devices.

4G Inside: Embedded Modules for Mobile WiMax & LTE provides critical insight and analysis for a range of industry participants, including:

			Mobile network operators needing insight into the development of technologies and products that will enable rapid uptake of 4G data services, and the timing for when those products will become available
			Chip suppliers looking for an independent assessment of the market opportunity for embedded mobile WiMax and LTE modules
			Mobile device makers needing a competitive overview of the emerging embedded 4G module sector
			Investors seeking a better understanding of how the mobile WiMax and LTE sectors will develop, and which technology suppliers are most likely to emerge as the winners

Sample research data from the report is shown in the excerpts below: HSPA is widely viewed as a precursor to LTE, and the 3.5G data-centric technology shows signs of developing a versatile family of 4G semiconductor vendors. Eight chip makers are now supplying HSPA chipsets. Dozens more are manufacturing data cards and USB sticks. At present, the GSMA lists more than 500 HSPA-enabled devices from more than 100 suppliers. The following table offers an overview of HSPA activity. 拡大図

• Companies analyzed in this report include: Ericsson AB (Nasdaq: ERIC); Icera Inc.; Intel Corp. (Nasdaq: INTC); Motorola Inc. (NYSE: MOT); Nokia Corp. (NYSE: NOK); Nortel Networks Corp. (NYSE/Toronto: NT); Qualcomm Inc. (Nasdaq: QCOM); Texas Instruments Inc. (NYSE: TXN); and Wavesat Inc.

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Table of Contents

I. Introduction: 4G Inside
II. The Evolving 4G Market
	■Core 4G Technologies
	■Issues Affecting Embedded Modules
		・Spectrum
		・IPR
		・Pricing
		・Chips
	■Cards, Dongles, Embedded Modules
Ⅲ.Ecosystems
	■Mobile WiMax
	■LTE
Ⅳ. Business Models
	■Mobile WiMax
	■LTE
Ⅴ. Vendor Profiles
	■Ericsson
	■Icera
	■Intel
	■Motorola
	■Nokia
	■Nortel
	■Qualcomm
	■Texas Instruments
	■Wavesat
Ⅶ. Conclusion