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イーサネットスイッチとPHYチップのガイド 第8版

A Guide to Ethernet Switch and PHY Chips
Eighth Edition

 

出版社 出版日冊子体+電子媒体
(05/23 レート)
リンレイグループ社 2011年11月US$ 3,495
\297,102(税込)
ライセンス別価格

サマリー

この調査レポートは、イーサネットスイッチとPHYチップ市場を幅広く調査し、多種多様な頭字語とイーサネット規格を理解する上で有用な情報を数多く掲載する、イーサネットスイッチとPHYチップの手引書です。ギガビットイーサネットシリコンも調査対象としており、関連製品の一般的な属性についても調査しています。

主な掲載内容 (目次より抜粋)

  • ネットワークと機器
  • イーサネット技術
  • 高速設計
  • ギガビットイーサネットと10ギガビットイーサネットチップ
  • 技術と市場動向
  • 市場概観
  • 関連企業情報
  • その他スイッチチップベンダ
  • 10ギガビットPHYベンダ
  • スイッチとPHYの比較

Evaluating and Comparing the Latest Ethernet Switches and PHY Chips

The Ethernet market is marked by technology transitions, which often result in large shifts in vendor share. In Ethernet switches, 10 Gigabit Ethernet (10GbE) shipments are growing quickly, with Broadcom, Marvell, and Intel (formerly Fulcrum) competing to establish a leadership position. These vendors are adding more features, increasing port counts, and reducing power dissipation. Broadcom and Marvell are also the leaders for Gigabit Ethernet switch chips. The market for 10GbE PHY chips is even more competitive, with several vendors vying to establish an early leadership position. In some cases, large vendors have acquired startups to fill holes, while at the same time, PHY vendors continue to raise new funding.

With the adoption of 10GbE in servers within the data center, it is necessary to have aggregation switches that support higher data rates. The IEEE has published specifications for 40GbE and 100GbE, and we expect these specifications to be adopted in the data center as well as in telecommunication applications. The leading vendors have already sampled switch and PHY products that support 40GbE and 100GbE?and more are expected to follow.

Ethernet is riding its success from LAN to access and metro markets with service providers migrating from circuit switched networks to Carrier Ethernet. Instead of competing directly with the established vendors, vendors such as Xelerated and Ethernity are entering with Carrier Ethernet products. The combination of new investment and a large number of suppliers is serving to make the Ethernet switch and PHY market increasingly competitive. "A Guide to Ethernet Switch and PHY Chips" breaks this market into five key segments:

  • GbE switch chips
  • 10GbE switch chips
  • Carrier-Ethernet switches
  • 10GbE PHYs for copper and optical media
  • 10GbE (KR) backplane transceivers
  • 40GbE and 100GbE PHYs

Unlike typical market research, this report provides technology analysis and head-to-head product comparisons. Which chips will win designs and why? How will these vendors be positioned as GbE, 10GbE, and 100GbE continue to grow? Only The Linley Group’s unique technology analysis can provide this forward-looking view.

We Sort Out the Technology and the Key Vendors

“A Guide to Ethernet Switch and PHY Chips” begins with an extensive overview of this growing market. The report provides tutorials that help you decipher the myriad of acronyms and Ethernet standards. We explore the target markets and applications for Ethernet silicon, followed by an explanation of the common attributes of these products.

Following these introductory chapters, the report delivers a complete chapter on five major vendors that offer products in multiple segments: AppliedMicro, Broadcom, Intel, Marvell, and Vitesse. Each major-vendor chapter includes company background information, full details of announced products, a discussion of the vendor’s roadmap where available, and our conclusions about the vendor and its products. Then, for each product segment, we include a chapter covering other vendors and a chapter comparing the products in the segment.

Product-segment chapters include coverage of switch chips and PHY chips. We cover switch chips from Centec, Ethernity, Mellanox, and Xelerated. For the physical layer, we cover 10Gbps optical PHYs and backplane PHYs from Cortina and NetLogic. The PHY section also covers 10Gbps Ethernet-over-copper chips from Aquantia and PLX Technology. In addition, this section discusses 100Gbps gearbox PHYs from Semtech and Inphi. Finally, we offer our outlook for the leading vendors in each segment and for the overall market.

Make Informed Decisions

As the leading vendor of technology analysis for networking silicon, The Linley Group has the expertise to deliver a comprehensive look at the full range of chips designed for GbE/10GbE/100GbE applications. Senior analysts Jag Bolaria and Bob Wheeler use their broad experience to deliver the deep technical analysis and strategic information you need to make informed business decisions.

Whether you are looking for the right Ethernet chip for your application or seeking to partner with or invest in a chip vendor, this report will cut your research time and save you money. Make the intelligent decision, order "A Guide to Ethernet Switch and PHY Chips" today.

This report is written for:

  • Engineers designing Ethernet switch products or systems that embed an Ethernet controller or switch
  • Marketing and engineering staff at companies that sell related chips who need more information on Ethernet chips
  • Technology professionals who wish an introduction to Ethernet chips
  • Financial analysts who desire a detailed analysis and comparison of GbE, 10GbE, and 100GbE semiconductor companies and their chances of success
  • Press and public-relations professionals who need to get up to speed on this technology

What's New in This Edition

Updates to the Eighth Edition of "A Guide to Ethernet Switch and PHY Chips"

"A Guide to Ethernet Switch and PHY Chips" has been updated to incorporate new announcements made since the release of the previous edition.

  • Coverage of new Carrier Ethernet switches from Broadcom and Vitesse
  • New coverage of Mellanox and its 10GbE/40GbE switches
  • Coverage of new 10Gbps Ethernet-over-copper chips from Broadcom and Marvell
  • Coverage of new 10GbE switch chips from Broadcom and Marvell
  • Coverage of new 10Gbps Optical PHYs from Broadcom, Cortina, and NetLogic
  • Coverage of 100Gbps gearbox PHYs from AppliedMicro, Inphi, and Semtech
  • 2010 market size and vendor share for GbE/10GbE switch chips and GbE PHYs
  • Market forecast for GbE/10GbE switch, GbE/10GbE PHY chips, and 40GbE/100GbE ports from 2010 - 2015
  • Product comparisons updated to include the latest chips

This market changes rapidly, don't be left behind!



目次

Table of Contents

List of Figures
List of Tables
About the Authors
About the Publisher
Preface
Executive Summary

Chapter 1. Networks and Equipment

LAN
Evolution of Ethernet LANs
Cable Plants
Ethernet Clients
Data Centers
Carrier Networks
Ethernet Equipment
SMB Switches
Desktop Switches
Top-of-Rack Switches
Modular LAN Switches
Carrier Ethernet Switch/Routers
Wireline-Access Equipment
Wireless Access Equipment

Chapter 2. Ethernet Technology

Network Layers and IEEE 802 Standards
Link Layers
Carrier Ethernet
Ethernet Physical Layers
Physical-Layer Interfaces
Optical Modules
Related Protocols
System Interfaces

Chapter 3. High-Speed Design Issues

Signal Integrity
PCB and Connectors
Signal Conditioning
Clock and Data Recovery

Chapter 4. Gigabit and 10G Ethernet Chips

Switch Chips
Common Characteristics
Performance
System Design
Software Considerations
GbE-Over-Copper PHYs
Common Characteristics
10Gbps Ethernet PHYs
Optical-Module Architecture
Optical-PHY Architecture and Common Characteristics
Copper-PHY Architecture and Common Characteristics
Interoperability and Compliance
Performance

Chapter 5. Technology and Market Trends

Technology Trends
Switch Chips
10GBase-T PHY Chips
10G Optical-PHY Chips
Emerging Technologies
Data-Center Technologies
Virtualization Support
Carrier Ethernet
Physical-Layer Developments
Market Trends
Data Centers
Blade Servers
Ethernet Backplanes for Embedded Applications

Chapter 6. Market Outlook

Market Size and Forecast
GbE Switches
10GbE Switches
Merchant Switch Chips
10GbE PHYs
40GbE and 100GbE Outlook
Market Share

Chapter 7. AppliedMicro

Company Background
10Gbps PHYs
Optical Transceivers
Copper Transceivers
100Gbps Gearbox Transceiver
Switch Products
Conclusions

Chapter 8. Broadcom

Company Background
GbE Switch Chips
10GbE Switch Chips
Switch Fabrics
Sand Fabric
10Gbps PHYs
Optical Transceivers
Backplane KR Transceivers
Copper Transceivers
Product Roadmap
Conclusions

Chapter 9. Intel (Fulcrum)

Company Background
Key Features and Performance
Design Details
Conclusions

Chapter 10. Marvell

Company Background
Switch Chips
Enterprise and Carrier Ethernet Switch Chips
Data-Center Switch Chips
System Design
Product Roadmap
Conclusions

Chapter 11. Vitesse

Company Background
Carrier Ethernet Switch Chips
Design Details
10Gbps PHYs
Conclusions

Chapter 12. Other Switch-Chip Vendors

Centec

Company Background
Key Features and Performance
Conclusions

Ethernity

Company Background
Key Features and Performance
Design Details
Conclusions

Mellanox

Company Background
Key Features and Performance
Conclusions

QLogic

Xelerated

Company Background
Key Features and Performance
Internal Architecture
System Design
Conclusions

Chapter 13. 10Gbps PHY Vendors

Aquantia

Company Background
Key Features and Performance
Conclusions

Cortina

Company Background
Key Features and Performance
Conclusions

Inphi

NetLogic
Company Background
Key Features and Performance
Conclusions

PLX Technology

Company Background
Key Features and Performance
Conclusions

Semtech

Chapter 14. Switch and PHY Comparisons

Comparing GbE and 10GbE Switch Chips
10GbE Switch Chips
GbE Switch Chips with 10GbE Uplinks
Carrier Ethernet Switch Chips
Comparing 10Gbps PHYs
Optical Transceivers
10GBase-KR Transceivers
10GBase-T Copper PHYs
Conclusions

Chapter 15. Conclusions

Market Directions
LAN GbE Switch-Vendor Outlook
Carrier Ethernet Switch-Vendor Outlook
10GbE Switch and Fabric Vendors
10GbE PHY Vendors
40GbE and 100GbE PHY Vendors
Closing Thoughts

Appendix: Further Reading
Index

List of Figures

Figure 1 1. Typical LAN architecture.
Figure 1 2. Typical data-center components. (Source: Emulex)
Figure 1 3. Generic network architecture.
Figure 2 4. IEEE 802 standards. (Source: IEEE 802)
Figure 2 5. IEEE 802.3 basic frame format.
Figure 2 6. VPLS switch conceptual model. AC=attachment circuit. (Source: TPack with permis-sion from Lightwave)
Figure 2 7. Hierarchical traffic management.
Figure 2 8. Ethernet physical layer. xMII can be GMII, SGMII, CGMII, or XLGMII, depending on the data rate.
Figure 2 9. 10G Ethernet physical layer. (Source: IEEE 802)
Figure 2 10. Layer model for 40G/100G Ethernet. (Source: IEEE 802.3ba)
Figure 2 11. Modules and interfaces for 10Gbps applications.
Figure 2 12. 40GbE and 100GbE modules and interfaces.
Figure 3 13. Transmitted data eye (left) and received data eye (right) after two connectors and 40 inches. (Source: LSI Logic)
Figure 3 14. Transmitted eye with pre-emphasis (left) and received eye (right). (Source: LSI Logic)
Figure 3 15. Impulse response and equalization.
Figure 3 16. Conceptual diagram of a phase-locked loop.
Figure 4 17. Block diagram of a typical GbE switch.
Figure 4 18. Single-port GbE PHY simplified block diagram.
Figure 4 19. Architecture of a generic SFP+ optical module.
Figure 4 20. 10Gbps serdes architecture.
Figure 4 21. Block diagram of a generic 10GBase-T PHY.
Figure 6 22. Forecast for Ethernet switch chips, 2010?2015. Data does not include ASICs. M=millions.
Figure 6 23. Forecast for 10G Ethernet switch chips, 2010?2015. Revenue excludes ASICs. M=millions.
Figure 6 24. Forecast for 10G Ethernet PHY-port shipments, 2010?2015.
Figure 6 25. Forecast for 40GbE and 100GbE port shipments, 2010?2015. M=millions. Data includes ASICs and ASSPs.
Figure 6 26. Gigabit Ethernet switch-chip and PHY market share, 2009?2010.
Figure 6 27. 10GbE switch revenue, 2009?2010.
Figure 6 28. Optical-PHY market share, 2010.
Figure 8 29. Broadcom 48?GbE+2?10GbE stackable switch.
Figure 9 30. Intel FM6372 internal architecture.
Figure 9 31. Intel FM6372 in a two-stage fat-tree architecture.
Figure 10 32. Marvell 48?GbE+2?10GbE stackable Layer 3 switch.
Figure 11 33. Vitesse 24?GbE+2?10GbE stackable Carrier Ethernet switch.
Figure 11 34. VSC848x equalizer cleaning 10Gbps signal. (Source: Vitesse)
Figure 11 35. Vitesse VSC8248 in a 40GbE application.
Figure 12 36. Centec 48?GbE+4?10GbE Carrier Ethernet switch design.
Figure 12 37. Ethernity Carrier Ethernet application.
Figure 12 38. Xelerated AX340 architecture.
Figure 12 39. Xelerated AX340 in a 16-port GPON line card.

List of Tables

Table 2 1. OSI reference model. (Source: OSI and The Linley Group)
Table 2 2. Ethernet PHY standards. *Depending on the standard used. (Source: IEEE 802)
Table 6 3. Forecast for Fast Ethernet and Gigabit Ethernet switch chips, 2010?2015. Data does not include ASICs. Revenue in millions. (Source: The Linley Group)
Table 6 4. Forecast for 10G Ethernet switch chips, 2010?2015. All data is in millions and excludes ASICs. (Source: The Linley Group)
Table 6 5. Forecast for 10G Ethernet PHY-port shipments, 2010?2015. Data in thousands. (Source: The Linley Group)
Table 6 6. Forecast for 40GbE and 100GbE port shipments, 2010?2015. Includes ASICs and ASSPs. Data in thousands. (Source: The Linley Group)
Table 6 7. Gigabit Ethernet switch-chip and PHY market share, 2009?2010. Totals may not match data due to rounding. (Source: The Linley Group)
Table 6 8. 10GbE switch revenue, 2009?2010. Totals may not match data due to rounding. (Source: The Linley Group)
Table 6 9. Optical-PHY market share, 2010. Totals may not match data due to rounding. (Source: The Linley Group)
Table 7 10. Key parameters for AppliedMicro 10Gbps PHY chips. *Part num-ber is QT2x25-1 for SFP+ version. (Source: AppliedMicro)
Table 7 11. Key parameters for AppliedMicro 10GBase-T PHY chips. (Source: AppliedMicro)
Table 7 12. Key parameters for AppliedMicro 100Gbps gearbox chip. (Source: AppliedMicro)
Table 7 13. Key parameters for AppliedMicro TPX devices. *Requires external PCIe PHY. (Source: AppliedMicro)
Table 8 14. Key parameters for selected Broadcom GbE switch chips. *Using external TCAM. (Source: Broadcom)
Table 8 15. Key parameters for Broadcom data-center switch chips. (Source: Broadcom, except *The Linley Group estimate)
Table 8 16. Key parameters for Broadcom Petra devices. (Source: Broadcom)
Table 8 17. Key parameters for Broadcom XGS Core fabric. *BCM88230/ BCM88235. (Source: Broadcom)
Table 8 18. Key parameters for Broadcom 10Gbps transceivers. *Power with MACSec enabled. (Source: Broadcom, except †The Linley Group estimate)
Table 9 19. Key parameters for selected Intel FM6000 switch chips. *10GbE (XAUI/CX4) ports also support SGMII at 100/1,000/2,500Mbps. (Source: Intel)
Table 10 20. Key parameters for Marvell Prestera-DX enterprise products. (Source: Marvell)
Table 10 21. Key parameters for Marvell Prestera-CX products. (Source: Marvell)
Table 10 22. Key parameters for Marvell optical PHYs. (Source: Marvell)
Table 10 23. Key parameters for Marvell 10GBase-T PHY products. (Source: Marvell)
Table 11 24. Key parameters for Vitesse Carrier Ethernet switch chips. (Source: Vitesse, except *The Linley Group estimate)
Table 11 25. Key parameters for selected Vitesse PHYs. (Source: Vitesse)
Table 12 26. Vendors of GbE and 10GbE switch chips. (Source: vendors)
Table 12 27. Key parameters for Centec Carrier Ethernet switch chips. (Source: Centec)
Table 12 28. Key parameters for Ethernity ENET devices. *RFC2684 Ethernet-to-ATM plus traffic management for a simple IMIX traffic pattern. (Source: Ethernity)
Table 12 29. Key parameters for Mellanox SwitchX chips. *10GbE ports also support SGMII at 1,000Mbps. (Source: Mellanox)
Table 12 30. Key parameters for selected Xelerated switch chips. *Sixteen ports support 2.5Gbps operation. (Source: Xelerated)
Table 13 31. Vendors and status of 10Gbps-and-above Ethernet PHYs. (Source: vendors, except *The Linley Group estimate)
Table 13 32. Key parameters for Aquantia’s 40nm PHY products. (Source: Aquantia)
Table 13 33. Key parameters for Cortina’s CS43xx PHYs. (Source: Cortina, except *The Linley Group estimate)
Table 13 34. Key parameters for Inphi gearbox PHYs. (Source: Inphi)
Table 13 35. Key parameters for NetLogic PHY chips. *Version without XAUI/RXAUI. (Source: NetLogic)
Table 13 36. Key parameters for NetLogic backplane transceivers. (Source: NetLogic)
Table 13 37. Key parameters for PLX second-generation PHY chips. (Source: PLX)
Table 13 38. Key parameters for Semtech gearbox components. (Source Semtech, except *The Linley Group estimate)
Table 14 39. Comparison of 10GbE/40GbE switch chips. (Source: vendors, except *The Linley Group estimate)
Table 14 40. Comparison of 100Gbps-and-above Carrier Ethernet switch chips. (Source: vendors)
Table 14 41. Comparison of Carrier Ethernet switch chips for access applications. (Source: vendors, except *The Linley Group estimate)
Table 14 42. Comparison of 10Gbps EDC components. *With EDC. (Source: vendors)
Table 14 43. Comparison of quad-channel 10Gbps retimers. (Source: vendors)
Table 14 44. Comparison of quad-port 10GBase-T PHY chips. (Source: vendors)

 

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