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※上記はシングルユーザライセンスのPDF(印刷不可)と冊子版1部のセット価格です
目次
価格・ご注文について この調査レポートは、3Gおよび4G向けチップ市場を調査し、通常の携帯電話のほか、フィーチャーフォンやスマートフォン、セルラーモデム向けUMTSとLTEのベースバンドプロセッサなどについて、詳細に調査・分析を行っています。
主な掲載内容 (目次より抜粋)
- 携帯端末
- 端末向けプロセッサ技術
- 端末向けプロセッサ
- 市場規模と動向
- 技術動向
- 関連企業情報
- Broadcom
- Intel/Infinion
- Marvell
- Media Tek
- Qualcomm
- ST-Ericsson
- その他のベースバンドプロセッサ
- 端末向けプロセッサ比較
Your Guide to the Newest 3G and 4G Technology
Cellular technology continues to advance rapidly. The first commercial LTE service is now available in some Nordic cities, and both NTT (Japan) and Verizon (U.S.) will launch LTE service soon. To vie for these designs, both large and small chip vendors have developed working LTE products using a variety of architectures. In the 3G domain, shipments of TD-SCDMA devices to China Mobile are on pace to grow 6× in 2010, attracting the attention of leading processor vendors to this technology. Advances in air interfaces are being matched by increasing CPU and multimedia capabilities in cellular processors that target smartphones. Some of these highly integrated devices include dual CPUs, 1080p video, and high-performance 3D graphics.
Although the pace of vendor consolidation has slowed, supplier turnover continues. Intel shook up the market with its acquisition of Infineon’s wireless business; the world’s largest semiconductor vendor brings new resources to the cellular market. Renesas acquired Nokia’s baseband technology and is planning a major thrust into the LTE market. Broadcom is finally accumulating market share, while market leaders Qualcomm and MediaTek also grow. The race is on to see how Nokia will split up its purchases among its new suppliers.
"A Guide to 3G/4G Wireless Chips" explains how to navigate this turmoil to choose the right processor for your design. We go under the hood to examine UMTS and LTE baseband processors that target basic phones, feature phones, smartphones, and cellular modems. The report provides in-depth coverage of Qualcomm’s UMTS and LTE processors in the MSM, MDM, and QSC families; ST-Ericsson’s converged product lineup, including the low-cost PNX processors and the U5500 and U8500 for smartphones; MediaTek's UMTS and TD-SCDMA chips; Infineon’s X-Gold product line; Marvell’s new Pantheon series; and Broadcom’s Cellairity platform. We also cover UMTS and LTE baseband processors from smaller suppliers such as Altair, Beceem, Icera, Renesas, Sequans, Spreadtrum, and Wavesat.
With handset technology evolving so rapidly, it can be difficult to keep up with the terminology. This report sorts out the different air interfaces and their data rates, explains how video and 3D performance is measured, discusses the various codecs for voice, audio, and video, and describes the system interfaces used to tie together all of the platform components.
After an extensive tutorial section, the report details the size of the baseband-processor market and breaks down the market and technology trends that will play out over the next few years. This edition includes both final 2009 market share and preliminary 2010 market share.
For each vendor, we examine their market position, market strategy, and roadmap before diving into the key features, performance, and design details of each product. We also look at software development before making recommendations regarding the best products for each type of application. Our unique technology analysis provides the information that handset designers need to quickly zero in on the platforms that meet their requirements.
Make Informed Decisions
As the leading vendor of technology analysis for mobile and wireless chips, The Linley Group has the expertise to deliver a comprehensive look at this burgeoning market. Analysts Linley Gwennap and Joseph Byrne use their extensive experience in the processor market to deliver the technical and strategic information you need to make informed business decisions.
Whether you are looking for an innovative solution for your design, a vendor to partner with, or a rising company to invest in, this report will cut your research time and save you money. Get the inside scoop on this major market. Order “A Guide to 3G/4G Wireless Chips" today.
This report is written for:
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Engineers who are designing handsets and need to select a baseband processor
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Marketing and engineering staff at companies that sell handset processors or products that work with handset processors
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Technology professionals who want an introduction to handset technology and handset processors
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Financial analysts who desire a detailed analysis and comparison of handset-processor companies and their chances of success
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Press and public-relations professionals who need to get up to speed on this important technology
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Table of Contents
| List of Figures | ix |
| List of Tables | xi |
| About the Authors | xiii |
| About the Publisher | xv |
| Preface | xvii |
| Executive Summary | xix |
| | |
| Chapter 1. Wireless Handsets | 1 |
| Types of Cellular Devices | 1 |
| Ultra-Low-Cost Phones | 2 |
| Basic Phones | 3 |
| Feature Phones | 3 |
| Smartphones | 5 |
| Cellular Modems | 6 |
| Cellular Networks | 6 |
| Cellular Technologies | 8 |
| 2G Technologies | 9 |
| 3G Technologies | 10 |
| 3.5G Technologies | 10 |
| 4G Technologies | 11 |
| Chapter 2. Handset-Processor Technology | 13 |
| Cellular Technology | 13 |
| GSM, GPRS and EDGE | 13 |
| UMTS | 14 |
| HSPA | 14 |
| LTE | 16 |
| WiMax | 17 |
| Multimedia Standards | 18 |
| Video Resolution and Frame Rates | 18 |
| Audio Codecs | 20 |
| Video Codecs | 20 |
| Digital Rights Management | 21 |
| Graphics Standards | 21 |
| Standard Interfaces | 22 |
| SPI and UART | 22 |
| Memory Cards | 22 |
| SIM Cards | 23 |
| Audio Interfaces | 23 |
| Video Interfaces | 24 |
| RF Interfaces | 24 |
| Sensors and Displays | 24 |
| USB | 25 |
| Wi-Fi | 25 |
| Bluetooth | 26 |
| GPS | 27 |
| Testing | 27 |
| Chapter 3. Handset Processors | 29 |
| What is a Handset Processor? | 29 |
| Common Characteristics | 31 |
| CPU Complex | 31 |
| Baseband Subsystem | 32 |
| Multimedia Engines | 33 |
| Security Engine | 35 |
| Internal Memory | 35 |
| Memory Controllers | 36 |
| Memory Cards | 36 |
| LCD, Keypad, and Touchscreen Controllers | 37 |
| System Interfaces | 37 |
| Power Management | 38 |
| RF Functions | 38 |
| Packaging | 39 |
| Handset-System Design | 40 |
| Feature-Phone Design | 40 |
| Smartphone Design | 41 |
| ARM CPUs | 42 |
| ARM Instruction Set | 42 |
| ARM CPU Cores | 42 |
| Chapter 4. Market Size and Trends | 45 |
| Market Size and Share | 45 |
| Handset Market | 45 |
| Other Cellular Devices | 46 |
| Baseband-Processor Market | 47 |
| UMTS Processor Market | 49 |
| Market Trends and Forecast | 50 |
| Cellular-Device Forecast | 50 |
| Baseband-Processor Forecast | 51 |
| Air Interfaces | 52 |
| Chapter 5. Technology Trends | 55 |
| Handset-Design Trends | 55 |
| Camera/Video Phones | 55 |
| Mobile Video | 56 |
| Screen Size and Resolution | 56 |
| Advanced User Interfaces | 57 |
| Smartphones | 57 |
| Noise Cancellation | 58 |
| Dual-SIM Phones | 58 |
| WiMax Versus LTE | 59 |
| Processor-Technology Trends | 59 |
| Single-Vendor Solutions | 60 |
| Functional Integration | 60 |
| Multiple Application CPUs | 61 |
| LTE Baseband Design | 62 |
| Chapter 6. Broadcom | 65 |
| Company Background | 65 |
| Key Features and Performance | 66 |
| Internal Architecture | 68 |
| System Design | 69 |
| Product Roadmap | 70 |
| Conclusions | 71 |
| Chapter 7. Intel/Infineon | 73 |
| Company Background | 73 |
| Key Features and Performance | 74 |
| UMTS Processors | 74 |
| LTE Processors | 76 |
| Internal Architecture | 76 |
| 3G Products | 76 |
| LTE Baseband | 77 |
| System Design | 78 |
| Development Tools | 80 |
| Product Roadmap | 80 |
| Conclusions | 81 |
| Chapter 8. Marvell | 83 |
| Company Background | 83 |
| Key Features and Performance | 84 |
| Internal Architecture | 85 |
| Application CPU | 85 |
| Cellular Baseband | 86 |
| System Design | 86 |
| Development Tools | 88 |
| Product Roadmap | 88 |
| Conclusions | 89 |
| Chapter 9. MediaTek | 91 |
| Company Background | 91 |
| Key Features and Performance | 92 |
| Internal Architecture | 93 |
| System Design | 94 |
| Development Tools | 95 |
| Product Roadmap | 96 |
| Conclusions | 96 |
| Chapter 10. Qualcomm | 99 |
| Company Background | 99 |
| Key Features and Performance | 100 |
| QSC Processors | 100 |
| MSM Processors | 102 |
| Modems | 104 |
| Internal Architecture | 105 |
| QSC6000 Family | 105 |
| MSM7000 Family | 106 |
| MSM8000 Family | 106 |
| Connectivity and RF Functions | 107 |
| System Design | 108 |
| Development Tools | 109 |
| Product Roadmap | 110 |
| Conclusions | 111 |
| Chapter 11. ST-Ericsson | 115 |
| Company Background | 115 |
| Key Features and Performance | 116 |
| Low-Cost Processors | 116 |
| Smartphone Processors | 118 |
| Modem Processors | 119 |
| Internal Architecture | 121 |
| PNX Processors | 121 |
| Smartphone Processors | 122 |
| System Design | 123 |
| PNX Processors | 123 |
| Smartphone Processors | 124 |
| Development Tools | 124 |
| Product Roadmap | 125 |
| Conclusions | 126 |
| Chapter 12. Other Baseband Processors | 129 |
| Altair | 130 |
| Company Background | 130 |
| Key Features and Performance | 130 |
| Conclusions | 132 |
| Beceem | 132 |
| Comsys | 133 |
| Freescale | 134 |
| Icera | 134 |
| Company Background | 134 |
| Key Features and Performance | 135 |
| Conclusions | 137 |
| Renesas | 138 |
| Company Background | 138 |
| Product Roadmap | 139 |
| Conclusions | 140 |
| Sequans | 141 |
| Company Background | 141 |
| Key Features and Performance | 142 |
| Conclusions | 142 |
| Spreadtrum | 143 |
| Company Background | 143 |
| Key Features and Performance | 143 |
| Conclusions | 145 |
| Texas Instruments | 146 |
| Via Telecom | 146 |
| Wavesat | 147 |
| Company Background | 147 |
| Key Features and Performance | 147 |
| Conclusions | 149 |
| Chapter 13. Comparing Handset Processors | 151 |
| Basic Phones | 152 |
| Feature Phones | 154 |
| Smartphones | 156 |
| Low-End Smartphone Processors | 156 |
| Midrange Smartphone Processors | 157 |
| High-End Smartphone Processors | 160 |
| TD-SCDMA Handsets | 161 |
| Data Cards | 163 |
| HSPA Modems | 164 |
| LTE Modems | 165 |
| Chapter 14. Conclusions | 169 |
| Market and Technology Directions | 169 |
| Device Types | 170 |
| Single-Vendor Solutions | 170 |
| Air-Interface Trends | 170 |
| Emerging Features | 171 |
| Top Handset Processors | 172 |
| Vendor Outlook | 172 |
| Qualcomm | 173 |
| MediaTek | 173 |
| ST-Ericsson | 174 |
| Intel/Infineon | 175 |
| Other Vendors | 175 |
| Closing Thoughts | 176 |
| Appendix: Further Reading | 179 |
| Index | 181 |
List of Figures
Figure 1-1- Handset-market segmentation in 2009
Figure 1-2- An idealized 2G cellular network
Figure 3-1- Generic handset-processor block diagram
Figure 3-2- Comparison of video power consumption
Figure 3-3- Traditional hard-wired 3D pipeline
Figure 3-4- Stacked-die and package-on-package techniques
Figure 3-5- Block diagram of generic 3G handset
Figure 4-1- Handset-vendor market share, 2007-2010
Figure 4-2- Market share of cellular baseband processors, 2009 and 2010
Figure 4-3- Market share of UMTS baseband processors, 2009 and 2010
Figure 4-4- Handset-shipment forecast, 2008-2014
Figure 4-5- Forecast for all cellular devices, 2008-2014
Figure 4-6- Baseband-processor forecast, 2008-2014
Figure 4-7- Air-interface forecast, 2008-2014
Figure 4-8- LTE device forecast, 2010-2018
Figure 6-1- Broadcom BCM21553 smartphone diagram
Figure 7-1- Infineon X-Gold SDR baseband block diagram
Figure 7-2- Infineon X-Gold 618 handset diagram
Figure 8-1- Marvell Pantheon PXA910 handset diagram
Figure 9-1- MediaTek MT6268 UMTS handset diagram
Figure 10-1- Qualcomm 6000-series and 7000-series architectures
Figure 10-2- Qualcomm MSM8260 smartphone diagram
Figure 11-1- NXP PNX6710 block diagram
Figure 12-1- Icera Livanto in Espresso 400 reference design
Figure 12-2- Architecture of Wavesat Odyssey multimode baseband
List of Tables
Table 1-1- Cellular technologies and data rates
Table 2-1- Common HSDPA data rates
Table 2-2- Common HSUPA data rates
Table 2-3- Common LTE data rates
Table 2-4- Standard screen sizes
Table 4-1- Baseband-processor market share, 2009
Table 4-2- Baseband-processor unit shipments and revenue, 2008-2014
Table 6-1- Selected Broadcom acquisitions for mobile technologies
Table 6-2- Key parameters for Broadcom 3G processors
Table 7-1- Key parameters for Infineon baseband processors
Table 8-1- Key parameters for Marvell-s Pantheon processors
Table 9-1- Key parameters for MediaTek 3G baseband processors
Table 10-1- Key parameters for Qualcomm low-cost (QSC) processors
Table 10-2- Key parameters for Qualcomm smartphone (MSM) processors
Table 10-3- Key parameters for Qualcomm modem-only (MDM) processors
Table 11-1- Key parameters for ST-Ericsson 3G baseband processors
Table 11-2- Key parameters for ST-Ericsson smartphone processors
Table 11-3- Key parameters for ST-Ericsson modem-only processors
Table 12-1- Baseband-processor vendors and products
Table 12-2- Key parameters for Altair FourGee 3100 baseband processor
Table 12-3- Key parameters for Icera Livanto baseband processors
Table 12-4- Key parameters for Sequans SQN3010 baseband processor
Table 12-5- Key parameters for Spreadtrum baseband processors
Table 12-6- Key parameters for Wavesat Odyssey 9010 baseband processor
Table 13-1- Comparison of entry-level 3G baseband processors
Table 13-2- Comparison of high-end 3G baseband processors
Table 13-3- Comparison of midrange smartphone processors
Table 13-4- Comparison of high-end smartphone processors
Table 13-5- Comparison of TD-SCDMA baseband processors
Table 13-6- Comparison of HSPA processors for data cards
Table 13-7- Comparison of Category 3 LTE processors
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| シングルユーザーライセンス - PDF(印刷不可)＆冊子版1部 | US$3,495 |
| 企業ライセンス - PDF(印刷可能)＆冊子版5部 | US$5,000 |
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