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目次

This report starts with an overview of LTE chipset architecture and the LTE ecosystem. The report then reviews the LTE chipset vendors including Altair Semiconductor, BitWave Semiconductor, ComSys Mobile, Qualcomm, and Samsung. Then, by defining the protocols, understanding the LTE ecosystem, and reviewing what we know about the LTE chipset manufacturers at this moment, we can anticipate which devices will enter the market. The last section of the report reviews the integration of LTE chipsets into mobile handsets.

The report includes market estimates and forecasts of LTE USB dongles and external clients, total portable devices, handset regional shipments, silicon BOM, and silicon revenue. Also included are the estimates for LTE MAC software and IP royalties.

Table of Contents

• Executive Summary
• Introduction
  • LTE End-Use Device Architecture Overview
  • How Does In-Stat Define an LTE Chipset?
  • LTE System Architecture Evolution, Flat Architecture
  • Characteristics of LTE Chipsets
  • PHY—OFDM
• Basic Protocol Layers in an LTE End-Use Device
  • RF Transceiver
  • LTE PHY
  • LTE MAC
  • Radio Link Control
  • Packet Data Control Protocol
  • Radio Resource Control
  • The Mobility Management Entity
• LTE Ecosystem
  • Major Mobile Operators Determine how Quickly LTE is Widely Deployed
  • LTE Patent and Royalty Pool
  • What is Reusable Between WiMAX and LTE
  • Spectrum
  • Recent Developments within the LTSI (The LTE/SAE Trial Initiative)
  • About LTE and LTE Advanced
  • Moving From First-Generation LTE Chipsets to Next-Generation LTE Chipsets
• LTE End-Use Chipset Vendor Landscape
  • The Samsung GT-B3710, the First Batter Up
  • Baseband Solutions
  • RF Solutions
  • Altair Semiconductor
  • BitWave Semiconductor
  • Comsys Mobile
  • Infineon
  • Qualcomm
  • Samsung
  • ST-Ericsson
  • Wavesat
  • Others
• Market Forecasts
  • LTE USB Dongles and External Devices
  • LTE Embedded Chipsets (Excluding Mobile Handsets)
• Challenges to Building an LTE Chipset for Mobile Handsets
  • In Handsets, For All That Is Different, Much Remains the Same
  • Limitations
    • Discrete Applications Processors
    • Time-to-Market
    • Antenna Technology
    • Regional Handset Shipments
  • Roll-Up Charts and Non-Silicon Costs
    • Non-Silicon Costs in LTE Devices
• Methodology
• Glossary
• Related In-Stat Reports

List of Tables

• Table 1. Techniques that are Used to Improve Bit Rates on the LTE Platform
• Table 2. Characteristics of First-Generation LTE Chipsets and Next-Generation LTE Chipsets
• Table 3. Comparison of Altair, BitWave, ST-Ericsson, and Wavesat LTE Chipsets for End-Use Devices
• Table 4. Total Regional Shipments of LTE USB Dongles and External Clients, 2010–2013 (Units in Thousands)
• Table 5. LTE USB Dongles and External Clients Silicon BOM, 2010–2013 (US$)
• Table 6. Total Value of LTE USB Dongle and External Clients Silicon, 2010–2013 (Units in Thousands and US$ in Millions)
• Table 7. LTE Portable End-Use Device Shipments, Excluding Handsets, 2010–2013 (Units Thousands)
• Table 8. LTE Portable End-Use Devices by Region, Excluding Handsets, 2010–2013 (Units in Thousands)
• Table 9. LTE Embedded Chipset Silicon BOM in Portable End-Devices, Excluding Handsets, 2010–2013 (US$)
• Table 10. Global Silicon Opportunity for LTE Embedded Chipsets in Portable End-Use Devices, 2010–2013 (Units in Thousands and US$ in Millions)
• Table 11. LTE Handset Shipments by Region, 2010–2013 (Units in Thousands)
• Table 12. LTE Handset Silicon BOM, 2010–2013 (US$)
• Table 13. Total Value of Global LTE Mobile Handset Silicon, 2010–2013 (Units in Thousands and US$ in Millions)
• Table 14. All LTE Devices Roll-Up by Region, 2010–2013 (Units in Thousands)
• Table 15. Total LTE Chipset Revenues by Device Type, 2010–2013 (US$ in Millions)
• Table 16. Average Cost for LTE MAC Software and IP Royalties, 2010–2013 (US$)

List of Figures

• Figure 1. Global Opportunity for Silicon in LTE End-Use Devices, 2010–2013 (US$ in Millions)
• Figure 2. Basic Protocol Layers in an LTE End-Use Device
• Figure 3. The Samsung GT-B3710 Kalmia Dongle
• Figure 4. Conceptual Representation of Analog Functions Moved to Digital Control in Wireless Chipsets
• Figure 5. Comsys ComMAX CM1125—Handset Reference Design Schematic
• Figure 6. Conceptual Representation of Chipset Integration in Mobile Handsets