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2011年中期時点でのIC業界におけるウエハー製造工場での生産能力について詳細に分析を行い、今後5年間について、１年毎の生産能力予測を提供しています。

ウエハーの生産能力データは、下記のようなカテゴリ毎に提供しています。

Major changes are now taking place in the IC manufacturing base!

The worst recession in 63 years in 2009 led to a record amount of wafer fab capacity being taken off-line in 2009 and 2010 as companies did what they could to survive by closing older fabs, adopting the fabless or fab-lite business model, and consolidating.

The number of companies able to afford the cost of a new advanced fab continues to dwindle, causing greater reliance on foundries for production capacity. While the foundries have served the industry very well, such high reliance on so few manufacturers has caused some uneasiness in the industry. This situation will become even more precarious when the 300mm-to-450mm wafer transition takes place in the next few years.

Did You Know?

The top 15 300mm wafer capacity leaders now hold 95% of the world's 300mm fab capacity, essentially comprising the entire future total available market (TAM) for leading-edge IC fabrication equipment and materials!

 The newly updated Global Wafer Capacity report is an ideal tool for understanding the "new realities" of the market. This study will greatly assist IC material and equipment suppliers in creating long-term strategic marketing plans, especially when it comes to determining which IC manufacturers stand the best chance to remain in the business of fabricating ICs.

Use This Study to Find:

• Capacity, wafer start, utilization forecasts.
• IDM vs. fabless vs. fab-/asset-lite strategies.
• Rankings of companies with the highest capacity.
• Capacity forecasts for Taiwan, Korea, China, etc.
• 300mm wafer fab count and specifications.
• Forecasts for leading-edge (<40nm) capacity.
• And more!

Report Contents

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(価格・内容は2012年2月に更新しました。最新の情報はお問合せください。株式会社データリソース、電話:03-3582-2531)

目次

Introduction
Overall Capacity Trends
Capacity by Geographic Region
Capacity by Wafer Size
Capacity by Process Technology
Capacity by Minimum Geometry
Capacity by Product Type
Conclusion
Addendum I (300mm Wafer Manufacturer Profiles)
Addemdum II(Fab Facility Specifications)

詳細目次
 

IC Companies Close 49 Wafer Fabs from 2009-2011
Japan and North America with most closures, 150mm wafer fabs account for 43% of closures

Data recently compiled and released in IC Insights’ Global Wafer Capacity 2011-2012 report, shows that 49 semiconductor wafer fabs were closed between 2009-2011.  Since mid-2007, the IC industry has been paring down its older capacity (i.e., ≤200mm wafers).  The decline in ≤200mm capacity picked up speed in 2009 and continued through 2010 and 2011 as suppliers closed or upgraded fabs that were manufacturing using smaller wafers in order to produce devices more cost-effectively on larger wafers.  It is worth noting that a few of the fabs are being refurbished for production on larger wafers or for production of “non-IC” products.  In the coming years, more companies are expected to shutter older fabs as they transition to the fab-lite business model or become completely fabless.  As seen in Figure 1, most of the fab closures from 2009-2011 were 150mm wafer fabs (43%).  The distribution of those 49 according to wafer size are: 21 for 150mm, 13 for 200mm, 7 for 125mm, 5 for 300mm, and 3 for 100mm.  With Qimonda going out of business in early 2009, its 300mm wafer fabs became the first of their kind to cease commercial operations.

Regionally, according to the Global Wafer Capacity 2011-2012 report, Japan and North America each had 17 wafer fab closures, followed by Europe with 12 and South Korea with 3 (Figure 2).  One of the wafer fab closures in Japan was a 300mm IC fab operated by Sony.  However, this fab is being retrofitted and will return to service to produce image sensors for the company.  The Qimonda wafer fab in Sandston, Virginia, was the only 300mm wafer fab closed in North American (2009) during this time.  At the other end of the spectrum, a total of three 100mm wafer fabs were closed in the three-year span.  These included fabs owned by DALSA in Bromont, Ontario, Canada, ON Semiconductor in Piestany, Slovak Republic, and Diodes in Oldham, England.

Report Details

IC Insights’ Global Wafer Capacity 2011-12 report features 78 pages and 61 charts/tables of IC wafer capacity analyses and forecasts along with two addendums: a 72-page addendum of 300mm wafer manufacturer profiles; and a 24-page addendum of detailed IC fab specifications.