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世界のウエハー生産能力 2018-2022年

Global Wafer Capacity 2018-2022

 

出版社 出版年月ファイ ル/CD-ROM価格 ページ数図表数
IC Insights
ICインサイツ社
2017年12月US$7,190
マルチユーザコーポレートライセンス
98 72

サマリー

この調査レポートは、IC業界におけるウエハー製造工場での生産能力について詳細に分析を行い、今後5年間について、1年毎の生産能力予測を提供しています。

ウエハーの生産能力データは、下記のようなカテゴリ毎に提供しています。

ウエハーサイズ
  • 300mm
  • 200mm
  • 150mm以下

最小ジオメトリ

ICデバイス

  • アナログ
  • メモリ
  • ロジック
  • マイクロコンポーネント
  • 半導体製造工場
地域
  • 南北アメリカ
  • 欧州
  • 日本
  • 韓国
  • 台湾
  • 中国
  • ROW

技術タイプ

  • CMOS
  • BiCMOS/BCD
  • 双極
  • III-V

主な掲載内容

  1. 集積データに含まれるICメーカ
  2. 年間のIC産業のウエハー生産能力の実績と予測
  3. 世界の年間設備生産能力動向
  4. 世界の年間生産量の変化
  5. 2009年から2017年の間に閉鎖された(もしくは再利用された)IC工場
  6. ウエハーの設備容量トップ企業
  7. 世界の総生産能力のトップ企業のシェア
  8. 地域毎の生産能力のトップ企業
  9. 世界の地域別設備容量
  10. 地域毎のウエハーサイズ別設備容量
  11. 各ウエハーの地域別設備容量
  12. 地域別設備容量予測
  13. 地震リスクのあるIC産業の生産能力
  14. 世界のウエハーサイズ別設備容量
  15. ウエハーサイズ毎の設備容量のトップ企業
  16. 300mmウエハーの製造工場数
  17. 2018年に開業が予定されている300mmウエハーの製造工場
  18. 300mmウエハー生産能力のトップ企業
  19. 300mmウエハー生産能力のトップ企業の"パワー"ランキング
  20. 300mmウエハー生産能力トップ企業予測
  21. 企業数比較:200mm工場と300mm工場
  22. ウエハーサイズ別設備容量予測
  23. 世界の加工技術別設備容量
  24. 地域毎の加工技術別設備容量
  25. 世界の最小ジオメトリ別設備容量
  26. 地域毎の最小ジオメトリ別設備容量
  27. 最小ジオメトリ毎の設備容量のトップ企業
  28. 最小ジオメトリ毎の設備容量予測
  29. 寸法毎のウエハー生産量実績
  30. 製品タイプ毎の世界の設備容量
  31. 各製品タイプに含まれるICデバイス
  32. ICデバイスタイプ毎の工場の生産量
  33. 製品タイプ毎の地域別設備容量
  34. 製品毎の設備容量予測

Report Contents

The Global Wafer Capacity 2018-2022 report offers a detailed breakdown of the IC industry's wafer fab capacity as it stood at the end of 2017 and then forecasts capacity for each year through 2022. The data were compiled, summarized, and extended into the future using both bottom-up and top-down research methodologies. Surveys of hundreds of fabs from around the world formed the basis for analyzing the IC industry's current capacity status. Future projections were based on both survey results and IC Insights' overall economic forecast for the IC industry.

The capacity analysis and forecast is presented in 72 charts and tables. In addition, there are two addendums to the report: a 40-page collection of profiles for the world's IC manufacturers that are leading the industry in 300mm production and have the most potential to use next-generation 450mm wafers;  and a 28-page listing showing detailed specifications, such as wafer size, capacity, and minimum process geometry, for all the fabs considered for the study.

Samples of the Charts and Tables

 

Capacity Leaders' Shares of Total Worldwide 300mm Wafer Capacity at Dec-2017 -  Global Wafer Capacity 2018-2022 (IC Insights)

Forecast Monthly Installed Capacity by Product Type -  Global Wafer Capacity 2018-2022 (IC Insights)

Comparing 300nm Wafer Capacity Based on Fab Location and HQ Locations -  Global Wafer Capacity 2018-2022 (IC Insights)

  1. IC Manufacturers Included in the Data Compilation
  2. Annual IC Industry Wafer Capacity History and Forecast
  3. Worldwide Annual Installed Capacity Trends
  4. Changes in Worldwide Annual Capacity Volume
  5. IC Fabs Closed (or Repurposed) During 2009-2017
  6. Installed Wafer Capacity Leaders
  7. Capacity Leaders' Shares of Total WW Capacity
  8. Capacity Leaders per Geographic Region
  9. Worldwide Installed Capacity by Geographic Region
  10. Regional Installed Capacity by Wafer Size
  11. Installed Capacity for Each Wafer Size by Region
  12. Installed Capacity Forecast by Geographic Region
  13. Seismically Risky IC Industry Capacity
  14. Worldwide Installed Capacity by Wafer Size
  15. Installed Capacity Leadera per Wafer Size
  16. 300mm Wafer Fab Count
  17. 300mm Wafer Fabs Scheduled to Open in 2018
  18. 300mm Wafer Capacity Leaders
  19. "Power" Ranking of the 300mm Wafer Capacity Leaders
  20. 300mm Wafer Capacity Leaders Forecast
  21. Number of Companies with 200mm vs. 300mm Fabs
  22. Installed Capacity Forecast by Wafer Size
  23. Worldwide Installed Capacity by Process Technology
  24. Regional Installed Capacity by Process Technology
  25. Worldwide Installed Capacity by Minimum Geometry
  26. Regional Installed Capacity by Minimum Geometry
  27. Installed Capacity Leaders per Minimum Geometry
  28. Installed Capacity Forecast by Minimum Geometry
  29. Historical Wafer Capacity by Dimensions
  30. Worldwide Installed Capacity by Product Type
  31. IC Devices Contained Within Each Product Category
  32. Foundry Capacity by IC Device Type
  33. Regional Installed Capacity by Product Type
  34. Installed Capacity Forecast by Product Type

Addendum I: Profiles of the World's Leading IC Manufacturers

Profiles of the world's leading IC manufacturers, with extra emphasis placed on each company's strategy with regard to existing 300mm fabs and the potential for participating in 450mm fabrication in the future.

Addendum II: Detailed Fab Specifications Provided

For each of the 380 or so fab facilities surveyed for this study, detailed specifications are provided in this addendum. The specifications include:

  • Company Name Fab Name
  • Fab Location (city, state, province, prefecture, county, etc).
  • Date Opened
  • Wafer Size (mm)
  • Wafer Capacity (wafers/month) as of Dec-2017 and Planned Maximum Capacity
  • Process(es) Ran
  • Minimum Geometry of Processes
  • Product(s) Fabricated

 



目次

Table of Contents

Introduction ................................................................................................ 1

IC Manufacturer Consolidation ......................................................................... 1
Fab Types Included ..................................................................................... 5

Capacity Trends Overview ................................................................................. 7

Semiconductor Capital Spending Leaders .............................................................. 8
Capital Spending as a Percent of Sales ................................................................. 11
History and Forecast for Wafer Capacity, Starts, and Utilization ....................................... 13
Recent IC Fab Closures ................................................................................ 18
Installed Capacity Leaders ............................................................................. 22

Capacity by Geographic Region ........................................................................... 27

Existing Capacity by Geographic Region and by Wafer Size ............................................ 28
Recent Earthquakes Have Exposed Capacity Risks .................................................... 31
Future Capacity by Geographic Region ................................................................ 37

Capacity by Wafer Size .................................................................................... 41

Future Capacity by Wafer Size ......................................................................... 46

300mm Wafer Fab Capacity Details ................................................................... 50

300mm Wafer Capacity Leaders .................................................................. 54
300mm “Power” Ranking ......................................................................... 59
300mm Capacity Leaders Forecast ............................................................... 62

Capacity by Process Technology ......................................................................... 65

Capacity by Minimum Geometry ......................................................................... 71

Regional Distribution of Existing Capacity by Minimum Geometry .................................... 73
Future Capacity by Minimum Geometry ............................................................... 79

Capacity by Product Type ................................................................................. 85

Regional Distribution of Existing Capacity by Product Type ........................................... 88
Future Capacity by Product Type ...................................................................... 92

Conclusion ................................................................................................. 95

Addendum I (Profiles of 300mm Wafer Capacity Leaders) ............................................. A1

Samsung .............................................................................................. A3
TSMC .................................................................................................. A7
SK Hynix ............................................................................................. A11
Micron ............................................................................................... A15
Intel ................................................................................................. A19
Toshiba (and partner SanDisk) ...................................................................... A23
GlobalFoundries ..................................................................................... A29
UMC ................................................................................................. A33
SMIC ................................................................................................. A37

Addendum II (Fab Facility Specifications) ............................................................. A41

 

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