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The McClean Report 2018:IC産業を徹底分析・予測(第21版)

The McClean Report 2018

A Complete Analysis and Forecast of the Integrated Circuit Industry

 

出版社 出版年月電子媒体価格ページ数図表数
IC Insights
ICインサイツ社
2018年1月US$4,290
インディビジュアルユーザライセンス
900 740

◇ 上記年月はコアレポートの出版年月です。
◇ ページ数と図表数はコアレポート、マンスリーアップデート、中間レポートを併せた数です。

サマリー

米国ICインサイツ社「The McCLEAN REPORT」は、世界の経済状況がIC業界に与える影響や設備投資計画の変化、多様な製品カテゴリの主要サプライヤ、製品ごとの成長予測、技術発展など、多面的、徹底的にIC業界を調査を行った結果を、2018年1月-12月の1年間提供する通年サービスです。

「The McCLEAN REPORT」には下記情報およびサービスが含まれています。

  • 2018年1月出版のコアレポート(400ページ以上)
  • 3月から11月まで(6月および7月を除く)計7回のEメールによるマンスリーアップデート
  • 中間レポート(200ページ以上)-7月発行
  • ICインサイツ社主催セミナーへの無料参加
  • The McCLEAN Report購入者向けWebcastへの無料アクセス

提供データ

  • IC市場、出荷台数、価格の詳細な予測データ
  • 資本支出と生産能力に関する情報
  • デバイス毎の主要ICサプライヤランキング
  • 製品市場の詳細データ(DRAM、MPU等)
  • IC技術と実装動向 など

「The McCLEAN REPORT」はIC業界を15のセクションに分け、詳細に調査しています。

各セクションの説明およびイメージはこちらをご覧ください。

  1. エグゼクティブ・サマリー
  2. 世界のIC業界の展望と周期
    1. 電子システム/半導体の関係
    2. マクロ経済
    3. IC産業の周期
    4. 世界の半導体市場
    5. IC市場の予測とデータベース
    6. IC市場の地域別予測
    7. 中国のIC産業戦略
  3. 主要ICサプライヤとICメーカ
    1. ICサプライヤの概要
    2. 半導体トップサプライヤーランキング
    3. IC製造工場の業界分析
  4. 設備投資と生産能力
    1. 半導体産業の設備投資展望
    2. IC産業の生産量動向
  5. デバイスタイプ別の市場概要
  6. メモリ市場概観
  7. フラッシュメモリと不揮発性メモリ
    1. フラッシュメモリー市場概観
    2. フラッシュメモリーの設備投資
    3. フラッシュメモリー売上の立役者
    4. 過渡期にあるフラッシュメモリー市場
    5. EEPROM/ROM/EPROM/その他のメモリー
  8. DRAMとSRAM
    1. DRAM市場レビュー
    2. DRAMのビット量
    3. DDR4 DRAMの成長
    4. DRAMの設備投資
    5. DRAMサプライヤーの注目点
    6. SRAM市場レビュー
  9. マイクロコンポーネント市場概観
  10. マイクロコントローラとDSP
  11. マイクロプロセッサ(MPU)
    1. マイクロプロセッサ市場概観
    2. マイクロプロセッサ予測
    3. PCシステムのマイクロプロセッサ
  12. ASIC
    1. 概説
    2. ASIC市場概観
    3. ASICの製品タイプ別市場予測
    4. ASICの地域別市場シェア
    5. ゲートアレイ市場
    6. スタンダードセル市場
    7. プログラマブルロジックデバイス(PLD)市場
  13. アナログ
    1. アナログ市場
    2. 汎用アナログ製品
    3. 特殊用途向けアナログ製品
    4. アナログユニット
    5. 動向
  14. 技術動向
    1. 概説
    2. 研究開発(R&D)への支出
    3. マクロ動向
    4. 最新の技術進歩
  15. 実装
    1. 概観
    2. 実装タイプ別出荷数
    3. 実装動向全般
    4. ボールグリッドアレイ(BGA)
    5. チップスケールパッケージ
    6. パッケージオンパッケージ(PoP)
    7. ウエハーレベルパッケージ(WLP)
    8. ベア・ダイ組立
    9. 今後の課題

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IC Insights is proud to offer the 2018 edition of The McClean Report. Now in its 21st year, this highly acclaimed study thoroughly examines the integrated circuit industry at many levels such as how world economic conditions impact the industry, changing capital spending plans, top suppliers in various product categories, forecasts of product segment growth, and technology developments through 2022.

A Great Resource For...

  • Detailed IC market, unit, and pricing forecasts
  • Capital spending and fab capacity issues
  • Rankings of major IC suppliers by device type
  • Product market details (e.g., DRAM, MPU, etc.)
  • IC technology and packaging trends.

...and more!

For more details on the topics covered in The McClean Report see the Report Contents.

Totaling 900-plus pages and containing more than 740 charts and illustrations, The McClean Report is sure to offer something for everyone. Whether you are involved in business planning, strategic or product marketing, sales, purchasing, securities analysis, technology development, or simply need an authoritative study of the integrated circuit industry, expect The McClean Report to provide the reliable data and information you need.

Free Monthly Updates, Seminar, and Webcasts

The McClean Report is more than just a one-and-done report. It's a complete year-long service. Purchasers receive, at no additional charge, monthly updates during the year, a seat reservation at one of the supporting seminars (1Q), and access to webcasts.

Internet access

The McClean Report is accessible over the Internet. Using the provided password, the valuable market data in The McClean Report can be viewed with any device connected to the Internet. Documents are keyword searchable and include color graphs, tables, and illustrations.

Report Contents and Summaries

The McClean Report offers a broad look at the integrated circuit industry. The original 400+ page study (monthly updates provide approximately 500 more pages of information) is separated into 15 sections. About 400 tables, graphs, and illustrations in the original report clearly describe various market dynamics (another 400 tables, graphs, and illustrations are included in the monthly updates).

Besides covering worldwide IC market conditions and economic issues, there are chapters dedicated to each of the major IC product segments. Likewise, trends pertaining to capital spending and fab capacity, as well as technology developments and packaging, can be found in other sections of the report.

Links to summaries of each section in the report are provided below.

Section 1. Executive Summary

The executive summary serves as an introduction to The McClean Report. It highlights the major issues that are detailed in the report to give the reader an idea for what to expect in the sections that follow.

Section 2. Global IC Industry Outlook and Cycles

Electronic Industry Interdependence. This section starts by examining the relationship between the electronic systems market and the IC market, as well as how the IC market depends on the health of two smaller but important segments---the semiconductor equipment market and the semiconductor materials market.

Global IC Industry Outlook and Cycles - McClean Report (IC Insights)Global Economics. The world and regional GDP environments are discussed and compared to the semiconductor market environment. In addition, regional electronic systems production statistics are provided and the effects of currency exchange rates on the electronic systems and semiconductor markets are covered.

Global Semiconductor Market Review and Forecast. An extensive historical review and five-year forecast through 2022 of the worldwide semiconductor market is provided. The forecasts are presented in terms of dollars, unit shipments, and average selling price, as well as by region and electronic system type. Forecast assumptions are also presented.

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Section 3. Leading IC Suppliers and Foundries

Who and where are the world's leading suppliers of ICs? Find the answers in this section. The top 50 IC suppliers, top 50 semiconductor suppliers, and top 50 fabless IC suppliers are shown for 2016 and 2017.

Leading IC Suppliers and Foundries - McClean Report (IC Insights)

In addition, a significant amount of coverage is included on IC foundries and the increasingly important role they play in the IC industry.

2017 Pure Play Foundry Sales by Feature Size - McClean Report (IC Insights)

 

Section 4. Capital Spending and Capacity Trends

Capital spending and fab capacity levels are an important indicator of health in the semiconductor industry. As in many business situations, overspending leads to overcapacity, which leads to an imbalance in supply and demand. Therefore, it is useful to track spending (or production) and capacity trends in the industry.

Worldwide Capital Spending. In addition to a review and forecast of worldwide spending, rankings of the world's biggest spenders are provided. Spending levels within each of the world's geographic regions are compared to show which areas are most aggressive in advancing production capabilities and adding capacity. Spending by IC product type is also covered.

Capital Spending and Capacity Trends - McClean Report (IC Insights)

Capital Spending Cycles. While the pronounced cycles of the semiconductor market are well documented, this section shows that capital spending trends are even more volatile. Also shown is how closely changes in capital spending and IC average selling price have tracked over the past two decades.

Worldwide IC Capacity and Production. Capacity and production statistics include die-per-wafer trends, wafer start trends, capacity utilization rates, and revenue-per-wafer trends.

世界のIC製造能力と生産 - McClean Report (IC Insights)

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Section 5. Market Summary by Device Type

Market Summary b Device Type - McClean Report (IC Insights)This section includes a detailed review and forecast (2015-2022) of each IC product category (e.g., data conversion ICs, standard cell ASICs, MPUs, DRAMs, etc.). The details include dollar volumes, unit shipments, and average selling prices. In addition, the average annual growth rates for each category are listed.

 

Section 6. Memory Market Overview

This section provides a brief summary of the MOS memory IC market and the various volatile and non-volatile memory products that make up the category. Trace the MOS memory market's best and worst times over the past few years and note any cyclical patterns through 2022.

Memory Market Overview - McClean Report (IC Insights)

 

Section 7. Flash and Other Non-Volatile Memory

フラッシュとその他の非揮発性メモリ - McClean Report (IC Insights)Non-volatile memory ICs include ROM, EPROM, EEPROM, and flash memory devices. The unifying characteristic is that they retain their stored information even after system power is removed. ROM and EPROM devices were once the backbone of the non-volatile memory market, but now take a back seat to more versatile flash memory devices. This section examines trends, reviews market, unit shipment, and average selling price data, and highlights technical advances.

 

Section 8. DRAMs and SRAMs

アーキテクチャ毎のDRAMのマーケットシェア - McClean Report (IC Insights)The DRAM market continues to be one of the most closely watched of all IC categories. Whether in discrete package form or embedded with other technology, these devices are a critical component in PCs and are found in a number of wireless and portable applications. This section examines the historical and forecasted markets, unit shipments, and the all-important average selling prices for both DRAM and SRAM products. DRAM price-per-bit information and DRAM architectures are reviewed.

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Section 9. Microcomponent Market Overview

This section features a high-level review of microprocessors, microcontrollers, and digital signal processors, all which fall under the banner of the microcomponent market. See how each of these segments contributes to the total microcomponent market.

MOS マイクロコンポーネントの市場シェア - McClean Report (IC Insights)

 

Section 10. Microcontrollers and Digital Signal Processors

MCU市場推移 - McClean Report (IC Insights)Microcontrollers are among the most ubiquitous of all integrated circuits. From 4-bit to 32-bit devices, microcontrollers are used to control and monitor both simple and extremely complex functions in the home, automobile, and office. This section reviews market, unit shipment, and pricing data and provides a review of the different segments of the MCU market.

The DSP market is suffering from a loss of identity as digital signal processing functions move into application-specific standard products (ASSPs) and field-programmable gate arrays (FPGAs) fill potential DSP sockets.  IC Insights reviews the market, unit shipments, and average selling price for the DSP market.  

 

Section 11. Microprocessors

用途毎のMPU売上 2018年 - McClean Report (IC Insights)From humble beginnings in 1971, microprocessors have emerged to be among the most closely followed of all IC products. Nearly everyone recognizes Intel's dominance in the microprocessor business, but what about processors for mobile devices such as smartphones and tablet PCs?  What does Intel's processor roadmap hold in store?  Can Intel achieve processor dominance in the market for portable handheld devices or will ARM-based processors continue to gain market momentum?  Learn IC Insights' take on the MPU market and review our forecast of market size, unit shipments, and average selling price.

 

Section 12. ASIC Market Overview

The application-specific IC (ASIC) and system-on-chip (SOC) market is an important segment of the IC industry. This section offers extensive coverage of ASIC/SOC market trends. Dollar, unit shipment, and average selling price information is provided for the total ASIC market, as well as for the standard cell, gate array, and PLD sub-segments.

ASIC製品セグメントの市場シェア - McClean Report (IC Insights)

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Section 13. Analog Market Overview

アナログIC売上 - McClean Report (IC Insights)Analog signals can be thought of as those that represent elements and conditions experienced in the "real" world. These include factors such as light, sound, temperature, and pressure. Analog signals are a continuous representation of phenomena in terms of points along a scale. Hype and hoopla surrounding advances in the world of digital ICs often overshadows developments in the analog IC business, but as noted in this section, the analog market continues to play a steady role in the IC industry. Important market, unit shipment, and pricing data for the overall analog market and for individual segments within this market (e.g., amplifiers, interface, comparators, etc.) are provided.

 

Section 14. Technology Trends

The success and proliferation of the integrated circuit since its discovery in the late 1950s has been due to the ability of manufacturers to continue offering more for the money. This ability to reduce the cost of ICs per performance has been driven by the continuous and rapid development of new and improved process technologies. Section 14 covers a variety of process technology related trends, such as the advanced lithography methods needed to continue shrinking chip geometries, new ways to improve performance that overcome limits to scaling such as 3D integration and novel transistor structures, and the migration to larger wafers.

技術動向 - McClean Report (IC Insights)

 

Section 15. Packaging Trends

実装動向 - McClean Report (IC Insights)The assembly and packaging of ICs no longer takes a back seat to front-end processing. For most new IC products, packaging is an integral part of the chip design and production process; it is no longer just a simple, final step in the chip supply chain. As a result, accelerating demand for smaller, faster, yet less expensive products is pressing the packaging industry to keep pace with advancements in IC process technology.

This section provides an IC unit shipment forecast by package type (e.g., SO, FP/CC, BGA, wafer-level, bare die, etc.) and data showing how packages have evolved from simple cookie-cutter type packages to highly sophisticated and customized solutions. Details are provided on the ball-grid array, chip-scale package (CSP), bare die or direct-chip attach (DCA), wafer-level packaging, and multichip package (MCP) technologies, including stacked-chip packages.

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Monthly Updates

In addition to the original comprehensive study that is delivered in January, monthly updates to The McClean Report are sent March through November that review significant trends shaping the industry. The June and July updates are combined to provide an extensive 200+ page Mid-Year Update report that revises all of the core information found in the original report.

Purchasers of The McClean Report receive these updates for no additional charge. 

Some of the important topics covered in the updates include:

  • Detailed quarterly market, unit, and pricing reviews throughout the year.
  • On-going capital spending updates (including revisions to capital spending budgets for the world's leading IC producers).
  • Wafer fab capacity models for tracking supply/demand conditions in the industry.
  • World regional economic developments that impact the IC industry.
  • Analysis of end-use markets.
  • Various additional subjects related to the IC industry.

 



目次

TABLE OF CONTENTS

Section 1. Executive Summary .....................................1-1

Section 2. Global IC Industry Outlook and Cycles ...........................2-1

The Electronic System/Semiconductor Relationship .........................2-1
Introduction ...........................................2-1
Semiconductor Content .....................................2-3
Macroeconomics ...........................................2-5
Worldwide GDP Update .....................................2-5
Regional GDP Update ......................................2-7
The IC Industry Cycle........................................ 2-13
Introduction .......................................... 2-13
The 2010-2017 Timeperiod .................................. 2-13
IC Market Growth versus Worldwide GDP Growth....................... 2-14
The Global Semiconductor Market ................................. 2-20
Currency Effects ........................................ 2-20
Semiconductor Market History and Forecast .......................... 2-21
IC Market Forecast Assumptions and Database ........................... 2-23
2018 Assumptions ....................................... 2-23
2019-2022 IC Industry Forecast Assumptions ......................... 2-25
2012-2022 Unit, Dollar, and ASP Analysis ........................... 2-26
IC Unit Shipments ....................................... 2-26
IC ASP Analysis......................................... 2-30
2016-2018F Quarterly Forecasts for the Total IC, O-S-D, and Semiconductor Markets ..... 2-32
1Q/4Q IC Market “Direction Indicator” Model ......................... 2-33
IC Market Forecast by Region .................................... 2-34
Overview ............................................ 2-34
China’s IC Industry Strategy ..................................... 2-39
China IC Market ........................................ 2-39
China IC Production Overview ................................. 2-40
China’s Current IC Industry Strategy of Massive Investment .................. 2-44
Overview .......................................... 2-44
Issues Regarding the Enactment of China’s Strategy .................... 2-47

Section 3. Leading IC Suppliers and Foundries .............................3-1

IC Suppliers Overview ........................................3-1
Top Semiconductor Supplier Rankings ................................3-2
Top 50 Semiconductor Suppliers ................................3-2
Marketshare Trends of Major Semiconductor Suppliers.....................3-7
Top 50 Semiconductor Suppliers, Including Foundries, Ranked by Growth Rate ........3-8
Top 10 Semiconductor Suppliers (Excluding Foundries) .................... 3-10
Mergers & Acquisitions .................................... 3-11
Top 50 Fabless IC Suppliers (Excludes O-S-D Sales) ...................... 3-18
The Increasing Role of the Fabless/System IC Supplier .................... 3-22
IC Foundry Industry Analysis .................................... 3-27
Pure-Play/IDM Definitions ................................... 3-27
Foundry Market Overview ................................... 3-27
 “Final” Foundry Sales Analysis................................. 3-31
IC Foundry Sales by Company ................................. 3-33
Foundry Sales by Customer Type ............................... 3-36
Foundry Sales by Region.................................... 3-39
Foundry Sales by Application ................................. 3-42
Foundry Revenue per Wafer .................................. 3-46
Foundry Sales by Feature Size ................................. 3-49
IC Foundry Capacity and Capital Spending........................... 3-56

Section 4. Capital Spending and Capacity ................................4-1
Semiconductor Industry Capital Spending Outlook ..........................4-1
Overview ............................................4-1
1Q Spending Survey versus Actual Spending Results ......................4-4
Capital Spending as a Percent of Sales ..............................4-5
2014-2018F Semiconductor Capital Spending by Company ...................4-7
Samsung’s Amazing 2017 Spending Spree ......................... 4-11
Capital Spending by Nationality ................................ 4-13
Capital Spending by Product Type ............................... 4-14
IC Industry Capacity Trends ..................................... 4-16
Overview ............................................ 4-16
History and Forecast for Wafer Capacity, Starts, and Utilization................ 4-17
2016-2018F IC Capacity Forecast by Feature Size ....................... 4-22
IC Capacity by Wafer Size ................................... 4-24
Revenue per Wafer ....................................... 4-27

Section 5. Market Overview by Device Type..............................5-1
Section 6. Memory Overview ......................................6-1

Section 7. Flash and Non--Volatile Memory ...............................7-1

Flash Memory Market Overview ...................................7-1
NOR Flash ............................................7-5
NAND Flash...........................................7-7
3D NAND Drives Market Growth ................................7-9
Flash Memory Capital Spending ................................... 7-18
Flash Memory Sales Leaders .................................... 7-21
Flash Memory Market in Transition ................................. 7-24
EEPROM/ROM/EPROM/Other Memory ............................... 7-26

Section 8. DRAM and SRAM.......................................8-1

DRAM Market Review ........................................8-1
DRAM Bit Volume.......................................... 8-12
DDR4 DRAM Growth........................................ 8-15
DRAM Capital Expenditures ..................................... 8-21
DRAM Supplier Highlights...................................... 8-30
SRAM Market Review ........................................ 8-34

Section 9. Microcomponent Overview .................................9-1

Section 10. MCU and DSP........................................ 10-1

Microcontroller Market Overview .................................. 10-1
Digital Signal Processors ...................................... 10-23

Section 11. MPU ............................................ 11-1

Microprocessor Market Overview .................................. 11-1
Microprocessors Forecast ...................................... 11-5
Microprocessors in Personal Computing Systems ......................... 11-13
Tablet Revival Hinges on Bigger Improvements ....................... 11-17
Smartphone MPUs Drive Advanced Wafer Processes..................... 11-23
MPU Trends for PCs, Servers, and Embedded Applications .................. 11-32
Multi-CPU Emphasis in PCs Takes Off Again ......................... 11-35
Intel-AMD Strike a Rare Partnership........................... 11-43
x86 Server MPU Battle Revs Up Again ............................ 11-44
Intel Steps Up Server Efforts Against ARM MPUs ....................... 11-49
AI and Workload Acceleration Pour into the Server Market ................. 11-55
Embedding AI and Deep-Learning in IoT Systems ...................... 11-64

Section 12. ASIC ............................................ 12-1

Introduction............................................. 12-1
ASIC Market Overview ....................................... 12-3
ASIC Market Forecast by Product Type ............................... 12-8
ASIC Marketshare by Region .................................... 12-12
Gate Array Market......................................... 12-16
Standard Cell Market ....................................... 12-18
PLD Market ............................................ 12-22

Section 13. Analog ........................................... 13-1

Analog Market............................................ 13-1
General-Purpose Analog Products.................................. 13-6
Amplifiers and Comparators .................................. 13-8
Interface ............................................ 13-9
Power Management ..................................... 13-10
Signal Conversion ...................................... 13-10
Application-Specific Analog Products ............................... 13-12
Consumer .......................................... 13-13
Computer ........................................... 13-14
Communications....................................... 13-14
Automotive .......................................... 13-16
Industrial/Other Analog ................................... 13-17
Analog Units ............................................ 13-18
Trends ............................................... 13-19

Section 14. Technology ........................................ 14-1

Introduction............................................. 14-1
Research and Development Spending................................ 14-2
Macrotrends ............................................ 14-14
Transistor Count Trends................................... 14-15
Chip Size Trends ....................................... 14-21
Device Feature Size Trends .................................. 14-24
Wafer Size Trends...................................... 14-29
Latest Technology Advancements ................................. 14-31
Advanced Memory Processes ................................. 14-31
NAND Flash Developments................................ 14-33
TLC and QLC 3D Flash Memory .............................. 14-35
DRAM Developments ................................... 14-37
Emerging Memory Architectures ............................. 14-41
Advanced Logic Processes .................................. 14-43
Intel Process Developments ............................... 14-44
GlobalFoundries, Samsung, and ST Process Developments ................ 14-46
TSMC Process Developments............................... 14-50
EUV Lithography Status ................................... 14-51
Summary ............................................. 14-54

Section 15. Packaging ......................................... 15-1

Overview .............................................. 15-1
Unit Shipments by Package Type .................................. 15-5
General Packaging Trends ...................................... 15-7
Package Mounting Transitions................................. 15-7
3D and 2.5D IC Integration with TSVs ............................ 15-10
Alternatives to Silicon Interposers with TSVs ....................... 15-14
Ball Grid Arrays .......................................... 15-15
Chip-to-Package Interconnect Trends ............................ 15-16
Chip-Scale Packages ........................................ 15-17
Stacked-Chip CSPs ...................................... 15-19
Package-On-Package ........................................ 15-21
Wafer-Level Packaging ...................................... 15-23
Bare Die Assembly ......................................... 15-26
Challenges Ahead ......................................... 15-27

 

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プレスリリース

January 12, 2018

 

Analog IC Market Forecast With Strongest Annual Growth Through 2022

Power management, signal conversion, and automotive-specific analog markets drive expansion.

Sales of analog ICs are expected to show the strongest growth rate among major integrated circuit market categories during the next five years, according to IC Insights’ new 2018 McClean Report, which becomes available this month. The McClean Report forecasts that revenues for analog products—including both general purpose and application-specific devices—will increase by a compound annual growth rate (CAGR) of 6.6% to $74.8 billion in 2022 from $54.5 billion in 2017.

The 2018 McClean Report separates the total IC market into four major product categories: analog, logic, memory, and microcomponents.  Figure 1 shows the forecasted 2017-2022 CAGRs of these product categories compared to the projected total IC market annual growth rate of 5.1% during the five-year period.

Figure 1

Analog ICs, the fastest growing major product category in the forecast, are a necessity within both very advanced systems and low-budget applications.  Components like power management analog devices help regulate power usage to keep devices running cooler and ultimately to help extend battery life in cellphones and other mobile/battery operated systems.  The power management market is forecast to grow 8% in 2018 after increasing 12% in 2017.

In 2018, the automotive—application-specific analog market is forecast to increase 15% to be the fastest growing analog IC category, and the third-fastest growing of 33 IC product categories classified by WSTS.  The growth of autonomous and electric vehicles and more electronic systems on board all new cars are expected to keep demand robust for automotive analog devices.

Communications and consumer applications continue to represent the biggest end-use applications for signal conversion analog ICs.  Signal conversion components (data converters, mixed-signal devices, etc.) are forecast to continue on fast-track growth with double-digit sales gains expected in three of the next five years.

After an extraordinary 58% sales spike in 2017, the memory market is forecast to return to more “normal” growth through the forecast.  The memory market is forecast to increase by a CAGR of 5.2% through 2022.  New capacity for flash memory and, to a lesser extent for DRAM, should bring some relief from fast-rising ASPs and result in better supply-demand balance for these devices to support newer applications such as enterprise solid-state drives (SSDs), augmented and virtual reality, graphics, artificial intelligence, and other complex, real-time workload functions.

Meanwhile, growth in the microcomponent market (forecast CAGR of 3.9%) has cooled significantly due to weak shipments of standard PCs (desktops and notebooks).  Tablet sales have also slowed and weighed down total microcomponent sales.  With the exception of the 32-bit MCU market, annual sales gains in most microcomponent segments are forecast to remain in the low- to mid single digit range through 2022.

IC Insights forecasts the total IC market will increase by a CAGR of 5.1% from 2017-2022.  Following the 22% increase in 2017, the total IC market is forecast to grow 8% in 2018 to $393.9 billion and then continue on an upward trend to reach $466.8 billion in 2022, the final year of the forecast.

Report Details:  The 2018 McClean Report

Additional details and forecasts for the worldwide IC market through 2022 are included in the new 2018 edition of IC Insights’ flagship report, The McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry.

 

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