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この調査レポートは、ネットブック、スマートブック、モバイルインターネット機器(MID)の市場と、これらの製品に対応するチップの市場の、2014年までの詳細な予測を行っています。

As the mobile data movement makes strides globally, a new breed of ultra-mobile devices with large-screens, 3D graphics and high-definition multimedia capabilities with all-day battery life is emerging. This report covers the three most popular devices; Netbooks, Smartbooks & Mobile Internet Devices (or MIDs) and the chips that enable them. While these device names are being used interchangeably by OEMs and the media, for the purpose of this report we define these devices as follows: 

Netbooks - These are essentially scaled down notebooks with smaller screen sizes, most commonly in 9 and 10 inches and based on x86 CPUs, such as Intel's Atom family.

Smartbooks - These are always-on devices based on ARM-based (most commonly Cortex-A8) platforms in screen sizes typically between 4 and 7 inches.

MIDs - Mobile Internet Devices are essentially a subset of Smartbooks with a similar architecture, and always-on capability but built on an x86 platform.

This report provides detailed forecasts for all three devices and the many integrated circuits that enable them through 2014.

Key Study Findings

With this valuable resource, you will be better equipped to understand the dynamics of this emerging market, to know your potential customers and to be better informed about your competitors.  As with all of our reports, your satisfaction is guaranteed.  Some of the key findings include:

The study provides detailed forecasts of Netbooks/Smartbooks & MIDs and compares them with our forecasts of  Notebooks and Smartphones, as well.  The individual integrated circuits forecast in the study are predicted to total $9.7 billion in 2014 and the report provides detailed forecasts for application processors, basebands, RF transceivers and for the myriad of ancillary chips that make up the devices.

About the Author:

Satish Menon is the author of this report and an independent consultant and Forward Concepts Senior Analyst specializing in communications electronics. Most recently, Satish was Chief Technology Officer for a facilities-based provider of wholesale and retail voice telecommunication services where he architected a distributed, high-availability voice network that unified several circuit-based and packet-based protocols into a single packet-core network based on SIP protocol.  Prior to this, he was founder and VP Product Development for Nuntius Systems, Inc. where he was responsible for all engineering activities that included activities involving voice codecs, GSM/GPRS/EDGE baseband/MAC, DSP based lower-power WLAN baseband/MAC and multimedia codecs. Mr. Menon led a multi-disciplinary team of over 120 engineers and was responsible for building several successful products from concept to completion, over a seven year period.  His background includes product management in areas of wireless technology and platforms, real-time embedded systems, DSP implementations of wired/wireless technology and communication protocol stacks along with product positioning and strategic planning expertise. Mr. Menon has also consulted with several high-tech companies in the areas of communication and multimedia technology. He earned his Bachelor’s degree in Electronics and Communication Engineering from REC, Trichy, India and his Master’s degree in Computer Engineering from University of Southern California.

Carter L. Horney, a recognized authority on microprocessor and DSP implementation in telecommunications, is a major contributor to this report.  Mr. Horney is an independent consultant and Forward Concepts Associate specializing in semiconductor product strategy and market planning.  He was formerly Division Planner for Rockwell International’s Digital Communications Division and earlier Strategic Marketing manager for Rockwell’s Semiconductor Products Division.  Mr. Horney was responsible for the product planning, which led Rockwell (now Conexant Systems) to dominate the worldwide FAX and high-speed modem chip market.  He was appointed a Rockwell Engineering Fellow and received many commendations for outstanding achievement in Computer Architecture, Engineering, Technical Marketing, Product Planning and Customer Relations.  Mr. Horney has a B.S. in Mathematics and Physics and an M.S. in Mathematics from Western Illinois University.

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Table Of Contents

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I. EXECUTIVE SUMMARY
II. NETBOOKS
III. SMARTBOOKS
IV. NETBOOK/SMARTBOOK/MID SEMICONDUCTOR MARKET
V. ANCILLIARY SEMICONDUCTORS

List of Figures

Figure 1: Global Handset‐Centric Internet Subscriber Mix by Air Interface Technology - 2008‐2014
Figure 2: Global PC‐Centric Mobile Broadband Subscriber Mix by Air Interface Technology - 2008‐2014
Figure 3: Global PC‐Mobile Broadband Subscriber Mix by Region - '08‐'14
Figure 4 Global Handset‐Centric Data Subscriber Mix by Region - 08‐'14
Figure 5: Smartbook/MID Shipments by Air Interface Technology - '08‐'14
Figure 6: 3G Netbook Shipments by Air Interface Technology - '08‐'14 
Figure 7: Smartbook/MID Semiconductor Revenue Forecast - '09‐'14
Figure 8: Netbook Semiconductor Revenue Forecast - '08‐'14
Figure 9: Smartphones, Smartbooks, Notebooks and Netbooks Market Share Forecast - '08‐'14
Figure 10: Smartphones, Smartbooks, Notebooks and Netbooks Unit Shipment Forecast - '08‐'14 
Figure 11: Netbook Vendor Market Shares - 2008 
Figure 12: TI OMAP44x Block Diagram 
Figure 13: Freescale's 4‐chip WCDMA/EDGE Radio Block Diagram
Figure 14: Freescale's RFX300‐30: 2‐chip WCDMA/EDGE Radio Block Diagram
Figure 15: Infineon HSDPA Modem Platform
Figure 16: MSM6260 Cat. 6 HSDPA Multimedia Platform
Figure 17: MSM6280 Cat. 8 HSDPA Enhanced Multimedia Platform 
Figure 18: MSM6500 EV‐DO Rev 0 + GSM/GPRS Multimedia Platform 
Figure 19: MSM6550 1X Rel 0/Rev A/EV‐DO Rev 0 + GSM/GPRS Multimedia Platform
Figure 20: Texas Instruments WiLink 6.0 Single‐chip WLAN, Bluetooth and FM Solution
Figure 21: A Typical GPS Receiver Block Diagram 
Figure 22: Global Locate/Broadcom Hammerhead II A‐GPS Chip Block Diagrams

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ウルトラモバイルデバイスとチップの市場が隆盛

米国アリゾナ州テンペ、2008年9月16日
米国調査会社フォワードコンセプト社は、ハイエンドスマートフォンとノートPCの中間に位置するウルトラモバイルデバイスに関する調査レポート「ウルトラモバイルデバイスとチップ市場調査:ネットブック/MID/スマートブックの市場動向、対応チップ市場、2014年までの予測 - ULTRA MOBILE DEVICES & CHIP MARKET OPPORTUNITIES:Strategies and Insight into the Emerging Class of Netbook, MID and Smartbook Devices」を出版した。ハイエンドのARMベースのアプリケーションプロセッサや、これと競合するAtom製品やX86プロセッサなどの組込チップ、モビリティを実現するセルラーチップについても詳細に調査している。調査レポートは、この新しい市場を展望し、デバイスとチップの両方についての2014年までの予測を行っている。

この調査レポートは、下記の重要事項について調査している。

• 外出先で頻繁に利用するようなユーザーを除けば、世界的な経済恐慌における2008年のPC市場での消費者行動は、小型で低価格のネットブックに寄与したといえる
• しかし、ネットブック利用者はインターネット接続の一層の拡充を期待しており、内蔵3G(将来的には内蔵LTE)の普及は進むだろう。オペレータの推進もあいまって、3Gネットブックカテゴリーの成長はCAGR124％で成長し、2014年には3400万台、3G/LTEの搭載率は45％に達するだろう
• スマートブックとモバイルインターネットデバイス(MID)は、ほぼユビキタスといってもよい3G/LTE接続性を有し、小型マルチメディア機能や常時接続のウルトラモバイルデバイスへの需用を満たすものとなるだろう。スマートブックとモバイルインターネットデバイス(MID)は、CAGR176％で成長を続け、2014年には6300万ユニットに達するだろう
• LTEネットワークが2010年に始まり、3G/LTEネットブックやスマートブック/MIDにおいて最も急速に成長する無線インターフェースとなるだろう。2014年には、3G/LTEネットブックは500万、スマートブック/MIDは4100万に達するだろう
• あたかもネットブックがノートブックPCからシェアを奪ったように、スマートブック/MIDはスマートフォンからシェアを奪うだろう
• ネットブックとスマートブックは、モバイルブロードバンドPCやモバイルインターネット端末の加入者数を上回り、2014年には、ネットブックが2億9500万、スマートブックが3億に達するだろう

この調査レポートは、地域毎と無線インターフェース毎の、3G/LTEネットブックとスマートブック/MIDの出荷数予測を記載している。予測は、WLAN、ブルートゥース、GPS、FMなど無線機能の、単独と組合せによるデバイスカテゴリー毎に行っている。

(後略)

(原文)
Ultra Mobile Devices & the Chips that Make Them Are Booming Says New Market Study

Report Provides Strategies & Insight into Netbooks, Smartbooks & Mobile Internet Devices

Tempe, AZ, U.S.A. September 16, 2008: Forward Concepts has announced the publication of a new study that covers the market prospects of the new Ultra Mobile Devices that serve a gap between high-end smartphones and notebook PCs.  The report also extensively covers the chips that go in them, both high-end ARM-based application processors and competing Atom-heritage and other X86 processors. Cellular chips that enable mobility are also covered in detail.  The in-depth study, "Ultra Mobile Device & Chip Market Opportunities" lays out the prospects of this emerging market and forecasts both devices and chips that enable them through 2014.

Some key findings in this report are:

 The report also provides detailed forecast of 3G/LTE Netbooks and Smartbook/MID shipments broken down by region and cellular air interface technology. Forecasts for standalone and combination wireless peripherals, that include WLAN, Bluetooth, GPS and FM, for each device category is also provided.
According to Satish Menon, Senior Analyst for Forward Concepts and primary author of the report, "As a result of limited upward mobility of non-captive Smartphone O/S, Smartbooks are currently lacking an 'anchor' web-centric, multitasking and lightweight O/S capable of fully exploiting the ARM-based applications processors. It is unlikely that Microsoft will be porting Windows7 to ARM platforms, but Maemo, Android, and Chrome are among early O/S candidates for Smartbooks, whether they be based on ARM Processors or on X86 platforms, like Intel's upcoming Moorestown.”
Will Strauss, Forward Concepts’ president and editor of the report, said “The study provides detailed forecasts of Netbooks/Smartbooks & MIDs and compares them with our forecasts of  Notebooks and Smartphones, as well.  The individual integrated circuits forecast in the study are predicted to total $9.7 billion in 2014 and the report provides detailed forecasts for application processors, basebands, RF transceivers, and for the myriad of ancillary chips that make up the devices."

The 311-page study provides detailed forecasts of Netbooks/Smartbooks & MIDs vs. Notebooks and Smartphones and the chips that enable them. It profiles key players and includes 22 figures and 79 tables plus appendix.