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価格・ご注文について この調査レポートは、イーサネット、ファイバーチャネル、インフィニバンド、CWDMなどの主要データ通信ネットワーク技術のデータ通信用トランシーバ市場を調査しています。クラウドコンピューティングや仮想化などのネットワーク環境の変化と、世界的な不況の影響も考慮した上での市場予測を提供しています。
This new report from CIR provides our latest forecasts of the data communications transceiver market and takes into account the impact of the difficult worldwide financial climate as well as the changing networking environment with its growing emphasis on cloud computing and virtualization. We also provide an assessment of the latest technological trends including the impact of the bandwidth demand from the latest generation of processors which seem finally to have caught up with what 10 GigE networking can offer. In this new environment in which 10 GigE is becoming mainstreamed, what is the revenue potential from 10 GigE-over-copper? And what does the rise of 10 GigE mean for the future of GigE?
This report answers this question and also examines how the copper vs. single-mode vs. multimode story will play out in the data center and short-haul communications market over the next five years. We also provide market forecasts for active optical cabling and parallel optics technology and discuss how these interesting new technologies may break out of the market limitations of the large data center and high-performance computing (HPC).
This new report from CIR covers the transceiver market for the key data communications networking technologies including Ethernet, Fibre Channel, InfiniBand, and CWDM. It examines where the opportunities in data communications transceivers will be found in the coming years and how the various overlapping MSAs and standards will play themselves out in the market. The report also discusses how the leading firms
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Table of Contents
Executive Summary
E.1 Datacom connectivity markets in the financial downturn
E.1.1 Impact on demand
E.1.2 Impact on funding
E.2 Key opportunities in the datacom connectivity market
E.2.1 Are there still any opportunities under 10 Gbps?
E.2.2 10 GigE opportunities
E.2.3 Fibre Channel and SAS opportunities
E.2.4 HPC opportunities
E.2.4 What is the real market potential of parallel optics and active cabling?
E.3 Summary of forecasts
E.3.1 Changes from Last Year
Chapter One: Introduction
1.1 Background to this report
1.1.1 New directions in data networking: cloud computing and virtualization
1.1.2 Processor speeds catch up with networking speeds
1.1.2 Copper vs. MMF vs. SMF
1.2 Objective and scope of this report
1.3 Methodology of report
1.4 Plan of report
Chapter Two: Enabling Technologies, Standards and MSAs
2.1 Enabling technologies
2.1.1 Optical integration and silicon photonics
2.1.2 CWDM technology
21.3 The rise of parallelism
2.1.4 Active optical cabling
2.1.5 Passive and active copper cabling
2.1.6 Trends in data center cabling: copper vs. MMF vs. SMF
2.2 Standards evolution
2.2.1 10 GigE
2.2.2 Fibre Channel: To 8 Gbps and beyond
2.2.3 Are new standards needed?
2.3 MSA Evolution
2.3.1 300-pin, XENPAK, XPAK and X2: The future
2.3.2 XFP markets and opportunities
2.3.3 SFP+ markets and opportunities
2.3.4 MSAs for parallel optics
Chapter Three: Markets, Applications and Forecasts
3.1 Forecasting methodologies
3.1.1 Changes from last year?s forecast
3.2 Impact of new trends in IT
3.2.1 Cloud computing and virtualization
3.2.2 Video in the enterprise and bandwidth demand
3.2.3 The impact of mobile computing and communications
3.3 Ethernet markets
3.3.1 Residential Ethernet forecasts
3.3.2 Business Ethernet forecasts
3.3.3 Forecast of Ethernet by media
3.3.4 Servers, data centers and the market for 10 GigE
3.3.5 Forecast of 10 GigE by IEEE standard
3.3.6 Forecast of 10 GigE by MSA
3.3.7 A note on 10 GigE and personal computers
3.3.8 A Note on 10 GigE and residential Ethernet
3.3.9 The future of GigE
3.3.10 Summary of Ethernet forecasts
3.4 Fibre Channel, InfiniBand, SAS and parallel optics
3.4.1 Fibre Channel market analysis
3.4.2 Fibre Channel market forecasts
3.4.3 InfiniBand and parallel optics analysis
3.4.4 Parallel optics market forecasts
3.5 Summary of market forecasts
Acronyms and abbreviations used in this report
About the Author
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