この調査レポートは、光インターコネクト市場について調査し、市場動向と今後を分析・予測しています。光インターコネクトのビジネス戦略を立てる上で有益な情報やデータを掲載しています。

主な掲載内容 (目次より抜粋)

• 光インターコネクトの現況と将来性
• 光コネクト製品、MSA規格製品、技術
• 光インターコネクト市場の5年間予測

The idea that boards and chips (or even devices on chips) could be interconnected with optics has excited the imagination of engineers for well over a decade. Start-ups have appeared with optical interconnection as their main focus only to disappear from the scene a year or so later. Established transceiver and semiconductor firms have also tried their hands at optical interconnection, but have generally abandoned or downsized projects after a short space of time.

Until very recently, optical interconnection has not portrayed itself as a good business to be in. Something has changed in the last year or so, however, and that is the size of the addressable market. Optical interconnection projects of the past have looked for initial revenues from the limited opportunities in supercomputers or in very high-end telecom gear. But, as Moore's Law has pushed VLSI ever forward, the addressable market for optical interconnects has expanded from a few niches to the giant market represented by corporate servers and large routers. 

Many believe that within a few years processor speeds will reach a point where optical interconnects will be required in most standard business computers. Meanwhile, the recent introduction by Intel of its LightPeak technology has propelled optical interconnection from something that is little more than a topic for technical conferences to a potential, near-term revenue generator.

These encouraging signs are countered by the quite daunting challenges facing optical interconnection; primarily, that is, providing cost-effective optical technology in markets that are used to paying only minimal amounts for metal connectivity. There is also the issue of matching optical interconnect technologies to the fairly different needs of the chip-to-chip, board-to-board and on-rack interconnection. CIR expects proprietary solutions to these problems to create sustainable market advantages for firms in the emerging optical interconnection space.

There are also significant new business opportunities emerging for suppliers of optical interconnect technology, including firms with roots in the diode laser, active optical cabling, transceiver, and semiconductor industry. We also think that optical interconnection will be a key enabling technology for computer and telecom/datacom equipment firms, which will increasingly find that the speed of internal interconnection is limiting their success in deploying the latest processors.

With all this in mind, CIR is publishing this new report, which identifies where the opportunities are to be found in optical interconnection and quantifies how much those opportunities will be worth. We believe it will be invaluable reading for all firms for which optical interconnection is key to their business strategies. 

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Table of Contents

Executive Summary: Optical Interconnects 

E.1 Summary of Current Market Drivers and Challenges for Optical Interconnection
E.2 Firms to Watch in this Space
E.2.1 Avago and MicroPOD
E.2.2 CyOptics and Terapics
E.2.3 Finisar, Laserwire and Optical Interconnection
E.2.4 Intel's Light Peak and Silicon Photonics
E.2.5 Luxtera and OptoPhy
E.2.6 Firms Offering Optical Engines and Optical Integration Solutions
E.2.7 Firms Offering Cable, Fiber and Connectors for Optical Interconnects
E.3 Summary of Key Opportunities as Perceived by Technology/Component Suppliers
E.3.1 Optical Engines and Embedded Optical Interconnects
E.3.2 Lasers
E.3.3 Connectors and Cables
E.4 Summary of Forecasts

Chapter One: Introduction

1.1 Background to this Report
1.1.1 Optical Interconnects Defined and Their Newfound Addressable Markets
1.1.2 Optical Integration for Optical Interconnection?
1.2 Objectives of this Report
1.3 Scope of this Report
1.4 Methodology and Information Sources for this Report
1.5 Plan of this Report

Chapter Two: Current and Future Markets for Optical Interconnects

2.1 Processor Speeds and the Need for Optical Interconnects
2.2 Optical Interconnects in Existing High-speed Very-Short-Reach Markets
2.2.1 VSR Telecom and Datacom
2.2.2 Rack-Based Cable Assemblies
2.2.3 Server Clusters
2.2.4 SANs
2.3 Board-level Opportunities for Optical Interconnects
2.3.1 On-board and Board-to-board Communications
2.3.2 Board-to-Board Cable Assemblies
2.3.3 Motherboards and Daughter Boards
2.3.4 Backplanes
2.4 Optical Interconnects in Chip-to-Chip Communications
2.4.1 Market Opportunities in Optical Interconnects in Chip-to-Chip Communications
2.4.2 Optical Interconnects and Multi-core Processors
2.4.3 Optical Interconnects in Transceivers
2.5 Longer-Term Opportunities for Optical Interconnects
2.5.1 On-Chip Optics
2.5.2 Fiber-at-the-Desk and Fiber-to-the-Desk

Chapter Three: Optical Interconnect Products, MSAs and Technologies

3.1 Products for Off-Chip Optical Interconnection
3.1.1 Pre-Terminated Optical Assemblies
3.1.2 Fiber-Optic Jumpers
3.1.3 MPO-based Parallel Optics
3.1.4 AOCs as Optical Interconnects
3.2 How MSAs and Standards are Shaping Optical Interconnection
3.2.1 The Dominant Datacom Standards Environment: Ethernet, Fibre Channel and InfiniBand Breeding New/Updated Transceiver MSAsSNAP12, QSFP, CXP
3.2.2 Optical Interconnection, 300-pin VSR, and OC-768
3.2.3 Optical Interconnection and PCI-Express
3.3 Proprietary Approaches to Optical Interconnection
3.3.1 Light Peak: Future Standard or MSA?
3.3.2 Other Proprietary Approaches
3.4 "Optical Engines" in Optical Interconnection: A New Product Direction?
3.4.1 The Role of Optical Integration in On-Chip and Chip-to-Chip Interconnection
3.4.2 Hybrid Integration Solutions
3.4.3 Future Monolithic Integration Solutions
3.4.4 Optical Interconnection and Novel Laser Types: Silicon and Quantum Dot

Chapter Four: Five-Year Forecasts of Optical Interconnection Markets

4.1 Forecasting Methodology
4.2 Alternative Scenarios
4.3 Forecast of Rack-based Optical Interconnection by Product Type 4.4 Forecast of Board-based Optical Interconnection by Product Type
4.5 Forecast of Chip-to-Chip Optical Interconnection by Product Type
4.6 Timetable and Qualitative Forecast of On-chip interconnection
4.7 Summary of Forecasts for Optical Interconnection

Acronyms and Abbreviations Used in this Report 

About the Author 

List of Exhibits

Exhibit E-1: Summary of Optical Interconnects Forecast ($ Millions) 
Exhibit 1-1: Optical Interconnection Components 
Exhibit 2-1: TIA-942 Basic Data Center Topology Defined 
Exhibit 2-2: Fiber Channel over Ethernet Illustration 
Exhibit 2-3: Avago's MicroPOD Module 
Exhibit 3-1: 4-connector End-to-End Fibre Channel Connection 
Exhibit 3-2: Harness Assemblies for a Brocade 48000 Switch in a Data Center 
Exhibit 3-3: Fiber-Optic Trunk Cable with Pulling Eye 
Exhibit 3-4: MPO Connector with Key Up 
Exhibit 3-6: Side View Cut-away of Cassette MPO Connection 
Exhibit 3-5: MPO Position 1 Designation 
Exhibit 3-7: MPO Connector Endface Within Cassette 
Exhibit 3-8: TIA-568C Method A Polarity 
Exhibit 3-9: TIA-568C Method B Polarity 
Exhibit 3-10: TIA-568C Method C Polarity 
Exhibit 3-11: SNAP12 Module 
Exhibit 3-13: CFP Module 
Exhibit 3-12: QSFP Module 
Exhibit 3-14: AOC with CXP ends 
Exhibit 3-15: Illustration of CXP module and cable (Annex 6, InfiniBand Architecture Specification) 
Exhibit 3-16: Today's Supercomputer 
Exhibit 3-17: InfiniBand Formats and Data Rates 
Exhibit 3-18: Cisco VSR Module with SNAP12 Devices 
Exhibit 3-19: PCIe PCB with OE-FPGA from Xilinx/Reflex Phonetics 
Exhibit 3-20: Intel Light Peak Technology 
Exhibit 3-21: Light Peak Functional Diagram 
Exhibit 3-22: MicroPOD Transmitter and Receiver Modules with 12-fiber Ribbon Cable 
Exhibit 3-23: Luxtera's OptoPhy Transceiver 
Exhibit 3-24: Opportunities for Optical Integration in High-Speed Networks
Exhibit 3-25: New Laser Integrated Products for Parallel Solutions 
Exhibit 3-26: Light on Board Technology and LightABLE Sub-Assembly 
Exhibit 3-27: CyOptics Terapics Project1 Tbps 
Exhibit 3-28: Rendering of 3-D Optical Interconnect 
Exhibit 3-29: 1310nm FP Quantum Dot Laser Structure
Exhibit 4-1: Data Center Active Optical Cables 
Exhibit 4-2: Rack-based Optical Interconnects Forecast 
Exhibit 4-3: MPO-to-LC breakout 
Exhibit 4-4: LC-to-LC Jumpers 
Exhibit 4-5: Total Revenue of Rack-based Optical Interconnects ($ Millions)
Exhibit 4-6: Board-based Optical Interconnects Forecast 
Exhibit 4-7: Chip-to-chip Optical Interconnects Forecast 
Exhibit 4-8: Summary of Optical Interconnects Forecast ($ Millions) 

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光インターコネクト市場は2015年に35億ドルのビジネスチャンス

ヴァージニア州グレンアレン、2010年5月10日
米国調査会社CIR社の調査レポート「光インターコネクト市場調査:市場動向、技術、5年間予測 ー New Revenue Opportunities for Optical Interconnects: A Market and Technology Forecast」は、光インターコネクト市場は2015年に35億ドルを上回るだろうと報告している。この調査レポートは、下記について調査している。

コンピュータやネットワーク機器のアプリケーションにおいては、銅線が圧倒的であるものの、それらの進歩のすべてをまかなうに十分な再発明は不可能だろう。より高度なデジタル信号処理が行える新世代の銅線相互接続によって、コスト、電力消費、スペースが必要となるだろう。ユーザーもOEMもそれを望んではいない。

CyOpticsがTerapicsプロジェクトで光集積を行い、Intelはシリコンフォトニクスを試行している。しかし、光集積は未だ遠い道のりであり、チップ設計や材料の使用に関する多くのビジネスチャンスが残されている。CIR社は、量子ドットレーザの分野に大きなビジネスチャンスがあると考えている。これらは、徐々に利用可能になっており、チップツーチップやオンチップの光相互接続を可能にするかもしれない。Avago MicroPOD、Luxtera OptoPhy、Intel Light Peakなどの最新の開発やQD Laserの進化によって、今まさにボードツーボード、チップツーチップ、オンチップの転換期に差し掛かっているのかもしれない。

今後5年間の光インターコネクトの販売量が多いのは、rackベースアプリケーションのLCツーLCジャンパーであるだろう。MPOツーLCやMPOツーMPOアセンブリも順調に成長するだろう。

この調査レポートは、光インターコネクトの市場を技術の詳細な分析を提供している。ケーブルアセンブリ、チップツーチップ、オンボード、ケーブル、コネクタ、サブシステム、モジュールなどの、光インターコネクトの製造や販売を行う企業のビジネスチャンスに注目している。VSR(Very Short Reach)通信、サーバとSAN(データセンタ)ケーブル、オンチップとチップツーチップの製品などの光インターコネクト市場について論議し、これらの相互接続の発展がネットワーク全体に与える影響を分析している。いくつかのサプライヤが扱っているIntelのLight Peakや光エンジンなどの光相互接続の様々な新しい製品を分析し、これらの製品がネットワークに与える影響についても予測している。光集積とオンチップ、チップツーチップ光インターコネクト、新規レーザタイプについても調査し、第4章では光インターコネクト製品の製品毎の出荷数と収益の予測も行っている。

(原文)CIR Issues New Report on Optical Interconnects Market, Sees $3.5 Billion Market Opportunity in 2015

May 10, 2010

Additional details are available at the CIR website at www.cir-inc.com.

Insights from the report:

While copper has had a stranglehold on both computing and networking equipment applications, moving forward, CIR believes that it will be unable to re-invent itself quickly enough to support all of the advances listed above. With each new generation of copper interconnects comes the need for more sophisticated digital signal processing, which becomes more costly in several waysdollars, power consumption and space. This is clearly not a direction in which either end users or OEMs want to move.

Optical integration is what CyOptics is doing in its Terapics project and Intel is trying with silicon photonics. However, optical integration still has a long way to go and there are many opportunities open with regard to chip design and materials used. CIR also sees considerable opportunity in the realm of quantum dot lasers. These are gradually becoming available and could enable chip-to-chip and on-chip optical interconnection. We could be on the cusp of transformation for board-to-board, chip-to-chip and on-chip with recent developments such as the Avago MicroPOD, Luxtera OptoPhy and Intel Light Peak as well as advances by QD Laser.

The volume opportunity for optical interconnects over the next five years will still be LC-to-LC jumpers in rack-based applications. There will also be healthy growth for MPO-to-LC and MPO-to-MPO assemblies.

About the Report:

This report is intended to provide in-depth analysis of optical interconnects markets and technologies. The specific purpose of this study focuses on likely new business opportunities for components including cable assemblies, chip-to-chip, on-board, cable and connectors and subsystems and modules firms utilizing or selling optical interconnects. In the report we discuss the markets for optical interconnects, which will include VSR telecom, servers and SANs (data centers) cabling, on-chip and chip-to-chip potential products. We also analyze how these developments in interconnection will impact the rest of the network. Also included is an analysis of the different types of possible new optical interconnect products like Light Peak from Intel and optical engines, that are now available from several suppliers, and how these products will affect the network. In addition, we cover optical integration and how its changing landscape will shape on-chip and chip-to-chip optical interconnects as well as novel laser types. Chapter Four includes forecasts for optical interconnect products by product type in volume and revenue terms.