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短距離通信

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複数の無線接続技術の組み合わせによるチップセットの市場は、短距離無線などの様々な規格をシングルダイチップセットに組み合わせている。この方法には、利点と欠点がある。市場にはまだスタンドアロンのチップセットもあり、組み合わせによるチップセットの出発点である。多くの企業が、様々なスタンドアロンのチップセットを組み合わせて、マルチスタンダードのソリューションを提供し、組み合わせチップセットと競争している。この調査レポートは、ブルートゥース、Wi-Fi、GPS、NFC(近距離通信)、UWB(ウルトラワイドバンド) などの技術に注目し、それぞれの軌跡と将来の各社の計画を調査している。市場予測と、シングルダイコンボチップセットヤマルチダイコンボソリューションパッケージ、スタンドアロンのチップを利用する際の利点と欠点、主要企業のプロフィールを記載している。

The combination connectivity chipsets market combines various short range and other wireless standards into a single-die chipset. This approach offers both advantages and disadvantages. Stand-alone chipsets are still found in the market, and have been the starting point for the combination chipsets. Many companies combine various stand-alone chipsets to provide multi standard solutions which directly compete with combo chipsets.

This study focuses on Bluetooth, Wi-Fi, GPS, NFC, and UWB technologies, and will provide insight on their market trajectories and their their makers' and users' future plans. It includes forecasts, and discusses the advantages and disadvantages of using single-die combo chipsets, multi-die combo solution packages, and standalone chips. Key company profiles are included.

What Questions Does This Report Answer?

• What barriers restrain the markets for combo chipsets?
• What are the drawbacks of using a combo chipset versus a multi-die chipset?
• What are the advantages of using stand-alone chipsets?
• What revenue opportunities are there for combo chipsets?
• What growth rates are expected over the next five years in the combo and stand-alone chipset markets?

Who Needs This Report?

• Businesses involved in short range wireless connectivity
• Laptop/PC manufacturers
• Portable media player manufacturers
• Cellular phone manufacturers
• Healthcare/sports/wellness device manufacturers
• Wireless router vendors
• Wireless video vendors
• Location Device vendors

目次

Almost 280 Million Combination Chipsets to Ship This Year

NEW YORK - August 20, 2010

Shipments of “combo” chipsets for mobile devices that gather a variety of connectivity types in one small package are expected to approach 280 million worldwide by the end of 2010. Integrating different radio technologies such as FM, Bluetooth, Wi-Fi and GPS on a single chip may sometimes involve performance compromises, but saves money, space and power. ABI Research forecasts that more than 979 million such chipsets will ship in 2015.

“The market for combo chipsets is taking off, but somewhat more slowly than was originally expected,” says research analyst Xavier Ortiz. “Mobile phones are the main market for these combinations today, although ABI Research believes that for true mass adoption, combos will have to penetrate other product types that require short-range wireless: laptops and consumer electronics devices.”

The combination most commonly found in cell phones is Wi-Fi+GPS. Wi-Fi+Bluetooth combos have seen slower adoption due to performance issues, because both technologies use similar frequencies, so they must alternate transmissions to avoid interference. Nonetheless, that is something many mobile handset manufacturers are prepared to accept for the sake of fitting greater functionality into a smaller package.

However we can expect to see ‘Bluetooth+Bluetooth Low Energy’ combinations replacing “traditional” Bluetooth chips, since the added cost is insignificant. More than two billion are expected to ship in 2015 and eventually Bluetooth/BLE combos will be universal in the Bluetooth segment.

“Combos are finding their way into newer devices more than they are being retrofitted to older models,” says Ortiz. “Many companies we speak with say that when they were using pre-combo standalone chips, they built relationships with a number of OEMs, and mixed-and-matched to fit their needs. While their newer devices may use combos, for their existing time-tested devices they prefer to stick to the proven solutions.”

Some of the leading vendors are Broadcom, TI, CSR, Atheros, and Qualcomm with its Snapdragon platform.

“Combo Connectivity Chipsets” focuses on Bluetooth, Wi-Fi, GPS, NFC, and UWB technologies, and provides insight on their market trajectories and their makers' and users' future plans. It includes forecasts, and discusses the advantages and disadvantages of using single-die combo chipsets, multi-die combo solution packages, and standalone chips. Key company profiles are included.

It is part of the Short Range Wireless Research Service.